Packaging structure of multiple laser chips

Abstract

The utility model relates to a packaging structure of multiple laser chips, comprising a copper sheet, the top of the copper sheet is fixedly provided with an insulating plate layer with a gap in the middle, and the top of the insulating plate layer is provided with at least one copper foil. And at least one chip bonding pad is fixedly mounted at the top of the copper sheet and on the inner side of the middle notch of the insulating plate layer. According to the packaging structure of the multiple laser chips, the copper sheets and the chip bonding pads are arranged, the laser chips are installed at the tops of the copper sheets, the number of the copper foils is the same as that of the chip bonding pads, and the copper foils extend to the positions closer to the laser chips, so that the single-face electrode routing thread of the laser chips is shortened, the routing yield is improved, the adjacent copper foils are not electrically connected, and the yield is improved. The packaging structure is simple in structure, convenient for the chip to be lighted by a single chip or a plurality of chips to be lighted together through external control, suitable for different application requirements, low in cost, capable of meeting the heat dissipation requirement of the low-power multi-laser chip, high in device stability performance and convenient to popularize and apply.

Description

Technical Field

[0001] This utility model relates to laser chip packaging, specifically a packaging structure for multiple laser chips. Background Technology

[0002] Multi-laser chip packaging refers to the integration and packaging of multiple laser chip units. Its purpose is to integrate the wavelengths of different light-emitting chips together, such as in a tri-color laser, where laser chips emitting red, green, and blue light are integrated and packaged together. This technology can be applied to display devices such as projectors and laser TVs to achieve higher color performance and screen brightness, resulting in significant market demand.

[0003] Existing multi-chip packaging primarily integrates high-power lasers, with relatively less integration for low-power lasers. High-power laser chips generate significant heat, demanding high heat dissipation and thermal conductivity from the packaging, thus increasing material costs to meet performance requirements. However, for low-power laser chips, directly adopting the packaging methods of high-power lasers offers good performance but high packaging costs. While directly bonding the laser chip to a PCB board reduces packaging costs, it results in poor thermal conductivity, the PCB board cannot meet the heat dissipation requirements of low-power lasers, and device stability is compromised. Utility Model Content

[0004] This utility model provides the following technical solution: a multi-laser chip packaging structure, including a copper sheet, an insulating plate layer with a notch in the middle fixedly installed on the top of the copper sheet, a copper foil of not less than one on the top of the insulating plate layer, a chip pad of not less than one fixedly installed on the top of the copper sheet and inside the notch in the middle of the insulating plate layer, laser chips fixedly installed on the top of the multiple chip pads, and conductive wires extending to the corresponding copper foils fixedly installed on the top of the multiple laser chips.

[0005] Furthermore, each of the copper foils is provided with a barrier groove between adjacent copper foils, and the copper foils are not electrically connected, which facilitates the formation of independent circuits.

[0006] Furthermore, the insulating board layer is made of insulating material, which blocks the copper sheet and copper foil.

[0007] Furthermore, the thickness of the insulating layer is greater than the thickness of the laser chip, and mounting the chip inside the notch in the middle of the insulating layer can provide lateral protection.

[0008] Furthermore, the number of copper foils is the same as the number of chip pads.

[0009] Compared with the prior art, this utility model provides a packaging structure for multiple laser chips, which has the following advantages:

[0010] This multi-laser chip packaging structure, by setting copper sheets and chip pads, mounts the edge-emitting laser chip on top of the copper sheet. This allows for effective heat conduction using the copper sheet while also providing multiple chips as coplanar electrodes, reducing wire bonding costs. Furthermore, by setting the number of copper foils equal to the number of chip pads and extending the copper foils closer to the laser chip, the number of wire bonding threads for single-sided electrodes of the laser chip can be shortened, improving wire bonding yield. Additionally, barrier grooves are set between adjacent copper foils, ensuring no electrical connection between adjacent copper foils. This allows for external control of single-chip illumination or multi-chip simultaneous illumination, adapting to different application requirements. This packaging structure, while cost-effective, meets the heat dissipation requirements of low-power multi-laser chips, exhibits strong device stability, and is easy to promote and apply. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of the structure of this utility model;

[0012] Figure 2 This is a top view of the laser chip packaging structure in Example 1;

[0013] Figure 3 This is a top view of the laser chip packaging structure in Example 2.

