Double-sided packaging structure of laser chip

Abstract

The utility model relates to a double-sided packaging structure of a laser chip, which comprises a copper sheet, the top surface and the bottom surface of the copper sheet are respectively and fixedly provided with an insulating plate layer, the sides, away from the copper sheet, of the insulating plate layers on the two sides are respectively and fixedly provided with a copper foil, and chip bonding pad positions are arranged on the top surface and the bottom surface of the copper sheet and located on the inner sides of the corresponding insulating plate layers. According to the double-sided packaging structure of the laser chip, multi-chip coplanar electrodes and heat dissipation are provided by arranging the copper sheets, the wire bonding thread of the conductive wires is shortened by arranging the insulating plate layers, and independent conductive circuits are provided for the laser chips on the two sides through the copper foils, so that single-chip lightening or multi-chip lightening is conveniently controlled through the outside, and the double-sided packaging structure is suitable for multiple application scenes; the chip bonding pads on the two sides are symmetrically distributed in the transverse direction of the copper sheet, light outlet cavity faces are located on the same longitudinal line after the laser chip is installed, later-period light path reconditioning is facilitated, and the overall packaging cost of the packaging structure and the later-period light path reconditioning cost are low.

Description

Technical Field

[0001] This utility model relates to laser chip packaging, specifically a double-sided packaging structure for a laser chip. Background Technology

[0002] Semiconductor laser chips come in a variety of packaging forms, and different packaging methods are suitable for different application scenarios to meet specific performance requirements, heat dissipation needs and cost considerations. Gallium nitride lasers mostly use TO packaging and substrate-type packaging.

[0003] Existing laser pointing devices are mostly made using low-power monochromatic laser chips. Low-power laser chips have relatively low requirements for heat dissipation performance. If conventional TO56 packaging is used, the chip packaging cost is relatively high. Moreover, with the diversification of the market, some fields require the use of multi-color lasers, which requires the integration and packaging of laser chips of different colors. To meet the needs of multi-color systems, TO packaging is difficult to meet the integration and packaging of multi-color chips. The conventional process is to integrate chips of different colors in a single-sided arrangement on a substrate. In order to reserve space for fixing the chips and providing space for the subsequent wire bonding process of the chip electrodes, the substrate area required is large, resulting in high overall packaging costs and high costs for subsequent optical path preparation. Utility Model Content

[0004] This utility model provides the following technical solution: a double-sided packaging structure for a laser chip, comprising a copper sheet, wherein an insulating plate layer is fixedly installed on the top and bottom surfaces of the copper sheet, and copper foil is fixedly provided on the side of the insulating plate layer opposite to the copper sheet on both sides. Chip pad positions are provided on the top and bottom surfaces of the copper sheet and inside the corresponding insulating plate layers. A laser chip is fixedly installed on the side of the chip pad positions away from the copper sheet on both sides. A conductive wire extending to the corresponding copper foil is fixedly installed on the side of the laser chip opposite to the corresponding chip pad position on both sides.

[0005] Furthermore, the length of the insulating plates on both sides is less than the length of the copper sheet, and the width of the insulating plates on both sides is the same as the width of the copper sheet. This allows the end of the copper sheet away from the laser chip to both contact the outside for heat conduction and provide a location for circuit connection.

[0006] Furthermore, the inner sides of the insulating plates on both sides are provided with notches larger than the chip pads, providing space for the installation of the laser chip and wire bonding in subsequent processes. The two chip pads are symmetrically distributed along the transverse direction of the copper sheet, and the light-emitting cavity surfaces are on the same longitudinal line after the laser chip is installed, which facilitates the adjustment of the optical path in the later stage.

[0007] Furthermore, both insulating layers are made of single or multiple layers of high-temperature resistant insulating material, and the thickness of the insulating layers is greater than that of the laser chip, which can provide lateral shielding for the laser chip and effectively reduce damage to the chip caused by lateral scratches.

[0008] Furthermore, the copper foil covering the insulating plate layer on both sides away from the copper sheet provides the electrode of the single-sided laser chip with external circuitry for conduction.

[0009] Compared with the prior art, this utility model provides a double-sided packaging structure for a laser chip, which has the following advantages:

[0010] The double-sided packaging structure of this laser chip, by setting copper sheets and chip pads on both sides, allows laser chips of different colors to be mounted on both sides of the copper sheet. The copper sheet can provide heat dissipation for low-power laser chips while serving as a coplanar electrode for multiple chips. The insulating plates and copper foils on both sides separate the copper foils from the copper sheets, which not only shortens the wire bonding thread but also provides independent conductive lines for the laser chips on both sides through the copper foils. This facilitates external control of single or multiple chip lighting, adapting to various application scenarios. The chip pads on both sides are symmetrically distributed along the transverse direction of the copper sheet, and the light-emitting cavity surfaces of the laser chips are on the same longitudinal line after installation, which facilitates the subsequent optical path preparation. The overall packaging cost and the cost of subsequent optical path preparation of this packaging structure are relatively low. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of the structure of this utility model;

[0012] Figure 2 This is a top view of the structure of this utility model.

