Onboard lightning protection device

Abstract

The utility model provides an onboard lightning protection device, and relates to the field of onboard installation surge protection. The onboard lightning protection device comprises a TVS chip, a first electrode, a second electrode, an insulating encapsulation piece, a tripping electrode and a tripping assembly. The first electrode and the second electrode are respectively and electrically connected with the TVS chip, the TVS chip, the first electrode and the second electrode are wrapped by the insulating encapsulation piece, the first electrode is provided with a first pin exposed on the surface of the insulating encapsulation piece, and the second electrode is provided with a first tripping part exposed on the surface of the insulating encapsulation piece; the tripping electrode is provided with a second pin and a second tripping part, the second tripping part is welded with the first tripping part through welding flux, and the tripping assembly separates the second tripping part from the first tripping part when the temperature rises until the welding flux is molten. According to the onboard lightning protection device, through the arrangement of the tripping assembly, mechanical tripping can be achieved under the condition that overvoltage continuously exists, combustion and fire breakout caused by too high temperature are avoided, and then the whole integrated circuit board is prevented from being burnt out.

Description

Technical Field

[0001] This utility model relates to the field of plate-mounted surge protection, and in particular to a plate-mounted surge protector. Background Technology

[0002] An onboard surge protector is an electronic device that provides safety protection for other electronic components on an integrated circuit board. When an overvoltage suddenly occurs on the integrated circuit board due to external interference, the onboard surge protector can conduct and divert current in a very short time, thereby preventing damage to other electronic components from the surge.

[0003] However, under continuous overvoltage conditions, onboard surge protectors are prone to catching fire, which can lead to the burning out of the entire integrated circuit board. Utility Model Content

[0004] In order to solve the problems existing in the prior art, the purpose of this utility model is to provide an onboard surge protector.

[0005] This utility model provides the following technical solution:

[0006] An onboard surge protector includes a TVS chip, a first electrode, a second electrode, an insulating encapsulation, a tripping electrode, and a tripping assembly;

[0007] The first electrode and the second electrode are electrically connected to the TVS chip, respectively. The insulating encapsulation covers the TVS chip, the first electrode and the second electrode. The first electrode is provided with a first pin exposed on the surface of the insulating encapsulation, and the second electrode is provided with a first tripping portion exposed on the surface of the insulating encapsulation.

[0008] The tripping electrode is provided with a second pin and a second tripping part. The second tripping part is soldered to the first tripping part by solder. When the temperature rises to the point where the solder melts, the tripping assembly separates the second tripping part from the first tripping part.

[0009] As a further optional embodiment of the onboard surge protector, the first electrode is provided with a first stepped portion, and the end of the first stepped portion away from the TVS chip is connected to the first pin; and / or

[0010] The second electrode is provided with a second stepped portion, and the end of the second stepped portion away from the TVS chip is connected to the first tripping portion.

[0011] As a further optional solution for the onboard surge protector, the first electrode is provided with a first positioning part, the first positioning part is connected to the first pin, and the first positioning part has an unbent state and a bent state.

[0012] When the first positioning part is in the unbent state, the first positioning part is located outside the insulating encapsulation and is used to position the first electrode when forming the insulating encapsulation;

[0013] When the first positioning part is in the bent state, the first positioning part is attached to the surface of the insulating encapsulation.

[0014] As a further alternative to the onboard surge protector, the second electrode is provided with a third pin exposed on the surface of the insulating encapsulation.

[0015] As a further optional feature of the onboard surge protector, the second tripping section is provided with a first through hole through which solder can pass.

[0016] As a further optional embodiment of the onboard surge protector, the tripping assembly includes a sliding member and an elastic member, the elastic member driving the sliding member to slide between the second tripping part and the first tripping part when the temperature rises to the point where the solder melts, so as to separate the second tripping part from the first tripping part.

[0017] As a further optional solution for the onboard surge protector, the tripping electrode is provided with a supporting part, the sliding member supports the supporting part when the temperature has not risen to the point where the solder melts, and the contact surface between the sliding member and the supporting part intersects with the sliding direction of the sliding member at an inclination.

[0018] The abutment portion is provided with a second through hole.

