Heat insulating material and electronic device

Abstract

The utility model provides a heat insulation part and electronic equipment. The electronic equipment comprises a middle frame, and a heating device is arranged on the middle frame; the touchable device is connected with the middle frame; the heat insulation piece is arranged between the middle frame and the touchable device, and the heat insulation piece is used for connecting the middle frame and the touchable device; wherein the heat insulation piece comprises a base material layer, a first adhesive layer and a second adhesive layer which are arranged in a stacked mode, the base material layer is located between the first adhesive layer and the second adhesive layer, the first adhesive layer is used for being bonded with the middle frame, the second adhesive layer is used for being bonded with the touchable device, and the heat conductivity coefficient of the base material layer ranges from 0.002 W / (m.K) to 0.1 W / (m.K). The scheme can weaken the influence of a heat source in the electronic equipment on the outside, inhibit local hot spots, and improve the user experience.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and more particularly, to a heat insulation piece and electronic equipment. BACKGROUND

[0002] With the enhancement of the performance of terminal electronic equipment, the heat dissipation problem thereof is increasingly prominent. Electronic devices inside the electronic equipment, such as system chips, batteries and the like, will generate heat in the working process. When the heat is too high, the heat is easy to be conducted to the screen or the battery back cover, resulting in heat source concentration and forming a local hotspot that can be perceived by the user, thereby affecting the user experience. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a heat insulation piece and electronic equipment, which can weaken the influence of the internal heat source of the electronic equipment on the outside, inhibit the local hotspot and improve the user experience.

[0004] In a first aspect, an electronic equipment is provided, comprising: a middle frame, a heat generating device being arranged on the middle frame; a touchable device, connected with the middle frame; a heat insulation piece, arranged between the middle frame and the touchable device, the heat insulation piece being used for connecting the middle frame and the touchable device; wherein the heat insulation piece comprises a substrate layer, a first adhesive layer and a second adhesive layer arranged in layers, the substrate layer being located between the first adhesive layer and the second adhesive layer, the first adhesive layer being used for bonding with the middle frame, the second adhesive layer being used for bonding with the touchable device, the thermal conductivity of the substrate layer being greater than or equal to 0.002 watt per meter kelvin and less than or equal to 0.1 watt per meter kelvin.

[0005] In the present application, the heat insulation piece has a low thermal conductivity, which can slow down or isolate the heat conduction between the middle frame and the touchable device, avoid heat source concentration on the touchable device, thereby weakening the influence of the internal heat source of the electronic equipment on the external device, inhibiting the local hotspot, making the whole machine heat evenly and improving the user experience. Moreover, the heat insulation piece has adhesive layers on both sides, which can be used for bonding the middle frame and the touchable device, thereby saving space.

[0006] In combination with the first aspect, in a possible implementation manner, the substrate layer comprises a porous material, a vacuum thermal insulation material or tungsten diselenide.

[0007] When the substrate layer adopts the porous material, the pore structure in the porous material can hinder heat transfer and reduce heat conduction.

[0008] When the substrate layer adopts the vacuum thermal insulation material, the number of gas molecules and solid particles in the vacuum state is greatly reduced, thereby reducing the thermal conductivity and effectively preventing heat transfer through the material inside.

[0009] When the substrate layer adopts tungsten diselenide, the tungsten diselenide has extremely low thermal conductivity, which can reduce heat conduction.

[0010] With reference to the first aspect, in a possible implementation manner, the porous material includes any one of the following materials: aerogel, ceramic fiber, or pearl wool.

[0011] With reference to the first aspect, in a possible implementation manner, the thermal conductivity of the substrate layer is less than or equal to the thermal conductivity of air at normal temperature and pressure.

[0012] Air is a poor conductor of heat, and the thermal conductivity of the substrate layer in the present application is lower than that of air, which can greatly reduce the conduction of heat and thereby inhibit local hot spots.

[0013] With reference to the first aspect, in a possible implementation manner, the first adhesive layer and the second adhesive layer are pressure-sensitive adhesives.

[0014] The pressure-sensitive adhesive can maintain adhesion during long-term use and can be easily peeled off, facilitating assembly.

[0015] With reference to the first aspect, in a possible implementation manner, the heat insulation member is arranged in a heat conduction region of the heat generating device.

[0016] Arranging the heat insulation member in the heat conduction region of the heat generating device can effectively avoid the middle frame from conducting heat to the touchable device to form a heat source concentration.

[0017] With reference to the first aspect, in a possible implementation manner, the heat conduction region of the heat generating device includes a heat generating region and / or a heat conducting region.

[0018] With reference to the first aspect, in a possible implementation manner, the heat insulation member is provided with a through hole for the device arranged on the middle frame to pass through.

[0019] The through hole arranged on the heat insulation member can avoid the device arranged on the middle frame, reducing the impact on the device layout while achieving heat insulation.

[0020] With reference to the first aspect, in a possible implementation manner, the heat generating device includes at least one of the following: a battery, a camera, a radio frequency chip, a system-on-chip, a power management chip, and a radio frequency power amplifier.

[0021] With reference to the first aspect, in a possible implementation manner, the heat generating device is fixed to the middle frame through a circuit board.

[0022] The heat generated by the heat generating device can be conducted to the middle frame through the circuit board, achieving heat dissipation.

[0023] With reference to the first aspect, in a possible implementation manner, the touchable device is a display screen or a back cover.

[0024] With reference to the first aspect, in a possible implementation manner, the display screen is arranged opposite to the back cover, and the middle frame is located between the display screen and the back cover.

