Etching tank structure capable of reducing bubbles of etching liquid medicine
By introducing acute-angled outer and inner groove guide plates into the etching tank structure, and arranging staggered through holes, the problem of bubbles caused by high etching solution flow rate is solved, achieving efficient bubble elimination and improved etching accuracy, which is suitable for the semiconductor manufacturing industry.
Patent Information
- Application Number
- CN202520449207.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-14
AI Technical Summary
In the wet etching process of semiconductor packaging manufacturing, the high flow rate of the etching solution leads to the generation of bubbles. These bubbles enter the etching tank and affect the etching effect and uniformity. Existing technologies cannot effectively reduce bubbles without changing the flow rate of the etching solution.
Design an etching tank structure including an outer tank and an inner tank. The outer tank guide plate and the inner tank guide plate form an acute angle. The outer tank guide plate and the inner tank guide plate are provided with staggered through holes. The guide plate is made of stainless steel and is used to discharge air bubbles.
With a bubble reduction rate of ≥90%, improved etching precision, stable solution flow rate, low modification cost, and convenient maintenance, it is suitable for high-precision semiconductor wet etching processes.
Smart Images
Figure CN223872712U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor technical field, concretely is a kind of etching tank structure for reducing etching liquid bubble. BACKGROUND
[0002] In the gold bump process of semiconductor package manufacturing industry liquid crystal screen driving chip, the conventional process is sputtering bump barrier layer (UBM, under bump metal) after, with photoresist process definition bump position, via chemical electroplating or electroless plating gold is deposited on wafer type into gold bump, again by wet etching photoresist and excess bump barrier layer is removed.And in this wet etching process, it is by etching liquid in etching tank circulation to achieve the purpose of removing photoresist and excess bump barrier layer.
[0003] As shown in Figure Figure 1 Gold bump manufacturing process is taken as an example, and the main process is as follows:
[0004] Incoming material→① sputtering→② photoresist coating→③ exposure→④ development→⑤ gold plating bump→⑥ photoresist removal→⑦ plasma treatment→⑧ gold etching→⑨ titanium tungsten etching→⑩ toughening:
[0005] Among them, development, photoresist removal, gold etching and titanium tungsten etching are etching tank processes, and bubbles will be generated in the circulation process of etching liquid in the etching tank. The bubbles also enter the inner tank along the circulation pipeline. The bubbles entering the inner tank cannot completely contact the product surface in the inner tank, resulting in reduced etching effect. At the same time, the movement of bubbles in the etching tank will affect the uniformity and precision of etching. Bubble generation is mainly due to high flow rate of etching liquid. In the etching tank process, the flow rate of the liquid has requirements, and the flow rate of the etching liquid cannot be reduced to reduce bubbles. Therefore, how to reduce the bubbles in the etching liquid without changing the flow rate of the etching liquid is a technical problem to be solved. UTILITY MODEL CONTENTS
[0006] The problem to be solved is to reduce the bubbles in the etching liquid without changing the flow rate of the etching liquid.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: an etching tank structure for reducing etching liquid bubbles, comprising an outer tank wall and an inner tank wall, an outer tank between the outer tank wall and the inner tank wall, and a space inside the inner tank wall as an inner tank. An outer tank guide plate is arranged above the outer tank, and the outer tank guide plate is connected with the inner tank wall. An included angle between the outer tank guide plate and the inner tank wall is an acute angle. An inner tank guide plate is arranged in the inner tank and located above the inner tank inlet. A plurality of through holes are arranged on the inner tank guide plate.
[0008] The outer tank guide plate and the inner tank guide plate are both used for discharging bubbles in the etching liquid.
[0009] Preferably, the plurality of through holes are staggered on the inner groove guide plate.
[0010] The path of the etching liquid is increased, and air bubbles can be fully discharged.
[0011] Preferably, the density of the staggered arrangement can be 2-5 holes per square centimeter.
