Sensor

By employing multiple electrically connected printed circuit boards and thermosetting material to encapsulate the lead wires in the sensor, the problems of low sensor panelization and insufficient sealing are solved, achieving modular design and cost reduction.

CN223882994UActive Publication Date: 2026-02-06VITESCO AUTOMOTIVE ELECTRONICS (CHANGCHUN) CO LTD
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Patent Information

Application Number
CN202520246353.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-17
Publication Date
2026-02-06
Estimated Expiration
2035-02-17

AI Technical Summary

Technical Problem

The existing sensors have a single integrated printed circuit board, resulting in low board ratio, high cost, and insufficient sealing. In particular, sensors immersed in liquids are easily damaged by moisture and dust.

Method used

The design achieves modularity and good sealing by using at least two electrically connected printed circuit boards, each integrating different functions, and encapsulating the leads through a thermosetting material seal.

Benefits of technology

It increases the panelization rate of printed circuit boards, reduces production costs, and achieves the sealing performance of sensors to prevent dust and liquid ingress.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a sensor, which comprises a shell, a printed circuit board accommodated in the shell and a leading-out wire which penetrates through a wire outlet on the shell and is led out, and is characterized in that the printed circuit board comprises a first printed circuit board and a second printed circuit board which are electrically connected with each other; the outgoing line is led out from the second printed circuit board, the outgoing line and the second printed circuit board are packaged into an integrated assembly at the connecting position of the outgoing line and the second printed circuit board through a sealing piece made of thermosetting materials, and the sealing piece is fixed in the line outlet in a sealed mode. According to the utility model, the board splicing rate of the printed circuit board is improved, modular design and good sealing are allowed to be realized, and the production cost is obviously reduced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field. BACKGROUND

[0002] In order to realize more complex function, many sensors currently integrate printed circuit board, and the printed circuit board is contained in the shell, and the lead wire is led out from the printed circuit board through the shell to connect with external equipment, so that the printed circuit board can communicate with the external equipment, thereby transmitting the detected data to the external equipment.

[0003] In order to avoid the damage of moisture and dust to the electronic components on the printed circuit board, the sensor usually needs to be sealed. Especially for the sensor immersed in liquid, the sealing of the sensor is particularly important, for example, the position sensor for detecting the rotation angle and position of the rotating shaft installed in the motor or gearbox is usually immersed in oil.

[0004] In addition, the printed circuit board in the current sensor usually adopts a single board, and all functions are integrated on the single board. In order to meet the space requirements of different customers, the printed circuit board will present various shapes, which makes the board rate of the printed circuit board low, resulting in high cost.

[0005] Therefore, there is a need to improve the sensor. SUMMARY

[0006] The utility model aims at solving at least one above-mentioned problem existing in prior art.

[0007] Therefore, the utility model provides a sensor, the sensor includes the shell, the printed circuit board contained in the shell and the lead wire led out through the outlet of the shell, characterized in that, the printed circuit board includes the first printed circuit board and the second printed circuit board electrically connected with each other, the lead wire is led out from the second printed circuit board, the lead wire and the second printed circuit board are encapsulated into an integral assembly at the part of their mutual connection through the sealing element formed by thermosetting material, and the sealing element is sealingly fixed in the outlet.

[0008] By setting at least two printed circuit boards electrically connected with each other, different functions can be integrated on different printed circuit boards, which is beneficial to improve the board rate of the printed circuit board. In addition, the lead wire and the printed circuit board connected with the lead wire are encapsulated into an integral assembly through the sealing element formed by thermosetting material, which on the one hand allows modular design, and on the other hand realizes the sealing of the lead wire. The sensor according to the utility model has good sealing performance and significantly reduced production cost.

[0009] In a preferred embodiment, a groove is provided on the sealing member and / or the housing, and a sealing ring is embedded in the groove to form a seal between the sealing member and the housing. By providing a sealing ring, a seal between the sealing member and the housing is achieved in a simple manner.

[0010] In a preferred embodiment, one of the sealing member and the housing is provided with a clamping protrusion, and the other of the sealing member and the housing is correspondingly provided with a clamping recess, and the clamping protrusion is clamped in the clamping recess. The clamping protrusion and the clamping recess that cooperate with each other allow better positioning and fixing between the sealing member and the housing.

