Heat-conducting wood grain floor
By using a composite structure of solid wood veneer, cement board, and moisture-proof membrane, the problem of poor thermal conductivity of ordinary wood is solved, achieving efficient heat conduction and stability of the floor and improving the heating effect of underfloor heating.
Patent Information
- Application Number
- CN202520210516.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-02-10
AI Technical Summary
The existing flooring material is ordinary wood, which has poor thermal conductivity, resulting in low heat transfer efficiency of the underfloor heating system and affecting the heating effect.
The product uses a hot-pressed composite structure consisting of a solid wood veneer layer, a cement board layer, and an adhesive thin-layer, combined with a moisture-proof membrane layer. It is then laid using a suspended method to form a heat-conducting wood grain floor, which utilizes the high thermal conductivity of the cement board and the isolation properties of the moisture-proof membrane to improve heat transfer efficiency.
It significantly improves the floor's heat conduction efficiency, enhances its stability and durability, while maintaining a comfortable feel and decorative effect.
Smart Images
Figure CN223880678U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to floor technology field, concretely relates to a heat conduction wood grain floor. BACKGROUND
[0002] Floor, namely house ground or floor surface layer. Make by wood or other materials. The classification of floor has a lot, according to structure classification has: solid wood floor, reinforced composite wood floor, three layer solid wood composite floor, bamboo wood floor, preservative floor, softwood floor and the most popular multi-layer solid wood composite floor etc.;According to use classification has: domestic, commercial, antistatic floor, outdoor floor, stage dance special floor, gymnasium special floor, track special floor etc.
[0003] The material of the existing floor is usually ordinary wood, which is a poor conductor of heat and has high thermal resistance, and the heat conduction efficiency with the lower floor heating system is low, thereby affecting the heating effect of the floor heating. UTILITY MODEL CONTENT
[0004] The utility model discloses a heat conduction wood grain floor.
[0005] The utility model discloses a heat conduction wood grain floor.
[0006] Solid wood veneer layer, cement board layer and adhesive thin paste layer, the cement board layer is set in the solid wood veneer layer and the adhesive thin paste layer.
[0007] As a further description of the above technical scheme, the solid wood veneer layer and the cement board layer are hot-pressed into a whole board.
[0008] As a further description of the above technical scheme, the solid wood veneer layer and the cement board layer are hot-pressed into a whole board.
[0009] As a further description of the above technical scheme, the solid wood veneer layer thickness is 25% of the cement board layer thickness.
[0010] As a further description of the above technical scheme, the solid wood veneer layer thickness is 1-2mm.
[0011] As a further description of the above technical scheme, the cement board layer thickness is 4-8mm.
[0012] As a further description of the above technical scheme, the adhesive thin paste layer is further provided with a moisture-proof film layer below, and a suspension piece is arranged in the adhesive thin paste layer and the moisture-proof film layer.
[0013] As a further description of the above technical solution, the bonding thin layer has a thickness of 125% of the thickness of the moisture-proof film layer.
[0014] As a further description of the above technical solution, the bonding thin layer has a thickness of 5-10mm.
[0015] As a further description of the above technical solution, the moisture-proof film layer has a thickness of 4-8mm.
[0016] The wood grain floor has the following beneficial effects.
[0017] The wood grain floor has the following beneficial effects.
[0018] To make the technical scheme of the wood grain floor clearer, the wood grain floor is described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a structural schematic view of the wood grain floor.
[0020] Reference signs:
[0021] 1, solid wood veneer layer; 2, cement board layer; 3, bonding thin layer; 4, moisture-proof film layer; 5, suspended paving piece; 6, ground. DETAILED DESCRIPTION
[0022] To make the technical scheme of the wood grain floor clearer, the wood grain floor is described in detail below with reference to the drawings and specific embodiments.
[0023] As shown in Figure 1 In one embodiment, a wood grain floor includes a solid wood veneer layer 1, a cement board layer 2, and a bonding thin layer 3. The cement board layer 2 is arranged between the solid wood veneer layer 1 and the bonding thin layer 3. A moisture-proof film layer 4 is arranged below the bonding thin layer 3.
[0024] The solid wood veneer layer 1 is used as a surface layer and is usually made of high-quality wood. The solid wood veneer layer 1 is formed into a thin layer through fine processing. The surface of the solid wood veneer layer 1 has lively and natural texture and can effectively simulate the appearance and touch of natural solid wood. The solid wood veneer layer 1 not only gives the floor a natural and elegant wood grain surface but also provides comfort in terms of foot feeling, ensures wear resistance and stain resistance, and enhances the decorative effect.