[0012] Preferably, the outer groove and the inner groove are connected through a circulating pipeline.
[0013] Preferably, the material of the outer groove guide plate and the inner groove guide plate is stainless steel.
[0014] Stainless steel is corrosion-resistant.
[0015] Preferably, the acute angle formed between the outer groove guide plate and the inner groove wall is 60-75°.
[0016] Air bubbles generated by fast liquid flow are reduced.
[0017] Preferably, the diameter of the through hole is 6-8mm, and the distance between adjacent through holes is 2-4mm.
[0018] Preferably, the outer groove guide plate and the inner groove wall are welded, and the distance between the connection point of the outer groove guide plate and the inner groove wall and the top end of the inner groove wall is 8-12cm.
[0019] Prevent etching liquid from spilling out of the outer groove.
[0020] Preferably, the outer groove guide plate and the inner groove wall are detachably connected, and the distance between the connection point of the outer groove guide plate and the inner groove wall and the top end of the inner groove wall is 8-12cm.
[0021] Preferably, the outer groove guide plate is detachably connected to the inner groove wall through a plurality of connecting pieces, and the outer groove guide plate is integrally formed with a vertical support plate, and the support plate is clamped into the clamping groove of the connecting piece.
[0022] Convenient to disassemble and maintain.
[0023] Compared with the prior art, the etching tank structure for reducing etching liquid bubbles has the following beneficial effects:
[0024] High bubble elimination efficiency: through the design that the inclination angle of the outer groove guide plate is an acute angle, the bubble reduction rate is ≥90%;
[0025] Significant improvement of etching precision: the inner groove guide plate reduces air bubbles while stabilizing the inner groove liquid flow rate at 0.8-1.5m / s;
[0026] Low transformation cost: based on the existing tank transformation, no need to replace etching tank, cost reduction 70%;
[0027] Strong durability: the guide plate is made of stainless steel material, excellent corrosion resistance;
[0028] Convenient maintenance: the outer tank guide plate can be detachably designed with a clamping groove connection, and the replacement efficiency is improved by 50%. BRIEF DESCRIPTION OF DRAWINGS
[0029] Figure 1 The process flowchart is related to the utility model;
[0030] Figure 2 The etching tank body structure schematic diagram is in the prior art;
[0031] Figure 3 The etching tank body top view is of the utility model;
[0032] Figure 4 The Figure 3 Front view of A in the middle;
[0033] Figure 5 The Figure 4 Enlarged view of B in the middle;
[0034] Figure 6 The connecting piece schematic diagram is related to the utility model;
[0035] Mark explanation: 1, outer tank wall; 2, inner tank wall; 3, outer tank; 31, outer tank inlet one; 32, outer tank inlet two; 4, inner tank; 41, inner tank inlet; 5, outer tank guide plate; 51, support plate; 6, inner tank guide plate; 61, through hole; 7, connecting piece; 71, longitudinal part one; 72, transverse part; 73, longitudinal part two; 74, clamping groove; 8, bolt. DETAILED DESCRIPTION
[0036] The technical scheme in the embodiments of the utility model will be described below with reference to the drawings in the embodiments of the utility model:
[0037] Figure 2 The structure of the etching tank body in the prior art, a large number of bubbles are retained in the inner tank 4 when the product is operated, the liquid level of the outer tank 3 is raised, so that the bubbles enter the inner tank 4, and at the same time, the bubbles also enter the inner tank 4 along the circulating pipeline, the bubbles entering the inner tank 4 are retained in the inner tank 4, so that the etching solution cannot completely contact the product surface, resulting in reduced etching effect, and the movement of the bubbles in the etching tank affects the uniformity and precision of etching, improves the performance and stability of the etching tank. In order to solve the above technical problems, the utility model is improved on the basis of the etching tank body structure, Figure 2 The etching tank body structure can effectively reduce or even eliminate the generation and retention of bubbles of the etching solution in the etching tank circulation process,
