Device for testing welding heat resistance of diode

By combining a heating mechanism that integrates high-frequency induction heating and infrared heating, along with a ceramic fiber heat shield and an adjustable clamping mechanism, the problem of inaccurate simulation in traditional devices is solved, enabling precise testing of the solderability and heat resistance of diodes.

CN223883704UActive Publication Date: 2026-02-06COLOR CORE (HAINING) SEMICON CO LTD
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Patent Information

Application Number
CN202520179831.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-05
Publication Date
2026-02-06
Estimated Expiration
2035-02-05

AI Technical Summary

Technical Problem

Traditional welding thermal simulation devices struggle to accurately replicate the heat distribution and stress changes during the welding process, resulting in large deviations in the test results of diode welding thermal resistance.

Method used

The heating mechanism combines a high-frequency induction heating component and an infrared heating component, along with a hollowed-out ceramic fiber heat insulation cover and an adjustable clamping mechanism, to accurately simulate the heat distribution and stress changes during the welding process.

Benefits of technology

This improves the accuracy and reliability of diode solderability thermal performance testing, ensures the precision and stability of test results, and reduces energy consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a diode welding heat resistance testing device, which relates to the technical field of electronic component testing and is technically characterized by comprising a workbench, a heating mechanism is arranged on one side of the top of the workbench, a clamping mechanism is arranged on the other side of the top of the workbench, and the heating mechanism comprises a high-frequency induction heating assembly and an infrared heating assembly. The high-frequency induction heating assembly comprises a high-frequency power source fixedly installed on one side of the top of the workbench, the output end of the high-frequency power source is fixedly connected with an induction coil, and a heat insulation cover fixedly installed on the top of the workbench is arranged on the outer side of the induction coil. According to the utility model, the high-frequency induction heating assembly and the infrared heating assembly are combined, and the ceramic fiber heat insulation cover and the adjustable clamping mechanism are matched, so that the welding heat distribution and the thermal stress change can be accurately simulated, the independence and the accuracy of the test are ensured, meanwhile, the device adapts to diodes with different sizes, and the test efficiency and the reliability are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component testing technical field, concretely is a diode welding heat resistance testing arrangement. BACKGROUND

[0002] In the production and application field of electronic components, diodes play a crucial role as a basic and key component, and their performance directly affects the function and efficiency of the entire electronic system. In particular, during the process of welding diodes to circuit boards or other substrates, diodes must be able to withstand the high temperature and thermal stress generated by welding operations. This characteristic - welding heat resistance - is crucial for ensuring the reliability, long-term stability of diodes in subsequent use, and the working efficiency of the overall circuit.

[0003] However, traditional devices that simulate welding heat environments are often limited to using heating wires or heating blocks to provide heat. Although this method is simple to operate, it is difficult to accurately replicate the complex heat distribution and stress changes in the actual welding process, including rapid temperature rise and local high temperature points. Therefore, the results often deviate significantly from the thermal stress conditions experienced by diodes in actual welding scenarios, and cannot fully and accurately reflect the welding heat resistance of diodes. Therefore, we propose a new diode welding heat resistance testing device. SUMMARY

[0004] (I) Technical problem solved

[0005] To overcome the shortcomings of the prior art, the utility model provides a diode welding heat resistance testing device, which solves the problem of large deviation of traditional welding heat simulation devices using heating wires or blocks, which is simple to operate but difficult to accurately replicate welding heat distribution and stress changes.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical scheme: a diode welding heat resistance testing device, comprising a workbench, one side of the top of the workbench is provided with a heating mechanism, the other side of the top of the workbench is provided with a clamping mechanism;

[0008] The heating mechanism comprises a high-frequency induction heating assembly and an infrared heating assembly;

[0009] The high-frequency induction heating assembly comprises a high-frequency power supply fixedly installed on one side of the top of the workbench, the output end of the high-frequency power supply is fixedly connected with an induction coil, and the outer side of the induction coil is provided with a heat shield fixedly installed on the top of the workbench;

[0010] The infrared heating assembly comprises a sealing top cover fixedly installed at the top end of the heat shield, and a plurality of infrared heating pipes are fixedly installed at the bottom of the sealing top cover.

[0011] Preferably, the induction coil is wound by a copper pipe, wherein the induction coil is hollow and filled with a cooling medium to remove the heat generated by the induction coil itself.

[0012] Preferably, the heat shield is in the shape of a hollow rectangular frame, and is made of ceramic fiber.

[0013] Preferably, the clamping mechanism comprises a guide rail fixedly installed on the other side of the top of the workbench, and a sliding block is slidingly connected to the outer side of the guide rail.

