Novel high-cleanliness wafer box

Abstract

The utility model discloses a novel high-cleanliness wafer box, which relates to the technical field of wafers and comprises a wafer, the surface of the wafer is provided with a wafer box assembly, and the inside of the wafer box assembly is provided with a dismounting mechanism. According to the utility model, the wafer is placed in the storage groove of the wafer box body, the storage groove of the wafer box body is arc-shaped, so that only the edge of the wafer is in contact with the wafer box body, pollutants attached to the surface of the wafer are reduced, at the moment, the connecting plate is placed on the surface, then the cover body is placed on the surface of the wafer box body, and the bump II is aligned with the cover body; when the second protruding block makes contact with the cover body, the cover body slightly deforms until the bottom end of the second protruding block makes contact with the wafer box body to complete clamping and closing, at the moment, the bottom end of the cover body is pressed downwards to enable the pressing plate to cover the wafer, the wafer is limited under the condition that only the edge of the wafer is in contact, and the adaptability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, specifically to a novel high-cleanliness wafer cassette. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot is formed into a silicon wafer. During transportation, wafer cassettes serve to carry and protect it.

[0003] Patent publication number CN218827019U discloses a single-wafer cassette, which includes a cassette body and a cassette cover, which are movably connected. The cassette body has a first accommodating space, in which a placement area for placing wafers is provided. The placement area has a certain depth from its outer periphery to the top surface of the cassette body. The inner diameter of the first accommodating space is adapted to the outer diameter of the wafers. The placement area is gradually recessed from its outer periphery toward the bottom surface of the first accommodating space. The cassette body is provided with a material handling port.

[0004] To address the issue of inconvenience in removing and placing wafers from the housing, existing technology involves creating a first accommodating space within the housing and a placement area within that space. When storing wafers in the housing, the wafers are placed horizontally in the placement area. By matching the inner diameter of the first accommodating space with the outer diameter of the wafer, the wafers can be horizontally positioned. Simultaneously, the placement area gradually recesses from its outer perimeter towards the bottom surface of the first accommodating space, allowing it to be tilted and preventing large-area adhesion between the wafer and the surface of the placement area, which could lead to adhesion and difficulty in retrieving the wafer. This is achieved by setting a retrieval port on the housing, which extends upwards from the bottom surface of the first accommodating space through the placement area. However, this approach still results in excessive gaps and angles in the housing, making cleaning difficult and leading to the easy adhesion of unremoved contaminants to the wafers. Utility Model Content

[0005] The purpose of this invention is to provide a novel high-cleanliness wafer cassette to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] A novel high-cleanliness wafer cassette includes a wafer, a wafer cassette assembly is disposed on the surface of the wafer, and a disassembly mechanism is disposed inside the wafer cassette assembly.

[0008] The wafer cassette assembly includes a wafer cassette body, which is movably mounted on the surface of a wafer. The surface of the wafer cassette body is provided with a storage slot, which is adapted to the wafer. A protrusion is fixedly mounted on the surface of the wafer cassette body, and the outer side of the protrusion is set at an inclined angle.

[0009] A further improvement of this utility model is that: a cover is movably mounted on the surface of the wafer housing, and anti-slip blocks are fixedly mounted on the surface of the cover. Multiple sets of anti-slip blocks are provided, and the anti-slip blocks are evenly distributed on the surface of the cover.

[0010] A further improvement of the present invention is that: a second protrusion is fixedly installed at the bottom of the cover, the inner surface of the second protrusion is set at an inclined angle, the second protrusion is movably installed on the surface of the first protrusion, and the second protrusion is adapted to the first protrusion.

[0011] A further improvement of this utility model is that an inner ring is fixedly installed inside the cover, and the inner ring is adapted to the top width of the protrusion.

[0012] A further improvement of the present invention is that the wafer box assembly further includes a connecting plate, the connecting plate is movably installed at the bottom of the cover, and a pressure plate is fixedly installed on the surface of the connecting plate. Multiple sets of pressure plates are provided, and the pressure plates are evenly distributed on the surface of the connecting plate.

[0013] A further improvement of the present invention is that the disassembly mechanism includes a housing, the housing is fixedly installed inside the cover, the surface of the housing is provided with a communicating groove, the inside of the housing is fixedly installed with a sliding groove, the surface of the sliding groove is movably installed with a movable plate, the surface of the movable plate is movably installed with a limiting rod, and the surface of the limiting rod is sleeved with a spring.

