Enterprise-level solid state disk testing device

Abstract

The utility model relates to the technical field of storage test equipment, in particular to an enterprise-level solid state disk test device, which comprises a top panel, a bottom panel, a front panel, a side panel and a plurality of PCIE (peripheral component interface express) to USB (universal serial bus) adapter plates, and is characterized in that the front panel and the side panel are clamped between the top panel and the bottom panel; hollow gaps are formed in the side panels; the top panel is provided with a plurality of limiting hollows, the plurality of PCIE-to-USB adapter plates are arranged on the bottom panel, test interfaces on the plurality of PCIE-to-USB adapter plates directly face the limiting hollows, and the enterprise-level solid state disk is connected with the PCIE-to-USB adapter plates through the limiting hollows of the top panel; a plurality of switches are further arranged on the top panel and used for controlling power sources of the PCIE-to-USB adapter plates, the testing efficiency and convenience can be improved, and powerful support is provided for research, development, production and application of enterprise-level solid state disks.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of storage test equipment, and specifically relates to an enterprise-level solid state disk testing device. BACKGROUND

[0002] In the face of rapid changes in information technology, Enterprise Solid State Drive (ESSD) as the core cornerstone of the data storage field, its importance in the data center, high-performance servers, Internet service architecture, cloud computing platform, intelligent manufacturing system and high-performance computing cluster and other diversified application scenarios is increasingly prominent. With the continuous emergence of data-intensive applications and the continuous rise of user requirements for data processing speed, the technology iteration and performance optimization of enterprise-level solid state disks have become an inevitable trend of industry development.

[0003] From the perspective of historical evolution, the signal transmission protocol of enterprise-level solid state disks has experienced a transition from SATA protocol to SATA and PCIE protocol, and then to the current three key stages dominated by PCIE protocol. In the early days, 2.5-inch SATA SSD and M.2 SATA SSD dominated the market with their advantages in cost and compatibility. However, with the advent of the big data era, the limitations of these traditional SSDs in data transfer rate and I / O performance have become increasingly apparent, prompting the industry to transition to higher-performance PCIE protocol.

[0004] In the transition stage from SATA to PCIE protocol, U.2 interface enterprise-level solid state disks emerged as the times require, which ingeniously maintained a certain compatibility while significantly improving data transmission bandwidth and storage performance, bringing new vitality to the market. U.2 interface SSD not only optimizes the physical connection structure, but also improves the electrical characteristics, laying a solid foundation for the comprehensive transition to PCIE protocol, and gradually becoming the mainstream choice of current enterprise-level storage solutions.

[0005] With the continuous innovation of technology, E1.S and E3.S enterprise-level solid-state drives under the PCIE protocol are regarded as the benchmark of the next generation of enterprise-level storage technology due to their outstanding performance indicators. E1.S aims to replace traditional M.2 SSDs, while E3.S targets the market space of 2.5-inch SATA SSDs. These two new types of SSDs adopt a more robust circuit board gold finger interface in design, not only significantly improving thickness and strength, effectively enhancing mechanical stability and electrical connection reliability, but also further improving data transmission efficiency and overall performance of the storage system by increasing the gold finger pitch and introducing DC12V high-power power supply. In terms of compatibility, E1.S and E3.S enterprise-level solid-state drives exhibit high flexibility and expansion capability, supporting multiple interface specifications from PCIEX4 to PCIE X16, and possessing downward compatibility, making them easily integrate into various high-performance computing environments to meet complex and varied storage needs.

[0006] However, despite the significant breakthroughs in performance of E1.S and E3.S enterprise-level solid-state drives, they still face many challenges in the current test process. Traditional testing methods rely on adapter devices or hard drive slots in server cabinets, which are not only cumbersome and inefficient, but also costly, severely restricting the research and development cycle and production cost of enterprise-level solid-state drives. Invention content

[0007] In order to overcome the shortcomings of the prior art, the utility model provides a kind of enterprise-level solid-state drive testing device, to improve test efficiency and convenience, provide strong support for the research and development, production and application of enterprise-level solid-state drive.

[0008] The technical means adopted by the utility model to solve its technical problems is: a kind of enterprise-level solid-state drive testing device, its improvement lies in, including top panel, bottom panel, front panel, side panel and several PCIEs USB adapter boards, wherein, the front panel and side panel are clamped between the top panel and bottom panel;The side panel is provided with a hollow gap;The top panel is provided with a plurality of limiting hollows, a plurality of PCIEs USB adapter boards are arranged on the bottom panel, and the test interface on a plurality of PCIEs USB adapter boards is opposite to the limiting hollow, and the enterprise-level solid-state drive is connected with PCIEs USB adapter board through the limiting hollow of top panel;A plurality of switches are further provided on the top panel for controlling the power supply of a plurality of PCIEs USB adapter boards.

