Pulse high-intensity magnetic field pressure device
By powering the coil assembly with a capacitor-type energy storage power source to generate a pulsed magnetic field, combined with mechanical pressure, the problem of insufficient magnetic field strength in existing magnetic field pressure devices is solved, and efficient material forming and performance optimization are achieved.
Patent Information
- Application Number
- CN202520351823.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-01-03
- Filing Date
- 2025-03-03
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-03
AI Technical Summary
The magnetic field strength of existing magnetic field pressure devices is limited, making it impossible to process and shape materials and perform magnetic treatment under high magnetic field conditions and rapid magnetization and demagnetization.
A capacitor-type energy storage power supply is used to power the coil assembly, generating a pulsed magnetic field. Combined with a mechanical pressure device, this enables the rapid application and release of a high-intensity magnetic field.
It enables rapid forming and processing of materials under high-intensity magnetic fields, optimizes the internal structure of materials, such as grain orientation and atomic arrangement, and improves the magnetic properties of materials.
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Figure CN223871336U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of magnetic forming and magnetic treatment of materials, and specifically relates to a pulsed strong magnetic field pressure device. Background Technology
[0002] A magnetic field press is a specially designed device that combines magnetic field action and mechanical pressing processes. It is used to simultaneously apply magnetic fields and pressure during material processing to achieve specific material shaping or performance optimization. These presses are particularly suitable for powder molding of magnetic materials, bulk molding, and / or magnetic treatment pressure devices that require adjusting the internal structure or external properties of magnetic materials through magnetic field influence. The core of a magnetic field press lies in its ability to apply a strong magnetic field while pressing the material. This allows the magnetic components in the material (e.g., magnetic particles, magnetic grains, magnetic atoms, etc.) to align in a specific direction under the influence of the magnetic field, thereby optimizing the magnetic properties and other physical characteristics of the final product. Specifically, magnetic field action: providing a uniform and sufficiently strong magnetic field environment allows the magnetic components in the pressed material to respond to the magnetic field and align in an orderly manner. Mechanical pressing: applying pressure to the material using a hydraulic system, electric pressure system, or other forms of pressure source.
[0003] In existing technologies, the magnetic field pressure devices used are mostly electromagnet magnetic field pressure devices, with the maximum magnetic field rarely exceeding 3T. Furthermore, the magnetic field generated by the electromagnet has a long magnetization and demagnetization time (on the order of seconds), making it impossible to process and magnetically treat materials under high magnetic field (>4.0T) and rapid magnetization and demagnetization (magnetization and demagnetization time on the order of milliseconds or even microseconds). Utility Model Content
[0004] The technical problem to be solved by this utility model is to address the above-mentioned deficiencies in the prior art by providing a pulsed strong magnetic field pressure device. The pulsed strong magnetic field pressure device adopts a capacitor-type energy storage power supply, which can power the coil assembly to generate a pulsed magnetic field, thereby effectively increasing the maximum magnetic field strength.
[0005] To solve the above problems, the present invention adopts the following technical solution:
[0006] A pulsed high magnetic field pressure device includes a mold, a coil assembly, and a magnetic field power supply. The coil assembly is disposed outside the mold, and a magnetic material is disposed inside the mold. The magnetic field power supply is a capacitor energy storage type power supply and is connected to the coil assembly to provide power to the coil assembly to generate a pulsed magnetic field inside the mold.
[0007] Preferably, the mold includes an upper mold, a lower mold, and a middle mold. The top and bottom of the middle mold are respectively provided with openings. The interior of the middle mold is a filling cavity, in which magnetic material is filled. The upper mold and the lower mold extend into the filling cavity from the top opening and the bottom opening of the middle mold, respectively, to compress the magnetic material.
[0008] Preferably, the pulsed strong magnetic field pressure device further includes a pressure component, which includes a first pressure cylinder and a second pressure cylinder. The first pressure cylinder is connected to the upper mold and is used to drive the upper mold to move; the second pressure cylinder is connected to the lower mold and is used to drive the lower mold to move.