[0011] In a preferred embodiment, the housing comprises a guiding support extending from an inner wall of the housing to an interior of the housing, and the guiding support comprises two oppositely arranged guiding grooves, and the un-encapsulated portion of the second printed circuit board is inserted and fitted in the guiding grooves. This allows the second printed circuit board to be well supported.

[0012] In a preferred embodiment, a support protrusion is provided on an inner wall of the guiding groove for supporting the un-encapsulated portion. The provision of the support protrusion allows the second printed circuit board to be more stably fixed.

[0013] In a preferred embodiment, the housing comprises a receiving portion extending from an outer wall of the housing to an exterior of the housing, and the sealing member is sealingly fixed in the receiving portion. The receiving portion extending from the outer wall of the housing allows the sealing member to be well supported, and does not increase the wall thickness of the housing.

[0014] In a preferred embodiment, a recess is provided on the receiving portion and / or the sealing member to allow the receiving portion and the sealing member to only contact on a part of a surface of the sealing member. This allows the sealing member to be more easily inserted into the receiving portion.

[0015] In a preferred embodiment, the sensor is a position sensor, the first printed circuit board is integrated with a module for position detection, and the second printed circuit board is integrated with a module for signal processing. This allows the first printed circuit board to change shape according to the spatial requirements of the customer, and the second printed circuit board forms a standardized module with the lead wire and the sealing member.

[0016] In a preferred embodiment, the housing of the sensor is formed by an upper housing and a lower housing that are sealingly fixed together. This allows the sensor to be conveniently assembled.

[0017] In a preferred embodiment, the upper housing and the lower housing are welded to each other. This allows a seal between the upper housing and the lower housing to be achieved in a simple manner. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present invention will now be described in detail with reference to the accompanying drawings and through non-limiting embodiments, wherein:

[0019] Figure 1 This is a perspective view of a sensor according to an embodiment of the present invention;

[0020] Figure 2 yes Figure 1 The image shows a 3D view of the sensor, with the upper housing removed to reveal the sensor's internal structure.

[0021] Figure 3 yes Figure 1 The sensor is shown in a perspective view, with the upper and lower housings removed to show the connection between the first and second printed circuit boards of the sensor, as well as between the second printed circuit board and the lead wires.

[0022] Figure 4 yes Figure 1 The sensor shown is a 3D view, in which the upper housing and lead wires have been removed;

[0023] Figure 5 yes Figure 4 The sensor shown is a cross-sectional view taken along its centerline to show how the sensor's second printed circuit board and seal are secured.

[0024] The accompanying drawings are schematic only and are not necessarily drawn to scale. They only show those parts necessary to illustrate the present invention, while other parts may be omitted or simply mentioned. The present invention may include other parts or components besides those shown in the drawings. Detailed Implementation

[0025] In the following description, numerous specific details are set forth to enable those skilled in the art to gain a more complete understanding of the present invention. However, it will be apparent to those skilled in the art that implementations of the present invention may not include some of these specific details. Furthermore, it should be understood that the present invention is not limited to the specific embodiments described. Rather, the present invention can be conceived to be practiced with any combination of the following features and elements, regardless of whether they relate to different embodiments. Therefore, the following features, embodiments, and advantages are for illustrative purposes only and should not be construed as elements or limitations of the claims unless expressly set forth in the claims.

[0026] The description used in the following description of orientation, such as "upper", "lower", etc., is only for the convenience of description, and is not intended to form any limitation on the utility model. In addition, in this text, the terms "first", "second" are used to describe the components, which are only used to distinguish the components, and are not used to limit the order or number of the components.

[0027] Reference will now be made to Figures 1 to 5 The utility model is described in detail. In the following description, the utility model is described in combination with a position sensor for detecting the rotation angle and position of a rotating shaft used in a motor or gearbox, which is usually immersed in oil, and therefore needs to be sealed. However, it should be understood that the utility model is also applicable to any other sensor that needs to be sealed.

[0028] As Figure 1 and Figure 2 shown, the sensor 100 includes a housing, a printed circuit board accommodated in the housing, and a lead-out wire led out from the printed circuit board, which passes through a wire outlet provided on the housing to communicate with an external device (not shown) so as to transmit the data detected by the sensor 100 to the external device.

[0029] More specifically, as Figure 1 shown, the sensor 100 includes an upper housing 1 and a lower housing 2. The upper housing 1 and the lower housing 2 are sealingly fixed to each other, for example, by welding (e.g., laser welding, friction welding, ultrasonic welding, etc.). It should be understood that the upper housing 1 and the lower housing 2 can also be sealingly fixed by any suitable means known in the art, such as adhesion.