[0019] As a further optional embodiment of the on-board surge protector, the sliding member is provided with a guide groove, the guide groove extending along the sliding direction of the sliding member, and the elastic member is accommodated within the guide groove; and / or

[0020] The tripping electrode is provided with a guide portion, which extends along the sliding direction of the sliding member and is inserted into the elastic member.

[0021] As a further optional solution for the onboard surge protector, the insulating encapsulation is provided with a slide rail, which extends along the sliding direction of the sliding member, and the sliding member slides in cooperation with the insulating encapsulation through the slide rail.

[0022] As a further optional embodiment of the onboard surge protector, the onboard surge protector also includes a housing that covers the tripping assembly and is connected to the insulating encapsulation.

[0023] The insulating encapsulation component is provided with a positioning boss, and the outer shell is provided with a positioning groove that matches the positioning boss.

[0024] The insulating encapsulation component is provided with a slot, and the outer shell is provided with a snap-fit ​​part that engages with the slot.

[0025] The embodiments of this utility model have the following beneficial effects:

[0026] In the aforementioned onboard surge protector, the first electrode, TVS chip, second electrode, and tripping electrode are sequentially electrically connected, with the first pin of the first electrode and the second pin of the tripping electrode respectively connected to the integrated circuit board. Under normal operating conditions, the TVS chip is in the off state. When an overvoltage suddenly occurs in the integrated circuit board due to external interference, the TVS chip conducts to discharge current, thereby preventing surge damage to other electronic components. Under continuous overvoltage, the TVS chip heats up, and the increased temperature melts the solder connecting the first and second tripping parts. At this time, the tripping assembly separates the second tripping part from the first tripping part, preventing the onboard surge protector from catching fire due to overheating, and thus preventing the entire integrated circuit board from burning out.

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This diagram shows the overall structure of an onboard surge protector provided in Embodiment 1 of the present invention.

[0030] Figure 2 This shows a schematic diagram of the overall structure of an onboard surge protector provided in Embodiment 1 of this utility model from another perspective;

[0031] Figure 3 This diagram illustrates the connection relationship between the first electrode, the TVS chip, and the second electrode in an onboard surge protector according to Embodiment 1 of this utility model.

[0032] Figure 4 This diagram illustrates the structure of an insulating encapsulation component in an onboard surge protector according to Embodiment 1 of this utility model.

[0033] Figure 5 This shows a schematic diagram of the insulating encapsulation component in an onboard surge protector provided in Embodiment 1 of this utility model from another perspective;

[0034] Figure 6 This diagram illustrates the structure of the third electrode in an onboard surge protector according to Embodiment 1 of this utility model.

[0035] Figure 7 This diagram illustrates the cooperation relationship between the tripping electrode and the tripping assembly in an onboard surge protector according to Embodiment 1 of this utility model.

[0036] Figure 8 A schematic diagram of the internal structure of an onboard surge protector provided in Embodiment 2 of this utility model is shown.

[0037] Explanation of key component symbols:

[0038] 100-TVS chip; 200-First electrode; 210-First pin; 220-First step portion; 230-First positioning portion; 300-Second electrode; 310-First tripping portion; 320-Second step portion; 330-Third pin; 340-Second positioning portion; 400-Insulating encapsulator; 410-First clearance groove; 420-Second clearance groove; 430-Third clearance groove; 440-Fourth clearance groove; 450-Slide rail; 460-Positioning boss; 470-Card 500-Trigger electrode; 500a-First body; 500b-Second body; 510-Second pin; 520-Second triggering part; 521-First through hole; 530-Supporting part; 531-Second through hole; 540-Guide part; 600-Trigger assembly; 610-Sliding member; 611-Guide groove; 620-Elastic member; 700-Third electrode; 710-Fourth pin; 720-Third positioning part; 800-Housing shell; 810-Positioning groove; 820-Snap-fit ​​part. Detailed Implementation

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0040] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0041] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] Example 1

[0045] Please see Figure 1 , Figure 2 and Figure 3 This embodiment provides an onboard surge protector, including a TVS (Transient Voltage Suppressor) chip 100, a first electrode 200, a second electrode 300, an insulating encapsulation 400, a tripping electrode 500, and a tripping assembly 600.