[0014] Preferably, a bottom plate is fixedly installed at the top of the sliding block, a lower backing plate is fixedly installed at the center of the top of the bottom plate, guide columns are fixedly installed at the four corners of the top of the bottom plate, a top plate is fixedly installed at the top of the guide columns, a compression rod is threadedly connected to the center of the inside of the top plate, a pressing plate slidingly connected to the guide columns is bearingly connected to the lower end of the compression rod, and an upper backing plate is fixedly installed at the bottom of the pressing plate.

[0015] Preferably, the lower backing plate and the upper backing plate are identical in shape and size, and are both made of high-temperature silica gel and metal sheet.

[0016] Preferably, a knob disc with a plurality of anti-skid blocks is fixedly installed at the top end of the compression rod, and the anti-skid blocks are uniformly distributed on the outer circular surface of the knob disc in a circumferential manner.

[0017] (Three) beneficial effects

[0018] Compared with the prior art, the utility model provides a kind of, with following beneficial effects:

[0019] 1. The utility model discloses a high-frequency induction heating assembly and an infrared heating assembly are combined to simulate the complex heat distribution and thermal stress change in the actual welding process more accurately. The high-frequency induction heating assembly generates rapid heating effect through high-frequency power supply and induction coil, and the infrared heating assembly provides uniform and controllable infrared radiation heating. The combination of the two can more comprehensively reflect the thermal stress condition of the diode in the actual welding process, thereby improving the accuracy and reliability of the test.

[0020] 2. The heat shield made of ceramic fiber effectively isolates the heat generated by the high-frequency induction heating assembly from affecting other parts of the workbench, ensuring the independence and accuracy of the test. At the same time, the hollow design of the heat shield also ensures the effective emission and uniform distribution of heat, further improving the accuracy and stability of the test.

[0021] 3. The utility model discloses a settable and adjustable clamping mechanism, can conveniently hold and fix the diode of different size and shape and test. The lower backing plate and upper backing plate in clamping mechanism all adopt high temperature silica gel and metal sheet compound, can bear high temperature and have good elasticity, can closely adhere diode surface, avoid heat loss and error in the testing process. Meanwhile, the design of the compression rod and knob disc also makes the clamping process more simple and fast, improves the testing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 It is the structure schematic drawing of the utility model;

[0023] Fig. 2 It is the heating mechanism cross section structure schematic drawing of the utility model;

[0024] Fig. 3 It is the inductive coil structure schematic drawing of the utility model.

[0025] In the drawing:

[0026] 1, workbench;

[0027] 2, heating mechanism;

[0028] 21, high-frequency induction heating assembly; 211, high-frequency power supply; 212, inductive coil; 213, heat shield;

[0029] 22, infrared heating assembly; 221, sealed top cover; 222, infrared heating tube;

[0030] 3, clamping mechanism; 31, guide rail; 32, sliding block; 33, bottom plate; 34, lower backing plate; 35, guide column; 36, top plate; 37, compression rod; 38, pressing plate; 39, upper backing plate. DETAILED DESCRIPTION

[0031] In the utility model, under the condition of not making opposite statement, the orientation such as " upper, lower " that using is usually for the direction shown in the drawing or for the vertical, perpendicular or gravity direction; Similarly, for the convenience of understanding and description, " left, right " is usually for the left, right shown in the drawing; " inner, outer " refers to the inner, outer of the contour of each component itself, but the above-mentioned orientation word is not used to limit the utility model.

[0032] The utility model provides a technical scheme:

[0033] Please refer to Figs. 1-3 A kind of diode welding heat resistance testing device, including workbench 1, the one side of workbench 1 top is provided with heating mechanism 2, the other side of workbench 1 top is provided with clamping mechanism 3.

[0034] The heating mechanism 2 comprises a high-frequency induction heating assembly 21 and an infrared heating assembly 22.

[0035] The high-frequency induction heating assembly 21 comprises a high-frequency power supply 211 fixedly installed on one side of the top of the workbench 1, and an induction coil 212 fixedly connected to the output end of the high-frequency power supply 211. An outer side of the induction coil 212 is provided with a heat shield 213 fixedly installed on the top of the workbench 1. The induction coil 212 is driven by the high-frequency power supply 211 to generate a high-frequency magnetic field, thereby inducing eddy current heating around the diode pin, simulating the high-temperature state in the welding instant. The heat shield 213 effectively insulates heat loss, ensuring that heat is concentrated on the diode welding site, improving test efficiency and accuracy.