[0009] Preferably, the pulsed high magnetic field pressure device further includes a cooling component for cooling the coil assembly.
[0010] Preferably, the pulsed high magnetic field pressure device further includes a control component, which includes a central controller, a computer, and a manual control console. The computer and the manual control console are electrically connected to the central controller and are used to send command signals to the central controller. The central controller is also electrically connected to the pressure component and the magnetic field power supply and is used to control the opening, closing, and adjustment of the pressure component and the magnetic field power supply according to the command signals from the computer or the manual control console.
[0011] Preferably, the coil assembly includes two or more coaxial nested coils, each coil being connected to a thyristor and a capacitor energy storage module and then connected in parallel with each other.
[0012] Preferably, the magnetic field strength generated by the coil assembly is in the range of 0-18T.
[0013] Preferably, the magnetic material is magnetic powder and magnetic block.
[0014] Preferably, the mold is a heated mold.
[0015] Preferably, the pulsed high magnetic field pressure device further includes a mold frame, on which both the mold and the coil assembly are mounted.
[0016] The pulsed high magnetic field pressure device of this invention uses a capacitor-type energy storage power supply to power the coil assembly, thereby generating a pulsed magnetic field and effectively increasing the maximum magnetic field strength. Furthermore, the pulsed magnetic field has the characteristics of rapid magnetization and rapid demagnetization. The pulsed magnetic field pressure device simultaneously applies a magnetic field and pressure during the processing of magnetic materials, enabling the magnetic powder to be pressed into blocks, the magnetic blocks to be deformed into blocks, or the magnetic blocks to be processed by a combination of magnetic force and pressure. Compared to blocks processed by magnetic fields or pressure alone, the internal structure is optimized (e.g., grain orientation optimization, ordered atomic arrangement, directional magnetic domain alignment, etc.). This combines the effects of magnetic fields and mechanical pressing to achieve special forming or performance optimization of magnetic materials. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the pulsed strong magnetic field pressure device in Embodiment 1 of this utility model;
[0018] Figure 2 This is a top view of the coil assembly and mold in Embodiment 1 of this utility model;
[0019] Figure 3 This is a schematic diagram of the coaxial inner and outer nested structure of the coil assembly in Embodiment 1 of this utility model;
[0020] Figure 4 This is a circuit diagram of the coil assembly in Embodiment 1 of this utility model.
[0021] In the diagram: 100-coil assembly, 200-middle mold, 300-pressure assembly, 310-upper mold, 320-lower mold, 400-magnetic field power supply, 500-cooling assembly, 600-central controller, 610-computer, 700-magnetic material, 800-manual control console. Detailed Implementation
[0022] The technical solutions of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of this utility model.
[0023] In the description of this utility model, it should be noted that the terms "above" and other indications of orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0024] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection," "setting," "installation," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] This utility model provides a pulsed strong magnetic field pressure device, including a mold, a coil assembly, and a magnetic field power supply. The coil assembly is disposed outside the mold, and the magnetic material is disposed inside the mold. The magnetic field power supply is a capacitor energy storage type power supply and is connected to the coil assembly to provide power to the coil assembly so as to generate a pulsed magnetic field inside the mold.
[0027] Example 1
[0028] like Figure 1 As shown, this embodiment discloses a pulsed strong magnetic field pressure device, including a mold, a coil assembly 100, and a magnetic field power supply 400. The coil assembly 100 is wound around the outside of the mold, and magnetic material 700 is filled inside the mold and thus pressed by the mold. The magnetic field power supply 400 is a capacitor-type power supply and is connected to the coil assembly 100 to provide power to the coil assembly 100 to generate a pulsed magnetic field inside the mold.
