Coding equipment

Abstract

The utility model provides a coding device. The coding device comprises a housing, a mainboard and a heat conductor. The shell comprises a containing cavity and at least one heat dissipation face, the heat dissipation face is located on one side of the containing cavity, and heat dissipation fins are arranged on the outer wall of the heat dissipation face. A limiting guide rail is arranged on the inner wall of the containing cavity, the distance between the limiting guide rail and the inner wall of the heat dissipation face is larger than the total thickness of the mainboard and the heat conductor, when the limiting guide rail guides the mainboard to enter the containing cavity of the shell, the mainboard is located below the limiting guide rail, and when the limiting guide rail abuts against the first face of the mainboard to guide the moving direction of the mainboard, the mainboard is located below the heat conductor. A gap is reserved between the heat conductor adhered to the second surface of the main board and the heat dissipation surface; when the main board is located in the containing cavity of the shell, the second face of the main board is bonded with the inner wall of the heat dissipation face through the heat conductor. The coding equipment is convenient to assemble, and the technical effect of improving the heat dissipation efficiency of the mainboard of the coding equipment can be achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of coding equipment, and specifically relates to a coding equipment. BACKGROUND

[0002] The coding equipment is an electronic equipment for signal coding conversion, and a mainboard is arranged in the coding equipment, the mainboard processes the input signal to obtain a coded signal, and then the coded signal is output to other receiving equipment. When the mainboard processes more data, the mainboard generates more heat, and the design of the existing coding equipment is not conducive to heat dissipation of the mainboard, which can easily lead to high temperature of the mainboard, affecting the coding efficiency and service life of the coding equipment. UTILITARY MODEL

[0003] The utility model aims at overcoming the defects and deficiencies in the prior art, and provides a coding equipment, which can improve the heat dissipation efficiency of the mainboard of the coding equipment.

[0004] One embodiment of the utility model provides a kind of coding equipment, comprising: shell, mainboard and heat conductor;

[0005] The shell includes accommodating cavity and at least one heat dissipation surface, the heat dissipation surface is located at one side of the accommodating cavity, and the outer wall of the heat dissipation surface is provided with heat dissipation fin;

[0006] The inner wall of the accommodating cavity is provided with a limiting guide rail, the spacing between the limiting guide rail and the inner wall of the heat dissipation surface is greater than the total thickness of the mainboard and the heat conductor, when the mainboard is guided into the accommodating cavity of the shell by the limiting guide rail, the mainboard is located below the limiting guide rail, and when the limiting guide rail and the first surface of the mainboard abut to guide the moving direction of the mainboard, the second surface of the mainboard is bonded with the heat conductor and the heat dissipation surface, and a gap is left between the heat conductor and the heat dissipation surface;

[0007] When the mainboard is located in the accommodating cavity of the shell, the second surface of the mainboard abuts against the inner wall of the heat dissipation surface of the shell via the heat conductor.

[0008] Relative to the prior art, the coding device of the utility model, when assembling, can guide the mainboard into the accommodating cavity of the shell through the limiting guide rail of the inner wall of the accommodating cavity, and because the spacing between the limiting guide rail and the inner wall of the heat dissipation surface is greater than the total thickness of the mainboard and the heat conductor, therefore, in the process of guiding the mainboard into the accommodating cavity through the limiting guide rail, the limiting guide rail abuts against the first surface of the mainboard, at this time, the second surface of the mainboard bonded with the heat conductor and the heat dissipation surface leaves a gap, which can prevent the heat conductor from contacting the heat dissipation surface, reduces the installation difficulty of the mainboard of the coding device, so that after the mainboard can smoothly enter the accommodating cavity, the second surface of the mainboard is bonded with the inner wall of the heat dissipation surface through the heat conductor, so as to transfer the heat generated during the coding of the mainboard to the heat dissipation surface through the heat conductor, and the heat dissipation surface improves the heat dissipation efficiency through the heat dissipation fins of the external heat dissipation surface, which realizes the technical effect of improving the heat dissipation efficiency of the mainboard through the heat conductor and the heat dissipation fins of the external heat dissipation surface.

