Substrate structure and LED lamp bead comprising same
By rearranging the die-bonding and wire-bonding areas and increasing the die-bonding pad area, the common cathode and common anode switching is achieved, solving the versatility and heat dissipation problems of the existing substrate structure and improving the production efficiency and lifespan of LED chips.
Patent Information
- Application Number
- CN202520305604.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-25
AI Technical Summary
The existing substrate structure cannot achieve common cathode and common anode compatibility, resulting in poor LED chip structure diversity, serious heat dissipation problems, and is not conducive to high-efficiency and highly standardized production operations.
By rearranging the die-bonding and wire-bonding areas, setting up multiple pin and pad assemblies, increasing the die-bonding pad area, and achieving common cathode and common anode switching through different arrangements of RGB chips, the airtightness and heat dissipation of the LEDs are improved.
This enables diverse LED chip structures and high-efficiency production, enhances heat dissipation, extends chip lifespan, and meets diverse customer needs.
Smart Images
Figure CN223872692U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED technology, and in particular to a substrate structure and an LED lamp bead containing the substrate structure. Background Technology
[0002] As LED RGB displays gradually move towards higher resolution, higher brightness, and longer lifespan, the pixel pitch of LED displays continues to shrink, and the pixels become denser. As a result, energy consumption of the displays increases, and energy saving becomes more and more important. Therefore, in the era of micro-pitch below P1.0, the technical routes of common cathode technology and common anode technology have emerged.
[0003] Compared to common anode technology, common cathode technology, which has greater energy-saving advantages, has also attracted further attention from the industry. Common anode LED displays typically supply a uniform voltage to the RGB chips. However, due to the characteristics of each RGB chip, their voltage requirements are different, resulting in significant power loss. Common cathode LED displays supply power according to the actual voltage required by the RGB chips, resulting in less power loss and a corresponding reduction in the heat generated during LED display operation. Based on precise power supply, common cathode technology can reduce system power consumption, reduce excess heat loss, lower screen temperature, and reduce the probability of LED damage by reducing the supply voltage to the red LED chip, thereby improving the stability and reliability of the entire display system.
[0004] In the existing technology, the existing substrate structure cannot achieve common cathode and common anode compatibility, resulting in diverse LED chip structures. This is not conducive to the current high-efficiency and highly standardized production operation methods, and it is not convenient to adjust according to customer needs. In addition, the existing chip structure has a small metal area, and the heat dissipation problem of the chip will reduce the chip life regardless of whether it is common anode or common cathode. Utility Model Content
[0005] Therefore, the purpose of this utility model is to provide a substrate structure and LED beads containing the substrate structure, which can effectively solve the shortcomings of the prior art.
[0006] A substrate structure includes a carrier, a pin assembly disposed at the bottom of the carrier, and a pad assembly disposed at the top of the carrier and electrically connected to the pin assembly. The pin assembly includes a first pin, a second pin, a third pin, and a fourth pin disposed at the bottom of the carrier. The pad assembly includes a die-bonding pad structure disposed at the top of the carrier and wire bonding pad structures disposed on both sides of the die-bonding pad structure. The die-bonding pad structure includes a first die-bonding pad disposed at the top of the carrier and electrically connected to the first pin, a second die-bonding pad electrically connected to the third pin, and a third die-bonding pad electrically connected to the second pin. The wire bonding pad structure includes a first wire bonding pad disposed on the side of the first die-bonding pad facing the fourth pin and electrically connected to the fourth pin, a second wire bonding pad connected to the side of the second die-bonding pad and electrically connected to the third pin, and a third wire bonding pad disposed on the side of the second die-bonding pad away from the second wire bonding pad and connected to the third die-bonding pad.
[0007] Furthermore, ink for covering metallic colors is provided at the four corners of the top of the carrier.
[0008] Furthermore, a MARK point is provided at the bottom of the carrier, and the MARK point is located between the first pin and the second pin.
[0009] Furthermore, electroplated leads are connected to the first bonding pad and the second bonding pad on the side away from the second die bond pad.
[0010] Furthermore, a through hole is provided at the bottom of the carrier, and the through hole is located on the side of the first pin, the second pin, the third pin, and the fourth pin away from the center of the bottom of the carrier.