[0025] The cement board layer 2 is located between the solid wood veneer layer 1 and the bonding thin pasting layer 3. The cement board has high stability and good heat conduction performance, which can effectively improve the deformation resistance and structural strength of the floor. This layer is firmly combined with the solid wood veneer layer 1 through the hot-pressing process to form an integrated composite structure, which makes the floor more stable and reduces the expansion or shrinkage problem caused by temperature change. The addition of the cement board layer 2 enhances the overall strength of the floor and further improves the durability of the floor.
[0026] The bonding thin pasting layer 3 is located below the cement board layer 2 and mainly serves as a reinforcing layer. The design of this layer helps to improve the adhesion of the floor and the stability of the overall structure.
[0027] Below the bonding thin pasting layer 3, there is also a moisture-proof film layer 4, which serves as a moisture-proof isolation layer. This layer can effectively prevent ground moisture 6 from penetrating into the floor and avoid damage or affect the performance of the floor in a humid environment. The moisture-proof film layer 4 is usually made of high-quality plastic film material with strong waterproof performance, which can effectively isolate moisture and protect the floor from the influence of humid weather, thereby prolonging the service life of the floor.
[0028] Specifically, the solid wood veneer layer 1 and the cement board layer 2 are any one of the following types: I-shaped, herringbone, checkered or fishbone. The thickness of the solid wood veneer layer 1 is 25% of the thickness of the cement board layer 2, and the thickness of the solid wood veneer layer 1 is 1-2mm, and the thickness of the cement board layer 2 is 4-8mm.
[0029] As shown in Figure 1 In this embodiment, the bonding thin pasting layer 3 and the moisture-proof film layer 4 are internally inserted with a suspended paving piece 5.
[0030] Specifically, the thickness of the bonding thin pasting layer 3 is 125% of the thickness of the moisture-proof film layer 4, and the thickness of the bonding thin pasting layer 3 is 5-10mm, and the thickness of the moisture-proof film layer 4 is 4-8mm.
[0031] It needs to be noted that the thermal conductivity of cement is 1.74W / (m·K), while the thermal conductivity of wood is 0.15W / (m·K), with a difference of more than ten times. Through calculation, after the hot-pressing process combines the veneer and the cement board into a whole board, the thermal conduction efficiency of the board ranges from 1W / (m·K) to 1.2W / (m·K), which is about ten times that of traditional wood. Moreover, the suspended paving method with moisture-proof film and the air in the suspended paving piece 5 are poor conductors of heat. Through the above technical solutions, the present application effectively improves the heat conduction efficiency while ensuring soft foot feeling.
[0032] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A thermally conductive wood grain floor, characterized by, Include: Solid wood veneer layer (1), cement board layer (2) and adhesive veneer layer (3), the cement board layer (2) is arranged between the solid wood veneer layer (1) and the adhesive veneer layer (3); The solid wood veneer layer (1) and the cement board layer (2) are hot-pressed into a whole board; The adhesive veneer layer (3) is further provided with a moisture-proof film layer (4) below, and the adhesive veneer layer (3) and the moisture-proof film layer (4) are internally provided with a suspended paving piece (5).
2. The thermally conductive wood flooring of claim 1, wherein, The solid wood veneer layer (1) and the cement board layer (2) are any one of I-shaped paving, herringbone paving, checkered paving or fishbone paving.
3. The thermally conductive wood flooring of claim 1, wherein, The thickness of the solid wood veneer layer (1) is 25% of the thickness of the cement board layer (2).
4. The thermally conductive wood flooring of claim 1, wherein, The thickness of the solid wood veneer layer (1) is 1-2mm.
5. The thermally conductive wood flooring of claim 1, wherein, The thickness of the cement board layer (2) is 4-8mm.
6. The thermally conductive wood flooring of claim 1, wherein, The thickness of the adhesive veneer layer (3) is 125% of the thickness of the moisture-proof film layer (4).
7. The thermally conductive wood flooring of claim 1, wherein, The thickness of the adhesive veneer layer (3) is 5-10mm.
8. The thermally conductive wood flooring of claim 1, wherein, The thickness of the moisture-proof film layer (4) is 4-8mm.