[0025] With reference to the first aspect, in a possible implementation manner, the middle frame and the touchable device are further connected through glue dispensing.

[0026] The connection strength between the middle frame and the touchable device can be improved by connecting them through glue dispensing.

[0027] The second aspect provides a heat insulation piece, comprising: a substrate layer, a first glue layer and a second glue layer which are stacked, the substrate layer being located between the first glue layer and the second glue layer, wherein the substrate layer has a thermal conductivity greater than or equal to 0.002 W / (m·K) and less than or equal to 0.1 W / (m·K).

[0028] With reference to the second aspect, in a possible implementation manner, the substrate layer comprises a porous material, a vacuum thermal insulation material or tungsten diselenide.

[0029] With reference to the second aspect, in a possible implementation manner, the porous material comprises any one of the following materials: aerogel, ceramic fiber or pearl wool.

[0030] With reference to the second aspect, in a possible implementation manner, the thermal conductivity of the substrate layer is less than or equal to the thermal conductivity of air at normal temperature and pressure.

[0031] With reference to the second aspect, in a possible implementation manner, the first glue layer and the second glue layer are pressure-sensitive glue.

[0032] The device of the second aspect has the beneficial effects described with reference to the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

[0034] Figure 2 is an exploded schematic diagram of the electronic device in Figure 1

[0035] Figure 3 is a sectional view of the electronic device in Figure 1

[0036] Figure 4 is a schematic structural diagram of a heat insulation piece provided by an embodiment of the present application.

[0037] Figure 5 is a schematic structural diagram of a heat insulation piece provided by an embodiment of the present application.

[0038] ​​Figure 6 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the present application will be described below with reference to the drawings.

[0040] It should be noted that, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" herein only describes the relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone.

[0041] In the embodiments of the present application, the terms "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two, "at least one" and "one or more" means one, two or more than two. The singular expressions "one", "a kind", "the", "the above", "that" and "this" are intended to also include, for example, "one or more" expressions, unless the context clearly indicates the opposite.

[0042] In the present description, the reference to "one embodiment" or "some embodiments" and the like means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in further some embodiments" and the like appearing in different places in the present description are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "include", "contain", "have" and their variants mean "include but not limited to", unless otherwise specifically emphasized.

[0043] In the description of the embodiments of the present application, the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or position relationship defined with respect to the orientation or position of the components in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and do not indicate or imply that the device or component must have a specific orientation or be constructed and operated in a specific orientation, which can be changed accordingly according to the orientation of the components placed in the drawings, therefore it cannot be understood as a limitation of the present application. In addition, in the description of the scope in the present application, if not otherwise specified, the range includes the end value.

[0044] The same reference signs are used throughout the drawings to represent the same components or parts. In addition, the various components in the drawings are not drawn to scale, and the size and dimensions of the components shown in the drawings are merely exemplary and should not be construed as limiting the present application.

[0045] For the convenience of understanding, the technical terms involved in the present application are explained and described below.

[0046] The coefficient of thermal conductivity, also known as thermal conductivity or thermal diffusivity, is a physical quantity representing the heat conduction capacity of a material. The coefficient of thermal conductivity is defined as the heat directly conducted by a material per unit cross section, length, unit temperature difference and unit time. The unit of thermal conductivity is watt per meter kelvin (symbolized as W / (m·K)).

[0047] Gel is an elastic solid formed by colloidal particles in sol or solution under the action of dispersion medium, and the one with gas as dispersion medium is called aerogel.

[0048] System on chips (SOC), also known as system-level chip, is an integrated circuit with a special target, which contains a complete system and all contents of embedded software.

[0049] It should be noted that the above introduction of terms and concepts is only for the purpose of understanding and should not be construed as limiting the embodiments of the present application.

[0050] Figures 1 to 3 A schematic structural diagram of an electronic device to which the embodiments of the present application are applicable is shown.

[0051] In the embodiments of the present application, the electronic device 100 can be a mobile phone, a personal digital assistant (PDA) computer, a tablet computer, a portable computer, a laptop computer, a smart watch, a smart wristband, a vehicle-mounted computer, a television (or a smart screen), an e-book reader, a wearable device, etc. The specific form of the electronic device 100 is not specially limited in the embodiments of the present application. For the convenience of explanation and understanding, the electronic device 100 is taken as a mobile phone as an example for description.

[0052] Exemplarily, Figure 1 The schematic diagram of the overall structure of the electronic device 100 is shown in FIG. 1. Figure 2 The exploded schematic diagram of the electronic device 100 is shown in FIG. 2. Figure 3A cross-sectional view of the electronic device 100 along the A-A line.

[0053] With reference to Figure 1 , the electronic device 100 mainly comprises a housing 10, a display panel 20 and a circuit board assembly 30, the display panel 20 and the circuit board assembly 30 are mounted on the housing 10.

[0054] The housing 10 is formed with an accommodation space for accommodating components of the electronic device 100. The display panel 20 and the circuit board assembly 30 are arranged in the accommodation space of the housing 10 and connected with the housing 10. The housing 10 can also serve to protect the electronic device 100 and support the whole machine.

[0055] For example, with reference to Figure 2 , the housing 10 can include a middle frame 11, a bezel 12 and a back cover 13. The display panel 20 is arranged on both sides of the middle frame 11 in the thickness direction of the electronic device 100, respectively.

