Backlight module and display device

Abstract

The utility model discloses a backlight module and a display device.The backlight module comprises a plurality of lamp strips which are spliced with one another, each lamp strip comprises a substrate, a conductive circuit layer and a light-emitting element, and the conductive circuit layer is arranged on the substrate; the light-emitting element is arranged on the conductive circuit layer and is electrically connected with the conductive circuit layer; every two adjacent substrates are spliced in a clamped mode and fixed through a welding structure. The substrates are clamped and spliced and then are fixed through the welding structures, so that the fixing effect between the light bars is improved. And meanwhile, splicing seams between the spliced lamp panels can be eliminated through the fixing mode, so that the display effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a backlight module and a display device. BACKGROUND

[0002] With the continuous expansion of the panel industry, the industry competition is becoming more and more fierce, how to seize the cost advantage becomes an important factor to stand in the market position; therefore, improving the utilization rate of glass becomes the key point to reduce cost. In the related art, a lot of glass substrates will have glass remaining after being cut by a plate cutter, which will cause considerable waste of glass material, increase production cost, and reduce manufacturing efficiency. When the number of lamp beads on the lamp plate is large, such as mini LED (Mini Light Emitting Diode) or micro LED (Micro Light Emitting Diode), the yield requirement of the lamp plate is extremely high. At the same time, in the process of splicing the lamp plate, how to package and fix the spliced lamp plate to achieve good sealing and display effect is also a problem to be considered. Utility model content

[0003] Therefore, the present application provides a backlight module and a display device to solve the problem of unsatisfactory packaging and display effects of the spliced lamp plate in the prior art.

[0004] To solve the above technical problems, the first technical solution provided by the present application is to provide a backlight module, comprising a plurality of lamp strips spliced with each other, wherein each lamp strip comprises a substrate, a conductive circuit layer and a light emitting element, the conductive circuit layer is arranged on the substrate, and the light emitting element is arranged on the conductive circuit layer and electrically connected with the conductive circuit layer; wherein two adjacent substrates are spliced by mutual clamping and fixed by a welding structure.

[0005] In an embodiment, two substrates spliced with each other have a splicing seam; one of the two substrates has a plurality of first insertion parts, and the other substrate has a plurality of second insertion parts, the plurality of first insertion parts and the plurality of second insertion parts are one-to-one correspondingly inserted to form a plurality of clamping structures; and the plurality of clamping structures are arranged along the splicing seam at intervals.

[0006] In an embodiment, the number of the welding structure is a plurality, and the plurality of welding structures and the plurality of clamping structures are alternately arranged along the splicing seam.

[0007] In an embodiment, the number of the welding structure is a plurality, and the plurality of welding structures and the plurality of clamping structures are alternately arranged along the splicing seam.

[0008] In an embodiment, the welding structure continuously extends from one end of the joint seam to the other end.

[0009] In an embodiment, the two substrates spliced with each other have a joint seam; one of the two substrates spliced with each other has a first protruding part, and the other substrate has a second protruding part, the first protruding part and the second protruding part are inserted to form a clamping structure; the clamping structure extends from one end of the joint seam to the other end, covers the entire joint seam, and at least partially covers the clamping structure.

[0010] In an embodiment, the two substrates spliced with each other are defined as a first substrate and a second substrate, the first edge of the first substrate has the first protruding part and the first notch in the thickness direction, the first protruding part and the first notch extend from one end of the first edge to the other end; the second edge of the second substrate has the second protruding part and the second notch in the thickness direction, the second protruding part and the second notch extend from one end of the second edge to the other end; the bottom surface of the first protruding part is flush with the bottom surface of the first substrate, and the top surface of the second protruding part is flush with the top surface of the second substrate; the first protruding part and the second protruding part are stacked, and the sum of the thicknesses of the first protruding part and the second protruding part is equal to the thickness of the substrate.