[0029] In this embodiment, the magnetic material 700 can be in powder or block form. Specifically, when the magnetic material 700 is in powder form, i.e., magnetic powder, the device is used for powder forming, especially powder orientation forming (the pulsed magnetic field is used to change the orientation of the powder, etc., and the mold is used to compress and form the powder); when the magnetic material 700 is in block form, the device is used for magnetic field deformation forming of block materials, wherein the mold is used to compress and deform the block material, and the magnetic field is used to change the deformation behavior and internal structure of the deformed block. Before the device is applied to the filler, the lateral dimension of the magnetic block is smaller than the lateral dimension of the mold. As another case, when the device performs magnetic pressure synergistic treatment on the block material, the external shape of the magnetic block may not change significantly, but the internal structure of the block material is optimized through the synergistic effect of the pulsed magnetic field and pressure (e.g., internal grain optimization, atomic arrangement ordering, magnetic domain orientation). Before the device is applied to the filler, the lateral dimension of the magnetic block can be smaller than or equal to the lateral dimension of the mold.
[0030] In summary, this device is suitable for the synergistic processing of magnetic materials using magnetic force and pressure, especially for powder orientation molding, magnetic field deformation of bulk materials, and magnetic treatment of bulk materials (without changing their external shape but optimizing their internal structure).
[0031] Specifically, in this embodiment, when the magnetic powder is subjected to magnetic field forming treatment, the pulsed magnetic field is used to cause the easy magnetization axis of each magnetic powder particle to align along the direction of the pulsed magnetic field, thereby achieving the so-called "preferred orientation" or "directional orientation", and thus obtaining a high-performance anisotropic bulk magnet.
[0032] like Figure 1 As shown, specifically, the mold includes an upper mold 310, a lower mold 320, and a middle mold 200. The middle mold 200 has a cylindrical structure with openings (circular) at its top and bottom. The interior of the middle mold 200 is a filling cavity, in which the powder material 700 is filled. The upper mold 310 and the lower mold 320 are adapted to the opening shapes of the middle mold 200 (both are cylindrical) and extend into the filling cavity from the top opening and the bottom opening of the middle mold 200, respectively, thereby applying physical pressure to the magnetic material 700 to compress the magnetic material 700.
[0033] Furthermore, the pulsed strong magnetic field pressure device also includes a pressure assembly 300, which comprises a first pressure cylinder and a second pressure cylinder. The first pressure cylinder is connected to the upper mold 310 and is used to drive the upper mold 310 to move. The second pressure cylinder is connected to the lower mold 320 and is used to drive the lower mold 320 to move. The pressure assembly 300 can also control the pressure magnitude of the first and second pressure cylinders. The lower mold 320 can be either integral or separate.
[0034] Furthermore, the pulsed high magnetic field pressure device also includes a cooling assembly 500. Since the coil assembly 100 generates a large amount of heat during operation, the cooling assembly 500 is required to cool it down. The cooling assembly 500 is disposed inside the coil assembly 100 and is used to cool the coil assembly 100.
[0035] Specifically, the cooling assembly 500 includes a cooling pipe disposed inside the coil assembly 100. Cooling water with a lower temperature flows through the cooling pipe to remove the heat dissipated by the coil assembly 100, thereby reducing the temperature of the coil assembly 100.
[0036] Optionally, the pulsed high magnetic field pressure device also includes a control component, which includes a central controller 600, a computer 610, and a manual control console 800. The computer 610 and the manual control console 800 are electrically connected to the central controller 600 and are used to send command signals to the central controller 600. The central controller 600 is also electrically connected to the pressure component 300 and the magnetic field power supply 400, and is used to control the opening, closing, and adjustment of the pressure component 300 and the magnetic field power supply 400 according to the command signals from the computer 610 or the manual control console 800, and at the same time, to feed back the execution information of the command signals to the computer.
[0037] Specifically, the computer is used to implement automatic and programmed control. It can input various process parameters (such as magnetic field strength, pressure, pulse width, etc.) and command signals to send control commands to various components and display signal information of each component during command execution. For example, it can control the magnetic field power supply 400 to start supplying power to the coil assembly 100 and adjust the magnetic field strength; it can control the pressure assembly 300 to apply a set pressure to the upper mold 310 and lower mold 320, thereby maintaining the synergistic effect of the mold and the pulsed magnetic field, ensuring that the magnetic material 700 undergoes synergistic processing under magnetic pressure within the mold 200. A manual control console is used to manually send various command signals to the central controller. Furthermore, the central controller 600 is also electrically connected to the cooling assembly 500.