[0009] The PCIE-to-USB adapter plate includes a PCIE-to-USB bridge chip, a Gen-Z 2C connector, a USB TYPE A male connector, a DC 12V power terminal, and a pin header.

[0010] The limiting hollows include a rectangular frame and square windows, and the rectangular frame has inverted edges on the sides.

[0011] The device rear end can be equipped with a cooling fan for active cooling and increased air flow.

[0012] The inner sides of the front panel and the side panel are provided with a shock-absorbing material layer, and the surface of the shock-absorbing material layer is designed with a non-slip texture to enhance the friction between the solid state disk and prevent sliding or falling during testing.

[0013] The PCIE-to-USB bridge chip supports multiple data transmission rates, including but not limited to USB 3.0, USB 3.1 Gen 1, USB 3.1 Gen 2, and USB 4, to meet the testing needs of enterprise-level solid state disks of different specifications and performance.

[0014] The PCIE-to-USB adapter plate is also provided with an integrated control unit, which is electrically connected to all PCIE-to-USB adapter plates for unified control and monitoring of the working status of each adapter plate, including but not limited to power status, data transmission speed, error detection, etc.

[0015] The utility model has the advantages of:

[0016] The top panel limiting hollow design not only has multiple functions such as fixing, limiting, and guiding, but also ensures the stability and accuracy of the solid state disk during installation, and pays special attention to the protection of the Gen-Z 2C connector, effectively prolonging the service life of the connector, thereby improving the overall test yield.

[0017] To meet diverse testing needs, this device is compatible with E1.S enterprise-grade solid-state drives of three different thicknesses: 9.5mm, 15mm, and 25mm, covering the mainstream solid-state drive specifications on the market and providing users with great convenience and flexibility.

[0018] The high-performance Gen-Z 2C connector was selected, which not only supports the high-speed data transmission standards of PCIE X4 and PCIE X8, but also features moderate insertion and extraction force and strong stability in its design. Attached Figure Description

[0019] Figure 1 This is a structural diagram of an enterprise-level solid-state drive testing device shown in an embodiment of the present invention;

[0020] Figure 2 This is a top view of an enterprise-level solid-state drive testing device shown in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of a PCIE to USB adapter board shown in an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram illustrating the limiting cutout in an embodiment of the present utility model. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0025] like Figures 1-2 As shown, this application provides an enterprise-level solid-state drive testing device, including a top panel 1, a bottom panel 2, a front panel 3, a side panel 4, and several PCIe to USB adapter boards 5, wherein...

[0026] The front panel 3 and the side panel 4 are sandwiched between the top panel 1 and the bottom panel 2; the side panel 4 is provided with a hollowed-out gap 41;

[0027] The top panel 1 is provided with several limiting cutouts 11, the bottom panel 2 is provided with screw holes, several PCIe to USB adapter boards 5 are installed and fixed on the bottom panel 2 by copper pillars and screws, the test interfaces on the several PCIe to USB adapter boards 5 are directly opposite the limiting cutouts 11, and the enterprise-level solid-state drive is connected to the PCIe to USB adapter board 5 through the limiting cutouts 11 of the top panel 1.

[0028] The top panel 1 is also provided with a number of switches 12 for controlling the power supply of a number of the PCIE to USB adapter boards 5. Optionally, the number of limiting cutouts 11 is 8, each corresponding to a switch 12.

[0029] In one possible implementation, such as Figure 3 As shown, the PCIe to USB adapter board 5 includes a PCIe to USB bridge chip 51, a Gen-Z 2C connector 52, a USB Type A male connector 53, a DC 12V power terminal 54, and a pin header 55.

[0030] The DC12V power terminal 54 is used to connect to the computer's DC12V power supply, providing power to the PCIE to USB adapter board 5 and the enterprise-grade solid-state drive.

[0031] The pin header 55 is connected to the switch 12 on the top panel 1 and is used to control the power switch of the test interface.

[0032] The Gen-Z 2C connector 52 is used for plugging and unplugging enterprise-grade solid-state drives;

[0033] The PCIE to USB bridge chip 51 is used to convert PCIE signals into USB signals, which are then connected to a USB hub or computer device through the USBTYPE A male connector 53.

[0034] The enterprise-grade solid-state drive testing device provided in this application adopts a vertical plug-in installation method suitable for operation. The panel on the top surface of the testing device is cut out for fixing, guiding and limiting, avoiding external forces that could cause damage to the connector due to lateral deviation. It uses a vertically mounted Gen-Z 2C connector to ensure the most stable plug-in and plug-in. The PCIe to USB bridge chip converts the PCIe signal to a USB signal, and then connects to the computer and other testing equipment through a HUB (USB hub).

[0035] In one possible implementation, such as Figure 4As shown, the limiting cutout 11 includes a rectangular frame 111 and a square window 112. The rectangular frame 111 has a chamfered edge 1111 on its side. The number and layout of the limiting cutout 11 can be flexibly adjusted according to the size and number of enterprise-level solid-state drives to be tested.