[0046] The first electrode 200 and the second electrode 300 are electrically connected to the TVS chip 100. The insulating encapsulation 400 covers the TVS chip 100, the first electrode 200 and the second electrode 300, and the first electrode 200 is provided with a first pin 210 exposed on the surface of the insulating encapsulation 400, and the second electrode 300 is provided with a first tripping part 310 exposed on the surface of the insulating encapsulation 400.

[0047] For example, the insulating encapsulation 400 is made of epoxy resin and is injection molded. During the processing, the connected first electrode 200, TVS chip 100, and second electrode 300 are placed in the cavity of the injection mold, so that the first pin 210 and the first tripping part 310 respectively adhere to the inner wall of the cavity, and then epoxy resin is injected into the injection mold. After the epoxy resin cures, the formed insulating encapsulation 400 encapsulates the TVS chip 100 and most of the first electrode 200 and second electrode 300. Since the first pin 210 and the first tripping part 310 are respectively adhered to the inner wall of the cavity, the first pin 210 and the first tripping part 310 are not completely encapsulated by the insulating encapsulation 400, but are exposed on the surface of the insulating encapsulation 400.

[0048] Furthermore, the tripping electrode 500 is provided with a second pin 510 and a second tripping part 520, and the second tripping part 520 is soldered to the first tripping part 310. Accordingly, the tripping assembly 600 separates the second tripping part 520 from the first tripping part 310 when the temperature rises to the point where the solder melts.

[0049] For example, the solder used is solder, and the solder alloy composition meets the requirement of not softening during reflow soldering, so that the above-mentioned onboard surge protector can be soldered and fixed to the integrated circuit board together with other electronic components using conventional reflow soldering process.

[0050] In the aforementioned onboard surge protector, the first electrode 200, TVS chip 100, second electrode 300, and tripping electrode 500 are electrically connected in sequence, and the first pin 210 of the first electrode 200 and the second pin 510 of the tripping electrode 500 are respectively soldered to the integrated circuit board. Among them, the first pin 210 is the main current-carrying pin, and the second pin 510 is the pin of the tripping electrode 500.

[0051] Under normal operating conditions, the TVS chip 100 is in the off state. When an overvoltage suddenly occurs in the integrated circuit board due to external interference, the TVS chip 100 conducts to discharge current, thereby preventing the surge from damaging other electronic components.

[0052] Under continuous overvoltage conditions, the TVS chip 100 heats up, causing the solder connecting the first tripping part 310 and the second tripping part 520 to melt. At this time, the tripping assembly 600 separates the second tripping part 520 from the first tripping part 310, preventing the onboard surge protector from catching fire due to overheating, and thus preventing the entire integrated circuit board from burning out.

[0053] Please see Figure 3 In some embodiments, the first electrode 200 is provided with a first step portion 220, and the end of the first step portion 220 away from the TVS chip 100 is connected to the first pin 210.

[0054] Specifically, the main body of the first electrode 200 is horizontally positioned and attached to the bottom surface of the TVS chip 100. The edge of the main body of the first electrode 200 extends outward to form a first step 220 and a first pin 210. The first step 220 is vertically positioned, with its top end connected to the main body of the first electrode 200 and its bottom end connected to the first pin 210. The first pin 210 is horizontally positioned and parallel to the bottom surface of the insulating encapsulator 400. During processing, the main body of the first electrode 200, the first step 220, and the first pin 210 are integrally bent and formed.

[0055] At this point, a certain height difference is formed between the first pin 210 and the TVS chip 100. After the insulating encapsulation 400 is injection molded, the side of the TVS chip 100 facing the first electrode 200 is wrapped by the insulating encapsulation 400 of a certain thickness. When the first pin 210 is soldered onto the integrated circuit board, this part of the insulating encapsulation 400 can play a role in heat insulation, preventing the TVS chip 100 from being affected by the soldering process. During long-term use, this part of the insulating encapsulation 400 can also enhance the environmental tolerance of the TVS chip 100.

[0056] Furthermore, when the design thickness of the TVS chip 100 changes, only the length of the first step 220 needs to be adjusted to keep the overall thickness of the first electrode 200, TVS chip 100, and second electrode 300 unchanged, without the need to redesign and manufacture the injection mold. In other words, the same set of injection molds can be used to complete the injection molding process for multiple products, greatly saving production costs.