[0009] In order to enable clearer understanding of the utility model, the specific implementation of the present application will be described below in conjunction with the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is the schematic diagram of the shell of the coding device of one embodiment of the utility model.

[0011] Figure 2 It is the schematic diagram of the mainboard and the chip of the coding device of one embodiment of the utility model.

[0012] Figure 3 It is the schematic diagram of the first cover body and the second cover body of the coding device of one embodiment of the utility model.

[0013] Figure 4 It is the schematic diagram of the first cover body of the coding device of one embodiment of the utility model.

[0014] Figure 5 It is the schematic diagram of the second cover body of the coding device of one embodiment of the utility model.

[0015] Figure 6 It is the schematic diagram of the second light transmission part of the coding device of one embodiment of the utility model.

[0016] 1, shell;11, accommodating cavity;111, limiting guide rail;13, heat dissipation surface;131, heat dissipation fin;15, first cover body;16, second cover body;17, first light transmission part;18, connecting part;19, second light transmission part;3, mainboard;31, limiting block;33, chip;5, heat conductor. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0018] Please refer to Figure 1 which is a schematic view of the coding device of one embodiment of the present application, comprising: a shell 1, a mainboard 3 and a heat conductor 5; wherein the heat conductor 5 can adopt adhesive heat-conducting silica gel.

[0019] The shell 1 comprises a containing cavity 11 and at least one heat dissipation surface 13, the heat dissipation surface 13 is located on one side of the containing cavity 11, and the outer wall of the heat dissipation surface 13 is provided with heat dissipation fins 131.

[0020] The inner wall of the containing cavity 11 is provided with a limiting guide rail 111, the spacing between the limiting guide rail 111 and the inner wall of the heat dissipation surface 13 is greater than the total thickness of the mainboard 3 and the heat conductor 5, when the mainboard 3 is guided by the limiting guide rail 111 to enter the containing cavity 11 of the shell 1, the mainboard 3 is located below the limiting guide rail 111, the limiting guide rail 111 abuts against the first surface of the mainboard 3 to guide the moving direction of the mainboard 3, so that the second surface of the mainboard 3 and the heat conductor 5 bonded thereto leave a gap between the heat dissipation surface 13.

[0021] When the mainboard 3 is located in the containing cavity 11 of the shell 1, the second surface of the mainboard 3 is bonded to the inner wall of the heat dissipation surface 13 via the heat conductor 5.

[0022] Wherein, under the action of gravity, the heat conductor 5 bonded to the mainboard 3 located in the containing cavity 11 is attached to the inner wall of the heat dissipation surface 13 to realize the bonding of the heat conductor 5 and the inner wall of the heat dissipation surface 13.

[0023] Specifically, in the assembling process of the encoding device, if the encoding device is assembled in the manner that the heat dissipation fins 131 face downward, when the limiting guide rail 111 guides the main board 3 to enter the accommodating cavity 11 of the shell 1, the main board 3 is located below the limiting guide rail 111, and the user can gradually push the main board 3 into the accommodating cavity 11 of the shell 1 under the condition that the first surface of the main board 3 abuts against the limiting guide rail 111, until the main board 3 is located in the accommodating cavity 11 of the shell 1, and then the user removes the force applied to the main board 3, so that the main board 3 moves downward under the action of gravity and the second surface of the main board 3 abuts against the inner wall of the heat dissipation surface 13 through the heat conduction body 5; if the encoding device is assembled in the manner that the heat dissipation fins 131 face upward, at this time, the shell 1 is in an upside-down state, and thus when the limiting guide rail 111 guides the main board 3 to enter the accommodating cavity 11 of the shell 1, the main board 3 is located above the limiting guide rail 111, and the first surface of the main board 3 abuts against the limiting guide rail 111 due to the action of gravity, at this time, the user can gradually push the main board 3 into the accommodating cavity 11 of the shell 1, until the main board 3 is located in the accommodating cavity 11 of the shell 1 or the assembling is completed, and then the user turns over the shell 1 or the encoding device, so that the main board 3 moves downward under the action of gravity and the second surface of the main board 3 abuts against the inner wall of the heat dissipation surface 13 through the heat conduction body 5.

