Heat sealing mechanism of semiconductor device packaging machine
By using three heat-sealing blades on a semiconductor device packaging machine to heat-press the sides and middle of the cover tape respectively, the problem of misalignment of semiconductor devices during transportation is solved, resulting in more secure packaging and improved product quality.
Patent Information
- Application Number
- CN202520487034.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-19
AI Technical Summary
During transportation, semiconductor devices can easily shift from their original slots on the carrier tape to adjacent slots, causing misalignment and affecting product quality.
Three heat-sealing blades are used to heat-press the cover tape onto the carrier tape from both sides and the middle, forming multiple sealing strips to ensure a tight bond between the cover tape and the carrier tape and prevent misalignment of semiconductor devices.
It effectively prevents semiconductor devices from shifting out of the carrier tape groove during vibration, thereby improving the stability and consistency of product quality.
Smart Images
Figure CN223878358U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present disclosure relate to the technical field of packaging machines, and in particular, to a heat sealing mechanism of a semiconductor device packaging machine. BACKGROUND
[0002] A packaging machine is a commonly used device in the production process of semiconductor devices. After the semiconductor devices are placed into the belt slots of a carrier tape, the heat sealing knife heated on the packaging machine is lowered to apply vertical downward heat pressure on the assembled carrier tape and cover tape. Under the action of heat pressure, the pressure surfaces of the cover tape and the carrier tape will melt, and the pressure contact surfaces of the two will fuse together. After the heat sealing knife stops pressing, the pressure fusion surfaces of the carrier tape and the cover tape are combined together after natural cooling, so as to package the semiconductor devices in the belt slots of the carrier tape. After the packaging is completed, in the transportation process, the semiconductor devices are easily transferred from the original belt slot to the adjacent belt slot due to vibration, which causes the semiconductor devices to be misaligned and easily affects the product quality. SUMMARY
[0003] To overcome the above defects, embodiments of the present disclosure provide a heat sealing mechanism of a semiconductor device packaging machine, which solves the technical problem that in the related art, in the transportation process, the semiconductor devices are easily transferred from the original belt slot to the adjacent belt slot due to vibration, which causes the semiconductor devices to be misaligned and easily affects the product quality.
[0004] According to one aspect, at least one embodiment of the present disclosure provides a heat sealing mechanism of a semiconductor device packaging machine for heat pressing a cover tape on a carrier tape with semiconductor devices, the carrier tape is used to be placed on an operation platform, and the cover tape is located above the carrier tape, comprising,
[0005] a first heat sealing knife, which is vertically arranged above the operation platform and located outside one end of the semiconductor devices, and after the first heat sealing knife is lowered, it is used to heat press one side of the cover tape on the carrier tape;
[0006] a second heat sealing knife, which is vertically arranged above the operation platform and located outside the other end of the semiconductor devices, and after the second heat sealing knife is lowered, it is used to heat press the other side of the cover tape on the carrier tape;
[0007] a third heat sealing knife, which is vertically arranged above the operation platform and located between the first heat sealing knife and the second heat sealing knife, and after the third heat sealing knife is lowered, it is used to heat press the middle part of the cover tape on the carrier tape.
[0008] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises,
[0009] A knife seat is arranged above the operation platform, and the first heat sealing knife, the second heat sealing knife and the third heat sealing knife are arranged at the bottom of the knife seat.
[0010] A heater is arranged on the knife seat for heating the first heat sealing knife, the second heat sealing knife and the third heat sealing knife through the knife seat.
[0011] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure comprises a knife seat, a bottom of the knife seat has a dovetail groove, a length direction of the dovetail groove is the same as a width direction of the carrier tape, an outer end of the dovetail groove is flush with an outer side surface of the knife seat, an inner end of the dovetail groove is a closed end, and the heat sealing mechanism further comprises
[0012] A heat conduction plate has a dovetail strip on an upper end surface, the dovetail strip is inserted into the dovetail groove, and the first heat sealing knife, the second heat sealing knife and the third heat sealing knife are connected to a lower end surface of the heat conduction plate.