[0038] As Figure 3 , Figure 4 shown, the utility model discloses a kind of etching tank structures for reducing etching liquid bubble, including outer tank wall 1 and inner tank wall 2, outer tank wall 1 and inner tank wall 2 between for outer tank 3, the space inside inner tank wall 2 is inner tank 4, etching liquid is circulated between outer tank 3, inner tank 4 by circulation pipeline, circulation pipeline is connected outer tank 3 with inner tank entrance 41, outer tank 3 is equipped with outer tank entrance one 31 and outer tank entrance two 32, outer tank entrance one 31 and outer tank entrance two 32 connect external etching liquid;On the basis of above structure, we have increased outer tank baffle 5 and inner tank baffle 6, outer tank baffle 5 and inner tank baffle 6 are all used for discharging bubble in etching liquid;The material of outer tank baffle 5 and inner tank baffle 6 is stainless steel. Outer tank baffle 5 is located above outer tank 3 and outer tank baffle 5 is connected with inner tank wall 2 outside, considering stable, outer tank baffle 5 and inner tank wall 2 adopt the mode of welding;As Figure 3 shown, inner tank wall 2 is all equipped with outer tank baffle 5 around, outer tank baffle 5 has four, and outer tank baffle 5 and inner tank wall 2 form an acute angle α between, as Figure 4 shown, acute angle α is 60 ° ~ 75 °;Inner tank baffle 6 is set in inner tank 4 and inner tank baffle 6 covers above inner tank 4 entrance, i.e. as Figure 3 shown, inner tank baffle 6 covers inner tank entrance 41, and this is conducive to etching liquid to overflow inner tank baffle 6;Inner tank baffle 6 is equipped with several through holes 61, several through holes 61 are staggered on inner tank baffle 6, and the density of through hole 61 staggered arrangement can be 2-5 holes per square centimeter;The diameter range of through hole 61 is 6mm-8mm, and the distance between adjacent through holes 61 is 2mm-4mm, which increases the distance of liquid on the premise of not affecting liquid flow rate, and can fully discharge bubble.
[0039] As Figure 4 shown, the width of outer tank 3 is d, and the projection length of outer tank baffle 5 on horizontal plane is generally 0.5d, so we need to pay attention to not too long when selecting outer tank baffle 5, also not too short, as shown in the figure, the length of outer tank baffle 5 is The distance between the connecting point of outer tank baffle 5 and inner tank wall 2 and the top end of inner tank wall 2 is h, and the range of h is generally 8cm-12cm, so that the liquid flowing out of inner tank 4 flows along inner tank wall 2 and then flows to outer tank baffle 5, avoiding the flowing liquid splashing out of outer tank 3, and inner tank baffle 6 is as full as possible in inner tank 4.
[0040] As Figure 5 , Figure 6As shown, the outer groove guide plate 5 and the inner groove wall 2 can also be detachably connected, which facilitates maintenance and replacement of parts, and the specific implementation is that the outer groove guide plate 5 is detachably connected with the inner groove wall 2 through a plurality of connecting pieces 7, the outer groove guide plate 5 is integrally formed with a vertical support plate 51 close to the inner groove wall 2, the support plate 51 is clamped into a clamping groove 74 of the connecting piece 7, the connecting piece 7 is connected with the inner groove wall 2 through a bolt 8, the connecting piece 7 comprises a longitudinal portion one 71, a transverse portion 72 and a longitudinal portion two 73, the clamping groove 74 is arranged between the longitudinal portion one 71, the transverse portion 72 and the longitudinal portion two 73, and a through hole is arranged on the longitudinal portion one 71 for the bolt 8 to pass through.