[0024] Compared with the prior art, the encoding device can guide the main board 3 to enter the accommodating cavity 11 of the shell 1 through the limiting guide rail 111 of the inner wall of the accommodating cavity 11 during the assembling, and because the distance between the limiting guide rail 111 and the inner wall of the heat dissipation surface 13 is greater than the total thickness of the main board 3 and the heat conduction body 5, the first surface of the main board 3 abuts against the limiting guide rail 111 during the process of guiding the main board 3 to enter the accommodating cavity 11 through the limiting guide rail 111, and at this time, a gap is left between the second surface of the main board 3 and the heat dissipation surface 13 to which the heat conduction body 5 is bonded, so that the heat conduction body 5 is prevented from contacting the heat dissipation surface 13, the installation difficulty of the main board 3 of the encoding device is reduced, and after the main board 3 is successfully guided into the accommodating cavity 11, the second surface of the main board 3 is bonded to the inner wall of the heat dissipation surface 13 through the heat conduction body 5, so that the heat generated during the encoding of the main board 3 is transmitted to the heat dissipation surface 13 through the heat conduction body 5, the heat dissipation efficiency of the heat dissipation surface 13 is improved through the heat dissipation fins 131 of the external device, and the technical effect of improving the heat dissipation efficiency of the main board 3 through the heat conduction body 5 and the heat dissipation fins 131 of the external device of the heat dissipation surface 13 is achieved.

[0025] In a feasible embodiment, a guide edge is arranged on the first surface of the main board 3 corresponding to the limiting guide rail 111, and one end of the guide edge is provided with a limiting block 31.

[0026] When the main board 3 enters the accommodating cavity 11 of the shell 1 to abut the limiting block 31 against the limiting guide rail 111, the main board 3 moves towards the heat dissipation surface 13, and the heat conduction body 5 abuts against the inner wall of the heat dissipation surface 13 of the shell 1.

[0027] One of the guide edges has a limiting block 31 at one end, which can be a metal block or a solder block after cooling.

[0028] When the main board 3 enters the accommodating cavity 11 to the abutment of the limiting block 31 and the limiting guide rail 111, the spacing between the main board 3 and the limiting guide rail 111 is increased, so that the main board 3 moves towards the heat dissipation surface 13, so as to eliminate the gap between the heat conduction body 5 and the heat dissipation surface 13, and make the heat conduction body 5 abut against the inner wall of the heat dissipation surface 13.

[0029] In this embodiment, the limiting block 31 can make the heat conduction body 5 abut against the inner wall of the heat dissipation surface 13 more tightly, so that the heat conduction body 5 is better bonded to the inner wall of the heat dissipation surface 13.

[0030] Please refer to Figure 2 In a feasible embodiment, the second surface of the main board 3 is provided with a chip 33, the heat conduction body 5 is bonded to the chip 33, and the spacing between the limiting guide rail 111 and the inner wall of the heat dissipation surface 13 is greater than the total thickness of the main board 3, the chip 33 and the heat conduction body 5.

[0031] The chip 33 is the device that generates the most heat on the main board 3, so bonding the heat conduction body 5 to the chip 33 can assist the chip 33 in heat dissipation through the heat conduction body 5, so as to improve the heat dissipation efficiency of the chip 33.

[0032] In this embodiment, the limiting guide rail 111 and the inner wall of the heat dissipation surface 13 have a spacing greater than the total thickness of the main board 3, the chip 33 and the heat conduction body 5, so that when the main board 3 enters the accommodating cavity 11 of the shell 1 through the limiting guide rail 111 of the inner wall of the accommodating cavity 11, a gap is left between the heat conduction body 5 and the heat dissipation surface 13 to prevent the heat conduction body 5 from contacting the heat dissipation surface 13, thereby reducing the installation difficulty of the main board 3 of the coding device.

[0033] In this embodiment, bonding the heat conduction body 5 to the chip 33 can improve the heat dissipation efficiency of the chip 33, and the limiting of the spacing between the limiting guide rail 111 and the inner wall of the heat dissipation surface 13 to be greater than the total thickness of the main board 3, the chip 33 and the heat conduction body 5 can reduce the installation difficulty of the main board 3 of the coding device.