[0011] On the other hand, this utility model also proposes an LED lamp bead, including the above-mentioned substrate structure and an RGB component disposed on the top of the die bond pad structure.
[0012] Furthermore, the RGB component includes an R chip, a G chip, and a B chip respectively disposed on the die bond pad structure. The R chip, the G chip, and the B chip are electrically connected to the wire bond pad structure via bonding wires. Each of the R chip, the G chip, and the B chip is provided with a solder ball structure for connecting the bonding wires. Conductive adhesive is disposed on the bottom of the R chip.
[0013] Furthermore, a sealant is provided on the top of the carrier, and the sealant covers the top of the carrier.
[0014] Compared with the prior art, the beneficial effects of this utility model are: by setting a first die-bonding pad electrically connected to the first pin, a second die-bonding pad electrically connected to the third pin, a third die-bonding pad electrically connected to the second pin, a first wire bonding pad electrically connected to the fourth pin, a second wire bonding pad electrically connected to the third pin, and a third wire bonding pad connected to the third die-bonding pad, the die-bonding area and the wire bonding area are rearranged, and the die-bonding area is RGB separated, which can improve the airtightness of the LED chip. Furthermore, by arranging the RGB chips in different orders... The connection method of the LED chip is adjusted using the first, second, and third die-bonding pads to achieve common cathode and common anode switching, resulting in diverse LED chip structures. This is beneficial for the current high-efficiency and highly standardized production process and allows for adjustments to meet customer needs. Furthermore, by setting the first die-bonding pad to be electrically connected to the first pin, the first die-bonding pad does not need to have an additional bonding area for electrical connection to the first pin. This increases the area of the first die-bonding pad, thereby increasing the metal area of the LED chip structure, enhancing heat dissipation, and extending the lifespan of the LED chip. Attached Figure Description
[0015] Figure 1 This is a top view of the substrate structure in an embodiment of the present invention;
[0016] Figure 2 This is a bottom view of the substrate structure in an embodiment of the present invention;
[0017] Figure 3 This is a cross-sectional schematic diagram of the LED beads in an embodiment of this utility model;
[0018] Figure 4 This is a top view of the LED beads in Embodiment 1 of this utility model;
[0019] Figure 5 This is a top view of the LED beads in Embodiment 2 of this utility model.
[0020] Explanation of key component symbols:
[0021] carrier 10 Third die bond pad 33 ink 11 First bonding pad 41 MARK point 12 Second bonding pad 42 Electroplated leads 13 Third bonding pad 43 Through hole 14 R chip 51 First pin 21 G chip 52 Second pin 22 B chip 53 Third pin 23 bond wire 54 fourth pin 24 solder ball structure 55 First die bond pad 31 conductive adhesive 56 Second die bond pad 32 sealant 61
[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0023] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0024] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0026] Example 1
[0027] Please see Figures 1 to 3 This utility model provides a substrate structure and an LED bead containing the substrate structure, including a substrate structure and an RGB component disposed on top of the die-bonding pad structure. The substrate structure includes a carrier 10, a pin assembly disposed at the bottom of the carrier 10, and a pad assembly disposed on the top of the carrier 10 and electrically connected to the pin assembly. The pin assembly includes a first pin 21, a second pin 22, a third pin 23, and a fourth pin 24 disposed at the bottom of the carrier 10. The pad assembly includes a die-bonding pad structure disposed on the top of the carrier 10 and wire bonding pad structures disposed on both sides of the die-bonding pad structure. The die-bonding pad structure includes a row of... A first die bond pad 31 electrically connected to the first pin 21, a second die bond pad 32 electrically connected to the third pin 23, and a third die bond pad 33 electrically connected to the second pin 22 are arranged on the top of the carrier 10. The wire bond pad structure includes a first wire bond pad 41 disposed on the side of the first die bond pad 31 facing the fourth pin 24 and electrically connected to the fourth pin 24, a second wire bond pad 42 connected on the side of the second die bond pad 32 and electrically connected to the third pin 23, and a third wire bond pad 43 disposed on the side of the second die bond pad 32 away from the second wire bond pad 42 and connected to the third die bond pad 33.