[0038] In addition, when the cooling assembly cools the coil assembly 100, cooling water is introduced into the cooling pipe, and a temperature detector is also installed near the coil. The temperature detector is electrically connected to the central controller 600. When the temperature detector detects that the temperature of the coil assembly 100 exceeds the set temperature, the central controller 600 issues an alarm signal.
[0039] In this embodiment, the coil assembly 100 includes two or more coaxial nested coils, each coil being connected to a thyristor and a capacitor energy storage module and then connected in parallel with each other.
[0040] like Figure 3 As shown, specifically, the coil assembly 100 in this embodiment includes three coaxial nested coils, namely coil L1, coil L2, and coil L3. Coil L1 is located on the innermost side of the coil assembly 100, coil L2 is wound around the outer side of coil L1, and coil L3 is wound around the outer side of coil L2. The winding directions of adjacent coils are opposite, and the starting end of the latter coil is close to the end of the former coil. Coil L1 has the most turns, coil L2 has fewer turns than coil L1, and coil L3 has fewer turns than coil L2.
[0041] Furthermore, the starting end of coil L1 is 1A, and the ending end of coil L1 is 1B; the starting end of coil L2 is 2A, and the ending end of coil L1 is 2B; the starting end of coil L3 is 3A, and the ending end of coil L3 is 3B.
[0042] When the wire diameter of the winding coil is fixed, the equivalent inductance of multiple coils connected in parallel is smaller than that of a single coil. The same capacitor voltage can generate a stronger current, thereby producing a stronger peak magnetic field.
[0043] like Figure 4 As shown, the three coils are connected to a thyristor and a capacitor energy storage module, respectively, and then connected in parallel. Therefore, there are a total of three series circuits connected in parallel in this circuit. In this embodiment, the capacitor energy storage module is the magnetic field power supply 400. The coils are connected as follows: 1A, 2B, and 3A are connected together and then connected to the negative terminal of the capacitor module; 1B is connected to the cathode of thyristor Q1; 2A is connected to the cathode of thyristor Q2; and 3B is connected to the cathode of thyristor Q3.
[0044] Specifically, a thyristor is a semiconductor device widely used in power electronics, especially in applications requiring control of large currents and high voltages. It is a type of controlled rectifier that can turn circuits on or off based on control signals. A thyristor consists of three terminals: a cathode, anode, and gate. The anode is connected to the positive terminal of the power supply, and the cathode is connected to the negative terminal. When the gate receives a control signal, it switches to the on state. When the current through the thyristor decreases to a very small value or zero, the thyristor immediately turns off. In other words, the control signal and the thyristor can control the switching on and off of various series circuits.
[0045] Therefore, the maximum magnetic field strength can be adjusted by controlling the number of conducting series circuits. For example, when thyristor Q1 is turned on, the capacitor energy storage module C1 discharges, thereby powering coil L1 and generating a pulsed magnetic field through coil L1. When a stronger pulsed magnetic field is needed, more thyristors can be turned on; that is, the more parallel circuits that are turned on, the stronger the magnetic field generated. When all three parallel circuits are turned on (thyristors Q1, Q2, and Q3 are all turned on), the pulsed magnetic fields generated by coils L1, L2, and L3 are superimposed, and the maximum magnetic field strength can reach 18T.
[0046] like Figure 4 As shown, in the circuit, freewheeling diode D01 and freewheeling resistor R01 are used to prevent the current in coil L1 from reverse charging the capacitor energy storage module C1. Freewheeling diode D02 and freewheeling resistor R02 are used to prevent the current in coil L2 from reverse charging the capacitor energy storage module C2. Freewheeling diode D03 and freewheeling resistor R03 are used to prevent the current in coil L3 from reverse charging the capacitor energy storage module C3.