[0030] As Figure 2 shown, the first printed circuit board 3 and the second printed circuit board 4 are accommodated in the internal space formed by the upper housing 1 and the lower housing 2. The first printed circuit board 3 is integrated with a module for detecting the rotation angle and position of a rotating shaft, and the second printed circuit board 4 is integrated with a module for signal processing. As Figure 2 and Figure 3 shown, the first printed circuit board 3 is in the shape of a generally circular ring, and is preferably fixed to the lower housing 2 by thermal riveting. The shape and size of the first printed circuit board 3 can be changed according to the spatial requirements of the customer. For sensors applied to other scenarios, the first printed circuit board 3 can be used to implement other functions, accordingly having other shapes and sizes. Additionally, the sensor 100 can also include more printed circuit boards integrated with other functional modules.

[0031] By integrating different functions on different printed circuit boards, the board rate of the printed circuit boards can be improved. That is, the first printed circuit board 3 and the second printed circuit board 4 can be more easily assembled with other printed circuit boards according to their shape and size. In addition, this can also achieve a modular design of the sensor, thereby improving the design efficiency and reducing the product development cycle. For example, the shape of the first printed circuit board 3 can be changed according to the customer's space requirements, while the second printed circuit board 4 remains unchanged.

[0032] The first printed circuit board 3 and the second printed circuit board 4 are electrically connected to each other, for example, by wire bonding or pin-to-pin connection. It should be understood that the first printed circuit board 3 and the second printed circuit board 4 can also be connected by any suitable means known in the art. The lead wire 5 is led out from the second printed circuit board 4 and passes through the wire outlet 6 provided on the lower housing 2 to communicate with external devices.

[0033] In addition to the need for sealing at the connection of the upper housing 1 and the lower housing 2, there is also a need for sealing at the lead wire 5. If the lead wire 5 is not sealed, dust and liquid can seep into the interior of the sensor 100 along the lead wire 5, causing damage to the electronic components inside the sensor 100. According to the present application, the lead wire 5 is encapsulated by a seal 7 formed of thermosetting material (see Figure 3 ). Thus, there is no leakage at the lead wire 5. Advantageously, during manufacture, after the second printed circuit board 4 is electrically connected to the lead wire 5, they are placed in a mold, and then the thermosetting material is injected into the mold and cured to form the seal 7. Thus, the second printed circuit board 4 and the lead wire 5 are encapsulated as an integral assembly by the seal 7. This achieves sealing of the lead wire 5 on the one hand, and allows modular design on the other hand. Here, advantageously, only the second printed circuit board 4 and the lead wire 5 can be encapsulated by the seal 7 at the part where they are connected to each other. This allows the exposed part of the second printed circuit board 4, facilitating the connection between the second printed circuit board 4 and the first printed circuit board 3 and the maintenance (e.g. replacement of electronic components) of the second printed circuit board 4.

[0034] During assembly of the sensor 100, the assembly formed by the second printed circuit board 4, the lead wire 5 and the seal 7 can be conveniently sealed and fixed in the wire outlet 6 of the lower housing 2. Advantageously, a groove 71 can be provided on the seal 7 for receiving a sealing ring 8, as shown in Figure 3 and Figure 5 . The sealing ring 8 is used to form a seal between the seal 7 and the lower housing 2. It is also envisaged that, additionally or alternatively, a groove is provided on the lower housing 2 for receiving a sealing ring.

[0035] To better realize the positioning and fixing between the seal 7 and the lower housing 2, a clamping protrusion 72 is arranged on the seal 7. Correspondingly, a clamping notch 21 is arranged on the lower housing 2. As shown in Figure 1 and Figure 5 , one long strip-shaped clamping protrusion 72 is arranged on each of the upper and lower sides of the seal 7, and correspondingly one long strip-shaped clamping notch 21 is arranged on each of the upper and lower sides of the lower housing 2. It should be understood that the number, shape and position of the clamping protrusion 72 and the clamping notch 21 can be changed according to actual needs. Alternatively, the positions of the clamping protrusion and the clamping notch can be interchanged, i.e. the clamping protrusion is arranged on the lower housing 2, and the clamping notch is arranged on the seal 7.