[0036] Because the weight of E1.S and E3.S enterprise-class solid-state drives increases after the casing is installed, vibration or misalignment during insertion or removal can damage the connectors or cause poor contact, interrupting the test.

[0037] The limiting cutouts securely hold the E1.S and E3.S enterprise-grade SSDs from all sides, maintaining vertical and horizontal stability. The chamfered edges around the limiting cutouts act as guides, facilitating insertion and removal. Utilizing the vertical overlap and differences between the E1.S and E3.S enterprise-grade SSDs, the limiting cutouts serve for fixing, limiting, and guiding, supporting E1.S enterprise-grade SSDs with thicknesses of 9.5mm, 15mm, and 25mm.

[0038] In one possible implementation, a cooling fan can be installed at the rear end of the device to actively dissipate heat and increase airflow.

[0039] Optionally, when a 45° cooling fan and a 90° cooling fan are installed at the rear of the device, the perforated gap between the side panel and the front panel is sealed, and air is discharged from the top panel through the interior of the testing device to the rear, thereby increasing the air circulation speed and enhancing heat dissipation.

[0040] In one possible implementation, a shock-absorbing material layer is provided on the inner side of the front panel 3 and the side panel 4. The surface of the shock-absorbing material layer is designed with an anti-slip texture to enhance the friction between it and the solid-state drive and prevent it from sliding or falling off during testing.

[0041] In one possible implementation, the PCIe to USB bridge chip 51 supports multiple data transfer rates, including but not limited to USB 3.0, USB 3.1 Gen 1, USB 3.1 Gen 2, and USB 4, to meet the testing needs of enterprise-grade solid-state drives of different specifications and performance.

[0042] In one possible implementation, the PCIe to USB adapter board 5 is also provided with an integrated control unit. The integrated control unit is electrically connected to all PCIe to USB adapter boards and is used to uniformly control and monitor the working status of each adapter board, including but not limited to power status, data transmission speed, error detection, etc. It can also communicate with a computer or other smart devices through the USB TYPE A male connector 53 to realize remote monitoring and control functions.

[0043] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An enterprise-level solid-state drive testing device, characterized in that, Includes a top panel, bottom panel, front panel, side panels, and several PCIe to USB adapter boards, among which... The front panel and the side panel are sandwiched between the top panel and the bottom panel; the side panel has a hollowed-out gap. The top panel is provided with several limiting cutouts, several PCIe to USB adapter boards are provided on the bottom panel, and the test interfaces on the several PCIe to USB adapter boards are directly opposite the limiting cutouts. The enterprise-grade solid-state drive is connected to the PCIe to USB adapter board through the limiting cutouts of the top panel. The top panel is also equipped with several switches for controlling the power supply of several of the PCIe to USB adapter boards.

2. The enterprise-level solid-state drive testing device according to claim 1, characterized in that, The PCIe to USB adapter board includes a PCIe to USB bridge chip, a Gen-Z 2C connector, a USB Type-A male connector, a DC12V power terminal, and a pin header. The DC12V power terminal is used to connect to the computer's DC12V power supply, providing power to the PCIe to USB adapter board and enterprise-grade solid-state drives. The pin header is connected to a switch on the top panel and is used to control the power switch of the test interface; The Gen-Z 2C connector is used for plugging and unplugging enterprise-grade solid-state drives; The PCIe to USB bridge chip is used to convert PCIe signals into USB signals, which are then connected to a USB hub or computer device via the USB TYPE A male connector.

3. The enterprise-level solid-state drive testing device according to claim 1, characterized in that, The limiting cutout includes a rectangular frame and a square window, and the rectangular frame has beveled edges on its sides.

4. The enterprise-level solid-state drive testing device according to claim 1, characterized in that, A cooling fan can be installed at the rear of the device to actively dissipate heat and increase airflow.

5. The enterprise-level solid-state drive testing device according to claim 1, characterized in that, The front panel and side panel are provided with a shock-absorbing material layer on the inside. The surface of the shock-absorbing material layer is designed with an anti-slip texture to enhance the friction between it and the solid-state drive and prevent it from sliding or falling off during testing.

6. The enterprise-level solid-state drive testing device according to claim 2, characterized in that, The PCIe to USB bridge chip supports multiple data transfer rates, including but not limited to USB 3.0, USB 3.1 Gen 1, USB 3.1 Gen 2, and USB4, to meet the testing needs of enterprise-level solid-state drives of different specifications and performance.

7. The enterprise-level solid-state drive testing device according to claim 2, characterized in that, The PCIe to USB adapter board is also equipped with an integrated control unit, which is electrically connected to all PCIe to USB adapter boards. It is used to uniformly control and monitor the working status of each adapter board, including power status, data transmission speed and error detection. It can also communicate with computer devices through the USB Type A male connector to realize remote monitoring and control functions.

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