[0047] Optionally, the mold is a heated mold, thus forming a device that integrates strong magnetic field, pressure, and heat effects, achieving efficient and high-quality molding of powder material 700. Furthermore, the pulsed strong magnetic field pressure device also includes a mold frame, on which both the mold and the coil assembly 100 are mounted.
[0048] The pulsed strong magnetic field pressure device in this embodiment uses a capacitor-type energy storage power supply to power the coil assembly 100, thereby generating a pulsed magnetic field and effectively increasing the maximum magnetic field strength. Furthermore, the pulsed magnetic field has the characteristics of rapid magnetization and demagnetization. This device is also widely applicable, suitable for magnetic powder molding, especially powder orientation molding, magnetic deformation of bulk materials, and magnetic treatment of bulk materials. When processing magnetic materials, physical pressure is applied to the magnetic material 700 within the mold through the upper mold 310 and lower mold 320, and a pulsed magnetic field is applied simultaneously with the pressure. This results in the processed bulk magnetic material exhibiting optimized internal structures (such as grain orientation optimization, ordered atomic arrangement, and oriented magnetic domains) that cannot be achieved by conventional single magnetic field or pressure application. This combines magnetic field application and mechanical pressing processes, simultaneously applying magnetic field and pressure during material processing to achieve special molding or performance optimization of magnetic materials. In addition, the capacitor-type energy storage power supply has high magnetic field strength, small size, and high safety.
[0049] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.
Claims
1. A pulsed strong magnetic field pressure device, characterized in that, Includes mold, coil assembly (100), and magnetic field power supply (400). The coil assembly (100) is disposed outside the mold, and the magnetic material (700) is disposed inside the mold. The magnetic field power supply (400) is a capacitor energy storage type power supply and is connected to the coil assembly (100) to provide power to the coil assembly (100) so as to generate a pulsed magnetic field inside the mold.
2. The pulsed high magnetic field pressure device according to claim 1, characterized in that, The mold includes an upper mold (310), a lower mold (320), and a middle mold (200). The middle mold has openings at the top and bottom, and the middle mold (200) has a filling cavity inside. The magnetic material (700) is filled in the filling cavity. The upper mold (310) and the lower mold (320) extend into the filling cavity from the top opening and the bottom opening of the middle mold (200) respectively, so as to press the magnetic material (700).
3. The pulsed high magnetic field pressure device according to claim 2, characterized in that, It also includes a pressure assembly (300), which comprises a first pressure cylinder and a second pressure cylinder. The first pressure cylinder is connected to the upper mold (310) and is used to drive the upper mold (310) to move; the second pressure cylinder is connected to the lower mold (320) and is used to drive the lower mold (320) to move.
4. The pulsed high magnetic field pressure device according to claim 1, characterized in that, It also includes a cooling assembly (500), which is disposed inside the coil assembly and is used to cool the coil assembly (100).
5. The pulsed high magnetic field pressure device according to claim 3, characterized in that, It also includes a control component, which comprises a central controller (600), a computer (610), and a manual control console (800). The computer (610) and the manual control console (800) are electrically connected to the central controller (600) and are used to send command signals to the central controller. The central controller (600) is also electrically connected to the pressure component (300) and the magnetic field power supply (400) for controlling the opening, closing and adjustment of the pressure component (300) and the magnetic field power supply (400) according to the instruction signals of the computer (610) or the manual control console.
6. The pulsed high magnetic field pressure device according to claim 1, characterized in that, The coil assembly (100) includes two or more coaxial nested coils, each coil being connected to a thyristor and a capacitor energy storage module and then connected in parallel with each other.
7. The pulsed strong magnetic field pressure device according to claim 6, characterized in that, The magnetic field strength generated by the coil assembly (100) ranges from 0 to 18 T.
8. The pulsed high magnetic field pressure device according to claim 1, characterized in that, The magnetic material (700) is magnetic powder or magnetic block.
9. The pulsed high magnetic field pressure device according to claim 1, characterized in that, The mold is a heated mold.
10. The pulsed high magnetic field pressure device according to any one of claims 1-9, characterized in that, It also includes a mold frame, on which both the mold and the coil assembly (100) are mounted.