[0014] A further improvement of this utility model is that: a push plate is fixedly installed at the bottom of the movable plate, the push plate is adapted to the connecting groove, and a button is fixedly installed on the surface of the push plate, the button extending to the surface of the cover.

[0015] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0016] 1. This utility model provides a novel high-cleanliness wafer cassette, employing a combination of wafers, a wafer cassette body, a first bump, a pressure plate, a cover, an anti-slip block, a connecting plate, a second bump, and an inner ring. The wafers are placed in the storage slot of the wafer cassette body, which is arc-shaped, ensuring that only the edges of the wafers contact the wafer cassette body, reducing contaminant adhesion to the wafer surface. The connecting plate is then placed on the surface of the wafer cassette body, followed by the cover, aligning the second bump with the cover. When the second bump contacts the cover, the cover undergoes a slight deformation until the bottom end of the second bump contacts the wafer cassette body, completing the locking and closing mechanism. At this time, the bottom of the cover is pressed down, causing the pressure plate to cover the wafer. The wafer is limited while only contacting the edge. At the same time, when the wafer cassette assembly is closed, the inner ring makes the inner side of the cover the same diameter as the inner side of the bump, which reduces gaps and increases the airtightness of the cassette. When it needs to be opened, the bump can be deformed by squeezing it through the disassembly mechanism, and the cover can be opened by holding it. The anti-slip block on the surface of the cover increases friction and prevents the cover from slipping out of your hand. This device ensures that there are no dead corners in the inner part that contacts the front side of the wafer, and it is not easy for dust particles to be retained during wafer cassette cleaning, which improves the adaptability of the device.

[0017] 2. This utility model provides a novel high-cleanliness wafer cassette, employing a combination of a shell, a sliding groove, a movable plate, a limiting rod, a spring, a push plate, a connecting groove, and a button. By placing the shell inside the cover, when the wafer cassette assembly needs to be opened, simply pressing the button causes the movable plate to slide inside the sliding groove. At this time, the limiting rod retracts into the movable plate, causing the movable plate to compress the spring. Simultaneously, the movable plate pushes the push plate to extend out of the connecting groove, compressing protrusion one, causing a portion of the protrusion to deform, thus separating protrusion two from protrusion one. Releasing the button then causes the spring to push the movable plate outward, resetting the button. In this device, the length of the button extending out of the cover is slightly higher than the anti-slip block, allowing the anti-slip block to block external objects from contacting the button, preventing the inner ring from being fully pressed down and preventing the cover from opening accidentally, thus improving the adaptability of the device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the closed three-dimensional structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the connecting plate of this utility model;

[0020] Figure 3 This is a schematic diagram of the wafer cassette assembly of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the second protrusion of this utility model;

[0022] Figure 5This is a schematic diagram of the disassembly mechanism of this utility model.

[0023] In the diagram: 1. Wafer; 2. Wafer box assembly; 201. Wafer box body; 202. Bump 1; 203. Pressure plate; 204. Cover; 205. Anti-slip block; 206. Connecting plate; 207. Bump 2; 208. Inner ring; 3. Disassembly mechanism; 301. Outer shell; 302. Slide groove; 303. Movable plate; 304. Limiting rod; 305. Spring; 306. Push plate; 307. Connecting groove; 308. Button. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to embodiments:

[0025] Example 1

[0026] like Figure 1-5 As shown, this utility model provides a novel high-cleanliness wafer cassette, including a wafer 1. A wafer cassette assembly 2 is disposed on the surface of the wafer 1. A disassembly mechanism 3 is disposed inside the wafer cassette assembly 2. The wafer cassette assembly 2 includes a wafer cassette body 201, which is movably mounted on the surface of the wafer 1. A storage slot is disposed on the surface of the wafer cassette body 201, which is adapted to the wafer 1. A protrusion 202 is fixedly mounted on the surface of the wafer cassette body 201, and the outer side of the protrusion 202 is set at an inclined angle. A cover 204 is movably mounted on the surface of the wafer cassette body 201, and an anti-slip block 205 is fixedly mounted on the surface of the cover 204. The anti-slip block 205 is configured to... Multiple sets of anti-slip blocks 205 are evenly distributed on the surface of the cover 204. A second protrusion 207 is fixedly installed at the bottom of the cover 204. The inner surface of the second protrusion 207 is set with an inclined angle. The second protrusion 207 is movably installed on the surface of the first protrusion 202. The second protrusion 207 is adapted to the first protrusion 202. An inner ring 208 is fixedly installed inside the cover 204. The inner ring 208 is adapted to the top width of the first protrusion 202. The wafer cassette assembly 2 also includes a connecting plate 206. The connecting plate 206 is movably installed at the bottom of the cover 204. A pressure plate 203 is fixedly installed on the surface of the connecting plate 206. Multiple sets of pressure plates 203 are provided. The pressure plates 203 are evenly distributed on the surface of the connecting plate 206.