[0036] The infrared heating assembly 22 comprises a sealed top cover 221 fixedly installed at the top end of the heat shield 213, and a plurality of infrared heating tubes 222 fixedly installed at the bottom of the sealed top cover 221. The infrared heating tubes 222 at the bottom of the sealed top cover 221 quickly and uniformly preheat the diode pin and the surrounding welding site, simulating the preparation process before actual welding, providing a stable basis for subsequent high-frequency induction heating, and ensuring the accuracy and reliability of the test.

[0037] Further, the induction coil 212 is made of copper pipe winding, wherein the induction coil 212 is hollow, and the inside is filled with a cooling medium for carrying away the heat generated by the induction coil 212 itself. By winding the induction coil 212 with a hollow copper pipe and filling it with a cooling medium, the heat generated during power-on can be effectively carried away, preventing the coil from overheating and ensuring the stability and accuracy of high-frequency induction heating, thereby improving the accuracy of diode welding heat resistance testing.

[0038] Further, the heat shield 213 is in the shape of a hollow rectangular frame, and is made of ceramic fiber. By making the heat shield 213 in the shape of a hollow rectangular frame of ceramic fiber, the heat generated by the high-frequency induction heating assembly can be effectively insulated, ensuring that heat is concentrated on the diode welding site, improving test efficiency and accuracy, and reducing energy consumption.

[0039] Further, the clamping mechanism 3 comprises a guide rail 31 fixedly installed on the other side of the top of the workbench 1, and a sliding block 32 slidingly connected to the outer side of the guide rail 31. By designing the guide rail 31 and the sliding block 32 in the clamping mechanism 3, the operator can accurately move the diode into the induction coil, ensuring the accuracy of the test position and the stability of the diode during the test process, improving the accuracy and reliability of the test.

[0040] Further, the top of the slider 32 is fixedly installed with a bottom plate 33, the center of the top of the bottom plate 33 is fixedly installed with a lower backing plate 34, the four corners of the top of the bottom plate 33 are fixedly installed with guide columns 35, the top of the guide column 35 is fixedly installed with a top plate 36, the inside of the top plate 36 is threadedly connected with a pressing rod 37, the lower end of the pressing rod 37 is bearingly connected with a pressing plate 38 which is slidingly connected with the guide column 35, the bottom of the pressing plate 38 is fixedly installed with an upper backing plate 39, and the combination of the bottom plate 33, the guide column 35, the top plate 36, the pressing rod 37, the pressing plate 38, the lower backing plate 34 and the upper backing plate 39 realizes stable clamping and protection of the diode, ensures that the diode is fixed and not damaged during the test, and improves the accuracy and reliability of the test.

[0041] Further, the lower backing plate 34 and the upper backing plate 39 are completely consistent in shape and size, and are both composed of high-temperature silica gel and metal sheet, which ensures stable clamping and high-temperature protection of the diode, prevents damage caused by direct contact with high-temperature components or excessive pressure, and improves the accuracy and reliability of the test.

[0042] Further, the top end of the pressing rod 37 is fixedly installed with a knob disc with a plurality of anti-skid blocks, the anti-skid blocks are uniformly distributed in a circumferential shape on the outer circular surface of the knob disc, and the anti-skid block knob disc at the top end of the pressing rod 37 facilitates stable rotation of the pressing rod 37 by the operator, improves the accuracy and convenience of operation, thereby ensuring that the diode is stably clamped during the test and avoiding test errors caused by improper operation.

[0043] In specific use, the working principle of the utility model is as follows:

[0044] During the test, the operator first accurately places the diode to be tested on the lower backing plate 34 on the clamping mechanism 3. The stable surface of the lower backing plate 34 ensures stable placement of the diode. Then, the operator rotates the pressing rod 37, which stably moves downward under the action of the threaded connection, which synchronously drives the accurate downward movement of the pressing plate 38 and the upper backing plate 39, thereby implementing stable and uniform clamping and fixing operation on the diode. This clamping method not only ensures the stability of the diode during the test, but also effectively prevents damage to the diode caused by improper clamping.

[0045] The lower backing plate 34 and the upper backing plate 39 are both composed of high-temperature silica gel and metal sheet, which gives them good high-temperature resistance and a certain elasticity. In a high-temperature test environment, this material combination can effectively protect the diode from damage caused by direct contact with high-temperature components or excessive pressure.

[0046] Then, under the precise guiding and sliding of the guide rail 31 and the sliding block 32, the operator can easily move the lead wire of one end of the diode to the inside of the induction coil 212. The accuracy of this step is crucial for the accuracy of the subsequent test.

