Tin soldering device

By simplifying the gas path structure and optimizing gas flow, the soldering device solves the problems of complex gas paths and unreasonable heating modes in existing soldering devices, achieving efficient and stable soldering protection, reducing costs and extending equipment life.

CN223876242UActive Publication Date: 2026-02-06FOSHAN HENGDAO ZHIJI TECH CO LTD
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Patent Information

Application Number
CN202520500999.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-21
Publication Date
2026-02-06
Estimated Expiration
2035-03-21

AI Technical Summary

Technical Problem

Existing soldering equipment has a complex gas circuit structure and an unreasonable gas heating mode, resulting in high manufacturing costs, inconvenient installation and maintenance, and potential for introducing failure points.

Method used

The design adopts a sealed tin bath, combined with an air inlet, an air outlet, and an isolation sleeve structure. The protective gas entering through the air inlet is fully heated in the tin bath and then flows to the liquid outlet through the air outlet, providing a uniform and efficient protective airflow. The sleeve and guide components optimize the gas flow, and a heating device is set up to ensure that the gas temperature meets the usage requirements.

Benefits of technology

It simplifies the gas path structure, reduces manufacturing costs, improves welding precision and stability, reduces failure points, lowers energy consumption, and extends equipment life.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223876242U_ABST
    Figure CN223876242U_ABST
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Abstract

The utility model provides a tin soldering device, which belongs to the technical field of welding and comprises a sealed tin bath, a heating device, a tin liquor pipeline, a tin liquor driving device, an air inlet and an air outlet runner. The tin liquor pipeline penetrates through the tin bath, and the tin liquor driving device drives tin liquor to flow; the gas inlet is connected with a protective gas source; the gas outlet runner is communicated with the inner cavity of the tin bath and faces the liquid outlet; a first isolation sleeve, a second isolation sleeve, a flow guide piece, an air uniformizing plate, a sealing piece and the like can be further arranged; according to the device, a simple air channel structure is constructed, a tin bath can be smoothly filled with protective gas, air can be isolated in all directions, tin liquid is reliably protected, after the temperature in the tin bath is fully increased, the protective gas flows to a liquid outlet along a specific path, and a protective barrier is built for the tin soldering procedure; the sleeve structure efficiently collects gas, all parts are in close cooperation, the gas is evenly and smoothly circulated, tin liquid is prevented from polluting a gas flow channel, it is guaranteed that the protective gas is kept at the proper temperature, the utilization efficiency is improved, and finally the welding quality is effectively improved.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to welding technical field, more specifically, relate to a soldering device. BACKGROUND

[0002] With the rapid development of modern electronic technology, the design and manufacture of electronic components tend to be highly refined and miniaturized, and the wiring density of the circuit board also significantly improves. Under this background, automated welding process has become the core link in the manufacturing process of electronic products, which puts forward more strict requirements for the precision and uniformity of soldering. Especially in the process of melting and soldering, the supply of protective gas becomes crucial.

[0003] In the automated welding process, the melting and soldering process of the solder tank is faced with the problem of oxidation of the molten solder in the solder tank, which not only causes material loss, but also may affect the welding quality. At the same time, protective gas needs to be provided around the solder nozzle during soldering to prevent oxidation and contamination. Therefore, it is usually necessary to supply protective gas to the solder tank and the solder nozzle respectively.

[0004] However, the existing protective gas supply structure is relatively complex, and the protective gas supply pipeline for the solder tank and the solder nozzle needs to be set respectively. This complex structure not only increases the manufacturing cost, but also may introduce additional failure points. In order to reduce the complexity of the heating device, although the existing technology considers heating the supply pipeline by using the high temperature of the solder tank, this method requires the pipeline to be arranged around the solder tank, which undoubtedly further increases the complexity of the structure, and also brings inconvenience to installation and maintenance. Therefore, it is an urgent technical problem in the art to provide a soldering device with simple gas path structure and reasonable gas heating mode. CONTENT OF THE UTILITY MODEL

[0005] In order to solve the above technical problems, the utility model provides a soldering device to solve the problem of complex gas path structure and unreasonable gas heating mode in the prior art.

[0006] In order to achieve the above purpose, the utility model is achieved by the following specific technical means:

[0007] A soldering device, comprising a solder tank, a heating device, a solder liquid pipeline, and a solder liquid driving device; the solder tank is a sealed solder tank; the heating device provides heat energy for the solder tank; the solder liquid pipeline is arranged through the solder tank, one end in the solder tank is a liquid inlet, and the other end outside the solder tank is a liquid outlet; the solder liquid driving device drives the solder liquid in the solder tank to flow from the liquid inlet to the liquid outlet; further comprising an air inlet and an air outlet flow channel, the air inlet is formed in the wall part of the solder tank for connecting with a protective gas source; one end of the air outlet flow channel communicates with the inner cavity of the solder tank, and the other end faces the liquid outlet.

