High-frequency RFID reader-writer with IO-LINK interface

The high-frequency RFID reader/writer with IO-LINK interface solves the problem of complex connection between sensors and actuators, simplifies wiring, improves maintainability and data transmission efficiency, supports multi-protocol access, and is suitable for industrial automation environments.

CN223884018UActive Publication Date: 2026-02-06HANGZHOU YOUSHANG INTELLIGENT TECH CO LTD +1
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Patent Information

Application Number
CN202520498272.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-02-06
Estimated Expiration
2035-03-20

AI Technical Summary

Technical Problem

Traditional methods of connecting sensors and actuators suffer from problems such as complex wiring, difficult maintenance, and slow data transmission speed.

Method used

The high-frequency RFID reader with IO-LINK interface includes a microcontroller module, an IO-LINK communication module, an RF processing module, a power supply module, a data storage module, and a display and control module. It simplifies device connection through standardized interfaces and enables fast data transmission and real-time monitoring.

Benefits of technology

It simplifies system wiring, reduces system costs, improves system scalability and maintainability, and enhances data transmission efficiency and integration capabilities with industrial control systems.

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Abstract

The utility model discloses a high-frequency RFID reader-writer with an IO-LINK interface, and belongs to the technical field of radio frequency identification. The device comprises a microcontroller module, an IO-LINK communication module, a radio frequency processing module, a power supply module, a data storage module and a display control module, the IO-LINK communication module is connected with the microcontroller module through a chip communication interface; the radio frequency read-write module is connected with the microcontroller module, and the radio frequency processing module comprises an integrated antenna; the data storage module is connected with the microcontroller module; the microcontroller module is connected with the display control module; the power supply module supplies power to the microcontroller module, the IO-LINK communication module, the radio frequency processing module, the data storage module and the display control module. According to the utility model, the IO-LINK technology is adopted, the system wiring is simplified, the system cost is reduced, and the expansibility and maintainability of the system are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of radio frequency identification technology, specifically relates to a high frequency RFID read-write ware of IO-LINK interface. BACKGROUND

[0002] In the field of industrial automation, there are various types of sensors and actuators, and the data formats are different. The traditional connection mode (such as analog signal, digital signal) has problems such as complex wiring, difficult maintenance, slow data transmission speed, etc. The introduction of IO LINK technology solves these problems, simplifies the device connection through standardized interface, and improves the reliability and speed of data transmission. SUMMARY

[0003] The utility model discloses a kind of high frequency RFID read-write ware of IO-LINK interface, with microcontroller module, IO-LINK communication module, radio frequency processing module, power module, data storage module and display control module.

[0004] To solve the above technical problems, the utility model provides a kind of high frequency RFID read-write ware of IO-LINK interface, including microcontroller module, IO-LINK communication module, radio frequency processing module, power module, data storage module and display control module.

[0005] The IO-LINK communication module is connected with the microcontroller module by chip communication interface.

[0006] The radio frequency read-write module is connected with the microcontroller module, and the radio frequency processing module includes integrated antenna.

[0007] The data storage module is connected with the microcontroller module.

[0008] The microcontroller module is connected with the display control module.

[0009] The power module is powered for microcontroller module, IO-LINK communication module, radio frequency processing module, data storage module and display control module.

[0010] Preferably, the power module includes power chip U4 and power chip U2.

[0011] 24V power input end is connected with the SHDN end and VIN end of power chip U4 after fuse FB1.

[0012] The CB end of the power chip U4 is connected with 5V voltage output end through capacitor C9 and inductor L4.

[0013] The SW end of the power chip U4 is connected with 5V voltage output end through inductor L4.

[0014] The FB end of the power supply chip U4 is divided into two paths, one of which is connected to ground through a resistor R1, and the other of which is connected to a 5V voltage output end through a resistor R30;

[0015] The 5V voltage output end is connected to the IN end and the EN end of the power supply chip U2, respectively;

[0016] The OUT end of the power supply chip U2 is connected to a 3.3V voltage output end through a resistor R13.

[0017] Preferably, a transient voltage suppression diode D1 is connected between the 24V power input end and the PGND end;

[0018] The adjustable resistor R7 is connected in parallel with the transient voltage suppression diode D1;

[0019] The gate and the drain of the N-channel enhancement mode MOS tube are connected across the transient voltage suppression diode D1, respectively;

[0020] The source and the gate of the N-channel enhancement mode MOS tube are connected through a resistor R95.