[0056] The middle frame 11 is a support frame inside the electronic device 100, used to carry various components such as batteries, cameras, earpieces, microphones, flat cables, mainboards, small boards, etc. The middle frame 11 is generally formed of metal materials such as copper, magnesium alloy, stainless steel, etc. or plastics, which can serve to increase the strength of the body, protect internal components and bear pressure. When a metal material is used, the middle frame 11 can also serve as a ground terminal of the electronic device 100. In the embodiments of the present application, the middle frame 11 can be used to fix and support the display panel 20. For example, as shown in Figure 3 , the display panel 20 can be adhered to the middle frame 11 by an adhesive 60.

[0057] As shown in Figure 3 , the middle frame 11 can include oppositely arranged first and second surfaces 111 and 112, the first surface 111 facing the back cover 13, and the second surface 112 facing the display panel 20. A first cavity can be formed between the middle frame 11 and the back cover 13, and a second cavity can be formed between the middle frame 11 and the display panel 20, the first and second cavities forming the accommodation space described above. For example, the first cavity can be used to mount internal components such as batteries, printed circuit boards (e.g. mainboards, small boards, etc.), functional modules, cameras, antennas, etc. or other components that need to be arranged between the back cover 13 and the middle frame 11, and the second cavity can be used to arrange vibration components for screen sound or other components that need to be arranged between the middle frame 11 and the display panel 20, etc.

[0058] The bezel 12 is a structure surrounding the outer periphery of the electronic device 100. With reference to Figure 2 and Figure 3The frame 12 can extend around the periphery of the electronic device 100, for example, can surround the four sides of the display screen 20, to help fix and protect the display screen 20, thereby reducing the adverse effects of collision, falling, etc. on the display screen 20. The frame 12 can be a metal frame or a non-metal frame (or called an insulating frame), wherein the metal frame is made of a metal material such as copper, magnesium alloy, stainless steel, etc., and the non-metal frame can be made of a plastic, glass or ceramic material, etc.

[0059] The back cover 13 is a structure arranged opposite to the display screen 20 on the electronic device 100, connected with the frame 12, used to seal the components of the electronic device 100 inside the electronic device, and also capable of preventing dust, collision, and hardware scratches. In some embodiments, the back cover 13 can also be used to fix other display screens in addition to the display screen 20, or to fix antennas, etc. The back cover 13 can be a back cover made of a metal material (i.e. a metal back cover), or a back cover made of a non-conductive material (i.e. a non-metal back cover), such as a glass back cover, a plastic back cover, etc. For example, as shown in FIG. 1, the back cover 13 can be a glass back cover. Figure 3 The back cover 13 can be adhered to the frame 12 by an adhesive 60.

[0060] The middle frame 11 and the frame 12 can be a separate structure or an integrated structure, which is not limited in the embodiments of the present application. When the middle frame 11 and the frame 12 are a separate structure, the middle frame 11 and the frame 12 are two different components of the shell 10, which can be assembled together by clamping, riveting, adhering, buckling, etc., and can be separated when disassembled. When the middle frame 11 and the frame 12 are an integrated structure, the connection relationship between the middle frame 11 and the frame 12 cannot be separated, for example, the middle frame 11 and the frame 12 are processed by one-piece molding, or are assembled by permanent connection such as welding, etc. The integrated middle frame and frame can be considered that the outer periphery of the middle frame acts as the frame of the electronic device 100, that is, the frame 12 is considered as a part of the middle frame 11.

[0061] The frame 12 and the back cover 13 can be a separate structure or an integrated structure, which is not limited in the embodiments of the present application. When the frame 12 and the back cover 13 are a separate structure, the frame 12 and the back cover 13 are two different components of the shell 10, which can be assembled together by clamping, riveting, adhering, buckling, etc., and can be separated when disassembled. When the frame 12 and the back cover 13 are an integrated structure, the connection relationship between the frame 12 and the back cover 13 cannot be separated, for example, the frame 12 and the back cover 13 are processed by one-piece molding, or are assembled by permanent connection such as welding, etc. The integrated frame and back cover can be considered that the outer periphery of the back cover 13 acts as the frame of the electronic device 100, that is, the frame 12 is considered as a part of the back cover 13.

[0062] The display screen 20 is configured to display images. The display screen 20 can be a liquid crystal display (LCD) screen, an organic light emitting diode (OLED) display screen, or the like. If the display screen 20 is an LCD screen, the electronic device 100 further includes a back light unit (BLU) configured to provide a light source for the LCD screen. If the display screen 20 is an OLED display screen, the OLED display screen is capable of self-illumination, and thus the electronic device 100 does not need to be provided with the above-mentioned back light unit. The display screen 20 can be a regular screen, or can be a special-shaped screen or a folding screen, or the like.

[0063] In the embodiments of the present application, the display screen 20 has a light-emitting surface capable of displaying images. A side surface of the display screen 20 opposite to the light-emitting surface can be referred to as a back surface of the display screen 20. The back surface of the display screen 20 is accommodated in the accommodating space (e.g., the second cavity) formed by the housing 10, and is not visible to a user.

[0064] In some embodiments, with reference to Figure 2 and Figure 3 The electronic device 100 can further include a cover plate 40 (e.g., a glass cover plate) configured to protect the display screen 20. The cover plate 40 can be arranged in close contact with the display screen 20, for example, by being fixed to the display screen 20 via an adhesive. The cover plate 40 has a certain toughness.