[0011] In an embodiment, the difference between the thickness of the first protruding part and the thickness of the substrate is 0.2mm-0.5mm; the difference between the thickness of the second protruding part and the thickness of the substrate is 0.2mm-0.5mm.

[0012] In an embodiment, the two substrates spliced with each other further have a glue layer, the glue layer is arranged on the joint seam; each of the light bars further includes a cover layer arranged on the substrate and covering the joint seam.

[0013] To solve the above technical problems, the second technical solution provided by the present application is to provide a display device, comprising a display panel and a backlight module; the backlight module is electrically connected with the display panel and is used for providing a light source for the display panel; wherein the backlight module is any one of the above-mentioned backlight modules.

[0014] The beneficial effects of the present application: different from the prior art, the backlight module of the present application comprises a plurality of mutually spliced lamp strips, wherein each lamp strip comprises a substrate, a conductive circuit layer and a light emitting element, the conductive circuit layer is arranged on the substrate; the light emitting element is arranged on the conductive circuit layer and electrically connected with the conductive circuit layer; wherein two adjacent substrates are spliced by mutual clamping and fixed by a welding structure. The present application improves the fixing effect between the lamp strips by clamping and splicing the substrates and then fixing them by the welding structure. At the same time, this fixing method can eliminate the splicing seam between the spliced lamp panels, thereby improving the display effect. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is a top view structural schematic diagram of the backlight module provided by the present application;

[0017] Figure 2 is Figure 1 is a sectional view of the backlight module provided by the present application along the line A-A;

[0018] Figure 3 is Figure 2 is a structural enlarged schematic diagram of part B provided by the present application;

[0019] Figure 4 is a split structural schematic diagram of the backlight module provided by the present application;

[0020] Figure 5 is a first structural schematic diagram of the backlight module provided by the first embodiment of the present application;

[0021] Figure 6 is a second structural schematic diagram of the backlight module provided by the first embodiment of the present application;

[0022] Figure 7 is a third structural schematic diagram of the backlight module provided by the first embodiment of the present application;

[0023] Figure 8 is a whole structural side view of the backlight module provided by the second embodiment of the present application;

[0024] Figure 9 is a split structural side view of the backlight module provided by the second embodiment of the present application;

[0025] Figure 10 is Figure 9A structure amplification schematic view of part C provided by the application is shown in the figure;

[0026] Figure 11 A three-dimensional structure schematic view of the backlight module provided by the second embodiment of the application is shown in the figure;

[0027] Figure 12 A three-dimensional structure schematic view of the backlight module provided by the second embodiment of the application is shown in the figure; Figure 11 A structure amplification schematic view of part D provided by the application is shown in the figure;

[0028] Figure 13 A structure amplification schematic view of part D provided by the application is shown in the figure; Figure 8 A structure amplification schematic view of part E provided by the application is shown in the figure;

[0029] Figure 14 A structure schematic view of the display device provided by the application is shown in the figure.

[0030] Explanation of reference signs:

[0031] 200, display device; 201a, display panel; 2011, counter substrate; 2012, array substrate; 2013, liquid crystal layer; 2014, liquid crystal molecule; 100, backlight module; 10, clamping structure; 101, splicing joint; 11, first plug-in part; 12, second plug-in part; 13, first protruding part; 14, second protruding part; 15, first notch; 16, second notch; 20, light bar; 21, substrate; 201, first substrate; 202, second substrate; 211, first edge; 212, second edge; 22, light emitting element; 23, conductive circuit layer; 231, conductive layer; 2310, driving electrode; 232, insulating layer; 30, soldering structure; 40, adhesive layer; 50, covering layer. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the application.

[0033] The terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eight" are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or a specific number of technical features indicated. Thus, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eight" can explicitly or implicitly include at least one of the features. All directional indications, such as up, down, left, right, front, back, etc., are only used for explanatory purposes in describing the relative position, movement, etc., of the components between the certain attitude (as shown in the drawings) and are changed accordingly if the certain attitude changes. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed or can optionally include other steps or units inherent to the process, method, product or device.