[0047] Subsequently, the operator starts the infrared heating pipe 222 on the infrared heating assembly 22. The infrared heating pipe 222 quickly emits infrared radiation, which quickly and uniformly acts on the pins and the welding site of the diode, and preheats a large area. This preheating stage simulates the preparation process before actual welding, ensuring the stability and reliability of the diode in the subsequent high-temperature test.

[0048] After the preheating is completed, the operator starts the high-frequency power supply 211. The output end of the high-frequency power supply 211 provides high-frequency current for the induction coil 212, and the induction coil 212 generates a high-frequency magnetic field. This magnetic field generates eddy currents around the diode pins, which quickly heat the welding points and their surrounding areas, thereby simulating the high-temperature state at the moment of welding. This high-frequency induction heating method not only has fast heating speed, but also can accurately control the heating area and temperature, making the simulated welding thermal environment more close to the actual welding situation.

[0049] During the entire test process, the cooperation of the high-frequency induction heating assembly 21 and the infrared heating assembly 22 plays a crucial role. They can strictly apply heat according to the temperature change curve in the actual welding process, thereby ensuring the similarity of the simulated welding thermal environment to the actual welding situation.

[0050] In addition, the design of the heat shield 213 also plays a key role. It effectively isolates the heat generated by the high-frequency induction heating assembly 21 from the surrounding environment, ensuring that the heat can be concentrated on the welding site of the diode. This design not only improves the test efficiency, but also reduces the energy consumption during the test process.

[0051] In summary, the diode soldering heat resistance test device realizes accurate testing of the soldering heat resistance of the diode through the precise clamping mechanism 3, the efficient infrared heating assembly 22 and the high-frequency induction heating assembly 21, and the ingenious design of the heat shield 213.

[0052] The above is only a specific embodiment of the present application, but the technical features of the present application are not limited to this. Any simple change, equivalent replacement or modification made on the basis of the present application to solve the same technical problem and achieve the same technical effect is covered by the protection scope of the present application.

Claims

1. A diode solder heat resistance testing device comprising a workbench (1), characterized in that: One side of the top of the workbench (1) is provided with a heating mechanism (2), the other side of the top of the workbench (1) is provided with a clamping mechanism (3); The heating mechanism (2) comprises a high-frequency induction heating assembly (21) and an infrared heating assembly (22); The high-frequency induction heating assembly (21) comprises a high-frequency power supply (211) fixedly installed on one side of the top of the workbench (1), and the output end of the high-frequency power supply (211) is fixedly connected with an induction coil (212), and the outer side of the induction coil (212) is provided with a heat shield (213) fixedly installed on the top of the workbench (1); The infrared heating assembly (22) comprises a sealed top cover (221) fixedly installed on the top end of the heat shield (213), and a plurality of infrared heating pipes (222) are fixedly installed on the bottom of the sealed top cover (221).

2. A diode solder heat resistance test device according to claim 1, characterized by: The induction coil (212) is made of copper pipe winding, wherein the induction coil (212) is hollow, and the inside is filled with cooling medium for taking away the heat generated by the induction coil (212) itself.

3. A diode solder heat resistance test device according to claim 1, characterized by: The heat shield (213) is in the shape of a hollow rectangular frame, and the heat shield (213) is made of ceramic fiber.

4. A diode solder heat resistance test device according to claim 1, characterized by: The clamping mechanism (3) comprises a guide rail (31) fixedly installed on the other side of the top of the workbench (1), and the outer side of the guide rail (31) is slidably connected with a sliding block (32).

5. A diode solder heat resistance test device according to claim 4, characterized in that: The top of the sliding block (32) is fixedly installed with a bottom plate (33), the center of the top of the bottom plate (33) is fixedly installed with a lower backing plate (34), the four corners of the top of the bottom plate (33) are fixedly installed with guide columns (35), the top of the guide columns (35) is fixedly installed with a top plate (36), the center of the inside of the top plate (36) is threadedly connected with a pressing rod (37), the lower end of the pressing rod (37) is bearingly connected with a pressing plate (38) slidably connected with the guide column (35), and the bottom of the pressing plate (38) is fixedly installed with an upper backing plate (39).

6. A diode solder heat resistance test device according to claim 5, characterized by: The lower backing plate (34) and the upper backing plate (39) are completely consistent in size, and the lower backing plate (34) and the upper backing plate (39) are both made of high-temperature silica gel and metal sheet.

7. A diode solder heat resistance test device according to claim 5, characterized by: The top end of the pressing rod (37) is fixedly installed with a knob disc with a plurality of anti-skid blocks, wherein the anti-skid blocks are uniformly distributed on the outer circular surface of the knob disc.