[0021] Preferably, the microcontroller module includes an MCU chip U1;

[0022] The 3.3V voltage output end is connected to the VDD end of the MCU chip U1;

[0023] The PHO-OSC_IN end and the PHO-OSC_OUT end of the MCU chip U1 are connected to a resistor R10 and a crystal oscillator Y2 connected in parallel;

[0024] The PA2 end and the PA3 end of the MCU chip U1 are connected to the 1 end and the 2 end of the pin header interface P1, respectively;

[0025] The VSS end, the PA14 end and the NRST end of the MCU chip U1 are connected to the 2 end, the 3 end and the 4 end of the pin header interface P2, respectively;

[0026] The NRST end of the MCU chip U1 is connected to ground through a capacitor C7.

[0027] Preferably, the display control module includes a light emitting diode LD1, a light emitting diode LD2, a light emitting diode LD3 and a light emitting diode LD4;

[0028] The PB8 end, the PB9 end, the PB15 end and the PB14 end of the MCU chip U1 are connected to the LED1 end, the LED2 end, the LED3 end and the LED1 end, respectively;

[0029] The LED1 end is connected with the base electrode of the triode M2, the emitter electrode of the triode M2 is grounded, and the 3.3V voltage output end is connected with the collector electrode of the triode M2 through the light emitting diode LD1 and the resistor R14;

[0030] The LED2 end is connected with the base electrode of the triode M3, the emitter electrode of the triode M3 is grounded, and the 3.3V voltage output end is connected with the collector electrode of the triode M3 through the light emitting diode LD2 and the resistor R15;

[0031] The LED3 end is connected with the base electrode of the triode M4, the emitter electrode of the triode M4 is grounded, and the 3.3V voltage output end is connected with the collector electrode of the triode M4 through the light emitting diode LD3 and the resistor R16;

[0032] The LED4 end is connected with the base electrode of the triode M5, the emitter electrode of the triode M5 is grounded, and the 3.3V voltage output end is connected with the collector electrode of the triode M5 through the light emitting diode LD4 and the resistor R17.

[0033] Preferably, the data storage module comprises a data storage chip U3;

[0034] The 3.3V voltage output end is connected with the VCC end of the data storage chip U3;

[0035] The PB6 end of the MCU chip U1 is connected with the SCL end of the data storage chip U3 after passing through the resistor R4;

[0036] The PB7 end of the MCU chip U1 is connected with the SDA end of the data storage chip U3 after passing through the resistor R5;

[0037] The WP end and the VCC end of the data storage chip U3 are connected with the capacitor C12.

[0038] Preferably, the IO-LINK communication module comprises a communication chip U5;

[0039] The 3.3V voltage output end is connected with the VDD end and the IN1 end of the communication chip U5;

[0040] The 24V power input end is connected with the VCC end of the communication chip U5 through the fuse FB4;

[0041] The OUTH end of the communication chip U5 is divided into two paths after passing through the diode D7, one path is connected with the I / Q end of the communication chip U5 through the resistor R25, and the other path is connected with the OUTL end of the communication chip U5 through the diode D8.

[0042] Preferably, the radio frequency processing module comprises a radio frequency processing chip U6 and an antenna chip J1;

[0043] The 3.3V voltage output end is connected with the VDD_IO of the radio frequency processing chip U6 through a fuse FB5.

[0044] The RFI1 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the capacitor C60 and the resistor R44.

[0045] The RFO2 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the inductor L5 and the capacitor C59 and the capacitor C61 which are arranged in parallel, and then through the resistor R44.

[0046] The RFO1 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the inductor L6 and the capacitor C65 and the capacitor C69 which are arranged in parallel, and then through the resistor R45.

[0047] The RFI2 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the capacitor C70 and the resistor R45.

[0048] Preferably, the 1 end and the 2 end of the antenna chip J1 are connected through the capacitor C62 and the capacitor C68 which are arranged in series, the capacitor C63 and the capacitor C66 which are arranged in series, and the capacitor C64 and the capacitor C67 which are arranged in series.

[0049] Compared with the prior art, the utility model has the advantages of:

[0050] The utility model adopts IO-LINK technology, simplifies system wiring, reduces system cost, improves the expansibility and maintainability of system, can improve data transmission efficiency and integration with different industrial control systems. BRIEF DESCRIPTION OF DRAWINGS

[0051] The specific embodiments of the utility model will be further explained in detail in combination with the drawings.

