Silicon optical chip and optical engine

Abstract

The utility model relates to a silicon optical chip, which comprises a chip body, an input waveguide and a plurality of output waveguides are arranged on the same side of the chip body, and a glue blocking structure used for blocking light path glue from overflowing to a port of the input waveguide is arranged in an area between the output waveguides and the input waveguide on the chip body. An optical engine comprises a multi-channel optical fiber array and a silicon optical chip, the multi-channel optical fiber array is coupled with a plurality of output waveguides of the silicon optical chip, and light path glue is dispensed between the multi-channel optical fiber array and the silicon optical chip. The beneficial effects are that when the multi-channel optical fiber array is coupled with a plurality of output waveguides of the silicon optical chip and light path glue is dispensed between the multi-channel optical fiber array and the silicon optical chip, the glue blocking structure can prevent the light path glue from overflowing to the input waveguide port; the problem that the coupling efficiency is reduced when a laser chip in a light emitting end is coupled with an input waveguide of a silicon optical chip is avoided, and the coupling yield is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of light engine, concretely relates to a silicon light chip and light engine. BACKGROUND

[0002] The traditional light engine specific structure as Figure 1 Shown, it includes: DR4 silicon light chip, light emission end and multichannel fiber array, DR4 silicon light chip has an input waveguide and four output waveguides on the same side, the input waveguide is coupled with the input of a first 1*2 coupler, two output of the first 1*2 coupler is coupled with the input of a second 1*2 coupler respectively, the output of each second 1*2 coupler is coupled with an output waveguide through an MZM modulator, the first 1*2 coupler and two second 1*2 couplers are all in equal proportion light splitting, so that the light into the input waveguide is divided to four output waveguides in equal proportion, the light emission end is coupled with the input waveguide in DR4 silicon light chip, and the light emission end includes: laser chip, collimating lens, optical isolator and converging lens coupled in turn along the light propagation direction, the converging lens is coupled with the input waveguide, and the laser chip is on the ceramic heat sink, the multichannel fiber array is coupled with four output waveguides in DR4 silicon light chip, and when the multichannel fiber array is coupled with DR4 silicon light chip, optical path glue (plays the role of refractive index matching) is usually pointed between the multichannel fiber array and DR4 silicon light chip, and in production, a small part of glue quantity control is not good, so that the glue overflow to the input waveguide port, so that the coupling efficiency is reduced when the laser chip in the light emission end is coupled with the input waveguide of DR4 silicon light chip. CONTENT OF THE UTILITY MODEL

[0003] The utility model wants to solve the technical problem to provide a silicon light chip and light engine to overcome the deficiencies in the prior art.

[0004] The utility model solves the technical problem as follows:

[0005] A silicon light chip, including: chip body, the chip body has an input waveguide and a plurality of output waveguides on the same side, and a glue blocking structure for blocking the overflow of optical path glue to the input waveguide port is arranged in the region between the output waveguide and the input waveguide on the chip body.

[0006] The utility model has the advantages that when the multichannel fiber array is coupled with a plurality of output waveguides of the silicon light chip, and optical path glue is pointed between the multichannel fiber array and the silicon light chip, the overflow of optical path glue to the input waveguide port can be blocked by the glue blocking structure, so that the coupling efficiency is avoided to be reduced when the laser chip in the light emission end is coupled with the input waveguide of the silicon light chip, and the coupling yield is improved.

[0007] On the basis of the above technical solutions, the utility model further can make improvement as follows.

[0008] Further, the glue blocking structure comprises: a solder pad fixed on the chip body, and a plurality of gold balls arranged side by side on the solder pad.

[0009] The above further beneficial effect is that: due to the liquid surface tension, the overflowed optical path glue will be blocked by the solder pad and the gold balls, so as to avoid the overflow of the optical path glue to the input waveguide port, thereby improving the coupling yield.

[0010] Further, the solder pad is a gold-plated solder pad or an aluminum solder pad.

[0011] Further, two gold balls are arranged side by side on the solder pad along the vertical glue flow direction, the size of the gold ball is 75 μm ± 25 μm, and the solder pad is higher than the upper surface of the chip body by 0.5 μm to 1 μm.

[0012] Further, the number of the solder pads is two, and the two solder pads are distributed side by side along the glue flow direction.

[0013] The above further beneficial effect is that: usually, only one set of solder pads with two gold balls can block the overflow of the optical path glue to the input waveguide port, and two sets are designed to achieve double insurance.

[0014] Further, the plurality of output waveguides are obliquely distributed and parallel to each other.