[0027] In this embodiment, the wafer 1 is placed in the storage slot of the wafer housing 201. The storage slot of the wafer housing 201 is arc-shaped, so that only the edge of the wafer 1 contacts the wafer housing 201, reducing contaminants adhering to the surface of the wafer 1. At this time, the connecting plate 206 is placed on the surface, and then the cover 204 is placed on the surface of the wafer housing 201, so that the second bump 207 is aligned with the cover 204. When the second bump 207 contacts the cover 204, the cover 204 undergoes a slight deformation until the bottom end of the second bump 207 contacts the wafer housing 201 to complete the locking and closing. At this time, the bottom end of the cover 204 presses down, causing the pressure plate 203 to press against the wafer 1. The cover is used to limit the wafer 1 while only contacting the edge of the wafer 1. At the same time, when the wafer cassette assembly 2 is closed, the inner ring 208 makes the inner diameter of the cover 204 the same as the inner diameter of the bump 202. This reduces gaps and increases the airtightness of the cassette. When it needs to be opened, the bump 202 can be deformed by squeezing it through the disassembly mechanism 3, and the cover 204 can be opened by holding it. The anti-slip block 205 on the surface of the cover 204 can increase friction and prevent the cover 204 from slipping out of the hand. This device ensures that there are no dead corners in the inner part of the wafer front, and it is not easy for dust particles to be retained during wafer cassette cleaning, thus improving the adaptability of the device.

[0028] Example 2

[0029] like Figure 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the disassembly mechanism 3 includes a housing 301, which is fixedly installed inside the cover 204. A connecting groove 307 is provided on the surface of the housing 301. A sliding groove 302 is fixedly installed inside the housing 301. A movable plate 303 is movably installed on the surface of the sliding groove 302. A limiting rod 304 is movably installed on the surface of the movable plate 303. A spring 305 is sleeved on the surface of the limiting rod 304. A push plate 306 is fixedly installed at the bottom end of the movable plate 303. The push plate 306 is adapted to the connecting groove 307. A button 308 is fixedly installed on the surface of the push plate 306 and extends to the surface of the cover 204.

[0030] In this embodiment, by placing the outer shell 301 inside the cover 204, when the wafer cassette assembly 2 needs to be opened, only the button 308 needs to be pressed, causing the button 308 to push the movable plate 303 to slide inside the slide groove 302. At this time, the limiting rod 304 retracts into the movable plate 303 and causes the movable plate 303 to compress the spring 305. Simultaneously, the movable plate 303 pushes the push plate 306 to extend out of the connecting groove 307 to compress the first protrusion 202, causing a partial deformation of the first protrusion 202, thus separating the second protrusion 207 from the first protrusion 202. At this time, the button 308 is released, and the spring 305 pushes the movable plate 303 to move outward, causing the button 308 to reset. In this device, the length of the button 308 extending out of the cover 204 is slightly higher than the anti-slip block 205, so that when an external object comes into contact with the button 308, the anti-slip block 205 can block the object, preventing the inner ring 208 from being fully pressed down, preventing the cover 204 from being opened in case of accidental contact, and improving the adaptability of the device.

[0031] The working principle of this new high-cleanliness wafer cassette will be explained in detail below.