[0034] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily mutually exclusive of other embodiments. It is explicitly and implicitly understood that the embodiments described herein can be combined with other embodiments.

[0035] With the continuous expansion of the panel industry, the competition in the industry is becoming more and more fierce, and how to seize the cost advantage has become an important factor to stand firm in the market position; therefore, improving the utilization rate of glass has become the key point to reduce cost. In the related art, a lot of glass substrates will have glass remaining after being cut by a plate, which will cause considerable waste of glass material, increase production cost, and reduce manufacturing efficiency. When the number of lamp beads on the lamp plate is large, such as mini LED (Mini Light Emitting Diode) or micro LED (Micro Light Emitting Diode), the yield requirement for the lamp plate is extremely high. At the same time, in the process of splicing the lamp plate, how to package and fix the spliced lamp plate to achieve better sealing and display effect is also a problem to be considered.

[0036] To solve the above problems, the application provides a new backlight module and display device.

[0037] Please refer to Figures 1 to 3 , Figure 1 is a top view structural schematic diagram of the backlight module provided by the application; Figure 2 is Figure 1 a cross-sectional view of the backlight module provided by the application along line A-A; Figure 3 is Figure 2The structural enlarged schematic view of part B provided; Figure 4 is a split structural schematic view of a clamping structure of the backlight module provided in the present application; Figure 5 is a first structural schematic view of the backlight module provided in the first embodiment of the present application; Figure 6 is a second structural schematic view of the backlight module provided in the first embodiment of the present application; Figure 7 is a third structural schematic view of the backlight module provided in the first embodiment of the present application.

[0038] As shown in Figures 1 to 7 , the backlight module 100 provided in the present application comprises: a plurality of lamp strips 20 spliced with each other, wherein each lamp strip 20 comprises: a substrate 21, a conductive circuit layer 23 and a light emitting element 22, the conductive circuit layer 23 is arranged on the substrate 21; the light emitting element 22 is arranged on the conductive circuit layer 23 and electrically connected with the conductive circuit layer 23; wherein two adjacent substrates 21 are spliced with each other by clamping and fixed by a welding structure 30.

[0039] Specifically, the conductive circuit layer 23 comprises a conductive layer 231 arranged on the substrate 21 and an insulating layer 232 covering the conductive layer 231; one end of the conductive layer 231 is partially exposed to form a driving electrode 2310. The light emitting element 22 is arranged on the insulating layer 232 (specifically, the surface of the insulating layer 232 away from the conductive layer 231) and electrically connected with the conductive layer 231. The light emitting element 22 can be LED, miniLED or micro LED, etc., which is not limited in the present application. It can be understood that the plurality of lamp strips 20 spliced together can be used in a direct type backlight module 100 or a side type backlight module 100.

[0040] In the present embodiment, the lamp strip 20 is a glass-based lamp strip, the substrate 21 of the glass-based lamp strip 20 is a glass substrate, and after the glass substrates 21 of a plurality of glass-based lamp strips are spliced, the glass substrates 21 spliced with each other can be fixed by the welding structure 30. Alternatively, the substrate 21 of the lamp strip 20 is partially glass, for example, the substrate 21 is made of plastic material, and glass is embedded at the position where welding is required, so that the glass material part of the substrate 21 can be welded, and the other areas which do not need to be welded can not use glass material. Using glass-based lamp strips can improve the utilization rate of glass and reduce the product manufacturing cost.

[0041] The two substrates 21 spliced with each other have a splicing seam 101; specifically, two glass substrates 21 are spliced, and a splicing seam 101 is formed after splicing.

[0042] The structure of the two substrates 21 spliced with each other is described in detail in the following specific embodiments.