[0057] Furthermore, when there is an error in the thickness of the TVS chip 100, especially when the thickness of the TVS chip 100 exceeds the design value, since the first electrode 200, the first step portion 220 and the first pin 210 are usually made of metal and have good elasticity after bending, the first step portion 220 can adaptively deform during the mold closing process to compensate for the thickness error of the TVS chip 100, avoid the TVS chip 100 being squeezed and damaged by the injection mold, and improve the product yield.

[0058] Similarly, in some embodiments, the second electrode 300 is provided with a second step portion 320, and the end of the second step portion 320 away from the TVS chip 100 is connected to the first trip portion 310.

[0059] Specifically, the main body of the second electrode 300 is horizontally positioned and attached to the top surface of the TVS chip 100. The edge of the main body of the second electrode 300 extends outward to form a second step portion 320 and a first tripping portion 310. The second step portion 320 is inclined upward, with its bottom end connected to the main body of the second electrode 300 and its top end connected to the first tripping portion 310. The first tripping portion 310 is horizontally positioned and parallel to the top surface of the insulating encapsulator 400. During processing, the main body of the second electrode 300, the second step portion 320, and the first tripping portion 310 are integrally bent and formed.

[0060] At this point, a certain height difference is formed between the first tripping part 310 and the TVS chip 100. After the insulating encapsulation part 400 is injection molded, the side of the TVS chip 100 facing the second electrode 300 is wrapped by the insulating encapsulation part 400 of a certain thickness. When the first tripping part 310 and the second tripping part 520 are welded, this part of the insulating encapsulation part 400 can play a role in heat insulation, preventing the TVS chip 100 from being affected by the welding process. During long-term use, this part of the insulating encapsulation part 400 can also enhance the environmental resistance of the TVS chip 100.

[0061] Furthermore, when the design thickness of the TVS chip 100 changes, only the length of the second step 320 needs to be adjusted to keep the overall thickness of the second electrode 300, TVS chip 100, and second electrode 300 constant, without the need to redesign and manufacture the injection mold. In other words, the same set of injection molds can be used to complete the injection molding process for multiple products, greatly saving production costs.

[0062] Furthermore, when there is an error in the thickness of the TVS chip 100, especially when the thickness of the TVS chip 100 exceeds the design value, since the second electrode 300, the second step portion 320 and the first trip portion 310 are usually made of metal, they have good elasticity after bending. Therefore, the second step portion 320 can adaptively deform during the mold closing process to compensate for the thickness error of the TVS chip 100, avoid the TVS chip 100 being squeezed and damaged by the injection mold, and improve the product yield.

[0063] In some embodiments, the first electrode 200 is provided with a first positioning portion 230. The first positioning portion 230 is connected to the first pin 210, and the first positioning portion 230 has an unbent state and a bent state.

[0064] When the first positioning part 230 is in an unbent state, the first positioning part 230 is located outside the insulating encapsulation 400 and is used to position the first electrode 200 when forming the insulating encapsulation 400.

[0065] Specifically, the first positioning part 230 is connected to the end of the first pin 210 away from the first step part 220. During the injection molding of the insulating encapsulation part 400, the first positioning part 230 is located outside the cavity of the injection mold and cooperates with the positioning structure on the injection mold to position the first electrode 200. After the epoxy resin in the cavity cures to form the insulating encapsulation part 400, the first positioning part 230 is located outside the insulating encapsulation part 400.

[0066] When the first positioning part 230 is in a bent state, the first positioning part 230 is attached to the surface of the insulating encapsulation 400.

[0067] Specifically, after injection molding the insulating encapsulation 400, the first positioning part 230 is bent upward so that the first positioning part 230 fits against the surface of the insulating encapsulation 400, so that the welding condition of the first pin 210 can be observed and detected from the side when welding the first pin 210.

[0068] Please combine Figure 4 Furthermore, the surface of the insulating encapsulation 400 is provided with a first clearance groove 410, and the first positioning part 230 is bent upward and embedded in the first clearance groove 410.

[0069] Please refer to it again. Figure 3 In some embodiments, the second electrode 300 is provided with a third pin 330 exposed on the surface of the insulating encapsulation 400.