[0034] Please refer to Figures 3-5 In a feasible embodiment, the shell 1 is provided with a first cover 15 and a second cover 16 at two ends respectively, the first end of the main board 3 is provided with at least one first communication interface and / or at least one button, and the second end of the main board 3 is provided with at least one second communication interface.

[0035] The first cover 15 is provided with a first limiting opening matched with the first communication interface and / or the button, and the second cover 16 is provided with at least one second limiting opening matched with the second communication interface; the main board 3 is clamped in the first limiting opening through the first communication interface and / or the button and clamped in the second limiting opening through the second communication interface, and is fixed in the accommodating cavity 11. The limiting block 31 is arranged at one end of the guiding edge close to the first cover 15.

[0036] The first communication interface can be a signal input interface, and the second communication interface can be a signal collection interface. The encoder can simultaneously input a signal through the signal input interface and output an encoded signal through the signal collection interface.

[0037] The first cover 15 and the second cover 16 are arranged at two ends of the shell 1 based on the connection relationship between the first cover 15, the second cover 16 and the shell 1. For example, the first cover 15 and the second cover 16 can be detachably connected with the two ends of the shell 1, or the first cover 15 is fixedly connected with one end of the shell 1, and the second cover 16 is detachably connected with the other end of the shell 1.

[0038] In the production or assembly of the encoder of the embodiment, the following operations can be implemented:

[0039] (1) If the second cover 16 is detachably connected with one end of the shell 1, the second cover 16 can be connected with one end of the shell 1 through a bolt, and if the second cover 16 is fixedly connected with one end of the shell 1, this step can be skipped.

[0040] (2) The main board 3 is placed in the accommodating cavity 11 of the shell 1 under the guidance of the limiting guide rail 111 until the limiting block 31 abuts against the limiting guide rail 111, so that the main board 3 moves towards the heat dissipation surface 13 to realize abutment between the heat conductor 5 and the inner wall of the heat dissipation surface 13 of the shell 1. During the process of placing the main board 3 in the accommodating cavity 11 of the shell 1, the second communication interface of the main board 3 is inserted into the second limiting opening of the second cover 16, so that the second communication interface of the main board 3 is clamped in the second limiting opening.

[0041] (3) According to the corresponding relationship between the first communication interface and / or the button of the main board 3 and the first limiting opening of the first cover 15, the first cover 15 is arranged at the other end of the shell 1, so that the first communication interface and / or the button of the main board 3 are clamped in the first limiting opening, and the first cover 15 is connected with the shell 1 through a bolt.

[0042] In the embodiment, the first limiting opening of the first cover 15 can be connected with the first communication interface and / or the button of the main board 3, and the second limiting opening of the second cover 16 can be connected with the second communication interface of the main board 3, so as to fix the main board 3. The main board 3 can be fixed without the fixing assembly in the accommodating cavity 11 of the shell 1, and the size of the accommodating cavity 11 only needs to meet the size of accommodating the main board 3, so that the volume of the encoder is reduced. Moreover, the production cost of the encoder is reduced, and the material consumption is saved because the fixing assembly is not arranged in the accommodating cavity 11 of the shell 1.

[0043] In an embodiment, the main board 3 comprises a board body, a chip 33 and a display screen. The display screen and the chip 33 are arranged on the board body. The display screen is connected with the chip 33. The display screen is used for displaying a state picture indicating the working state of the encoder. One side of the shell 1 or the first cover 15 corresponding to the display screen is provided with a first light-transmitting part 17. The display screen displays the state picture through the first light-transmitting part 17.

[0044] The board body is used as a carrier of the chip 33 and the display screen. The chip 33 is used for signal coding and outputting a state picture indicating the working state of the encoder to the display screen, so that the state picture is displayed through the display screen.