[0041] In use, the liquid medicine flows into the outer groove 3 through the outer groove inlet one 31 and the outer groove inlet two 32, is guided through a circulating pipeline and then enters the inner groove 4, the liquid medicine in the inner groove 4 overflows the inner groove wall 2 and then flows back to the outer groove 3 through the outer groove guide plate 5, and the bubbles are eliminated after passing through the outer groove guide plate 5 and then flow back to the inner groove 4; the inner groove guide plate 6 in the inner groove 4 disperses and guides the liquid medicine flowing out of the inner groove inlet 41, and the bubbles are eliminated after passing through the inner groove guide plate 6 to realize bubble-free etching operation.
[0042] The utility model discloses a groove body structure for efficiently reducing bubbles in etching groove through the collaborative design of the outer groove inclined guide plate and the inner groove porous guide plate. The outer groove guide plate guides the bubbles to concentrate and discharge at an acute angle of 60°-75°, and the inner groove guide plate disperses the liquid medicine through large-diameter staggered through holes and prolongs the liquid medicine path. Under the premise of maintaining the liquid medicine flow rate at 0.8-1.5 m / s, the bubble reduction rate is ≥90%, and the guide plate is made of stainless steel and is corrosion-resistant, which is suitable for large-scale industrial application of high-precision semiconductor wet etching process.
[0043] The above-mentioned embodiments are only part of the embodiments of the utility model, but not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
Claims
1. An etching tank structure for reducing air bubbles in etching solution, comprising an outer tank wall (1) and an inner tank wall (2), wherein the space between the outer tank wall (1) and the inner tank wall (2) is an outer tank (3), and the space inside the inner tank wall (2) is an inner tank (4), characterized in that: An outer channel guide plate (5) is provided above the outer channel (3) and the outer channel guide plate (5) is connected to the inner channel wall (2). An acute angle is formed between the outer channel guide plate (5) and the inner channel wall (2). An inner channel guide plate (6) is provided in the inner channel (4) and the inner channel guide plate (6) is located above the inlet of the inner channel (4). Several through holes (61) are provided on the inner channel guide plate (6).
2. The etching tank structure for reducing air bubbles in the etching solution according to claim 1, characterized in that: The plurality of through holes (61) are arranged alternately on the inner groove guide plate (6).
3. The etching tank structure for reducing air bubbles in the etching solution according to claim 2, characterized in that: The density of the staggered arrangement can be 2-5 pores per square centimeter.
4. The etching tank structure for reducing air bubbles in the etching solution according to claim 1, characterized in that: The outer tank (3) and the inner tank (4) are connected by a circulation pipeline.
5. The etching tank structure for reducing air bubbles in the etching solution according to claim 1, characterized in that: The outer trough guide plate (5) and the inner trough guide plate (6) are made of stainless steel.
6. The etching tank structure for reducing air bubbles in the etching solution according to claim 1, characterized in that: The acute angle formed between the outer tank guide plate (5) and the inner tank wall (2) is 60-75°.
7. The etching tank structure for reducing etching solution bubbles according to claim 1, characterized in that: The diameter of the through hole (61) is 6-8 mm, and the distance between adjacent through holes (61) is 2-4 mm.
8. The etching tank structure for reducing etching solution bubbles according to claim 1, characterized in that: The outer tank guide plate (5) is welded to the inner tank wall (2), and the distance between the connection point of the outer tank guide plate (5) and the inner tank wall (2) and the top of the inner tank wall (2) is 8-12cm.
9. The etching tank structure for reducing air bubbles in the etching solution according to claim 1, characterized in that: The outer channel guide plate (5) is detachably connected to the inner channel wall (2), and the distance between the connection point of the outer channel guide plate (5) and the inner channel wall (2) and the top of the inner channel wall (2) is 8cm-12cm.
10. The etching tank structure for reducing etching solution bubbles according to claim 9, characterized in that: The outer trough guide plate (5) is detachably connected to the inner trough wall (2) through multiple connectors (7). The outer trough guide plate (5) is integrally formed with a vertical support plate (51), which is inserted into the slot (74) of the connector (7).