[0052] Figure 1 It is the structural schematic diagram of power module;

[0053] Figure 2 It is the structural schematic diagram of microcontroller module;

[0054] Figure 3 It is the structural schematic diagram of display control module;

[0055] Figure 4 It is the structural schematic diagram of data storage module;

[0056] Figure 5 It is the structural schematic diagram of IO-LINK communication module;

[0057] Figure 6 It is the structural schematic diagram of radio frequency processing chip;

[0058] Figure 7 This is a schematic diagram of the antenna matching circuit.

[0059] Figure 8 This is a schematic diagram of a high-frequency RFID reader / writer module with an IO-LINK interface. Detailed Implementation

[0060] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0061] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this specification. The singular forms “a,” “described,” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0062] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0063] The present invention will now be described in further detail with reference to the accompanying drawings:

[0064] like Figure 8 As shown, this utility model provides a high-frequency RFID reader / writer with an IO-LINK interface, including a microcontroller module, an IO-LINK communication module, an RF processing module, a power supply module, a data storage module, and a display and control module;

[0065] The IO-LINK communication module is connected to the microcontroller module through a chip communication interface;

[0066] The radio frequency read / write module is connected to the microcontroller module, and the radio frequency processing module includes an integrated antenna;

[0067] The data storage module is connected to the microcontroller module;

[0068] The microcontroller module is connected with the display control module;

[0069] The power module supplies power for the microcontroller module, the IO-LINK communication module, the radio frequency processing module, the data storage module and the display control module.

[0070] Preferably, the power module comprises a power chip U4 and a power chip U2;

[0071] The 24V power input end is connected with the SHDN end and the VIN end of the power chip U4 after passing through the fuse FB1;

[0072] The CB end of the power chip U4 is connected with the 5V voltage output end through the capacitor C9 and the inductor L4;

[0073] The SW end of the power chip U4 is connected with the 5V voltage output end through the inductor L4;

[0074] The FB end of the power chip U4 is divided into two paths, one of which is connected with the ground after passing through the resistor R1, and the other of which is connected with the 5V voltage output end after passing through the resistor R30;

[0075] The 5V voltage output end is connected with the IN end and the EN end of the power chip U2 respectively;

[0076] The OUT end of the power chip U2 is connected with the 3.3V voltage output end through the resistor R13.

[0077] Preferably, a transient voltage suppression diode D1 is connected between the 24V power input end and the PGND end;

[0078] The adjustable resistor R7 is connected with the transient voltage suppression diode D1 in parallel;

[0079] The gate and the drain of the N-channel enhancement mode MOS tube are connected with the transient voltage suppression diode D1 respectively;

[0080] The source and the gate of the N-channel enhancement mode MOS tube are connected with the resistor R95.

[0081] Preferably, the microcontroller module comprises an MCU chip U1;

[0082] The 3.3V voltage output end is connected with the VDD end of the MCU chip U1;

[0083] The PHO-OSC_IN end and the PHO-OSC_OUT end of the MCU chip U1 are connected with the resistor R10 and the crystal oscillator Y2 which are arranged in parallel;

[0084] The PA2 end and the PA3 end of the MCU chip U1 are connected with the 1 end and the 2 end of the pin interface P1.

[0085] The VSS end, PA14 end and NRST end of the MCU chip U1 are connected with the 2nd end, 3rd end and 4th end of the pin interface P2 respectively;

[0086] The NRST end of the MCU chip U1 is grounded through the capacitor C7.

[0087] Preferably, the display control module comprises a light-emitting diode LD1, a light-emitting diode LD2, a light-emitting diode LD3 and a light-emitting diode LD4.

[0088] The PB8 end, PB9 end, PB15 end and PB14 end of the MCU chip U1 are connected with the LED1 end, LED2 end, LED3 end and LED1 end respectively;

[0089] The LED1 end is connected with the base of the triode M2, the emitter of the triode M2 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M2 through the light-emitting diode LD1 and the resistor R14.

[0090] The LED2 end is connected with the base of the triode M3, the emitter of the triode M3 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M3 through the light-emitting diode LD2 and the resistor R15.

[0091] The LED3 end is connected with the base of the triode M4, the emitter of the triode M4 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M4 through the light-emitting diode LD3 and the resistor R16.

[0092] The LED4 end is connected with the base of the triode M5, the emitter of the triode M5 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M5 through the light-emitting diode LD4 and the resistor R17.

[0093] Preferably, the data storage module comprises a data storage chip U3.

[0094] The 3.3V voltage output end is connected with the VCC end of the data storage chip U3.