[0065] The circuit board assembly 30 includes at least one printed circuit board (PCB) and at least one electronic component carried on the PCB. In some embodiments, the circuit board assembly 30 can further include an electrical connection plate (e.g., a board-to-board (BTB) connector) or a flexible printed circuit board (FPC), or the like. For example, the circuit board assembly 30 can be a printed circuit board assembly (PCBA). The main function of the circuit board assembly 30 is to electrically interconnect electronic components (e.g., resistors, capacitors, inductors, transistors, integrated circuits, or the like) to form a circuit, to provide mechanical support for the electronic components, and to help dissipate heat, or the like.

[0066] A printed circuit board (PCB) is a support for electronic components and a carrier for electrical connections of the electronic components. The PCB can be made of FR-4 medium board, rogers medium board, mixed medium board of rogers and FR-4, etc. Here, FR-4 is a code of a fire-resistant material grade, and the rogers medium board is a high-frequency board. The PCB can be a single-sided board, a double-sided board, a multi-layer circuit board, etc. The PCB can be a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, etc.

[0067] The PCB is provided with conductive patterns, and electronic components can be electrically connected by wiring between different conductive patterns. The PCB after wiring can include functional networks and non-functional networks. The functional networks can provide certain electrical functions, such as charging, radio frequency, antenna, multimedia, data storage, sensor, etc. The non-functional networks do not provide electrical functions, and are mainly used for mechanical connection between a structure to be welded and the PCB, etc. The non-functional networks are usually grounded (GND) or floating (not connected to any functional network or GND network), used for isolating the structure carried on the PCB from the functional networks to avoid electric shock or equipment damage caused by miscontact. For example, the PCB can be provided with a metal layer for grounding of the electronic components carried on the PCB. The metal layer can be formed by etching metal on the surface of the PCB, for example. In some embodiments, the metal layer can be referred to as a PCB floor. The embodiments of the present application are not limited to the PCB floor, and the electronic device 100 can also have other floors for grounding, such as a metal middle frame, a metal back cover, etc.

[0068] In some embodiments, the circuit board assembly 30 can also include a circuit board support for fixing the PCB to the middle frame 11. The circuit board support can be made of metal and serve as a conductive GND. Alternatively, the circuit board support can be an insulating support provided with a metal member.

[0069] By way of example and not limitation, the PCB in the circuit board assembly 30 can include a main board and a small board. The main board is a central hub for connecting various hardware in the electronic device 100, and functions to make the various hardware work cooperatively and control the operation and transmission of data of each part. The small board is an auxiliary board of the main board and is an auxiliary device for implementing various functions. The main board and the small board can be connected by a flexible printed circuit (FPC), i.e., the aforementioned flat cable. The main board or the small board and the associated hardware can also be electrically connected by the FPC. The FPC can be attached to the housing 10 (e.g., the middle frame 11 or the back cover 13).

[0070] Flexible printed circuit board (FPC), also known as soft board, is a flexible printed circuit board made of flexible insulating substrate (such as polyimide or polyester film). FPC can meet the design needs of smaller and higher density installation, and help reduce assembly process and enhance reliability.

[0071] In the embodiments of the present application, the electronic components carried on the PCB include but are not limited to capacitors, inductors, resistors, processors, memories, cameras, flashlights, microphones, etc. The electronic components carried on the PCB can form a plurality of functional modules, such as a wireless fidelity (WiFi) module, a radio frequency power amplifier (RFPA), a radio frequency integrated circuit (RFIC), a system in package (SiP), a system on chip (SOC) (or system level chip), an audio module, a power management unit (PMU) (or power management chip), etc., to realize corresponding functions. The shape of the PCB can be designed according to the shape of the electronic device and the positions and shapes of the functional modules to be arranged inside the electronic device.

[0072] In some embodiments, with reference to Figure 3 The electronic device 100 can further include a power supply 50 for powering the circuit board assembly 30 and the display screen 20. The power supply 50 can be a lithium ion battery, such as a ternary lithium battery or a lithium iron phosphate battery, for example.

[0073] With reference to Figure 3 The display screen 20 and the back cover 13 are respectively arranged on both sides of the middle frame 11 in the thickness direction of the electronic device 100 and are connected to the middle frame 11. The circuit board assembly 30 is arranged in the space formed by the display screen 20 and the back cover 13 and is fixed to the middle frame 11. In the case where the electronic device 100 includes the power supply 50, the power supply 50 can be arranged in the space formed by the display screen 20 and the back cover 13 and is fixed to the middle frame 11.

[0074] In some embodiments, the electronic device 100 can be a straight-screen electronic device (screen cannot be folded) or a folding-screen electronic device (screen can be folded). When the electronic device 100 is a folding-screen electronic device, the electronic device 100 has at least one folding axis. Accordingly, the housing 10 can include a plurality of housing portions that are relatively rotatable about the folding axis. Each of the housing portions can include a portion of the middle frame 11 and a portion of the bezel 12, and at least one of the housing portions further includes at least a portion of the back cover 13.

[0075] It should be understood that Figures 1 to 3 The structure shown in the above figure does not constitute a specific limitation on the electronic device 100, and the electronic device 100 can include more or fewer components than the figure, and the electronic device 100 can also have a different component arrangement than the figure. In addition, the type of electronic device 100 is different, and the components included in the electronic device 100 are different, for example, the electronic device 100 can also be a side sliding mobile phone, a folding machine, etc. The electronic device structure provided in the embodiments of the present application is only an exemplary description.