[0013] An outer heat insulation plate is detachably arranged on the knife seat, the outer heat insulation plate is attached to the knife seat and located outside the knife seat, a lower end of the outer heat insulation plate is detachably connected to an outer end of the heat conduction plate, and an upper end of the outer heat insulation plate extends above the heater.
[0014] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises
[0015] A positioning seat is located inside the operation platform.
[0016] A first lifting driving mechanism has one end arranged on the positioning seat and the other end arranged on the knife seat.
[0017] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises an inner heat insulation plate, the inner heat insulation plate is detachably arranged on the knife seat and located inside the knife seat, a lower end of the inner heat insulation plate is connected to a lower end of the first lifting driving mechanism, and an upper end of the inner heat insulation plate extends above the first lifting driving mechanism.
[0018] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises a first guide rod, one end of the first guide rod is connected to the positioning seat, and the other end of the first guide rod is inserted into the heater and forms a sliding fit.
[0019] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises a first elastic buffer, which is sleeved on the periphery of the first guide rod, the lower end of the first elastic buffer is connected with the heater, and the upper end of the first elastic buffer is connected with the positioning seat.
[0020] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure, the upper end surface of the operation platform has a guide groove, the carrier tape is used to be placed in the guide groove, and the cover tape pressing block is arranged above the operation platform, the cover tape pressing block is arranged on the feeding side and / or the discharging side of the first heat sealing knife, and a cover tape channel is left between the cover tape pressing block and the operation platform.
[0021] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises,
[0022] The second lifting driving mechanism is connected with the positioning seat at one end, and connected with the cover tape pressing block at the other end.
[0023] The second guide rod is connected with the positioning seat at one end, and inserted into and slidably connected with the cover tape pressing block at the other end.
[0024] For example, the heat sealing mechanism of the semiconductor device packaging machine provided by at least one embodiment of the present disclosure further comprises a second elastic buffer, which is sleeved on the periphery of the second guide rod, the lower end of the second elastic buffer is connected with the cover tape pressing block, and the upper end of the second elastic buffer is connected with the positioning seat.
[0025] The carrier tape is used to be placed on the operation platform, the cover tape is arranged above the carrier tape, the first heat sealing knife is arranged above the operation platform and located outside one end of the semiconductor device, the first heat sealing knife is used to heat and press one side of the cover tape on the carrier tape after being lowered, the second heat sealing knife is arranged above the operation platform and located outside the other end of the semiconductor device, the second heat sealing knife is used to heat and press the other side of the cover tape on the carrier tape after being lowered, and the third heat sealing knife is arranged above the operation platform and located between the first heat sealing knife and the second heat sealing knife, the third heat sealing knife is used to heat and press the middle part of the cover tape on the carrier tape after being lowered.
[0026] In the present disclosure, after the first heat sealing knife is lowered, one side of the cover tape is heat pressed on the carrier tape to form a first sealing strip, after the second heat sealing knife is lowered, the other side of the cover tape is heat pressed on the carrier tape to form a second sealing strip, and after the third heat sealing knife is lowered, the middle part of the cover tape is heat pressed on the carrier tape to form a third sealing strip, so that both sides and the middle part of the cover tape are tightly combined with the carrier tape, which can effectively prevent the semiconductor device from being transferred from the original carrier tape groove to the adjacent carrier tape groove due to vibration, thereby more firmly packaging the semiconductor device in the carrier tape groove, avoiding misplacement of the semiconductor device, and improving product quality. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments of the present disclosure will be briefly introduced. Obviously, the drawings in the following description are only some example embodiments of the present disclosure. Those skilled in the art can obtain other drawings according to the content of the example embodiments of the present disclosure and these drawings without any creative effort.
[0028] Figure 1 The structural schematic diagram of an embodiment of the present disclosure in one direction.
[0029] Figure 2 The structural schematic diagram of an embodiment of the present disclosure in another direction.
[0030] Figure 3 The connection structure schematic diagram of the heat sealing knife and the knife seat in an embodiment of the present disclosure.
[0031] Figure 4 The structural schematic diagram of the carrier tape in an embodiment of the present disclosure.
[0032] Figure 5 The front view of the heat conduction plate connected with the heat sealing knife and the knife seat in an embodiment of the present disclosure.