[0014] In the diagram: 1. Copper sheet, 2. Insulating board layer, 3. Copper foil, 4. Chip pad, 5. Laser chip, 6. Conductive wire. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Example 1:

[0017] Please see Figure 1-2 A multi-laser chip packaging structure includes a copper sheet 1, an insulating plate layer 2 with a notch in the middle fixedly mounted on the top of the copper sheet 1, three copper foils 3 on the top of the insulating plate layer 2, three chip pads 4 fixedly mounted on the top of the copper sheet 1 and inside the notch in the middle of the insulating plate layer 2, laser chips 5 fixedly mounted on the top of the three chip pads 4, and conductive wires 6 extending to the corresponding copper foils 3 fixedly mounted on the top of each of the three laser chips 5.

[0018] In this embodiment, barrier grooves are provided between the three adjacent copper foils 3, and the three copper foils 3 are not electrically connected, which facilitates the formation of independent circuits.

[0019] In this embodiment, the insulating board layer 2 is made of a mixture of glass fiber and epoxy resin, which blocks the copper sheet 1 and copper foil 3.

[0020] In this embodiment, the thickness of the insulating plate layer 2 is greater than the thickness of the laser chip 5. Installing the chip inside the notch in the middle of the insulating plate layer 2 can provide lateral protection.

[0021] In this embodiment, the three laser chips 5 are low-power side-emitting laser chips, namely red, green and blue.

[0022] Example 2:

[0023] Please see Figure 1 and Figure 3 A multi-laser chip packaging structure includes a copper sheet 1, an insulating plate layer 2 with a notch in the middle fixedly mounted on the top of the copper sheet 1, two copper foils 3 on the top of the insulating plate layer 2, two chip pads 4 fixedly mounted on the top of the copper sheet 1 and inside the notch in the middle of the insulating plate layer 2, laser chips 5 fixedly mounted on the top of the two chip pads 4, and conductive wires 6 extending to the corresponding copper foils 3 fixedly mounted on the top of each of the two laser chips 5.

[0024] In this embodiment, a barrier groove is provided between two adjacent copper foils 3, and the two copper foils 3 are not electrically connected, which facilitates the formation of an independent circuit.

[0025] In this embodiment, the insulating board layer 2 is made of a mixture of glass fiber and epoxy resin, which blocks the copper sheet 1 and copper foil 3.

[0026] In this embodiment, the thickness of the insulating plate layer 2 is greater than the thickness of the laser chip 5. Installing the chip inside the notch in the middle of the insulating plate layer 2 can provide lateral protection.

[0027] In this embodiment, the two laser chips 5 are low-power side-emitting laser chips, one green and one blue.

[0028] The beneficial effects of the above embodiments are as follows:

[0029] The packaging structure of this multi-laser chip, by setting copper sheet 1 and chip pad 4, mounts the edge-emitting laser chip on top of copper sheet 1. This allows the copper sheet 1 to effectively conduct heat while also providing multiple chips as coplanar electrodes, reducing wire bonding costs. At the same time, the number of copper foils 3 is the same as the number of chip pads 4, and the copper foils 3 are extended closer to the laser chip 5, which can shorten the wire bonding thread of the single-sided electrode of the laser chip 5 and improve the wire bonding yield. Furthermore, the copper foils 3 are all provided with barrier grooves between adjacent copper foils 3, and there is no electrical connection between adjacent copper foils 3. This allows the chips to be controlled by external means to light up one chip or multiple chips together, adapting to different application requirements. This packaging structure meets the heat dissipation requirements of low-power multi-laser chips at low cost, has strong device stability, and is easy to promote and apply.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for a multi-laser chip, comprising a copper sheet (1), characterized in that: An insulating plate layer (2) with a notch in the middle is fixedly installed on the top of the copper sheet (1). At least one copper foil (3) is provided on the top of the insulating plate layer (2). At least one chip pad (4) is fixedly installed on the top of the copper sheet (1) and inside the notch in the middle of the insulating plate layer (2). Laser chips (5) are fixedly installed on the top of multiple chip pads (4). Conductive wires (6) extending to the corresponding copper foil (3) are fixedly installed on the top of each of the multiple laser chips (5).

2. The packaging structure of a multi-laser chip according to claim 1, characterized in that: Each of the copper foils (3) has a barrier groove between adjacent copper foils, and the copper foils (3) are not electrically connected.

3. The packaging structure of a multi-laser chip according to claim 1, characterized in that: The insulating board layer (2) is made of insulating material.

4. The packaging structure of a multi-laser chip according to claim 1, characterized in that: The thickness of the insulating layer (2) is greater than the thickness of the laser chip (5).

5. The packaging structure of a multi-laser chip according to claim 1, characterized in that: The number of copper foils (3) is the same as the number of chip pads (4).

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