[0076] The electronic devices inside the electronic device 100, such as SOC, battery, camera, radio frequency chip, etc., will generate heat during operation. When the heat is too high, the heat is easily conducted to the display screen 20 or the back cover 13 through the middle frame 11, causing heat concentration and forming a local hot spot that can be perceived by the user, affecting the user experience.

[0077] Therefore, the embodiments of the present application provide a heat insulation piece applied to an electronic device, which can slow down the heat transfer of the heat generating components, prevent heat concentration to form a local hot spot that can be perceived by the user, improve the overall heat dissipation performance of the electronic device, and thus improve the user experience.

[0078] Figure 4 A schematic structural diagram of a heat insulation piece provided by the embodiments of the present application is shown. Figure 4 The heat insulation piece 200 shown can be applied to Figures 1 to 3 The electronic device 100 shown, specifically, the heat insulation piece 200 can be Figure 3 An example of the adhesive piece 60 shown.

[0079] As shown in the above figure, Figure 4 The heat insulation piece 200 includes a substrate layer 61, a first adhesive layer 62 and a second adhesive layer 63 arranged in layers, the substrate layer 61 is arranged between the first adhesive layer 62 and the second adhesive layer 63, and the thermal conductivity of the substrate layer 61 is greater than or equal to 0.002 W / mK and less than or equal to 0.1 W / mK. That is, the thermal conductivity of the substrate layer 61 is in the range of 0.002 W / (m•K)~0.1 W / (m•K).

[0080] In the embodiments of the present application, the heat insulation piece 200 has a lower thermal conductivity, which can effectively slow down or insulate heat conduction, avoid heat source concentration on the touchable devices on the electronic device, thereby reducing the influence of the internal heat source of the electronic device on the external devices, and suppressing the local hot spot, thus improving the overall heat dissipation performance and improving the user experience. Moreover, the heat insulation piece 200 has adhesive layers on both sides, so it can be used to bond two structural pieces. Therefore, when the heat insulation piece 200 is applied to the electronic device, it can bond two structural pieces while reducing heat transfer between the two structural pieces, saving space and improving user experience.

[0081] In some embodiments, the substrate layer 61 comprises at least one of the following materials: a porous material, a vacuum thermal insulation material, or tungsten diselenide.

[0082] A porous material is a material that has a network structure composed of interconnected or closed pores. Compared with a continuous medium material, a porous material generally has the advantages of low relative density, high specific strength, high specific surface area, light weight, sound insulation, heat insulation, good permeability, and the like. When the substrate layer 61 is made of a porous material, the pore structure in the porous material can hinder heat transfer and reduce heat conduction. Specifically, the pore structure in the porous material is mostly irregular in shape and uneven in size distribution, which hinders heat transfer. In addition, the porosity of the porous material is relatively high, and the gas in the pores will absorb part of the heat due to its low thermal conductivity, which will hinder heat conduction.

[0083] In some embodiments, the substrate layer 61 can comprise at least one of the following porous materials: aerogel, ceramic fiber, and pearl wool.

[0084] An aerogel is a three-dimensional network of nanometer porous solid material filled with gas, with a porosity of 80% to 99.8%, a specific surface area of 900 square meters per gram (symbolized as m 2 / g), a density as low as 0.002 grams per cubic centimeter (symbolized as g / cm 3 ), and a pore size generally less than 50 nanometers (symbolized as nm). The thermal conductivity of aerogel is about 0.012 W / (m•K) to 0.024 W / (m•K). Aerogel has a special microstructure of high specific surface area, nanoscale pores, and low density, which greatly reduces the proportion of solid-phase heat conduction, thus exhibiting excellent performance in thermal aspects. Using aerogel as the material of the substrate layer 61 not only can achieve heat insulation, but also can reduce weight.

[0085] In some embodiments, if the substrate layer 61 is made of aerogel, the substrate layer 61 can comprise at least one of the following types of aerogel:

[0086] Oxide aerogels, such as silica (SiO2) aerogel, zirconia (ZrO2) aerogel, alumina (Al2O3) aerogel, vanadium pentoxide (V2O5) aerogel, titanium dioxide (TiO2) aerogel, and the like;

[0087] Carbide aerogels, such as silicon carbide (SiC) aerogel, silicon oxycarbide (SiOC) aerogel, zirconium carbide (ZrC) aerogel, and the like;

[0088] nitride aerogels, such as silicon nitride (Si3N4) aerogels, boron nitride (BN) aerogels, carbon nitride (C3N4) aerogels, vanadium nitride (VN) aerogels, and the like;

[0089] organic aerogels, such as polyimide aerogels, polyurethane aerogels, polyurea aerogels, polyamide aerogels, poly-m-phenylene diamine aerogels, polyvinylidene chloride aerogels, polypyrrole aerogels, and the like;

[0090] carbon aerogels, such as graphene aerogels;

[0091] biomass aerogels, such as cellulose aerogels, protein aerogels, and the like;

[0092] composite aerogels, such as doped aerogels, binary and multi-component composite aerogels, aerogels combined with substrates, and the like.

[0093] For the sake of understanding, several commonly used types of aerogels are introduced below.

[0094] SiO2 aerogels are nano-porous network structures formed by cross-linking SiO2 nanoparticles, and have excellent thermal insulation performance, as well as good optical transparency and chemical stability. The thermal conductivity of SiO2 aerogels is about 0.012 W / (m•K).

[0095] ZrO2 aerogels are nano-porous materials with a three-dimensional cross-linked network structure, taking ZrO2 as the main component, and have high specific surface area, high porosity, and good thermal stability. The thermal conductivity of ZrO2 aerogels ranges from about 0.0238 W / (m•K) to about 0.029 W / (m•K).