[0045] It should be noted that because the display screen is arranged in the accommodating cavity 11 of the shell 1, the display screen needs to display the state picture to the outside through the first light-transmitting part 17 arranged on the shell 1, so that the user can watch the state picture displayed by the display screen through the first light-transmitting part 17. Therefore, if the first cover 15 is detachably connected with one end of the shell 1, the direction of the first cover 15 arranged on one end of the shell 1 needs to be adjusted before the first cover 15 is connected with one end of the shell 1 through the bolt. When the first communication interface of the main board 3 is connected with the first limiting opening, the display screen of the main board 3 corresponds to the first light-transmitting part 17 of the shell 1. Moreover, when the main board 3 is arranged in the accommodating cavity 11 of the shell 1, the direction of the first light-transmitting part 17 of the shell 1 can be upward, so as to reduce the situation that the display screen is scratched by the inner wall of the shell 1 due to gravity, thereby protecting the display screen. In addition, the distance between the display screen and the inner wall of the shell 1 can be maintained during the process of arranging the main board 3 in the accommodating cavity 11 of the shell 1, thereby protecting the display screen. The first light-transmitting part 17 of the shell 1 is a transparent light-transmitting part, which can be made of transparent material, so as to reduce the influence on the display of the state picture when the display screen displays the state picture through the first light-transmitting part 17, and the state picture can be clearly displayed to the outside.

[0046] In the embodiment, the display screen on the main board 3 and the first light-transmitting part 17 on the shell 1 can be matched to display the state picture of the encoder to the outside.

[0047] In one feasible embodiment, the inner wall of the housing 1 is provided with a plurality of connecting portions 18; the first cover 15 and the second cover 16 are respectively provided with a plurality of connecting holes; the first cover 15 and the second cover 16 are respectively bolted to the connecting portions 18 of the housing 1 through the connecting holes and fixed at both ends of the housing 1.

[0048] The connecting part 18 is provided with an internal threaded hole. The first cover 15 and the second cover 16 are bolted to the connecting part 18 of the housing 1 through the connecting holes in the same way. Taking the first cover 15 as an example, when the first cover 15 is placed on one end of the housing 1, each connecting hole of the first cover 15 corresponds to the internal threaded hole of each connecting part 18 at that end of the housing 1, so that the screw can pass through the connecting hole of the first cover 15 and enter the internal threaded hole of the corresponding connecting part 18, and the screw nut abuts against the first cover 15, so that the first cover 15 and one end of the housing 1 are bolted together.

[0049] In this embodiment, the first cover 15 and the second cover 16 can be bolted to the connecting part 18 of the housing 1 through the connecting hole.

[0050] In one feasible embodiment, the connecting portion 18 includes a limiting connecting portion 18 located between the limiting guide rail 111 and the heat dissipation surface 13, and the thickness of the heat conductor 5 is greater than or equal to the height of the limiting connecting portion 18.

[0051] The height of the limiting connection part 18 refers to the height of the limiting connection part 18 relative to the inner wall of the heat dissipation surface 13. Since the thickness of the heat conductor 5 is greater than or equal to the height of the limiting connection part 18, the limiting connection part 18 will not affect the contact between the heat conductor 5 and the inner wall of the heat dissipation surface 13, so that the heat conductor 5 can be smoothly bonded to the inner wall of the heat dissipation surface 13.

[0052] In this embodiment, by limiting the relationship between the thickness of the heat conductor 5 and the height of the limiting connection portion 18, the limiting connection portion 18 can be prevented from affecting the contact between the heat conductor 5 and the inner wall of the heat dissipation surface 13.

[0053] In one feasible embodiment, each of the connecting portions 18 is provided with a notch facing the motherboard 3.

[0054] Since each connecting part 18 has a notch facing the main board 3, the screw hole wall surrounding the internal screw hole in each connecting part 18 is not closed. That is, when the screw size is slightly larger than the internal screw hole of the connecting part 18, the size of the internal screw hole of the connecting part 18 is increased by the elastic deformation of the screw hole wall of the connecting part 18, so that the screw can smoothly enter the internal screw hole of the connecting part 18.

[0055] In this embodiment, the notch in the connecting portion 18 can expand the range of screw sizes that the connecting portion 18 can accept.

[0056] In one feasible embodiment, the motherboard 3 includes a board body, a chip 33, and an indicator light group. The indicator light group is disposed on both sides of the board body. The indicator light group is connected to the chip 33 and is used to emit status lights indicating the working status of the encoder. The housing 1 has a second light-transmitting part 19 on one side corresponding to the indicator light group, and the indicator light group displays the status lights through the second light-transmitting part 19.