[0015] Further, the input waveguide is coupled with an input of a first 1x2 coupler, two outputs of the first 1x2 coupler are each coupled with an input of a second 1x2 coupler, and all two outputs of each second 1x2 coupler are each coupled with an output waveguide through an MZM modulator.

[0016] Based on the above technical solutions, the utility model further provides an optical engine, comprising: a multi-channel fiber array and a silicon optical chip, the multi-channel fiber array is coupled with a plurality of output waveguides of the silicon optical chip, optical path glue is dotted between the multi-channel fiber array and the silicon optical chip, and an input waveguide of the silicon optical chip is coupled with a light emitting end.

[0017] The above further beneficial effect is that: when the optical path glue is dotted between the multi-channel fiber array and the silicon optical chip, the coupling efficiency can be avoided to be reduced when a laser chip in the light emitting end is coupled with the input waveguide of the silicon optical chip, thereby improving the coupling yield.

[0018] Further, the light emitting end comprises: a laser chip, a collimating lens, an optical isolator and a converging lens which are coupled in sequence along the light propagation direction, the converging lens is coupled with the input waveguide, and the laser chip is located on a ceramic heat sink. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 This is a structural diagram of a light engine in existing technology;

[0020] Figure 2 This is a structural diagram of the silicon photonic chip in this utility model;

[0021] Figure 3 This is a partial view of the silicon photonics chip in this utility model;

[0022] Figure 4 This is a structural diagram of the light engine in this utility model.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1. Silicon photonics chip; 110. Chip body; 111. Input waveguide; 112. Output waveguide; 113. First 1×2 coupler; 114. Second 1×2 coupler; 115. MZM modulator; 120. Adhesive shielding structure; 121. Bonding pad; 122. Gold ball; 2. Multi-channel fiber array; 3. Optical path adhesive; 4. Optical transmitter; 410. Laser chip; 420. Collimating lens; 430. Optical isolator; 440. Converging lens; 450. Ceramic heat sink. Detailed Implementation

[0025] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0026] Example 1

[0027] like Figure 2 As shown, a silicon photonics chip includes: a chip body 110, on which an input waveguide 111 and multiple output waveguides 112 are located on the same side. The multiple output waveguides 112 are located on one side of the input waveguide 111. The multiple output waveguides 112 on the chip body 110 can refer to two, four, etc. Taking the DR4 silicon photonics chip as an example, there are four output waveguides 112 here. A baffle structure 120 is provided on the chip body 110 in the area between the output waveguides 112 and the input waveguide 111. When the multi-channel fiber array 2 is coupled to the multiple output waveguides 112 of the silicon photonics chip 1, and optical path adhesive 3 is applied between the multi-channel fiber array 2 and the silicon photonics chip, the baffle structure 120 can prevent the optical path adhesive 3 from overflowing to the port of the input waveguide 111, so as to avoid the decrease in coupling efficiency when the laser chip 410 in the optical transmitter 4 is coupled to the input waveguide 111 of the silicon photonics chip 1.

[0028] Example 2

[0029] like Figure 2 ,Figure 3 As shown in the figure, the embodiment is a further improvement on the basis of example 1, and the specific implementation is as follows:

[0030] The glue blocking structure 120 includes a pad 121 fixed on the chip body 110, and a plurality of gold balls 122 are arranged side by side on the pad 121. Due to the liquid surface tension, the overflowed optical path glue 3 will be blocked by the pad 121 and the gold balls 122 to avoid the overflow of the optical path glue 3 to the port of the input waveguide 111, thereby improving the coupling yield.

[0031] Further, the pad 121 is a gold-plated pad or an aluminum pad.

[0032] Two gold balls 122 are preferably arranged side by side on the pad 121 along the vertical glue flow direction, the size of the gold ball 122 is 75 μm ± 25 μm, the pad 121 is higher than the upper surface of the chip body 110 by 0.5 μm to 1 μm, the pad 121 is plated on the upper surface of the chip body 110, and the number of gold balls 122 arranged on each pad 121 can be adjusted according to actual conditions, and the number of gold balls 122 arranged on each pad 121 is two in this example.

[0033] Example 3

[0034] As shown in the figure, the embodiment is a further improvement on the basis of example 2, and the specific implementation is as follows: Figure 2 The number of pads 121 is preferably two, and the two pads 121 are arranged side by side along the glue flow direction. Two gold balls 122 are arranged on each pad 121. In actual application, only one set of pads 121 with two gold balls 122 can block the overflow of the optical path glue 3 to the port of the input waveguide 111. Designing two sets is actually a double insurance. Of course, in actual application, it is not excluded to design three sets, four sets, etc. At this time, only the cost will be increased.