[0033] Figure 6 The left view of the heat conduction plate connected with the heat sealing knife and the knife seat in an embodiment of the present disclosure.
[0034] Figure 7 The front view of an embodiment of the present disclosure in specific use.
[0035] Figure 8 The left view of an embodiment of the present disclosure in specific use.
[0036] In the figure: 1, the first heat sealing knife, 2, the second heat sealing knife, 3, the third heat sealing knife, 4, the knife seat, 5, the heater, 6, the dovetail groove, 7, the heat conduction plate, 8, the outer heat insulation plate, 9, the dovetail strip, 10, the positioning seat, 11, the first lifting driving mechanism, 12, the inner heat insulation plate, 13, the first guide rod, 14, the first elastic buffer, 15, the cover tape pressing block, 16, the second lifting driving mechanism, 17, the second guide rod, 18, the second elastic buffer, 19, the operation platform, 20, the guide groove, 21, the cover tape, 22, the carrier tape, 23, the semiconductor device, 24, the tape groove. DETAILED DESCRIPTION
[0037] The present disclosure will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present disclosure, but not to limit the present disclosure.
[0038] In order to make the drawing simple, only the parts related to the disclosure are shown in each figure, which does not represent the actual structure of the product. In addition, in order to make the drawing simple and easy to understand, only one of the parts with the same structure or function is shown in some figures, or only one of them is marked. In this paper, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".
[0039] In this paper, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.
[0040] In the present disclosure, unless otherwise specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.
[0041] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.
[0042] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0043] like Figures 1-8 The diagram illustrates a heat-sealing mechanism for a semiconductor device packaging machine according to an embodiment of the present disclosure. The mechanism is used to heat-press a cover strip 21 onto a carrier strip 22 carrying a semiconductor device 23. The carrier strip 22 is placed on an operating platform 19, with the cover strip 21 positioned above the carrier strip 22. The mechanism includes a first heat-sealing blade 1, a second heat-sealing blade 2, and a third heat-sealing blade 3. The first heat-sealing blade 1 is raised and lowered above the operating platform 19, located outside one end of the semiconductor device 23. After lowering, the first heat-sealing blade 1 heat-presses one side of the cover strip 21 onto the carrier strip 22. The second heat-sealing blade 2 is raised and lowered above the operating platform 19, located outside the other end of the semiconductor device 23. After lowering, the second heat-sealing blade 2 heat-presses the other side of the cover strip 21 onto the carrier strip 22. The third heat-sealing blade 3 is raised and lowered above the operating platform 19, located between the first heat-sealing blade 1 and the second heat-sealing blade 2. After lowering, the third heat-sealing blade 3 heat-presses the middle portion of the cover strip 21 onto the carrier strip 22.
[0044] In this disclosure, taking the cover tape 21 and carrier tape 22 as an example where their lengths are arranged in the left-right direction, the first heat-sealing blade 1 and the second heat-sealing blade 2 are arranged in the front-back direction, and the third heat-sealing blade 3 is located between the first heat-sealing blade 1 and the second heat-sealing blade 2. Taking the first heat-sealing blade 1 as being located behind the second heat-sealing blade 2 as an example, the carrier tape 22 has a plurality of grooves 24 arranged at intervals in the left-right direction for placing semiconductor devices 23. The first heat-sealing blade 1 is located behind the grooves 24, the second heat-sealing blade 2 is located in front of the grooves, and the third heat-sealing blade 3 is located in the middle part of the front-back direction of the grooves 24.
[0045] After the first heat sealing knife 1 is lowered, the rear side of the cover tape 21 is heat pressed on the carrier tape 22 to form a first sealing strip. After the second heat sealing knife 2 is lowered, the front side of the cover tape 21 is heat pressed on the carrier tape 22 to form a second sealing strip. After the third heat sealing knife 3 is lowered, the middle part of the cover tape 21 is heat pressed on the carrier tape 22 to form a third sealing strip. The front and rear sides and the middle part of the cover tape 21 are tightly combined with the carrier tape 22. The distance between the third sealing strip and the first sealing strip and the distance between the third sealing strip and the second sealing strip are both less than the length of the semiconductor device 23 in the front-rear direction. This can effectively prevent the semiconductor device 23 from being transferred from the original carrier tape 22 slot to the adjacent carrier tape 22 slot due to vibration. Thus, the semiconductor device 23 is more firmly packaged in the carrier tape 22 slot, and the semiconductor device 23 is prevented from being misaligned, thereby improving product quality.