[0095] The PB6 end of the MCU chip U1 is connected with the SCL end of the data storage chip U3 after passing through the resistor R4.

[0096] The PB7 end of the MCU chip U1 is connected with the SDA end of the data storage chip U3 after passing through the resistor R5.

[0097] The WP end and VCC end of the data storage chip U3 are connected with the capacitor C12.

[0098] Preferably, the IO-LINK communication module comprises a communication chip U5.

[0099] The 3.3V voltage output end is connected with the VDD end and the IN1 end of the communication chip U5.

[0100] The 24V power input end is connected with the VCC end of the communication chip U5 through the fuse FB4.

[0101] The OUTH end of the communication chip U5 is divided into two paths after passing through the diode D7, one path is connected with the I / Q end of the communication chip U5 through the resistor R25, and the other path is connected with the OUTL end of the communication chip U5 through the diode D8.

[0102] Preferably, the radio frequency processing module comprises a radio frequency processing chip U6 and an antenna chip J1.

[0103] The 3.3V voltage output end is connected with the VDD_IO of the radio frequency processing chip U6 through the fuse FB5.

[0104] The RFI1 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the capacitor C60 and the resistor R44.

[0105] The RFO2 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the inductor L5 and the capacitor C59 and the capacitor C61 which are arranged in parallel, and then through the resistor R44.

[0106] The RFO1 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the inductor L6 and the capacitor C65 and the capacitor C69 which are arranged in parallel, and then through the resistor R45.

[0107] The RFI2 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the capacitor C70 and the resistor R45.

[0108] Preferably, the 1 end and the 2 end of the antenna chip J1 are connected with the capacitor C62 and the capacitor C68 which are arranged in series, the capacitor C63 and the capacitor C66 which are arranged in series, and the capacitor C64 and the capacitor C67 which are arranged in series.

[0109] In order to better illustrate the technical effect of the utility model, the utility model provides the following specific embodiment to illustrate the above technical process:

[0110] Embodiment 1, a high-frequency RFID reader of IO-LINK interface, adopts a standardized interface to simplify device connection, facilitate wiring and maintenance. The reader can quickly read RFID electronic tags and transmit the read data to the host station in real time through IO-LINK communication, thereby realizing real-time monitoring of the data; at the same time, the reader can quickly write the data transmitted by the host station to the RFID electronic tags through IO-LINK.

[0111] IO LINK is an industrial communication standard aiming to realize seamless connection between sensors and actuators and control systems, and its purpose is to realize periodic data exchange between sensors / actuators and controllers (PLC). It provides a simple, reliable and cost-effective way for data exchange in an industrial automation environment. The IO LINK standard defines the specifications of the physical layer, data link layer and application layer, ensuring interoperability between devices of different manufacturers.

[0112] A high-frequency RFID reader of IO-LINK interface adopts the following technical solutions:

[0113] The high-frequency RFID reader of IO-LINK interface comprises a microcontroller module, an IO-LINK communication module, a radio frequency processing module, a power management control module, a data storage module and a display control module. The power module provides stable power supply for the entire reader; the IO-LINK communication module is connected to the microcontroller module through a chip communication interface, used for receiving data transmitted by the host station through IO-LINK and uploading the data processed by the microcontroller module to the host station; the radio frequency reading and writing module inducts electronic RFID tags through an antenna and interacts with the microcontroller module; the data storage module is used for storing information such as RFID reader mode, reading size and reading address; the microcontroller module comprises a single-chip microcomputer and a single-chip microcomputer peripheral circuit, used for processing data of IO-LINK interface and radio frequency; and the display control module indicates different states of the reader.

[0114] The power management control circuit uses low-power chips and designs, carries power protection and power anti-reverse designs, has overvoltage, overcurrent and undervoltage protection functions, and ensures reliable operation of the device in a complex power grid environment.

[0115] The radio frequency processing module further comprises an integrated antenna and an antenna matching circuit, which can respectively drive two independent single-ended antennas, support low-power capacitors and inductive card detection, and the data transmission rate is as high as 53 KB / s.

[0116] The interface integrates power supply and communication, supports the highest COM3 (230.4kbps) transmission rate, can realize high-speed data transmission, and ensures efficient operation of the system. It is connected with the IO-LINK master station in a wired manner and supports hot plug function, allowing safe operation without shutdown, greatly improving production continuity.