[0028] Understandably, by setting a first die-bonding pad 31 electrically connected to the first pin 21, a second die-bonding pad 32 electrically connected to the third pin 23, a third die-bonding pad 33 electrically connected to the second pin 22, a first wire bonding pad 41 electrically connected to the fourth pin 24, a second wire bonding pad 42 electrically connected to the third pin 23, and a third wire bonding pad 43 connected to the third die-bonding pad 33, the die-bonding area and wire bonding area are rearranged, and the die-bonding area is separated into RGB, which can improve the airtightness of the LED. Furthermore, by setting the first die-bonding pad 31 electrically connected to the first pin 21, the first die-bonding pad 31 does not need to have an additional wire bonding area electrically connected to the first pin 21, thereby increasing the area of the first die-bonding pad 31, achieving the effect of increasing the metal area of the LED structure, thereby enhancing heat dissipation and increasing the lifespan of the LED.
[0029] Furthermore, ink 11 for covering metallic colors is provided at the four corners of the top of the carrier 10.
[0030] Understandably, by setting the ink 11, the metallic color can be covered, increasing the ink color consistency of the LED beads, and at the same time facilitating the bonding of the packaging.
[0031] Furthermore, a MARK point 12 is provided at the bottom of the carrier 10, and the MARK point 12 is located between the first pin 21 and the second pin 22.
[0032] Understandably, by setting the MARK point 12, the machine vision system can identify and locate components, ensuring that they can be accurately mounted to the designated positions.
[0033] Furthermore, electroplated leads 13 are connected to the side of the first bonding pad 41 and the second bonding pad 42 away from the second die bond pad 32.
[0034] It is understandable that by setting the electroplating lead 13, this utility model can be connected to other chips through the electroplating lead 13, and can play a conductive role during electroplating.
[0035] Furthermore, a through hole 14 is provided at the bottom of the carrier 10. The through hole 14 is located on the side of the first pin 21, the second pin 22, the third pin 23 and the fourth pin 24 away from the center of the bottom of the carrier 10.
[0036] It is understandable that by providing the through hole 14 on the side of the first pin 21, the second pin 22, the third pin 23, and the fourth pin 24 away from the bottom center of the carrier 10, the through hole 14 enables the front metal portion and the back metal portion of the first pin 21, the second pin 22, the third pin 23, and the fourth pin 24 to be connected and conduct electricity.
[0037] Furthermore, the RGB component includes an R chip 51, a G chip 52, and a B chip 53 respectively disposed on the die bond pad structure. The R chip 51, the G chip 52, and the B chip 53 are electrically connected to the wire bond pad structure via bonding wires 54. Each of the R chip 51, the G chip 52, and the B chip 53 is provided with a solder ball structure 55 for connecting the bonding wires 54. Conductive adhesive 56 is disposed at the bottom of the R chip 51.
[0038] Please see Figure 4 In this embodiment, the R chip 51 is disposed on the top of the first die bond pad 31 and electrically connected to the first die bond pad 31 through the conductive adhesive 56 at the bottom and electrically connected to the third wire bond pad 43 through the bonding wire 54; in this embodiment, the G chip 52 is disposed on the top of the second die bond pad 32 and electrically connected to the third wire bond pad 43 and the fourth pin 24 through the bonding wire 54 respectively; in this embodiment, the B chip 53 is disposed on the top of the third die bond pad 33 and electrically connected to the third wire bond pad 43 and the third pin 23 through the bonding wire respectively. This arrangement enables the LED to achieve a common anode.
[0039] Furthermore, a sealant 61 is provided on the top of the carrier 10, and the sealant 61 covers the top of the carrier 10.
[0040] Example 2
[0041] Please see Figure 5 A substrate structure and an LED bead containing the substrate structure are disclosed, which differ from the substrate structure and LED bead containing the substrate structure in that:
[0042] In this embodiment, the B chip 53 is disposed on the top of the first die bond pad 31 and electrically connected to the third wire bond pad 43 and the first die bond pad 31 via the bonding wire 54; in this embodiment, the G chip 52 is disposed on the top of the second die bond pad 32 and electrically connected to the third wire bond pad 43 and the fourth pin 24 via the bonding wire 54; in this embodiment, the R chip 51 is disposed on the top of the third die bond pad 33 and electrically connected to the third die bond pad 33 via the conductive adhesive 56 at the bottom and electrically connected to the second wire bond pad 42 via the bonding wire 54. This arrangement enables the lamp bead to achieve a common cathode.