[0046] In some examples, the knife seat 4 and the heater 5 are further included. The knife seat 4 is arranged to be lifted and lowered above the operation platform 19. The first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 are arranged at the bottom of the knife seat 4. The heater 5 is arranged on the knife seat 4 and is used to heat the first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 through the knife seat 4.
[0047] For example, as shown in Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , the knife seat 4 serves as a bearing component of the first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 and is arranged to be lifted and lowered above the operation platform 19. The knife seat 4 can simultaneously drive the first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 to be lifted and lowered for heat sealing operation. The heater 5 is arranged on the knife seat 4. According to the heat conduction principle, the heat generated by the heater 5 is simultaneously transmitted to the first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 through the knife seat 4. The heat sealing knife can heat press the cover tape 21 on the carrier tape 22 to a temperature. The overall structure is simpler.
[0048] In some examples, the bottom of the knife seat 4 has a dovetail groove 6. The length direction of the dovetail groove 6 is the same as the width direction of the carrier tape 22. The outer end of the dovetail groove 6 is flush with the outer side surface of the knife seat 4. The inner end of the dovetail groove 6 is a closed end. The knife seat 4 further includes a heat conduction plate 7 and an outer heat insulation plate 8. The upper end surface of the heat conduction plate 7 has a dovetail strip 9. The dovetail strip 9 is inserted into the dovetail groove 6. The first heat sealing knife 1, the second heat sealing knife 2, and the third heat sealing knife 3 are connected to the lower end surface of the heat conduction plate 7. The outer heat insulation plate 8 is detachably arranged on the knife seat 4. The outer heat insulation plate 8 is attached to the knife seat 4 and is located on the outer side of the knife seat 4. The lower end of the outer heat insulation plate 8 is detachably connected to the outer end of the heat conduction plate 7. The upper end of the outer heat insulation plate 8 extends above the heater 5.
[0049] For example, as shown in Figure 5And Figure 6 As shown in the drawings, the first heat sealing knife 1, the second heat sealing knife 2 and the third heat sealing knife 3 are all arranged on the heat conduction plate 7, the heat conduction plate 7 has at least two dovetail strips 9 arranged in the left-right direction, the length direction of the dovetail strip 9 is arranged in the front-rear direction, the number of the dovetail grooves 6 at the bottom of the knife holder 4 is equal to the number of the dovetail strips 9, the rear end of the dovetail groove 6 is an open end, and the front end is a closed end. When installing, the dovetail strip 9 is inserted into the dovetail groove 6 from the rear to the front. When the front end of the dovetail strip 9 contacts the front end surface of the dovetail groove 6, the dovetail strip 9 cannot continue to move forward, indicating that it is inserted in place. Then, the outer heat insulation plate 8 is attached to the outside of the knife holder 4, and the outer heat insulation plate 8 is locked together with the heat conduction plate 7 and the knife holder 4. When disassembling the heat sealing knife, first, the locking part between the outer heat insulation plate 8 and the knife holder 4 is removed, and then the outer heat insulation plate 8 is pulled backward to separate the dovetail strip 9 from the dovetail groove 6, so that the heat sealing knife can be disassembled from the knife holder 4. The structure is simple, the connection is firm and reliable, the disassembly is convenient and fast, time and labor are saved. Moreover, the outer heat insulation plate 8 can play a heat insulation role, which can reduce the heat dissipation during use, so that the heat is more concentratedly transmitted to the heat sealing knife and the part that needs to be heat sealed, and the operator can be prevented from being scalded. When disassembling the heat sealing knife, the outer heat insulation plate 8 is pulled, not the heat sealing knife, so that the operator can also be prevented from being scalded.
[0050] In some examples, a positioning seat 10 and a first lifting driving mechanism 11 are further included, the positioning seat 10 is located inside the operation platform 19, one end of the first lifting driving mechanism 11 is arranged on the positioning seat 10, and the other end of the first lifting driving mechanism 11 is arranged on the knife holder 4.