[0096] Al2O3 aerogels are nano-porous materials with a three-dimensional cross-linked network structure composed of Al2O3. The thermal conductivity of Al2O3 aerogels is about 0.015 W / (m•K).

[0097] Cellulose aerogels are gels formed by mixing cellulose and water or other organic solvents under certain pressure and temperature conditions. Cellulose is a natural high-molecular organic compound and widely exists in the cell walls of biomass materials. Cellulose aerogels can be divided into three categories according to the different sources and structural properties of cellulose: nano-cellulose aerogels, regenerated cellulose aerogels, and cellulose derivative aerogels. Cellulose aerogels have good biodegradability and renewability, and are an environmentally friendly multifunctional material. The thermal conductivity of cellulose aerogels can be as low as below 0.020 W / (m•K), for example, 0.0196 W / (m•K).

[0098] Polyimide (PI) aerogel is a kind of nano-porous material combining the characteristics of polyimide and aerogel, which has the advantages of good thermal insulation performance, lightweight, low density, high mechanical strength, etc. The thermal conductivity of polyimide aerogel can be as low as 0.015 W / (m•K).

[0099] Composite aerogel is an aerogel composite material composed of two or more single-component aerogels or combined with fiber, whisker, nanotube, etc.

[0100] Ceramic fiber is a kind of fibrous lightweight refractory material, which has the advantages of light weight, high temperature resistance, good thermal stability, low thermal conductivity, small specific heat and resistance to mechanical vibration. The thermal conductivity of ceramic fiber is in the range of 0.03 W / (m•K) to 0.06 W / (m•K).

[0101] Pearl wool is a kind of closed-cell material formed by physical foaming of low-density polyethylene, which has the characteristics of lightweight, shock absorption, waterproof, thermal insulation, sound insulation, etc. The thermal conductivity of pearl wool is relatively low, usually below 0.034 W / (m•K).

[0102] Vacuum insulation material (VIM) is a special material that uses vacuum state to insulate heat conduction. Vacuum insulation material is mainly composed of core material and shell. The core material is mostly porous material, and the shell plays a protective and sealing role. In the core material, the main carriers of heat conduction are gas molecules and solid particles. In a vacuum state, the number of gas molecules and solid particles is greatly reduced, reducing the thermal conductivity, thereby effectively preventing heat transfer through the material inside. The thermal conductivity of vacuum insulation material is in the range of 0.002 W / (m•K) to 0.004 W / (m•K).

[0103] Tungsten diselenide (chemical formula WSe2) is an inorganic compound, which presents gray crystal form. Its main structure is composed of one layer of selenium atoms above and below connecting one layer of tungsten atoms in the middle. Tungsten diselenide is a typical low-dimensional transition metal chalcogenide semiconductor material, which not only has extremely low thermal conductivity, but also has high density similar to copper, excellent electrical and optical properties, and high quantum yield. The thermal conductivity of tungsten diselenide is about one hundred thousandth of the thermal conductivity of the best diamond, and its thermal conductivity at room temperature is about 0.006 W / (m•K) to 0.04 W / (m•K).

[0104] In summary, the thermal conductivities of different materials are shown below for convenience.

[0105]

[0106] In some embodiments, the substrate layer 61 has a thermal conductivity less than or equal to that of air at normal temperature and pressure (or standard state).

[0107] In the embodiments of the present application, normal temperature can be understood as "ambient temperature", which refers to a temperature range that is not particularly low or particularly high. Generally in chemistry and physics, normal temperature usually refers to a temperature of about 20°C, at which most chemical reactions can be carried out. Due to fluctuations in ambient temperature, in some cases, a temperature range between room temperature and a temperature that is comfortable for humans (e.g. about 25°C) is also considered as normal temperature.

[0108] In the embodiments of the present application, normal pressure refers to standard atmospheric pressure or ambient pressure, specifically the atmospheric pressure value at the standard sea level on Earth, which is about 101.325 kilopascals (symbolized as kPa).

[0109] Generally, the thermal conductivity of air at normal temperature and pressure is about 0.023 W / (m•K) to 0.026 W / (m•K).

[0110] Air is a poor conductor of heat, and the thermal conductivity of the substrate layer 61 in the present application is lower than that of air, which can greatly reduce the conduction of heat and thereby inhibit local hot spots.

[0111] In some embodiments, the substrate layer 61 can be a film or a sheet. The main difference between a film and a sheet is the thickness, for example, the thickness of a film is generally less than 0.25 millimeters (mm), and the thickness of a sheet is generally between 0.25 millimeters and 2 millimeters.

[0112] In some embodiments, the first adhesive layer and the second adhesive layer are pressure sensitive adhesives (or back adhesives).

[0113] Pressure sensitive adhesive (PSA) is an adhesive with special properties, which can form an adhesive effect without any additional activator or moisture when pressure is applied, and has the characteristics of not losing adhesion during long-term use and being easily peeled off.

[0114] For example, the material of the pressure sensitive adhesive can include at least one of the following materials: polymer, resin or rubber.

[0115] Polymers are usually polymerized from monomers such as acrylic acid, styrene-butadiene rubber and allylic acid. The type and structure of the polymer will affect the performance of the pressure sensitive adhesive, such as adhesion, peelability and chemical resistance, etc.

[0116] Commonly used resins include polyester, polyether and polyurea, etc. These resins usually have excellent adhesion properties, which can make the pressure sensitive adhesive maintain stable adhesion properties in different environments.