[0036] To better support the second printed circuit board 4, the lower housing 2 comprises a guide support portion 22 extending from the inner wall of the lower housing 2 to the inside of the lower housing 2, as shown in Figure 2 , Figure 4 , Figure 5 . Preferably, the guide support portion 22 comprises two oppositely arranged guide grooves 23, and the two sides of the un-encapsulated part of the second printed circuit board 4 can be inserted and fitted in the guide grooves 23.

[0037] To better fix the second printed circuit board 4, as shown in Figure 5 , a support protrusion 24 can also be arranged on the inner wall of the guide groove 23. In the embodiment shown in Figure 5 , the support protrusion 24 is arranged on the upper wall of the guide groove 23. It should be understood that the support protrusion can also be arranged on the lower wall and / or the side wall of the guide groove.

[0038] Advantageously, to better support the seal 7 without increasing the wall thickness of the lower housing 2, the lower housing 2 further comprises a receiving portion 25 extending from the outer wall of the lower housing 2 to the outside of the lower housing 2, and the seal 7 is sealingly fitted and fixed in the receiving portion 25.

[0039] In assembling the sensor 100, the first printed circuit board 3 can be first fixed in the lower housing 2, the sealing ring 8 is embedded in the groove 71 of the seal 7, then the integrated assembly formed by the second printed circuit board 4, the lead wire 5 and the seal 7 is inserted into the receiving portion 25 of the lower housing 2, and the assembly is pushed into the inside of the lower housing 2 until the clamping protrusion 72 is clamped into the clamping notch 21, at this time the second printed circuit board 4 is inserted and fitted into the guide groove 23, then the first printed circuit board 3 and the second printed circuit board 4 are connected, and finally the upper housing 1 is covered and sealingly fixed to the lower housing 2. In this way, the printed circuit boards are completely sealed in the housing and will not be damaged by external liquids and dust.

[0040] In order to more easily insert the seal 7 into the housing 25 and fit into place, the seal 7 can be brought into contact with the housing 25 only on a part of the surface of the seal 7, for example, as shown in Figure 5 a recess 26 can be provided on the seal 7 such that the seal 7 is not in contact with the housing 25 at the recess 26. It is also conceivable to alternatively or additionally provide a recess on the inner wall of the housing 25.

[0041] Although the utility model discloses as above with preferable embodiment, the utility model is not limited to this. Any person skilled in the art makes various changes and modifications without departing from the spirit and scope of the utility model, and all should be included in the protection scope of the utility model, therefore the protection scope of the utility model should be limited to the range defined in the claims.

Claims

1. A sensor comprising a housing, a printed circuit board housed within the housing, and a lead wire drawn out through a lead wire outlet on the housing, characterized in that, The printed circuit board comprises a first printed circuit board and a second printed circuit board electrically connected to each other, the lead-out wire is led out from the second printed circuit board, the lead-out wire and the second printed circuit board are packaged into an integrated assembly at the part where they are connected to each other by a seal formed by a thermosetting material, and the seal is sealingly fixed in the lead-out port.

2. The sensor of claim 1, wherein, A groove is provided on the seal and / or the housing, and a sealing ring is embedded in the groove to form a seal between the seal and the housing.

3. The sensor of claim 1, wherein, One of the seal and the housing is provided with a clamping protrusion, and the other of the seal and the housing is correspondingly provided with a clamping notch, and the clamping protrusion is clamped in the clamping notch.

4. The sensor according to any one of claims 1 to 3, characterized in that, The housing comprises a guide support extending from the inner wall of the housing to the inside of the housing, and the guide support comprises two oppositely arranged guide grooves, and the unsealed part of the second printed circuit board is inserted and fitted in the guide grooves.

5. The sensor of claim 4, wherein, A support protrusion is provided on the inner wall of the guide groove for supporting the unsealed part.

6. The sensor of any one of claims 1 to 3, wherein, The housing comprises a containing part extending from the outer wall of the housing to the outside of the housing, and the seal is sealingly fixed in the containing part.

7. The sensor of claim 6, wherein, A recess is provided on the containing part and / or the seal to allow the containing part and the seal to only contact on a part of the surface of the seal.

8. The sensor of any one of claims 1 to 3, wherein, The sensor is a position sensor, the first printed circuit board is integrated with a module for position detection, and the second printed circuit board is integrated with a module for signal processing.

9. The sensor of any one of claims 1 to 3, wherein, The housing of the sensor is formed by an upper housing and a lower housing sealingly fixed together.

10. The sensor of claim 9, wherein, The upper housing and the lower housing are welded together.