[0051] For example, as shown in the drawings, the positioning seat 10 provides a fixed support point for the first lifting driving mechanism 11, and the first lifting driving mechanism 11 can drive the knife holder 4 to lift through extension and contraction, so as to control the up-down position of the heat sealing knife, ensure that the heat sealing knife applies appropriate pressure and is in an accurate position when pressing the cover tape 21 and the carrier tape 22, and better guarantee the consistency and stability of the heat sealing effect and improve the packaging quality. Figure 7 Figure 8 As shown in the drawings, the positioning seat 10 provides a fixed support point for the first lifting driving mechanism 11, and the first lifting driving mechanism 11 can drive the knife holder 4 to lift through extension and contraction, so as to control the up-down position of the heat sealing knife, ensure that the heat sealing knife applies appropriate pressure and is in an accurate position when pressing the cover tape 21 and the carrier tape 22, and better guarantee the consistency and stability of the heat sealing effect and improve the packaging quality.
[0052] In some examples, an inner heat insulation plate 12 is further included, the inner heat insulation plate 12 is arranged on the knife holder 4 in a detachable manner and located inside the knife holder 4, the lower end of the inner heat insulation plate 12 is connected with the lower end of the first lifting driving mechanism 11, and the upper end of the inner heat insulation plate 12 extends above the first lifting driving mechanism 11.
[0053] For example, as shown in the drawings, the positioning seat 10 provides a fixed support point for the first lifting driving mechanism 11, and the first lifting driving mechanism 11 can drive the knife holder 4 to lift through extension and contraction, so as to control the up-down position of the heat sealing knife, ensure that the heat sealing knife applies appropriate pressure and is in an accurate position when pressing the cover tape 21 and the carrier tape 22, and better guarantee the consistency and stability of the heat sealing effect and improve the packaging quality. Figure 7 Figure 8 As shown, the inner heat insulation plate 12 mainly utilizes the low thermal conductivity characteristics of the heat insulation material to prevent the heat generated by the heater 5 from being transmitted to the first lifting driving mechanism 11, avoids the first lifting driving mechanism 11 from being affected by high temperature, and prolongs the service life of the first lifting driving mechanism 11, so as to ensure that the first lifting driving mechanism 11 can stably drive the knife holder 4 to lift, and further ensure the normal operation of the heat sealing mechanism and reduce the probability of failure caused by overheating of the components.
[0054] In some examples, a first guide rod 13 is further included, one end of the first guide rod 13 is connected with the positioning seat 10, and the other end of the first guide rod 13 is inserted into the heater 5 and forms a sliding fit.
[0055] For example, as shown in Figure 7 and Figure 8 The first guide rod 13 can provide a guide and limiting action for the lifting movement of the heater 5 and the knife holder 4, ensure that they move along the predetermined direction during the lifting process, and cannot deviate or shake, which can improve the stability and accuracy of the lifting movement of the heat sealing knife, so that the heat sealing knife can keep vertical during the heat pressing process, ensure that the heat sealing effect of the cover tape 21 and the carrier tape 22 at different positions is uniform, and avoid the problem of poor packaging caused by the inclination or deviation of the heat sealing knife.
[0056] In some examples, a first elastic buffer 14 is further included, the first elastic buffer 14 is sleeved on the periphery of the first guide rod 13, the lower end of the first elastic buffer 14 is connected with the heater 5, and the upper end of the first elastic buffer 14 is connected with the positioning seat 10.
[0057] For example, as shown in Figure 7 and Figure 8 The first elastic buffer 14 utilizes the elastic deformation characteristics of the elastic material, and can play a buffering role during the lifting process of the knife holder 4 and the heater 5, so as to avoid the damage of the operating platform 19 and the heat sealing knife caused by the rapid descent of the heater 5, the knife holder 4 and the heat sealing knife when the first lifting driving mechanism 11 has a problem.