[0117] The high-frequency RFID reader of the IO-LINK interface supports process data length up to 32 bytes in / out, can transmit more read / write data at a time, reduces data transmission times, and the minimum synchronization time can reach 4ms, which can quickly realize data synchronization between the reader and the control system, ensure the timeliness and accuracy of data, and improve the real-time performance and response speed of the system.

[0118] The IO-LINK interface has a self-diagnosis function, which can monitor the device status in real time, facilitate quick positioning and problem solving, and reduce maintenance time and cost.

[0119] Among them:

[0120] I. Power module

[0121] The power module includes power chip U4 and power chip U2, which is specifically composed of power chip LMR14006XDDCR, TLV70333DBVR and discrete components, and realizes the conversion of 24V stable voltage to 3.3V for power supply of other modules. It has overvoltage, overcurrent, undervoltage protection, and reverse protection function. As shown in Figure 1 ;

[0122] II. Microcontroller module

[0123] The microcontroller module includes MCU chip U1, which is a low-power microcontroller module chip with peripheral circuit, responsible for controlling the working process of the reader, preprocessing, verifying and other operations on read / write data, and ensuring the accuracy and integrity of the data. As shown in Figure 2 ;

[0124] III. Display control module

[0125] The display control module is composed of three blue LEDs and one red LED, with ESD protection and triode drive. The blue LEDs indicate the power supply and system running state, and the red LED indicates system abnormalities. As shown in Figure 3 ;

[0126] IV. Data storage module

[0127] The data storage module includes data storage chip U3, which uses 24C02 chip, supports I2C two-wire serial interface, has page write capability and hardware data write protection, has 100w erase / write life, and has 100-year data retention time. As shown in Figure 4As shown;

[0128] V. IO-LINK Communication Module

[0129] The IO-LINK communication module includes a communication chip U5, which consists of an IO-Link chip L6362A and discrete resistors and capacitors, enabling data communication between the IO-Link master station and the IO-Link reader. For example... Figure 5 As shown;

[0130] VI. Radio Frequency Processing Module

[0131] The radio frequency (RF) processing module includes an RF processing chip U6 and an antenna chip J1. It comprises a high-performance ST25R3916 chip circuit and an antenna matching circuit. The chip features a low-power RC oscillator and a wake-up timer, operates over a wide power supply voltage range, and has high RF output power, enabling direct and efficient antenna driving. Figure 6 , Figure 7 As shown;

[0132] This embodiment uses IO-LINK technology, which is used for debugging through the integrated IO-LINK interface. No time-consuming programming is required. It can be used plug and play in "simple mode", which simplifies system wiring, reduces system cost, and improves system scalability and maintainability.

[0133] This embodiment improves data transmission efficiency: the IO-LINK interface supports bidirectional communication and the highest COM3 (230.4kbps) transmission rate, which can efficiently transmit RFID reader data. It also supports the transmission of parameter configuration and diagnostic information, thus improving the overall efficiency of the system.

[0134] This embodiment can be connected to a multi-protocol IO-LINK master station, supporting all current mainstream industrial Ethernet communication protocols, such as Profinet, Ethernet / IP, EtherCAT, CC-Link IE, and Modbus TCP, facilitating integration with different industrial control systems.

[0135] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A high frequency RFID reader of an IO-LINK interface, characterized in that, The microcontroller module, the IO-LINK communication module, the radio frequency processing module, the power supply module, the data storage module and the display control module are connected with each other. The IO-LINK communication module is connected with the microcontroller module through a chip communication interface. The radio frequency processing module is connected with the microcontroller module, and the radio frequency processing module comprises an integrated antenna. The data storage module is connected with the microcontroller module. The microcontroller module is connected with the display control module. The power supply module supplies power for the microcontroller module, the IO-LINK communication module, the radio frequency processing module, the data storage module and the display control module.

2. The high-frequency RFID reader of the IO-LINK interface according to claim 1, wherein: The power supply module comprises a power supply chip U4 and a power supply chip U2. The 24V power supply input end is connected with the SHDN end and the VIN end of the power supply chip U4 after passing through a fuse FB1. The CB end of the power supply chip U4 is connected with a 5V voltage output end through a capacitor C9 and an inductor L4. The SW end of the power supply chip U4 is connected with the 5V voltage output end through the inductor L4. The FB end of the power supply chip U4 is divided into two paths, one of which is connected with the ground after passing through a resistor R1, and the other of which is connected with the 5V voltage output end after passing through a resistor R30. The 5V voltage output end is connected with the IN end and the EN end of the power supply chip U2. The OUT end of the power supply chip U2 is connected with a 3.3V voltage output end through a resistor R13.

