Radiator with multi-layer design structure

Abstract

The utility model discloses a radiator with a multilayer design structure, and relates to the technical field of heat radiation of electronic devices. An existing single-layer radiator is limited in heat exchange area, single in flow channel, prone to local overheating, incapable of being customized according to the size of a chip and low in heat dissipation efficiency. Therefore, the utility model provides a radiator with a multi-layer design structure, which is formed by welding the top layer, the outlet layer, the divided layer, the top layer and the bottom layer in sequence, and positioning columns at four corners are inserted into positioning holes, a diversion trench of the outlet layer is matched with a diversion trench tongue groove of the divided layer, and annular step surfaces of the top layer and the bottom layer are attached to each other. Complete circulation flow channels of cooling liquid in all layers are achieved, the contact area of a chip is maximized, heat is evenly conducted, the overall heat dissipation efficiency is improved by 50% compared with a traditional single layer, and adaptability and reliability are remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and specifically discloses a heat sink with a multi-layer design structure. Background Technology

[0002] Currently, in the heat dissipation requirements of high-power chips or high-power electronic devices, common heat sink structures are usually single-layer metal heat sinks or simple water-cooled plate designs. Due to their limited thermal conductivity and simple internal flow channels, these structures cannot fully utilize the heat exchange potential between the cooling medium and the heat dissipation material, resulting in low heat dissipation efficiency, localized temperature rise, and a tendency for heat concentration. Furthermore, existing heat sinks are mostly of fixed standard sizes, lacking flexibility and making it difficult to customize them according to the specific size and power consumption characteristics of the chip. Poor thermal contact surface matching between the chip and the heat sink results in a certain amount of gap thermal resistance, further affecting the heat dissipation effect. One existing heat sink (publication number: CN204740553U) has at least the following drawbacks:

[0003] 1. Existing heat sinks mostly adopt a single-layer structure, with short heat conduction paths and limited heat exchange areas, making it difficult to meet the requirements of rapid heat conduction and uniform heat dissipation for high-power chips. Due to the single or obstructed flow path of fluids inside the heat sink, local heat accumulation occurs, easily forming overheated areas, which seriously affects the stability and reliability of chip operation. Therefore, there is an urgent need for a multi-layer rapid heat dissipation device.

[0004] 2. Most existing heat sinks are of standard size, making it difficult to flexibly adjust them according to the specifications of different chips. This results in gaps or size mismatches between the heat source and the heat sink, failing to achieve complete coverage of the thermal contact surface. Furthermore, a single-plane contact method easily creates thermal resistance zones, further reducing heat dissipation efficiency and affecting chip lifespan. Therefore, there is an urgent need for a device with adjustable size matching. Summary of the Invention

[0005] The main objective of this invention is to provide a multi-layer heat sink design that can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a multi-layer design radiator, including a radiator body, a top layer, an outlet layer, a sub-layer, a middle top layer, and a bottom layer. The top layer is installed at the top of the radiator body. The outlet layer is welded to the bottom of the top layer. The sub-layer is welded to the bottom of the outlet layer. The middle top layer is welded to the bottom of the sub-layer.

[0007] Preferably, a bottom layer is welded below the top layer.

[0008] Preferably, the top layer, the outlet layer, the sub-layer, and the through holes on the top and bottom layers are aligned on the same axis, and the edge welds of each layer are connected to form an integral structure.

[0009] Preferably, the radiator body adopts an integrated design.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. This utility model adopts a multi-layer heat-conducting sheet structure, which is formed into an integrated flow channel system through precision welding. This allows the coolant to fully penetrate each heat-conducting layer, improving heat exchange efficiency. At the same time, the flow channels in each layer are rationally distributed, effectively achieving uniform heat conduction and avoiding local overheating. Compared with traditional single-layer heat sinks, the overall heat dissipation efficiency is improved by up to 50%, significantly enhancing the heat dissipation protection effect of the chip.