[0058] In some examples, the upper end surface of the operating platform 19 has a guide groove 20, the carrier tape 22 is used to be placed in the guide groove 20, and a cover tape pressing block 15 is further included, the cover tape pressing block 15 is arranged above the operating platform 19, and the cover tape pressing block 15 is arranged on the feeding side and / or the discharging side of the first heat sealing knife 1, and a cover tape passage is left between the cover tape pressing block 15 and the operating platform 19.
[0059] For example, as shown in Figure 7 and Figure 8As shown, the guide groove 20 can provide positioning and guiding for the carrier tape 22, so that the carrier tape 22 can be placed on the operation platform 19 according to a predetermined path, and better ensure the position accuracy of the carrier tape 22 during conveying and heat sealing, so that the heat sealing knife can accurately heat seal the corresponding position on the carrier tape 22. The cover tape pressing block 15 is arranged above the operation platform 19 and leaves a cover tape passage between the operation platform 19. By using the principle of pressure, the cover tape 21 is pressed in the appropriate position to prevent the cover tape 21 from shaking or shifting before heat sealing, and to ensure the relative position accuracy of the cover tape 21 and the carrier tape 22 during heat sealing, thereby improving the quality and consistency of the packaging.
[0060] In some examples, a second lifting driving mechanism 16 and a second guide rod 17 are further included. One end of the second lifting driving mechanism 16 is connected with the positioning seat 10, and the other end of the second lifting driving mechanism 16 is connected with the cover tape pressing block 15. One end of the second guide rod 17 is connected with the positioning seat 10, and the other end of the second guide rod 17 is inserted into the cover tape pressing block 15 and forms a sliding fit.
[0061] For example, as shown in Figure 7 and Figure 8 The second lifting driving mechanism 16 can drive the cover tape pressing block 15 to rise and fall through telescoping, thereby controlling the height of the cover tape pressing block 15, so that the cover tape pressing block 15 can apply pressure to the cover tape 21 at the appropriate height, and better ensure the consistency and stability of the heat sealing effect and improve the packaging quality. The second guide rod 17 can provide guiding and limiting for the lifting movement of the cover tape pressing block 15, so that it moves along the predetermined direction during the lifting process and cannot deviate or shake, thereby improving the stability and accuracy of the lifting movement of the cover tape pressing block 15 and enabling the cover tape pressing block 15 to keep vertical lifting.
[0062] In some examples, a second elastic buffer 18 is further included. The second elastic buffer 18 is sleeved around the second guide rod 17. The lower end of the second elastic buffer 18 is connected with the cover tape pressing block 15, and the upper end of the second elastic buffer 18 is connected with the positioning seat 10.
[0063] For example, as shown in Figure 7 and Figure 8 Figure 7 Figure 8 The second elastic buffer 18 can play a buffering role during the lifting process of the cover tape pressing block 15 by using the elastic deformation characteristics of the elastic material, thereby avoiding the cover tape pressing block 15 from rapidly falling and damaging the operation platform 19 and the cover tape pressing block 15 when the second lifting driving mechanism 16 malfunctions.
[0064] It should be noted that the above examples are only used to illustrate the technical solutions of the present disclosure rather than limit the present disclosure. Although the present disclosure is described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present disclosure can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present disclosure, and all should be covered in the scope of the claims of the present disclosure.
Claims
1. A heat sealing mechanism of a semiconductor device packaging machine for heat-pressing a cover tape (21) on a carrier tape (22) with semiconductor devices (23), the carrier tape (22) being used for being placed on an operation platform (19), the cover tape (21) being located above the carrier tape (22), characterized in that: Comprising, a first heat sealing knife (1) is arranged above the operation platform (19) and outside one end of the semiconductor device (23), after the first heat sealing knife (1) is lowered, it is used to heat and press one side of the cover tape (21) on the carrier tape (22); a second heat sealing knife (2) is arranged above the operation platform (19) and outside the other end of the semiconductor device (23), after the second heat sealing knife (2) is lowered, it is used to heat and press the other side of the cover tape (21) on the carrier tape (22); a third heat sealing knife (3) is arranged above the operation platform (19) and between the first heat sealing knife (1) and the second heat sealing knife (2), after the third heat sealing knife (3) is lowered, it is used to heat and press the middle part of the cover tape (21) on the carrier tape (22).