3. The high-frequency RFID reader of the IO-LINK interface according to claim 2, wherein: The 24V power supply input end and the PGND end are connected with a transient voltage suppression diode D1. An adjustable resistor R7 is connected with the transient voltage suppression diode D1 in parallel. The gate and the drain of an N-channel enhancement mode MOS tube are connected with the transient voltage suppression diode D1 in series. A resistor R95 is connected between the source and the gate of the N-channel enhancement mode MOS tube.

4. The high-frequency RFID reader of the IO-LINK interface according to claim 3, wherein: The microcontroller module comprises an MCU chip U1. The 3.3V voltage output end is connected with the VDD end of the MCU chip U1. The PHO-OSC_IN end and the PHO-OSC_OUT end of the MCU chip U1 are connected with a resistor R10 and a crystal oscillator Y2 arranged in parallel. The PA2 end and the PA3 end of the MCU chip U1 are connected with the 1 end and the 2 end of a pin header interface P1. The VSS end, the PA14 end and the NRST end of the MCU chip U1 are connected with the 2 end, the 3 end and the 4 end of a pin header interface P2 respectively. The NRST end of the MCU chip U1 is connected with the ground through a capacitor C7.

5. The high-frequency RFID reader of the IO-LINK interface according to claim 4, wherein: The display control module comprises light emitting diodes LD1, LD2, LD3 and LD4. The PB8 end, PB9 end, PB15 end and PB14 end of the MCU chip U1 are connected with the LED1 end, LED2 end, LED3 end and LED1 end respectively; The LED1 end is connected with the base of the triode M2, the emitter of the triode M2 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M2 through the light emitting diode LD1 and the resistor R14; The LED2 end is connected with the base of the triode M3, the emitter of the triode M3 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M3 through the light emitting diode LD2 and the resistor R15; The LED3 end is connected with the base of the triode M4, the emitter of the triode M4 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M4 through the light emitting diode LD3 and the resistor R16; The LED4 end is connected with the base of the triode M5, the emitter of the triode M5 is grounded, and the 3.3V voltage output end is connected with the collector of the triode M5 through the light emitting diode LD4 and the resistor R17.

6. The high-frequency RFID reader of the IO-LINK interface according to claim 5, characterized in that: The data storage module comprises a data storage chip U3; The 3.3V voltage output end is connected with the VCC end of the data storage chip U3; The PB6 end of the MCU chip U1 is connected with the SCL end of the data storage chip U3 after passing through the resistor R4; The PB7 end of the MCU chip U1 is connected with the SDA end of the data storage chip U3 after passing through the resistor R5; The WP end and the VCC end of the data storage chip U3 are connected with the capacitor C12.

7. The high-frequency RFID reader of the IO-LINK interface according to claim 6, characterized in that: The IO-LINK communication module comprises a communication chip U5; The 3.3V voltage output end is connected with the VDD end and the IN1 end of the communication chip U5; The 24V power input end is connected with the VCC end of the communication chip U5 through the fuse FB4; The OUTH end of the communication chip U5 is divided into two paths after passing through the diode D7, one path is connected with the I / Q end of the communication chip U5 through the resistor R25, and the other path is connected with the OUTL end of the communication chip U5 through the diode D8.

8. The high-frequency RFID reader of the IO-LINK interface according to claim 7, characterized in that: The radio frequency processing module comprises a radio frequency processing chip U6 and an antenna chip J1; The 3.3V voltage output end is connected with the VDD_IO of the radio frequency processing chip U6 through the fuse FB5; The RFI1 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the capacitor C60 and the resistor R44; The RFO2 end of the radio frequency processing chip U6 is connected with the 2 end of the antenna chip J1 through the inductor L5 and the capacitor C59 and the capacitor C61 connected in parallel, and then through the resistor R44; The RFO1 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the inductor L6 and the capacitor C65 and the capacitor C69 connected in parallel, and then through the resistor R45; The RFI2 end of the radio frequency processing chip U6 is connected with the 1 end of the antenna chip J1 through the capacitor C70 and the resistor R45.

9. The high-frequency RFID reader of the IO-LINK interface according to claim 8, characterized in that: The 1 end and the 2 end of the antenna chip J1 are connected through the capacitor C62 and the capacitor C68 arranged in series, the capacitor C63 and the capacitor C66 arranged in series, and the capacitor C64 and the capacitor C67 arranged in series.