[0008] Compared with the prior art, the utility model has the following beneficial effects:

[0009] The protection gas enters the tin bath through the gas inlet, fills the space outside the tin liquid in the tin bath with the protection gas, and effectively protects the tin liquid.

[0010] Further, the first isolation sleeve pipe is arranged outside the tin liquid pipeline, and the first isolation sleeve pipe is arranged through the tin bath.

[0011] As a preferred mode, the second isolation sleeve pipe is arranged between the first isolation sleeve pipe and the tin liquid pipeline.

[0012] Further, the flow guide member is arranged, and the gas outlet end of the gas flow channel is directed to the liquid outlet, so that the utilization efficiency of the protection gas is improved.

[0013] Further, the liquid outlet is arranged at the upper portion of the gas outlet end of the gas flow channel, and the gas outlet end of the gas flow channel is directed to the side wall of the liquid outlet, so that the protection gas gradually rises along the side wall of the liquid outlet, the protection gas flow is more closely wrapped around the welding position, and the flow rate of the gas flow to the liquid outlet is prevented from being too high to affect the welding precision.

[0014] Further, the gas outlet end of the gas flow channel is provided with the air uniformizing plate, so that the uniformity of the protection gas flow is improved.

[0015] Further, the sealing member is arranged on the tin bath, and the sealing member is arranged on the tin bath.

[0016] In order to ensure that the temperature of the protection gas flowing to the liquid outlet reaches the use requirement, the second heating device is arranged in the gas flow channel.

[0017] For the preferred mode of the second isolation sleeve pipe, the second heating device is arranged on the second isolation sleeve pipe.

[0018] Further, the tin bath comprises a tin bath body with an upper end opening, and a sealing cover plate covering the tin bath body; the first isolation sleeve is arranged from bottom to top, and the air inlet hole is close to the inner wall of the sealing cover plate, so that the filling effect of the protective gas on the tin bath is ensured, and since the gas with high temperature is located at a high position, the air inlet hole is arranged at the position, and the temperature of the discharged air can be effectively ensured. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic view of the embodiment one of the utility model;

[0020] Figure 2 It is a structural schematic view of the embodiment one of the utility model after being split;

[0021] Figure 3 It is a structural schematic view of the embodiment two of the utility model after being split;

[0022] Figure 4 It is a sectional view of the first isolation sleeve.

[0023] In the figure, the corresponding relationship of the component name and the drawing number is as follows:

[0024] 11, heating device; 12, tin liquid pipeline; 13, tin liquid driving device; 21, liquid outlet; 22, air inlet; 23, air inlet hole; 31, first isolation sleeve; 32, second isolation sleeve; 33, sealing element; 35, uniform air distribution plate; 41, tin bath body; 42, sealing cover plate. DETAILED DESCRIPTION

[0025] The embodiment of the utility model will be further described in detail in combination with the drawings and the embodiment. The following embodiment is used to illustrate the utility model, but cannot be used to limit the range of the utility model.

[0026] Embodiment one:

[0027] As Figure 1 , 2As shown, the utility model provides a kind of soldering device, including tin tank, heating device 11, tin liquid pipeline 12, tin liquid driving device 13, tin tank adopts sealed structure, can effectively avoid the impurity mixing of outside, and heating device 11 undertakes the important task of providing heat energy for tin tank, by continuous heating, the tin in tin tank keeps molten state, satisfies welding demand.Tin liquid pipeline 12 is through tin tank, and one end in tin tank is liquid inlet, and one end located tin tank outside is liquid outlet 21.Tin liquid driving device 13 plays a role here, it can promote the tin liquid that has been molten in tin tank, from liquid inlet to liquid outlet 21 smoothly, realize the conveying process of tin liquid.The soldering device also has air inlet 22 and gas outlet channel, air inlet 22 is formed in the side wall of tin tank, and main function is connected with protective gas source.When protective gas source is opened, protective gas will enter tin tank from air inlet 22, and one end of gas outlet channel is interconnected with the inner chamber of tin tank, and the other end is directly towards liquid outlet 21.In this way, the protective gas that enters tin tank, after filling to a certain degree, under the continuous pressurization of outside protective gas source, can flow to liquid outlet 21 smoothly through gas outlet channel, provides protection for subsequent soldering process, and ensures that soldering process is stably carried out.