[0043] First embodiment:

[0044] like Figure 4 As shown, in this embodiment, among the two substrates 21 spliced ​​together, one substrate 21 has a plurality of first insertion portions 11 and the other substrate 21 has a plurality of second insertion portions 12. For example, the first substrate 201 has a plurality of first insertion portions 11 and the second substrate 202 has a plurality of second insertion portions 12. The plurality of first insertion portions 11 and the plurality of second insertion portions 12 are inserted one-to-one to form a plurality of engaging structures 10.

[0045] like Figure 1 , Figures 4 to 6 As shown, multiple interlocking structures 10 are spaced apart along the splice seam 101. In this embodiment, one of the first insertion portion 11 and the second insertion portion 12 is a protrusion and the other is a recess. When the first insertion portion 11 and the second insertion portion 12 are inserted into each other, the protrusion is inserted into the recess, thereby forming multiple matching and connected interlocking structures 10. The multiple first insertion portions 11 and the multiple second insertion portions 12 can be formed by irregular cutting.

[0046] The first structure in this embodiment:

[0047] like Figure 5 As shown, this structure includes multiple welded structures 30, which are alternately arranged with multiple engaging structures 10 along the splice seam 101. That is, along the extension direction of the splice seam 101, each welded structure 30 and each engaging structure 10 are staggered; the welded structure 30 is not engaged at its location, and the engaging structure 10 is not welded at its location. Adjacent welded structures 30 and engaging structures 10 can be tightly fitted together or spaced apart; this application does not impose any restrictions on this.

[0048] The second structure in this embodiment:

[0049] like Figure 6 As shown, there are multiple welded structures 30 in this structure, and these welded structures 30 are arranged in a one-to-one correspondence with the multiple engaging structures 10 along the splice seam 101. This one-to-one correspondence means that one welded structure 30 corresponds to one engaging structure 10, and each welded structure 30 is positioned at the location of the engaging structure 10. For example, a welded structure 30 can be arranged on the contact surface of the first insertion portion 11 and the second insertion portion 12 of each engaging structure 10. During welding, the entire contact surface of the first insertion portion 11 and the second insertion portion 12 can be welded, or spot welding can be performed on the contact surface of the first insertion portion 11 and the second insertion portion 12; this application does not impose any restrictions on this.

[0050] The third structure in this embodiment:

[0051] like Figure 7As shown, in the structure, the engaging structure 10 still has multiple, while the welding structure 30 has only one, and the welding structure 30 continuously extends from one end of the joint seam 101 to the other end. That is, welding is performed from one end to the other end of the joint seam 101, and the welding structure 30 covers all the engaging structures 10. It can be understood that, in order to improve the fixing effect of the welding structure 30, the contact surfaces of the first insertion part 11 and the second insertion part 12 of each engaging structure 10 are preferably all welded to form a whole continuous strip-shaped welding structure 30.

[0052] Please refer to Figures 8 to 12 , Figure 8 is the overall structure side view of the backlight module provided by the second embodiment of the present application; Figure 9 is the split structure side view of the backlight module provided by the second embodiment of the present application; Figure 10 is Figure 9 the structure enlarged schematic view of part C provided by the second embodiment of the present application; Figure 11 is the three-dimensional structure schematic view of the backlight module provided by the second embodiment of the present application; Figure 12 is Figure 11 the structure enlarged schematic view of part D provided by the second embodiment of the present application.

[0053] Second embodiment:

[0054] In this embodiment, as Figures 8 to 10 shown, among the two substrates 21 spliced with each other, one substrate 21 has a first protruding part 13, and the other substrate 21 has a second protruding part 14, the first protruding part 13 and the second protruding part 14 are inserted to form an engaging structure 10.

[0055] As Figure 10 shown, in this embodiment, the first protruding part 13 and the second protruding part 14 are both protrusions, when the first protruding part 13 and the second protruding part 14 are inserted, the first protruding part 13 is inserted into the gap on one side of the second protruding part 14, and the second protruding part 14 is inserted into the gap on one side of the first protruding part 13, so that the first protruding part 13 and the second protruding part 14 are arranged in an overlapping manner to form the engaging structure 10.