[0117] Commonly used rubbers include styrene butadiene rubber, styrene rubber, and nitrile rubber, etc. The type and structure of the rubber can affect the physical properties of the pressure sensitive adhesive, such as tensile strength, ductility, and abrasion resistance, etc.

[0118] In some embodiments, the first adhesive layer and the second adhesive layer are dispensing materials. Here, the dispensing materials are in a fluid state during the bonding process.

[0119] Using dispensing materials as the adhesive agent, the thickness of the adhesive layer can be adjusted in real time according to the space, so as to meet the bonding effect and space requirements.

[0120] Exemplary dispensing materials include, but are not limited to, silver glue, red glue, hot melt glue, silicone glue, quick-drying glue, epoxy glue, etc.

[0121] Silver glue is a glue containing silver powder with conductive function, and has the characteristic of quick drying. Red glue is a polyolefin compound, which can be used at room temperature. Hot melt glue is a plastic adhesive, which changes its physical state with temperature within a certain temperature range, while its chemical properties remain unchanged. When used, it is dispensed after being heated by a heating device. Silicone glue includes single-component silicone glue and two-component silicone glue. Single-component silicone glue does not need to be mixed with an adhesive (curing agent) before use. It already contains a latent curing agent in its production formula. Two-component silicone glue consists of two components, which need to be mixed together in a certain proportion to cure. Quick-drying glue can be cured immediately after contacting with the surface of the structure, and has fast drying speed. Epoxy glue has high strength and chemical corrosion resistance, and is suitable for various bonding and sealing requirements.

[0122] In some embodiments, referring to Figure 5 The thermal insulation member 200 is provided with a through hole 64, which can be used for the device to pass through, so as to leave out the space for avoiding the device.

[0123] Figure 6 A schematic structural diagram of an electronic device is shown. Figure 6 The electronic device 300 shown can be Figures 1 to 3 An example of the electronic device 100 shown.

[0124] As Figure 6As shown, the electronic device 300 includes a mid-frame 310, a touchable device 320, and a heat insulation member 200 described in the foregoing embodiments. A heating element 330 is disposed on the mid-frame 310. The touchable device 320 is fixedly connected to the mid-frame 310 and forms a receiving space for accommodating the mid-frame 310. The heat insulation member 200 is disposed between the mid-frame 310 and the touchable device 320, connecting the mid-frame 310 and the touchable device 320, and also suppressing heat conduction between them. Specifically, the first adhesive layer 62 of the heat insulation member 200 is bonded to the mid-frame 310, and the second adhesive layer 63 of the heat insulation member 200 is bonded to the touchable device 320. The substrate layer 61 of the heat insulation member 200 satisfies the aforementioned thermal conductivity condition, i.e., a thermal conductivity greater than or equal to 0.002 watts per meter Kelvin and less than or equal to 0.1 watts per meter Kelvin.

[0125] In this embodiment, the heat insulation component 200 has a low thermal conductivity, which can slow down or isolate the heat conduction between the middle frame 310 and the touchable device 320, avoid the generation of heat source concentration on the touchable device 320, thereby suppressing local hot spots, making the heat dissipation of the whole machine uniform, and thus improving the user experience.

[0126] In this embodiment, the touchable device 320 refers to a device that the user can touch and perceive in the overall device state. For example, the touchable device 320 is a display screen or a back cover. The display screen can be... Figures 1 to 3 The described display screen 20 may have a back cover that is Figures 1 to 3 The back cover 13 is described.

[0127] In this embodiment of the application, the middle frame 310 can be Figure 2 or Figure 3 An example of the middle frame 11 shown.

[0128] In some embodiments, the display screen and the back cover are disposed opposite each other, and the mid-frame 310 is located between the display screen and the back cover. The display screen and the back cover may form a receiving space for accommodating the mid-frame 310.

[0129] It should be noted that if the electronic device 300 is a foldable device, the relative positional relationship between the mid-frame 310 and the display screen and back cover will change depending on the folded state of the electronic device 300. In this case, the mid-frame 310 may be located between the display screen and the back cover when the electronic device 300 is in a certain state.

[0130] In this embodiment, the heat-generating device 330 is a device that generates heat during operation. For example, the heat-generating device 330 may include at least one of the following: a battery, a camera, an RF chip, a system-on-a-chip, a power management chip, or an RF power amplifier.

[0131] In some embodiments, the heat generating device 330, such as a battery, etc., can be directly fixed to the middle frame 310. In this case, the heat generated by the heat generating device 330 can be directly conducted to the middle frame 310, achieving heat dissipation.

[0132] In other embodiments, the heat generating device 330, such as a camera, a radio frequency chip, a system on chip, a power management chip, a radio frequency power amplifier, etc., can be fixed to the middle frame 310 through a circuit board. That is, the middle frame 310 is provided with a circuit board, and the circuit board is provided with the heat generating device 330. In this case, the heat generated by the heat generating device 330 can be conducted to the middle frame 310 through the circuit board, achieving heat dissipation.

[0133] For example, the circuit board can be the circuit board in the circuit board assembly 30 introduced in the foregoing embodiments, such as a printed circuit board (PCB) or a flexible printed circuit (FPC).

[0134] In some embodiments, the heat insulation member 200 can be arranged in the heat conduction region of the heat generating device 330.