[0012] 2. The overall structure of the heat sink of this utility model can be customized according to different chip sizes. The heating surface and the chip are fitted with high precision, maximizing the thermal contact area, effectively reducing thermal resistance, eliminating heat concentration areas, improving adaptability and reliability, and further extending the chip's working life. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the top-level structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the outlet layer structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the multi-layer structure of this utility model;

[0017] Figure 5 This is a schematic diagram of the top-level structure of this utility model;

[0018] Figure 6 This is a schematic diagram of the underlying structure of this utility model;

[0019] In the diagram: 1. Heat sink body; 101. Top layer; 102. Outlet layer; 103. High layer; 104. On the top layer; 105. Bottom layer. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0023] Please see Figure 1-6 This utility model provides a technical solution:

[0024] A multi-layered radiator includes a radiator body, a top layer, an outlet layer, a dividing layer, a middle layer, and a bottom layer. The top layer is installed on the top of the radiator body. The outlet layer is welded to the bottom of the top layer. The dividing layer is welded to the bottom of the outlet layer. The middle layer is welded to the bottom of the dividing layer. The bottom layer is welded to the bottom of the middle layer. The through holes on the top layer, outlet layer, dividing layer, middle layer, and bottom layer are aligned on the same axis. The welds at the edges of each layer are continuous to form an integral structure. The radiator body adopts an integrated design.

[0025] It should be noted that the top layer and the outlet layer: four cylindrical positioning posts are provided at the four corners of the bottom surface of the top layer, which are fitted into the four positioning holes at the corresponding positions of the outlet layer; the outer flange faces of the top layer and the outlet layer are each provided with mating flat welding surfaces. After the positioning posts are fitted, the two flange faces are continuously welded together along the edges by argon arc welding or brazing.

[0026] Outlet layer and dividing layer: Several guide channels are formed on the outlet layer, and the bottom edge of the channel is attached to the top edge of the corresponding dividing channel on the dividing layer. In the attachment area, the dividing layer has a narrow notch on its top edge side, which forms a tongue groove with the outer edge of the outlet layer guide channel. After the fit is completed, the two layers are firmly connected in the tongue groove area by spot welding or laser pulse welding.

[0027] The outer flange face of the upper section and the inner flange face of the upper section are aligned and fitted together; the upper section has several small vent holes on its flange face, which are connected to the return groove 104c on the upper section. After assembly, the flange face is welded with a continuous circumferential weld to form a sealed tongue-and-groove connection.

[0028] At the top and bottom layers: There are matching annular stepped surfaces on the periphery of both the top and bottom layers; during installation, the annular stepped surfaces are first aligned, and then the two layers are welded into an integrated structure by a combination of spot welding and argon arc welding along the full circumference weld.

[0029] Overall structure: The flange face, positioning post and tongue groove of the five-layer copper sheet are first dry-assembled and positioned during the assembly process. After confirming that there is no deviation, they are welded in sections in sequence. All welds have reserved welding allowance when cutting materials. After welding, the external dimensional tolerance and interlayer flatness are ensured by machining and cleaning.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat sink of a multi-layer design structure, comprising a heat sink body (1), a top layer (101), an outlet layer (102), a high layer (103), a top layer (104), a bottom layer (105), characterized in that: The top layer (101) is provided on the top of the radiator body (1), and the outlet layer (102) is connected below the top layer (101) by welding, the high layer (103) is connected below the outlet layer (102) by welding, and the top layer (104) is connected below the high layer (103) by welding.

2. A heat sink of a multi-layer design structure according to claim 1, characterized in that: The bottom layer (105) is connected below the top layer (104) by welding.

3. A heat sink of a multi-layer design structure according to claim 1, wherein: The through holes on the top layer (101), the outlet layer (102), the high layer (103), the top layer (104) and the bottom layer (105) are aligned on the same axis, and the edge welds of each layer are penetrated to form an integral structure.

4. The heat sink of claim 1, wherein: The radiator body (1) adopts an integral design.

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