[0056] Specifically, as Figure 11 and Figure 12As shown, the two substrates 21 that are spliced with each other are defined as a first substrate 201 and a second substrate 202, the first edge 211 of the first substrate 201 has a first protruding portion 13 and a first notch 15 in the thickness direction, the first protruding portion 13 and the first notch 15 extend from one end of the first edge 211 to the other end; the second edge 212 of the second substrate 202 has a second protruding portion 14 and a second notch 16 in the thickness direction, the second protruding portion 14 and the second notch 16 extend from one end of the second edge 212 to the other end. Wherein, the first edge 211 and the second edge 212 are both arranged close to the position of the splicing joint 101.

[0057] Meanwhile, as shown in Figure 11 and Figure 12 In this embodiment, the engagement structure 10 extends from one end of the splicing joint 101 to the other end, covers the entire splicing joint 101, and at least partially covers the engagement structure 10. That is, the entire splicing joint 101 of the first substrate 201 and the second substrate 202 is provided as the engagement structure 10. Meanwhile, the contact surfaces of the first protruding portion 13 and the second protruding portion 14 of the engagement structure 10 can be partially welded (spot welded) or fully welded. Figure 12 As shown, the split structure diagram of the welding structure 30 is provided.

[0058] In this embodiment, the bottom surface of the first protruding portion 13 is flush with the bottom surface of the first substrate 201, and the top surface of the second protruding portion 14 is flush with the top surface of the second substrate 202; the first protruding portion 13 and the second protruding portion 14 are arranged in a stacked manner when inserted, so that one side of the outer side surface of the first protruding portion 13 and the second protruding portion 14 after engagement is flush with the top surface of the first substrate 201 and the second substrate 202, and the other side is flush with the bottom surface of the first substrate 201 and the second substrate 202. And the sum of the thicknesses of the first protruding portion 13 and the second protruding portion 14 is equal to the thickness of the substrate 21. That is, the thickness of the second protruding portion 14 is the same as the height of the first notch 15, and the thickness of the first protruding portion 13 is the same as the height of the second notch 16.

[0059] In this embodiment, the difference between the thickness of the first protruding portion 13 and the thickness of the substrate 21 is 0.2mm-0.5mm; preferably 0.2mm-0.3mm, for example 0.2mm, 0.25mm, 0.3mm. The difference between the thickness of the second protruding portion 14 and the thickness of the substrate 21 is 0.2mm-0.5mm, preferably 0.2mm-0.3mm, for example 0.2mm, 0.25mm, 0.3mm.

[0060] It can be understood that the two clamping modes in the first embodiment and the second embodiment can be used in combination, that is, the first protrusion 13 and the second protrusion 14 are inserted in the thickness direction, and the protrusion and the recess in the first embodiment are connected in the insertion direction in the thickness direction. The specific selection can be made as required.

[0061] In any of the above embodiments provided in the present application, when the welding structure 30 between the two adjacent substrates 21 is fixed by laser welding, the welding positions of the two substrates 21 are both of glass material, so that under the irradiation of laser, the glass at the welding position of the first substrate 201 can be fused or the welding position of the first substrate 201 and the welding position of the second substrate 202 can be provided with solder for fusion, thereby completing the laser welding fixation of the first substrate 201 and the second substrate 202.

[0062] Further, the welding position between the first substrate 201 and the second substrate 202 can be directly irradiated by laser to melt and cool and solidify the welding position, thereby forming the welding structure 30 for connecting and fixing the first substrate 201 and the second substrate 202.

[0063] In any of the above embodiments, the solder can be an opaque pigment or a glass fiber, and filling the solder at the welding position between the first substrate 201 and the second substrate 202 can increase the absorption rate of laser, so that the solder can be melted and connected with the first substrate 201 and the second substrate 202 after laser irradiation. The process parameters can also be adjusted by focusing mirrors, automatic focal length compensation and precise motion control systems, so that the gap between the first substrate 201 and the second substrate 202 is not less than a preset distance, for example, 1.5 μm to 2 μm.