[0028] Example two:

[0029] As Figure 3 、 4 shown, a kind of soldering device also includes the first isolation sleeve 31 of being set in tin liquid pipeline 12 outside, first isolation sleeve 31 is set through tin tank, and air inlet hole 23 is opened on the side wall in tin tank, it extends from tin tank interior and comes out, extends to the outside of liquid outlet 21, partially surrounds liquid outlet 21.In the gas cavity formed between tin liquid pipeline 12 and first isolation sleeve 31;And the protective gas in tin tank can enter this gas cavity through air inlet hole 23 on the side wall of first isolation sleeve 31, then is communicated with gas outlet channel, as through air inlet hole 23, gas cavity is communicated to form gas outlet channel, forms first gas outlet mode.

[0030] Meanwhile, the second isolation sleeve 32 is arranged between the first isolation sleeve 31 and the tin liquid pipeline 12, another gas passage is formed between the first isolation sleeve 31 and the second isolation sleeve 32, and the electric heating ring is arranged in the gas passage; when the device is started and the heating device 11 is heated, the tin in the tin tank is melted to form the tin liquid, and the heating device 11 is immersed in the tin liquid, the overall temperature in the tin tank is increased, the protective gas filled in the tin tank is heated and then enters the gas passage, and the electric heating ring is started to heat the gas entering the gas passage for the second time. With the preheating, the electric heating ring does not need to run at full power, and the energy consumption is reduced. Moreover, because the working load is reduced, the service life of the electric heating ring is also significantly increased, which provides protection for the stable and efficient operation of the wave soldering device. Similarly, the protective gas in the tin tank enters the gas passage from the gas inlet hole 23, then communicates with the gas outlet flow channel, and finally forms the gas outlet flow channel, thereby forming the second gas outlet mode. The cooperation of the two sleeves makes the structure of the gas passage more regular, and the circulation and transmission of the protective gas in the gas passage are more uniform and smooth.

[0031] In order to make the protective gas more effectively act on the liquid outlet 21, the device is also provided with a flow guide member, which can guide the gas outlet end of the gas outlet flow channel to accurately face the liquid outlet 21, so as to improve the utilization efficiency of the protective gas and make the protective gas cover the position that needs to be protected. The liquid outlet 21 is located at the upper part of the gas outlet end of the gas outlet flow channel, and the gas outlet end of the gas outlet flow channel does not directly face the upper part of the liquid outlet 21, but faces the side wall of the liquid outlet 21. After the protective gas flows out from the gas outlet end of the gas outlet flow channel, it gradually rises along the side wall of the liquid outlet 21, thereby providing more comprehensive protective gas flow to the welding position. At the same time, this mode can also avoid that the gas flow directly hits the liquid outlet 21, especially the welding nozzle, thereby effectively avoiding the influence on the welding precision.

[0032] The air uniformizing plate 35 is installed at the gas outlet end of the gas outlet flow channel. The existence of the air uniformizing plate 35 can optimize the flow direction of the protective gas flow, so that the protective gas flowing out from the gas outlet end of the gas outlet flow channel blows more uniformly to the liquid outlet 21.

[0033] In order to make the protective gas in the tin tank flow into the gas passage through the gas inlet hole 23 in a concentrated and efficient manner, in the first gas outlet mode, the lower end of the first isolation sleeve 31 needs to be inserted below the liquid level of the tin liquid; in the second gas outlet mode, the lower ends of the first isolation sleeve 31 and the second isolation sleeve 32 need to be inserted below the liquid level of the tin liquid.

[0034] In addition, in the first gas outlet mode, in order to ensure that the gas passage is completely isolated from the tin liquid in the tin tank, a sealing member can also be used in the device.

[0035] And in the second kind of gas exhaust mode, for the case of simultaneously provided with the first isolation sleeve 31 and the second isolation sleeve 32, further comprising a sealing member 33 connected to the first isolation sleeve 31 and the second isolation sleeve 32 located in the tin bath, so that the gas passage formed between the first isolation sleeve 31 and the second isolation sleeve 32 is a relatively closed environment, only through the gas inlet hole 23 and the tin bath; the sealing member 33 can reduce the overall volume of the airflow passage, so that the flow rate of the protective gas in it is easier to control, thereby ensuring the stable operation of the entire soldering device. The sealing member 33 can be formed as a separate structure, or a sealing flange can be formed on one of the first isolation sleeve 31 or the second isolation sleeve 32, and the other cylinder without the sealing flange can be abutted on the sealing flange to form a sealing effect.