[0057] Please see Figure 6 The second light-transmitting part 19 can be a colored light-transmitting part, such as being made of a light-transmitting material like white, yellow, or green. Optionally, the indicator light group can be located on both sides of the main board 3, and the second light-transmitting part 19 can also be located on both sides of the housing 1, so that users can easily view the status lights emitted by the indicator light group from either side of the housing 1.

[0058] Specifically, the indicator light group includes multiple indicator lights arranged parallel to the edge of the board. The parallel arrangement of these indicator lights allows for easy indication of the encoder's operating status by the number of status lights emitted.

[0059] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An encoding device, characterized in that, include: Housing, motherboard, and heatsink; The housing includes a receiving cavity and at least one heat dissipation surface, the heat dissipation surface is located on one side of the receiving cavity, and the outer wall of the heat dissipation surface is provided with heat dissipation fins; The inner wall of the accommodating cavity is provided with a limiting guide rail. The distance between the limiting guide rail and the inner wall of the heat dissipation surface is greater than the total thickness of the motherboard and the heat conductor. When the limiting guide rail guides the motherboard into the accommodating cavity of the housing, the motherboard is located below the limiting guide rail. When the limiting guide rail abuts against the first surface of the motherboard to guide the movement direction of the motherboard, a gap is left between the heat conductor bonded to the second surface of the motherboard and the heat dissipation surface. When the motherboard is located in the accommodating cavity of the housing, the second side of the motherboard is bonded to the inner wall of the heat dissipation surface via the heat conductor.

2. The encoding device according to claim 1, characterized in that: The first surface of the motherboard is provided with a guide edge corresponding to the limiting guide rail, and a limiting block is provided at one end of the guide edge; When the motherboard enters the accommodating cavity of the housing until the limiting block abuts against the limiting guide rail, the motherboard moves toward the heat dissipation surface, and the heat conductor abuts against the inner wall of the heat dissipation surface of the housing.

3. The encoding device according to claim 1, characterized in that: A chip is provided on the second side of the motherboard, the heat conductor is bonded to the chip, and the distance between the limiting guide rail and the inner wall of the heat dissipation surface is greater than the total thickness of the motherboard, the chip and the heat conductor.

4. The encoding device according to any one of claims 1-3, characterized in that: The heat conductor is a viscous thermally conductive silicone gel.

5. The encoding device according to any one of claims 1-3, characterized in that: The housing is provided with a first cover and a second cover at its two ends respectively; the first end of the motherboard is provided with at least one first communication interface and / or at least one button, and the second end of the motherboard is provided with at least one second communication interface; The first cover is provided with a first limiting opening that matches the first communication interface and / or the button, and the second cover is provided with at least one second limiting opening that matches the second communication interface; the motherboard is snapped into the first limiting opening through the first communication interface and / or the button, and the second communication interface is snapped into the second limiting opening, and fixed in the accommodating cavity.

6. The encoding device according to claim 5, characterized in that: The motherboard includes a board body, a chip, and a display screen; the display screen and the chip are disposed on the board body; the display screen is connected to the chip; the display screen is used to display a status screen indicating the working status of the encoder, and the housing or the first cover has a first light-transmitting part on the side corresponding to the display screen, through which the display screen displays the status screen.

7. The encoding device according to claim 6, characterized in that: The inner wall of the housing is provided with a plurality of connecting parts; the first cover and the second cover are respectively provided with a plurality of connecting holes; the first cover and the second cover are respectively bolted to the connecting parts of the housing through the connecting holes and fixed at both ends of the housing.

8. The encoding device according to claim 7, characterized in that: The connecting part includes a limiting connecting part located between the limiting guide rail and the heat dissipation surface, and the thickness of the heat conductor is greater than or equal to the height of the limiting connecting part.

9. The encoding device according to claim 7, characterized in that: Each of the aforementioned connecting parts has a notch facing the motherboard.

10. The encoding device according to claim 5, characterized in that: The motherboard includes a board body, a chip, and an indicator light group. The indicator light group is disposed on both sides of the board body. The indicator light group is connected to the chip and is used to emit status lights indicating the working status of the encoder. The housing has a second light-transmitting part on one side corresponding to the indicator light group, and the indicator light group displays the status lights through the second light-transmitting part.

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