[0070] Understandably, the third pin 330 is a sampling or tripping signal output pin. When the first tripping part 310 is connected to the second tripping part 520, the third pin 330 is conductive to the second pin 510. When the first tripping part 310 is disconnected from the second tripping part 520, the third pin 330 is disconnected from the second pin 510. Therefore, by monitoring whether the connection between the third pin 330 and the second pin 510 is maintained through a voltage monitoring circuit, it can be confirmed whether the onboard surge protector has tripped.

[0071] Similarly, the second electrode 300 is also provided with a second positioning part 340. The second positioning part 340 is connected to the third pin 330, and the second positioning part 340 has an unbent state and a bent state.

[0072] When the second positioning part 340 is in an unbent state, the second positioning part 340 is located outside the insulating encapsulation 400 and is used to position the second electrode 300 when forming the insulating encapsulation 400.

[0073] When the second positioning part 340 is in a bent state, the second positioning part 340 is attached to the surface of the insulating encapsulation 400 so that the welding status of the third pin 330 can be observed and detected from the side when welding the third pin 330.

[0074] Please combine Figure 5 Furthermore, the surface of the insulating encapsulation 400 is provided with a second clearance groove 420, and the second positioning part 340 is bent upward and embedded in the second clearance groove 420.

[0075] Please see Figure 6 Furthermore, the aforementioned onboard surge protector also includes a third electrode 700. The third electrode 700 is an empty electrode and is covered by an insulating encapsulation 400. The third electrode 700 is provided with a fourth pin 710 exposed on the surface of the insulating encapsulation 400, and a third positioning part 720 connected to the fourth pin 710.

[0076] Among them, the fourth pin 710 is an unused pin, which is soldered together with the first pin 210, the second pin 510 and the third pin 330 on the integrated circuit board to strengthen the fixation.

[0077] Furthermore, when the third positioning part 720 is in an unbent state, it is located outside the insulating encapsulation 400, and positions the third electrode 700 during the injection molding of the insulating encapsulation 400. When the third positioning part 720 is in a bent state, it fits against the surface of the insulating encapsulation 400, so that the welding status of the fourth pin 710 can be observed and inspected from the side when welding the fourth pin 710.

[0078] Please combine Figure 5 Correspondingly, the surface of the insulating encapsulation 400 is provided with a third clearance groove 430, and the third positioning part 720 is bent upward and embedded in the third clearance groove 430.

[0079] Please see Figure 7 In some embodiments, one end of the tripping electrode 500 is located above the insulating encapsulation 400 and is provided with a second tripping portion 520. The main body of the tripping electrode 500 extends downward along the side of the insulating encapsulation 400 and is provided with a second pin 510. The second pin 510 is located on the bottom surface of the insulating encapsulation 400 and is coplanar with the first pin 210, the third pin 330, and the fourth pin 710 to facilitate surface mount soldering.

[0080] Please combine Figure 5 Correspondingly, the bottom surface of the insulating encapsulation 400 is provided with a fourth clearance groove 440 into which the second pin 510 can be inserted.

[0081] Please refer to it again. Figure 7 Furthermore, the second tripping part 520 is provided with a first through hole 521 through which solder can pass.

[0082] When the second tripping part 520 is welded to the first tripping part 310, the molten solder can flow through the first through hole 521 to the surface of the first tripping part 310, and better combine with the first tripping part 310, thereby ensuring a stable connection between the second tripping part 520 and the first tripping part 310.

[0083] In some embodiments, the tripping assembly 600 includes a slider 610 and an elastic member 620. The elastic member 620 drives the slider 610 to slide between the second tripping portion 520 and the first tripping portion 310 when the temperature rises to the point where the solder melts, so as to separate the second tripping portion 520 from the first tripping portion 310.

[0084] Specifically, the slider 610 slides in a direction parallel to the top surface of the insulating encapsulator 400.

[0085] Under continuous overvoltage, the TVS chip 100 heats up, causing the solder connecting the first tripping part 310 and the second tripping part 520 to melt. At this point, the solder no longer holds the second tripping part 520 in place, and the second tripping part 520 becomes movable. Based on this, the elastic member 620 drives the sliding member 610 to slide between the second tripping part 520 and the first tripping part 310, thus separating the second tripping part 520 from the first tripping part 310, ensuring that the second tripping part 520 is disconnected from the first tripping part 310, and completely cutting off the arc and solder wire during the operation.