2. A heat seal mechanism of a semiconductor device packaging machine according to claim 1, characterized by: Further comprising, a knife seat (4) is arranged above the operation platform (19), the first heat sealing knife (1), the second heat sealing knife (2) and the third heat sealing knife (3) are arranged at the bottom of the knife seat (4); a heater (5) is arranged on the knife seat (4), which is used to heat the first heat sealing knife (1), the second heat sealing knife (2) and the third heat sealing knife (3) through the knife seat (4).
3. A heat seal mechanism for a semiconductor device packaging machine according to claim 2, wherein: The bottom of the knife seat (4) has a dovetail groove (6), the length direction of the dovetail groove (6) is the same as the width direction of the carrier tape (22), the outer end of the dovetail groove (6) is flush with the outer side of the knife seat (4), and the inner end of the dovetail groove (6) is a closed end, further comprising, a heat conduction plate (7) has a dovetail strip (9) on the upper end face, the dovetail strip (9) is inserted into the dovetail groove (6), and the first heat sealing knife (1), the second heat sealing knife (2) and the third heat sealing knife (3) are connected with the lower end face of the heat conduction plate (7); an outer heat insulation plate (8) is detachably arranged on the knife seat (4), the outer heat insulation plate (8) is attached to the knife seat (4) and located outside the knife seat (4), the lower end of the outer heat insulation plate (8) is detachably connected with the outer end of the heat conduction plate (7), and the upper end of the outer heat insulation plate (8) extends above the heater (5).
4. The heat seal mechanism of a semiconductor device packaging machine according to claim 2, wherein: Further comprising, a positioning seat (10) is located inside the operation platform (19); a first lifting driving mechanism (11) has one end arranged on the positioning seat (10) and the other end arranged on the knife seat (4).
5. A heat seal mechanism for a semiconductor device packaging machine according to claim 4, wherein: Further comprising an inner heat insulation plate (12) which is detachably arranged on the knife seat (4) and located inside the knife seat (4), the lower end of the inner heat insulation plate (12) is connected with the lower end of the first lifting driving mechanism (11), and the upper end of the inner heat insulation plate (12) extends above the first lifting driving mechanism (11).
6. The heat seal mechanism of a semiconductor device packaging machine according to claim 4, wherein: Further comprising a first guide rod (13), one end of the first guide rod (13) is connected with the positioning seat (10), the other end of the first guide rod (13) is inserted with the heater (5) and forms a sliding fit.
7. A heat seal mechanism for a semiconductor device packaging machine according to claim 6, wherein: Further comprising a first elastic buffer (14), the first elastic buffer (14) is sleeved on the periphery of the first guide rod (13), the lower end of the first elastic buffer (14) is connected with the heater (5), and the upper end of the first elastic buffer (14) is connected with the positioning seat (10).
8. The heat seal mechanism of a semiconductor device packaging machine according to claim 4, wherein: The upper end surface of the operation platform (19) has a guide groove (20), the carrier tape (22) is used to be placed in the guide groove (20), and further comprising a cover tape pressing block (15), the cover tape pressing block (15) is arranged above the operation platform (19), the cover tape pressing block (15) is arranged on the feeding side and / or the discharging side of the first heat sealing knife (1), and a cover tape passage is left between the cover tape pressing block (15) and the operation platform (19).
9. A heat seal mechanism for a semiconductor device packaging machine according to claim 8, wherein: Further comprising, A second lifting driving mechanism (16), one end of the second lifting driving mechanism (16) is connected with the positioning seat (10), and the other end of the second lifting driving mechanism (16) is connected with the cover tape pressing block (15); A second guide rod (17), one end of the second guide rod (17) is connected with the positioning seat (10), and the other end of the second guide rod (17) is inserted with the cover tape pressing block (15) and forms a sliding fit.
10. A heat seal mechanism of a semiconductor device packaging machine according to claim 9, wherein: Further comprising a second elastic buffer (18), the second elastic buffer (18) is sleeved on the periphery of the second guide rod (17), the lower end of the second elastic buffer (18) is connected with the cover tape pressing block (15), and the upper end of the second elastic buffer (18) is connected with the positioning seat (10).