[0135] Here, the heat conduction region of the heat generating device 330 refers to the conduction range of the heat generated by the heat generating device 330, and can specifically include a heat generating region and / or a heat conduction region. The heat generating region refers to the source region of the heat generated by the heat generating device 330, and is generally located adjacent to the heat generating device 330. The heat conduction region refers to the region through which the heat generated by the heat generating device 330 is conducted, for example, the heat generated by the heat generating device 330 can be transmitted to the cold region through a heat conduction structure, and the vicinity of the heat conduction structure is the heat conduction region.

[0136] Arranging the heat insulation member 200 in the heat conduction region of the heat generating device 330 can effectively avoid the middle frame 310 from conducting heat to the touchable device 320 to form a heat source concentration.

[0137] In some embodiments, the heat insulation member 200 can be arranged at a position between the middle frame 310 and the touchable device 320 that needs to be bonded.

[0138] In some embodiments, the heat insulation member 200 can be provided with a relief area, the relief area penetrating the thickness of the heat insulation member 200, and the relief area is used to avoid the device 340 arranged on the middle frame 310. For example, the relief area can be a through hole, such as the through hole 64 shown in the figure. The through hole 64 is used for the device 340 to pass through. Figure 5

[0139] In some embodiments, if the device 340 is a heat generating device, there is a gap between the device 340 and the touchable device 320. The air existing in the gap is a poor conductor of heat, which can inhibit the heat conduction between the device 340 and the touchable device 320, and avoid forming a local hot spot on the touchable device 320.​

[0140] In some embodiments, the middle frame 310 and the touchable device 320 can also be connected through dispensing. For example, the dispensing position can be located outside the heat conduction area of the heat generating device 330.

[0141] The connection between the middle frame 310 and the touchable device 320 can be achieved through the heat insulation piece 200 and dispensing, which can improve the connection strength.

[0142] In the embodiments of the present application, the thickness of the heat insulation piece 200 can be determined according to actual conditions (such as installation space, heat insulation requirement, etc.). Generally, the greater the thickness of the heat insulation piece 200, the better the heat insulation effect.

[0143] In some embodiments, the thickness of the heat insulation piece 200 is greater than or equal to 0.02 mm and less than or equal to 2 mm. For example, the thickness of the heat insulation piece 200 can be 0.05 mm, 0.13 mm, 0.25 mm, 0.4 mm, 0.5 mm, 0.6 mm, 1.0 mm, 1.1 mm, 1.6 mm or 1.8 mm, etc.

[0144] In some embodiments, when designing, the heat insulation effect of the heat insulation piece 200 can be determined by using a thermal simulation diagram. For example, if the temperature change gradient on the touchable device 320 is less than a threshold value, it can be explained that there is no local hot spot on the touchable device 320, and then it can be considered that the heat insulation piece 200 can achieve the effect of suppressing local hot spots.

[0145] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0146] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: include: A middle frame, on which a heating element is disposed; A touchable device is connected to the middle frame; A heat insulation component is disposed between the middle frame and the touchable device, and the heat insulation component is used to connect the middle frame and the touchable device; The heat insulation component includes a substrate layer, a first adhesive layer, and a second adhesive layer stacked together. The substrate layer is located between the first adhesive layer and the second adhesive layer. The first adhesive layer is used to bond to the middle frame, and the second adhesive layer is used to bond to the touchable device. The thermal conductivity of the substrate layer is greater than or equal to 0.002 watts per meter Kelvin and less than or equal to 0.1 watts per meter Kelvin.

2. The electronic device of claim 1, wherein, The substrate layer includes porous materials, vacuum insulation materials, or tungsten diselenide.

3. The electronic device of claim 2, wherein, The porous material includes any one of the following: aerogel, ceramic fiber, or pearl cotton.

4. The electronic device of claim 1, wherein, The thermal conductivity of the substrate layer is less than or equal to that of air at room temperature and pressure.

5. The electronic device of any of claims 1-4, wherein, The first adhesive layer and the second adhesive layer are pressure-sensitive adhesives.

6. The electronic device of any of claims 1-4, wherein, The heat insulation element is disposed within the heat conduction area of ​​the heating device.

7. The electronic device of any of claims 1-4, wherein, The heat insulation component is provided with through holes, which are used for devices mounted on the middle frame to pass through.

8. The electronic device of any of claims 1-4, wherein, The heating device includes at least one of the following: Battery, camera, RF chip, system-on-a-chip, power management chip, RF power amplifier.

9. The electronic device of any of claims 1-4, wherein, The touchable device is a display screen or a back cover.

10. The electronic device of any of claims 1-4, wherein, The middle frame and the touchable device are also connected by adhesive dispensing.

11. A thermal insulating element, characterized in that include: A substrate layer, a first adhesive layer, and a second adhesive layer are stacked together, with the substrate layer located between the first adhesive layer and the second adhesive layer, wherein the thermal conductivity of the substrate layer is greater than or equal to 0.002 watts per meter Kelvin and less than or equal to 0.1 watts per meter Kelvin.

12. The insulating element according to claim 11, characterized in that The substrate layer includes porous materials, vacuum insulation materials, or tungsten diselenide.

13. The insulating element according to claim 12, characterized in that The porous material includes any one of the following: aerogel, ceramic fiber, or pearl cotton.

14. The insulating element according to any one of claims 11 to 13, characterized in that The thermal conductivity of the substrate layer is less than or equal to that of air at room temperature and pressure.

15. The insulating element according to any one of claims 11 to 13, characterized in that The first adhesive layer and the second adhesive layer are pressure-sensitive adhesives.

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