[0032] like Figure 1-5As shown, by placing the wafer 1 in the storage slot of the wafer housing 201, which is arc-shaped, the wafer 1 only has its edge in contact with the wafer housing 201, reducing contaminants adhering to the surface of the wafer 1. Then, the connecting plate 206 is placed on the surface, and the cover 204 is placed on the surface of the wafer housing 201, aligning the second bump 207 with the cover 204. When the second bump 207 contacts the cover 204, the cover 204 undergoes a slight deformation until the bottom end of the second bump 207 contacts the wafer housing 201, completing the engagement. When closed, the bottom of the cover 204 presses down, causing the pressure plate 203 to cover the wafer 1. This limits the wafer 1's position by only contacting its edge. Simultaneously, with the wafer housing assembly 2 closed, the inner ring 208 ensures that the inner diameter of the cover 204 is the same as the inner diameter of the protrusion 202, reducing gaps and increasing the internal airtightness of the housing. To open, the protrusion 202 is deformed by the disassembly mechanism 3, and the cover 204 can be opened by gripping it. The anti-slip block 205 on the surface of the cover 204 increases friction. To prevent the cover 204 from slipping out of your hand, this device ensures that there are no blind spots on the inner part of the wafer front side, making it less likely for dust particles to accumulate during wafer cassette cleaning. The outer casing 301 is located inside the cover 204. When it is necessary to open the wafer cassette assembly 2, simply press the button 308, causing the button 308 to push the movable plate 303 to slide inside the slide groove 302. At this time, the limiting rod 304 retracts into the movable plate 303, causing the movable plate 303 to compress the spring 305. Simultaneously, the movable plate 303 pushes the push plate 306 to extend the connecting groove 307 to the protrusion 202. By applying pressure, a portion of protrusion 202 deforms, separating protrusion 207 from protrusion 202. At this point, releasing button 308 causes spring 305 to push movable plate 303 outward, resetting button 308. In this device, the length of button 308 extending out of cover 204 is slightly higher than that of anti-slip block 205. This allows anti-slip block 205 to block external objects from contacting button 308, preventing the inner ring 208 from being fully pressed down and preventing cover 204 from opening due to accidental contact, thus improving the adaptability of the device.

[0033] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A novel high-cleanliness wafer cassette, comprising wafers (1), characterized in that: The wafer (1) is provided with a wafer box assembly (2) on its surface, and the wafer box assembly (2) is provided with a disassembly mechanism (3) inside its interior; The wafer cassette assembly (2) includes a wafer cassette body (201), which is movably mounted on the surface of the wafer (1). The surface of the wafer cassette body (201) is provided with a storage slot, which is adapted to the wafer (1). A bump (202) is fixedly mounted on the surface of the wafer cassette body (201), and the outer side of the bump (202) is set with an inclined angle.

2. The novel high-cleanliness wafer cassette according to claim 1, characterized in that: A cover (204) is movably mounted on the surface of the wafer housing (201), and anti-slip blocks (205) are fixedly mounted on the surface of the cover (204). Multiple sets of anti-slip blocks (205) are provided, and the anti-slip blocks (205) are evenly distributed on the surface of the cover (204).

3. The novel high-cleanliness wafer cassette according to claim 2, characterized in that: The bottom end of the cover (204) is fixedly installed with a second protrusion (207). The inner surface of the second protrusion (207) is set at an inclined angle. The second protrusion (207) is movably installed on the surface of the first protrusion (202). The second protrusion (207) is adapted to the first protrusion (202).

4. The novel high-cleanliness wafer cassette according to claim 2, characterized in that: An inner ring (208) is fixedly installed inside the cover (204), and the inner ring (208) is adapted to the top width value of the protrusion (202).

5. A novel high-cleanliness wafer cassette according to claim 2, characterized in that: The wafer box assembly (2) further includes a connecting plate (206), which is movably installed at the bottom of the cover (204). A pressure plate (203) is fixedly installed on the surface of the connecting plate (206). Multiple sets of pressure plates (203) are provided, and the pressure plates (203) are evenly distributed on the surface of the connecting plate (206).

6. A novel high-cleanliness wafer cassette according to claim 2, characterized in that: The disassembly mechanism (3) includes a housing (301), which is fixedly installed inside the cover (204). A connecting groove (307) is provided on the surface of the housing (301). A sliding groove (302) is fixedly installed inside the housing (301). A movable plate (303) is movably installed on the surface of the sliding groove (302). A limiting rod (304) is movably installed on the surface of the movable plate (303). A spring (305) is sleeved on the surface of the limiting rod (304).

7. A novel high-cleanliness wafer cassette according to claim 6, characterized in that: A push plate (306) is fixedly installed at the bottom of the movable plate (303). The push plate (306) is adapted to the connecting groove (307). A button (308) is fixedly installed on the surface of the push plate (306). The button (308) extends to the surface of the cover (204).

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