[0064] In any of the above embodiments, the welding structure 30 for welding the first substrate 201 and the second substrate 202 can use femtosecond laser welding technology when laser welding, without damaging the original display structure of the display panel 201a. The glass at the welding position is instantaneously fused by femtosecond laser to achieve the welding effect, improve the peel strength between the glass of the first substrate 201 and the second substrate 202, and improve the overall waterproof effect of the display device 200.

[0065] Please refer to Figure 13 , Figure 13 is Figure 8 the structure of the E part provided is enlarged and schematically shown.

[0066] In any of the above embodiments, as Figure 13As shown, the mutually spliced substrates 21 are also provided with an adhesive layer 40, which is arranged at the splicing joint 101 to further improve the fixing effect between the substrates 21. The adhesive layer 40 can be an OC glue (Optical Clear Adhesive), that is, after the welding structure 30 is arranged on the mutually spliced substrates 21, the OC glue is used for bonding, so as to further fix and seal, and the OC glue has the effects of light transmission, high aesthetics, and does not affect the light transmission effect.

[0067] In any of the above embodiments, as shown in Figure 13 each light bar 20 can also include a cover layer 50 arranged on the substrate 21 and covering the splicing joint 101. For example, after the welding realizes the seamless combination between the adjacent substrates 21, white paint is coated on the substrate 21 between the adjacent light emitting elements 22 at the welding position, which can shield the splicing joint 101 and the welding structure 30 on the one hand to improve the aesthetics, and on the other hand, the white paint as the cover layer 50 can ensure the light emitting effect.

[0068] In addition, a sandblasting layer (not shown in the figure) can be arranged instead of the cover layer 50 to prevent the problem of exposure of internal components affecting the aesthetics. In the embodiment, the sandblasting layer can be formed by sandblasting treatment, for example, using compressed air to spray abrasive materials (such as corundum, glass beads, etc.) at high speed to the outer surface of the substrate 21, so as to ensure the appearance texture. The selection of the abrasive material depends on the surface effect and material required by the shell of the backlight module 100, which is not limited in the present application. Other roughening treatments can also be used to cover the welding structure 30 and other components (such as circuits) inside the backlight module 100, so that they cannot be seen by the naked eye outside, for example, by grinding to form a frosted texture on the outer surface of the substrate 21, so as to both cover the welding structure 30 and other components inside the backlight module 100 and improve the overall appearance texture of the backlight module 100.

[0069] Please refer to Figure 14 , Figure 14 is a structural schematic diagram of the display device provided by the present application.

[0070] As shown in Figure 14 the display device 200 provided by the present application can include a display panel 201a and a backlight module 100, the backlight module 100 is electrically connected with the display panel 201a, and is used for providing a light source for the display panel 201a; wherein the backlight module 100 is any of the backlight modules 100 described above, which will not be repeated here.

[0071] In an embodiment, the display panel 201a can be a liquid crystal display panel (LCD), an LED display panel or an OLED display panel. The liquid crystal display panel can include a color filter substrate 2011, an array substrate 2012 and a liquid crystal layer 2013 disposed between the color filter substrate 2011 and the array substrate 2012. The liquid crystal layer 2013 can include a plurality of liquid crystal molecules 2014. The color filter substrate 2011 can be a color film substrate. The backlight module 100 includes a plurality of lamp strips 20.

[0072] Specifically, each lamp strip 20 can include a substrate 21, a conductive circuit layer 23 and a light emitting element 22. The conductive circuit layer 23 includes a conductive layer 231 disposed on the substrate 21 and an insulating layer 232 covering the conductive layer 231. An end portion of the conductive layer 231 is exposed to form a driving electrode 2310. The light emitting element 22 is disposed on the insulating layer 232 (specifically, a surface of the insulating layer 232 away from the conductive layer 231) and electrically connected to the conductive layer 231. Adjacent two substrates 21 are spliced by clamping each other and fixed by a welding structure 30. For details, please refer to the foregoing description, which will not be repeated here.