[0043] Understandably, by arranging RGB chips in different orders on the first, second, and third die-bonding pads, the connection method of the LED beads can be adjusted to achieve common cathode and common anode switching. This makes the LED bead structure more diverse, which is conducive to the current high-efficiency and highly standardized production operation and makes it easier to adjust according to customer needs.
[0044] In summary, the substrate structure and LED beads containing the substrate structure in the above embodiments of this utility model, by setting a first die-bonding pad electrically connected to the first pin, a second die-bonding pad electrically connected to the third pin, a third die-bonding pad electrically connected to the second pin, a first wire bonding pad electrically connected to the fourth pin, a second wire bonding pad electrically connected to the third pin, and a third wire bonding pad connected to the third die-bonding pad, rearranges the die-bonding area and wire bonding area, and separates the RGB in the die-bonding area, which can improve the airtightness of the LED beads, and can also improve the airtightness of the LED beads by arranging the RGB chips in a non-linear fashion. The connection method of the LED chips is adjusted by arranging the first, second, and third die-bonding pads in the same order, realizing the switching between common cathode and common anode, which makes the LED chip structure more diverse. This is conducive to the current high-efficiency and highly standardized production operation, and it is easy to adjust according to customer needs. In addition, by setting the first die-bonding pad electrically connected to the first pin, the first die-bonding pad does not need to set an additional bonding area to electrically connect to the first pin. This can increase the area of the first die-bonding pad, thereby increasing the metal area of the LED chip structure, which in turn enhances heat dissipation and increases the life of the LED chip.
[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0046] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A substrate structure, characterized in that, The device includes a carrier, a pin assembly disposed at the bottom of the carrier, and a pad assembly disposed at the top of the carrier and electrically connected to the pin assembly. The pin assembly includes a first pin, a second pin, a third pin, and a fourth pin disposed at the bottom of the carrier. The pad assembly includes a die-bonding pad structure disposed at the top of the carrier and wire bonding pad structures disposed on both sides of the die-bonding pad structure. The die-bonding pad structure includes a first die-bonding pad disposed at the top of the carrier and electrically connected to the first pin, a second die-bonding pad electrically connected to the third pin, and a third die-bonding pad electrically connected to the second pin. The wire bonding pad structure includes a first wire bonding pad disposed on the side of the first die-bonding pad facing the fourth pin and electrically connected to the fourth pin, a second wire bonding pad connected to the side of the second die-bonding pad and electrically connected to the third pin, and a third wire bonding pad disposed on the side of the second die-bonding pad away from the second wire bonding pad and connected to the third die-bonding pad.
2. The substrate structure according to claim 1, characterized in that, The four corners of the top of the carrier are provided with ink for covering metallic colors.
3. The substrate structure according to claim 1, characterized in that, A MARK point is also provided at the bottom of the carrier, and the MARK point is located between the first pin and the second pin.
4. The substrate structure according to claim 1, characterized in that, Electroplated leads are connected to the first bonding pad and the second bonding pad on the side away from the second die bond pad.
5. The substrate structure according to claim 1, characterized in that, A through hole is also provided at the bottom of the carrier, and the through hole is located on the side of the first pin, the second pin, the third pin and the fourth pin away from the center of the bottom of the carrier.
6. An LED lamp bead, characterized in that, It includes the substrate structure as described in any one of claims 1-5 and the RGB component disposed on top of the die bond pad structure.
7. The LED lamp bead according to claim 6, characterized in that, The RGB component includes an R chip, a G chip, and a B chip respectively disposed on the die bond pad structure. The R chip, the G chip, and the B chip are electrically connected to the wire bond pad structure via bonding wires. Each of the R chip, the G chip, and the B chip is provided with a solder ball structure for connecting the bonding wires. Conductive adhesive is disposed on the bottom of the R chip.
8. The LED lamp bead according to claim 7, characterized in that, A sealant is also provided on the top of the carrier, and the sealant covers the top of the carrier.