[0086] For example, the elastic element 620 is a compression spring, and the elastic elements 620 are arranged in pairs so that the sliding element 610 is subjected to force evenly.

[0087] Furthermore, the trip electrode 500 is provided with a supporting portion 530. The sliding member 610 supports the supporting portion 530 when the temperature has not risen to the point where the solder melts, and the contact surface between the sliding member 610 and the supporting portion 530 intersects at an angle with the sliding direction of the sliding member 610.

[0088] Since the contact surfaces of the slider 610 and the abutment 530 intersect at an angle with the sliding direction of the slider 610, the slider 610 applies an upward force to the abutment 530 under the drive of the elastic member 620, which allows the second release part 520 to separate from the first release part 310 more smoothly after the solder melts.

[0089] In addition, a second through hole 531 is provided on the supporting part 530.

[0090] The second through hole 531 can reduce the contact area between the supporting part 530 and the sliding part 610, reduce the heat transferred to the sliding part 610 through the supporting part 530 when welding the second release part 520 and the first release part 310, and make the sliding part 610 less likely to melt.

[0091] For example, the slider 610 is made of high-temperature resistant LCP (Liquid Crystal Polymer) material.

[0092] Furthermore, a guide groove 611 is provided on the slider 610. The guide groove 611 extends along the sliding direction of the slider 610, and the elastic member 620 is accommodated in the guide groove 611.

[0093] In use, the guide groove 611 can limit and guide the elastic element 620, which is conducive to the deformation of the elastic element 620 along the sliding direction of the sliding element 610, thereby smoothly pushing the sliding element 610 to slide.

[0094] Similarly, the tripping electrode 500 is provided with a guide portion 540. The guide portion 540 extends along the sliding direction of the slider 610 and is inserted into the elastic member 620.

[0095] In use, the guide part 540 can limit and guide the elastic member 620, which is conducive to the deformation of the elastic member 620 along the sliding direction of the slider 610, thereby smoothly pushing the slider 610 to slide.

[0096] Furthermore, the insulating encapsulation 400 is provided with a slide rail 450. The slide rail 450 extends along the sliding direction of the sliding member 610, and the sliding member 610 slides in cooperation with the insulating encapsulation 400 through the slide rail 450.

[0097] Understandably, the slide rail 450 and the main body of the insulating encapsulation 400 are integrally injection molded. In use, the slide rail 450 limits and guides the sliding member 610, allowing the sliding member 610 to slide smoothly.

[0098] Please refer to it again. Figure 1 and Figure 2 In some embodiments, the aforementioned onboard surge protector further includes a housing 800. The housing 800 covers the tripping assembly 600 and is connected to the insulating encapsulation 400.

[0099] In use, the outer shell 800 and the insulating encapsulation 400 together form an internal space, covering the tripping assembly 600 and most of the tripping electrodes 500, which serves to isolate dust, moisture and provide photoelectric shielding.

[0100] The insulating encapsulation component 400 is provided with a positioning boss 460, and the outer shell 800 is provided with a positioning groove 810 that matches the positioning boss 460.

[0101] Understandably, when the housing 800 is connected to the insulating encapsulation 400, the positioning boss 460 is embedded in the positioning groove 810 to position the housing 800.

[0102] In addition, the insulating encapsulation 400 is provided with a slot 470, and the outer shell 800 is provided with a snap-fit ​​part 820 that engages with the slot 470.

[0103] During assembly, the outer shell 800 is placed over the insulating encapsulation 400 until the snap-fit ​​part 820 snaps into the slot 470, thus fixing the outer shell 800 and the insulating encapsulation 400 together.

[0104] In summary, the aforementioned onboard surge protector, through the tripping component 600, can mechanically trip under continuous overvoltage conditions, preventing combustion and fire due to overheating, and thus avoiding the burnout of the entire integrated circuit board. Furthermore, the onboard surge protector uses a TVS chip 100, which features small size, low residual voltage, and high current carrying capacity. Moreover, the first pin 210, second pin 510, third pin 330, and fourth pin 710 of the onboard surge protector employ surface-mount electrodes, reducing the amount of component insertion and surface-mount work, and minimizing the user's board space requirements. It is suitable for large-scale integration and highly automated soldering scenarios and can be soldered together with other electronic components using conventional reflow soldering processes.