[0073] A driving circuit board (not shown) can be further provided to be connected to the driving electrode 2310 to drive the light emitting element 22 to emit light.

[0074] The backlight module disclosed in the present application includes a plurality of spliced lamp strips. Each lamp strip includes a substrate, a conductive circuit layer and a light emitting element. The conductive circuit layer is disposed on the substrate. The light emitting element is disposed on the conductive circuit layer and electrically connected to the conductive circuit layer. Adjacent two substrates are spliced by clamping each other and fixed by a welding structure. The present application improves the fixing effect between the lamp strips by clamping and splicing the substrates and then fixing them by the welding structure. Meanwhile, the fixing method can eliminate the splicing seams between the spliced lamp strips, thereby improving the display effect.

[0075] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation based on the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A backlight module, characterized in that, The backlight module comprises: a plurality of mutually spliced light bars, wherein each of the light bars comprises: a substrate; a conductive circuit layer disposed on the substrate; a light emitting element disposed on the conductive circuit layer and electrically connected with the conductive circuit layer; wherein two adjacent substrates are spliced by mutual engagement and fixed by a welding structure.

2. The backlight module according to claim 1, wherein: the two mutually spliced substrates have a splicing seam therebetween; one of the two mutually spliced substrates has a plurality of first insertion portions, and the other substrate has a plurality of second insertion portions, the plurality of first insertion portions and the plurality of second insertion portions correspondingly insert into each other to form a plurality of engagement structures, and the plurality of engagement structures are arranged along the splicing seam at intervals.

3. The backlight module of claim 2, wherein, The number of the welding structures is a plurality, and the plurality of welding structures and the plurality of engagement structures are alternately arranged along the splicing seam.

4. The backlight module of claim 2, wherein, The number of the welding structures is a plurality, and the plurality of welding structures and the plurality of engagement structures are correspondingly arranged along the splicing seam.

5. The backlight module of claim 2, wherein, The welding structure continuously extends from one end of the splicing seam to the other end.

6. The backlight module of claim 1, wherein, The two mutually spliced substrates have a splicing seam therebetween; one of the two mutually spliced substrates has a first protruding portion, and the other substrate has a second protruding portion, the first protruding portion and the second protruding portion insert into each other to form an engagement structure, the engagement structure extends from one end of the splicing seam to the other end, covers the entire splicing seam, and at least partially covers the engagement structure.

7. The backlight module of claim 6, wherein, The two mutually spliced substrates are defined as a first substrate and a second substrate, respectively, the first edge of the first substrate has the first protruding portion and a first notch along the thickness direction, the first protruding portion and the first notch extend from one end of the first edge to the other end; the second edge of the second substrate has the second protruding portion and a second notch along the thickness direction, the second protruding portion and the second notch extend from one end of the second edge to the other end; the bottom surface of the first protruding portion is flush with the bottom surface of the first substrate, and the top surface of the second protruding portion is flush with the top surface of the second substrate; the first protruding portion and the second protruding portion are arranged in a stack, and the sum of the thicknesses of the first protruding portion and the second protruding portion is equal to the thickness of the substrate.

8. The backlight module of claim 7, wherein, The difference between the thickness of the first protruding portion and the thickness of the substrate is 0.2mm-0.5mm, and the difference between the thickness of the second protruding portion and the thickness of the substrate is 0.2mm-0.5mm.

9. The backlight module according to any one of claims 2-8, wherein, The two mutually spliced substrates further comprise: a glue layer disposed on the splicing seam; each of the light bars further comprises: a cover layer disposed on the substrate and covering the splicing seam.

10. A display device, characterized by comprising: The backlight module comprises: a display panel; a backlight module electrically connected with the display panel and used for providing a light source for the display panel; wherein the backlight module is the backlight module according to any one of claims 1 to 9.

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