[0035] Example 4

[0036] As shown in the figure, the embodiment is a further improvement on the basis of example 1 or 2 or 3, and the specific implementation is as follows:

[0037] Figure 2 A plurality of output waveguides 112 are inclined and parallel to each other, that is, four output waveguides 112 are inclined and parallel to each other. The inclination angle of the output waveguide 112 can be 8°. Of course, this is only an example. In actual application, other degrees are not excluded.

[0038] Example 5

[0039] As shown in the figure, the embodiment is a further improvement on the basis of example 1 or 2 or 3, and the specific implementation is as follows:

[0040] As shown in the figure, the embodiment is a further improvement on the basis of example 1 or 2 or 3, and the specific implementation is as follows: Figure 2 ​As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below:

[0041] The input waveguide 111 is coupled to the input of a first 1×2 coupler 113. The two outputs of the first 1×2 coupler 113 are each coupled to the input of a second 1×2 coupler 114, thus having two second 1×2 couplers 114. The two outputs of each second 1×2 coupler 114 are each coupled to an output waveguide 112 via an MZM modulator 115, thus having four MZM modulators 115. The first 1×2 coupler 113 and the two second 1×2 couplers 114 split the light proportionally, thereby realizing that the light entering the input waveguide 111 is split into four output waveguides 112 in a proportional manner.

[0042] Example 5

[0043] like Figure 4 As shown, an optical engine includes a multi-channel fiber array 2 and a silicon photonic chip 1. The multi-channel fiber array 2 is coupled to multiple output waveguides 112 of the silicon photonic chip 1, and optical path adhesive 3 is applied between the multi-channel fiber array 2 and the silicon photonic chip 1. The input waveguide 111 of the silicon photonic chip 1 is coupled to an optical emitting end 4.

[0044] Furthermore, the optical transmitter 4 includes a laser chip 410, a collimating lens 420, an optical isolator 430, and a converging lens 440, which are coupled sequentially along the light propagation direction. The converging lens 440 is coupled to the input waveguide 111. The laser chip 410 is located on a ceramic heat sink 450. That is, the light emitted by the laser chip 410 is coupled into the input waveguide 111 of the silicon photonic chip 1 after passing through the collimating lens 420, the optical isolator 430, and the converging lens 440 in sequence.

[0045] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A silicon photonics chip, characterized in that, include: The chip body (110) has an input waveguide (111) and a plurality of output waveguides (112) on the same side. The chip body (110) has a baffle structure (120) in the area between the output waveguide (112) and the input waveguide (111) to prevent the optical path adhesive (3) from overflowing to the port of the input waveguide (111).

2. A silicon photonic chip according to claim 1, characterized in that, The adhesive shielding structure (120) includes: a pad (121) fixed on the chip body (110), and multiple gold balls (122) arranged side by side on the pad (121).

3. A silicon photonic chip according to claim 2, characterized in that, The pad (121) is a gold-plated pad or an aluminum pad.

4. A silicon photonic chip according to claim 2, characterized in that, Two gold balls (122) are arranged side by side on the pad (121) along the direction perpendicular to the glue flow. The size of the gold balls (122) is 75μm±25μm. The pad (121) is 0.5μm to 1μm higher than the upper surface of the chip body (110).

5. A silicon photonic chip according to claim 2, 3, or 4, characterized in that, The number of the solder pads (121) is two, and the two solder pads (121) are arranged side by side along the direction of glue flow.

6. A silicon photonic chip according to claim 1, characterized in that, Multiple output waveguides (112) are tilted and parallel to each other.

7. A silicon photonic chip according to claim 1, characterized in that, The input waveguide (111) is coupled to the input of a first 1×2 coupler (113), and the two outputs of the first 1×2 coupler (113) are each coupled to the input of a second 1×2 coupler (114). The two outputs of each second 1×2 coupler (114) are each coupled to an output waveguide (112) via an MZM modulator (115).

8. A light engine, characterized in that, include: The multi-channel fiber array (2) and the silicon photonic chip (1) as described in any one of claims 1 to 7, wherein the multi-channel fiber array (2) is coupled to a plurality of output waveguides (112) of the silicon photonic chip (1), and there is a point optical path adhesive (3) between the multi-channel fiber array (2) and the silicon photonic chip (1), and the input waveguide (111) of the silicon photonic chip (1) is coupled to the optical emitting end (4).

9. A light engine according to claim 8, characterized in that, The light emitting end (4) includes a laser chip (410), a collimating lens (420), an optical isolator (430) and a converging lens (440) coupled sequentially along the light propagation direction. The converging lens (440) is coupled to the input waveguide (111), and the laser chip (410) is located on a ceramic heat sink (450).

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