[0036] A second heating device is provided in the gas passage to provide heat energy for the protective gas, and for the case of provided with the second isolation sleeve 32, the second heating device is formed on the second isolation sleeve 32, so that when the gas preliminarily heated by the heating device 11 flows into the gas passage, the second heating device can quickly respond and use its own heating element to reheat the gas.

[0037] In the soldering device, it is composed of a tin bath body 41 with an open upper end and a sealing cover plate 42 covering it. The tin bath body 41 is used to contain high-temperature tin liquid to provide the necessary material for soldering operation. The presence of the sealing cover plate 42 is crucial, which can prevent dust, impurities and other foreign matters from entering the tin bath, ensuring the purity of the tin liquid and reducing heat loss. The first isolation sleeve 31 is arranged in the tin bath from bottom to top. The side wall thereof located in the tin bath is provided with a gas inlet hole 23, and the gas inlet hole 23 is close to the inner wall of the sealing cover plate 42. Such arrangement makes the protective gas enter from the gas inlet hole 23, fully utilizes the space with higher temperature in the upper part of the tin bath, heats the gas sufficiently during the rising process, and then flows to the liquid outlet 21 better, thereby providing high-quality protection for the soldering process.

[0038] The embodiments of the present application are given for the purpose of illustration and description, and are not exhaustive or limit the present application to the disclosed form. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles and practical application of the present application, and to enable those skilled in the art to understand the present application so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A soldering apparatus characterized by comprising: The tin bath, a heating device (11), a tin liquid pipeline (12), and a tin liquid driving device (13); The tin bath is a sealed tin bath, and the heating device (11) provides heat energy for the tin bath. The tin liquid pipeline (12) is arranged through the tin bath, and one end of the tin liquid pipeline (12) in the tin bath is a liquid inlet, and the other end of the tin liquid pipeline (12) outside the tin bath is a liquid outlet (21); the tin liquid driving device (13) drives the tin liquid in the tin bath to flow from the liquid inlet to the liquid outlet (21). The tin bath further comprises an air inlet (22) and an air outlet flow channel, the air inlet (22) is formed in the wall of the tin bath and is connected with a protective gas source, and one end of the air outlet flow channel is connected with the inner cavity of the tin bath, and the other end of the air outlet flow channel is directed to the liquid outlet (21).

2. The soldering apparatus of claim 1, wherein: The tin bath further comprises a first isolation sleeve (31) sleeved outside the tin liquid pipeline (12), the first isolation sleeve (31) is arranged through the tin bath, an air inlet hole (23) is arranged on the side wall of the tin bath, the air inlet hole (23) is extended to the outside of the liquid outlet (21), a gas passage is formed between the tin liquid pipeline (12) and the first isolation sleeve (31), and the air inlet hole (23) and the gas passage are communicated to form the air outlet flow channel.

3. The soldering apparatus of claim 2, wherein: The tin bath further comprises a second isolation sleeve (32) arranged between the first isolation sleeve (31) and the tin liquid pipeline (12), a gas passage is formed between the first isolation sleeve (31) and the second isolation sleeve (32), and the air inlet hole (23) and the gas passage are communicated to form the air outlet flow channel.

4. The soldering apparatus according to claim 2 or 3, wherein: The tin bath further comprises a flow guide member, and the air outlet end of the air outlet flow channel is directed to the liquid outlet (21).

5. The soldering apparatus according to claim 2 or 3, wherein: The liquid outlet (21) is located at the upper portion of the air outlet end of the air outlet flow channel, and the air outlet end of the air outlet flow channel is directed to the side wall of the liquid outlet (21).

6. The soldering apparatus of claim 2 or 3, wherein: The air outlet end of the air outlet flow channel is provided with an air uniformizing plate (35).

7. The soldering apparatus of claim 3, wherein: The tin bath further comprises a sealing member (33) connected to the first isolation sleeve (31) and the second isolation sleeve (32) arranged in the tin bath.

8. The soldering apparatus of claim 2 or 3, wherein: The tin bath further comprises a second heating device for providing heat energy for the protective gas in the gas passage.

9. The soldering apparatus of claim 8, wherein: For the case that the second isolation sleeve (32) is arranged, the second heating device is arranged on the second isolation sleeve (32).

10. The soldering apparatus of claim 1, wherein: The tin bath comprises a tin bath body (41) with an open upper end and a sealing cover plate (42) covering the tin bath body (41), the first isolation sleeve (31) is arranged from bottom to top, and the air inlet hole (23) is close to the inner wall of the sealing cover plate (42).