[0105] Example 2

[0106] Please see Figure 8 This embodiment provides an onboard surge protector. The difference from Embodiment 1 is that this embodiment only includes a first pin 210 and a second pin 510. The pins are packaged using a surface-mount electrode in a SMEJ standard package output manner, and the package uses a two-pin surface-mount output method.

[0107] Furthermore, the tripping electrode 500 is composed of a first body 500a and a second body 500b. The first body 500a is enclosed by an insulating encapsulation 400. One end of the first body 500a is provided with a second pin 510, and the other end of the first body 500a is exposed on the top surface of the insulating encapsulation 400 and soldered to one end of the second body 500b. The second body 500b is located outside the insulating encapsulation 400, and a second tripping part 520 is provided at the end of the second body away from the first body 500a.

[0108] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0109] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0110] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. An onboard surge protector, characterized in that, It includes a TVS chip, a first electrode, a second electrode, an insulating encapsulation, a tripping electrode, and a tripping assembly; The first electrode and the second electrode are electrically connected to the TVS chip, respectively. The insulating encapsulation covers the TVS chip, the first electrode and the second electrode. The first electrode is provided with a first pin exposed on the surface of the insulating encapsulation, and the second electrode is provided with a first tripping portion exposed on the surface of the insulating encapsulation. The tripping electrode is provided with a second pin and a second tripping part. The second tripping part is soldered to the first tripping part by solder. When the temperature rises to the point where the solder melts, the tripping assembly separates the second tripping part from the first tripping part.

2. The plate-mounted surge protector according to claim 1, characterized in that, The first electrode has a first stepped portion, and the end of the first stepped portion away from the TVS chip is connected to the first pin; and / or The second electrode is provided with a second stepped portion, and the end of the second stepped portion away from the TVS chip is connected to the first tripping portion.

3. The plate-mounted surge protector according to claim 1, characterized in that, The first electrode is provided with a first positioning part, which is connected to the first pin. The first positioning part has an unbent state and a bent state. When the first positioning part is in the unbent state, the first positioning part is located outside the insulating encapsulation and is used to position the first electrode when forming the insulating encapsulation; When the first positioning part is in the bent state, the first positioning part is attached to the surface of the insulating encapsulation.

4. The plate-mounted surge protector according to claim 1, characterized in that, The second electrode is provided with a third pin exposed on the surface of the insulating encapsulation.

5. The plate-mounted surge protector according to claim 1, characterized in that, The second tripping part is provided with a first through hole through which solder can pass.

6. The plate-mounted surge protector according to any one of claims 1-5, characterized in that, The tripping assembly includes a sliding member and an elastic member. The elastic member drives the sliding member to slide between the second tripping part and the first tripping part when the temperature rises to the point where the solder melts, so as to separate the second tripping part from the first tripping part.

7. The plate-mounted surge protector according to claim 6, characterized in that, The tripping electrode is provided with a supporting part, and the sliding member supports the supporting part when the temperature has not risen to the point where the solder melts. The contact surface between the sliding member and the supporting part is inclined to intersect with the sliding direction of the sliding member. The abutment portion is provided with a second through hole.

8. The plate-mounted surge protector according to claim 6, characterized in that, The slider is provided with a guide groove, which extends along the sliding direction of the slider, and the elastic element is accommodated within the guide groove; and / or The tripping electrode is provided with a guide portion, which extends along the sliding direction of the sliding member and is inserted into the elastic member.

9. The plate-mounted surge protector according to claim 6, characterized in that, The insulating encapsulation is provided with a slide rail, which extends along the sliding direction of the sliding member, and the sliding member slides in cooperation with the insulating encapsulation through the slide rail.

10. The plate-mounted surge protector according to any one of claims 1-5, characterized in that, The plate-mounted surge protector also includes a housing, which covers the tripping assembly and is connected to the insulating encapsulation. The insulating encapsulation component is provided with a positioning boss, and the outer shell is provided with a positioning groove that matches the positioning boss. The insulating encapsulation component is provided with a slot, and the outer shell is provided with a snap-fit ​​part that engages with the slot.

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