[0013] In the diagram: 1. Copper sheet, 2. Insulating board layer, 3. Copper foil, 4. Chip pad, 5. Laser chip, 6. Conductive wire. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-2A double-sided packaging structure for a laser chip includes a copper sheet 1. Insulating plates 2 are fixedly mounted on the top and bottom surfaces of the copper sheet 1. Copper foils 3 are fixedly disposed on the sides of the insulating plates 2 opposite to the copper sheet 1. Chip pad positions 4 are provided on the top and bottom surfaces of the copper sheet 1 and inside the corresponding insulating plates 2. Laser chips 5 are fixedly mounted on the sides of the chip pad positions 4 away from the copper sheet 1. Conductive wires 6 extending to the corresponding copper foils 3 are fixedly mounted on the sides of the laser chips 5 opposite to the corresponding chip pad positions 4.

[0016] In this embodiment, the length of the insulating plate layer 2 on both sides is less than the length of the copper sheet 1, and the width of the insulating plate layer 2 on both sides is the same as the width of the copper sheet 1, so that the end of the copper sheet 1 away from the laser chip 5 can both contact the outside for heat conduction and provide a position for circuit connection.

[0017] In this embodiment, slots larger than the chip pad positions 4 are provided on the inner sides of both insulating layers 2 to provide space for the installation of the laser chip 5 and wire bonding in subsequent processes. The two chip pad positions 4 are symmetrically distributed along the transverse direction of the copper sheet 1. After the laser chip 5 is installed, the light-emitting cavity surface is on the same longitudinal line, which facilitates the adjustment of the optical path in the later stage.

[0018] In this embodiment, both insulating layers 2 are made of single or multiple layers of high-temperature resistant insulating material. The thickness of the insulating layers 2 is greater than the thickness of the laser chip 5, which can provide lateral shielding for the laser chip 5 and effectively reduce lateral scratches that could damage the chip.

[0019] In this embodiment, the copper foil 3 on both sides covers the side of the insulating plate layer 2 away from the copper sheet 1, providing the electrodes of the single-sided laser chip 5 to be connected to the external circuit.

[0020] The beneficial effects of the above embodiments are as follows:

[0021] The double-sided packaging structure of this laser chip, by setting a copper sheet 1 and chip pads 4 on both sides, allows laser chips of different colors to be mounted on both sides of the copper sheet 1. The copper sheet 1 can provide heat dissipation for low-power laser chips while serving as a coplanar electrode for multiple chips. The insulating plate layer 2 and copper foil 3 on both sides are set. The insulating plate layer 2 separates the copper foil 3 from the copper sheet 1, which can shorten the bonding thread of the conductive wire 6 and provide independent conductive lines for the laser chips 5 on both sides through the copper foil 3. This facilitates the external control of single or multiple chip lighting, adapting to multiple application scenarios. The chip pads 4 on both sides are symmetrically distributed along the transverse direction of the copper sheet 1. After the laser chips 5 are installed, the light-emitting cavity surfaces are on the same longitudinal line, which facilitates the preparation of the optical path later. The overall packaging cost and the cost of subsequent optical path preparation of this packaging structure are low.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-sided packaging structure for a laser chip, comprising a copper sheet (1), characterized in that: Insulating plates (2) are fixedly installed on the top and bottom surfaces of the copper sheet (1). Copper foil (3) is fixedly installed on the side of the insulating plates (2) opposite to the copper sheet (1). Chip pad positions (4) are provided on the top and bottom surfaces of the copper sheet (1) and inside the corresponding insulating plates (2). Laser chips (5) are fixedly installed on the side of the chip pad positions (4) away from the copper sheet (1). Conductive wires (6) extending to the corresponding copper foil (3) are fixedly installed on the side of the laser chips (5) opposite to the corresponding chip pad positions (4).

2. The double-sided packaging structure of a laser chip according to claim 1, characterized in that: The length of the insulating plate layer (2) on both sides is less than the length of the copper sheet (1), and the width of the insulating plate layer (2) on both sides is the same as the width of the copper sheet (1).

3. The double-sided packaging structure of a laser chip according to claim 1, characterized in that: Both sides of the insulating plate layer (2) have slots on their inner sides that are larger than the size of the chip pad position (4), and the two chip pad positions (4) are symmetrically distributed along the transverse direction of the copper sheet (1).

4. The double-sided packaging structure of a laser chip according to claim 1, characterized in that: Both insulating layers (2) are made of single or multiple layers of high-temperature resistant insulating material, and the thickness of the insulating layer (2) is greater than the thickness of the laser chip (5).

5. The double-sided packaging structure of a laser chip according to claim 1, characterized in that: The copper foil (3) on both sides covers the insulating plate layer (2) on the side away from the copper sheet (1).

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