Heat dissipation structure of electronic component

Abstract

The utility model relates to a heat dissipation structure of an electronic component. The heat dissipation structure comprises the electronic component, a radiator and a circuit board, the electronic component is provided with a packaging shell, a plurality of pins exposed out of the packaging shell, and an overhead radiating fin exposed out of the packaging shell. The radiator is provided with a space capable of accommodating the electronic component and an injection channel communicated with the space, the injection channel allows a solid heat-conducting medium to be injected into the space, and the solid heat-conducting medium enables the overhead radiating fin and the radiator to generate a heat conduction relation. The circuit board is provided with a plurality of first copper foils for bonding the plurality of pins and a second copper foil for bonding the radiator. In addition, the number of the electronic components can be multiple, and the multiple electronic components can be arranged in a parallel connection mode.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation structure of electronic component, especially a heat dissipation structure with increased heat dissipation efficiency. BACKGROUND

[0002] Electronic components are prone to generate waste heat during operation, so manufacturers mostly use heat sinks to dissipate heat from electronic components. The conventional technology of attaching heat sinks is to lock the heat sink to the electronic component so that the heat sink directly contacts the electronic component for heat conduction. On the other hand, a heat conduction medium can be applied to the surface of the electronic component, and then the heat sink is placed and positioned according to the position of the electronic component, and the gap between the electronic component and the heat sink is filled with the heat conduction medium to form a heat conduction path from the electronic component to the heat sink.

[0003] Therefore, Taiwan TW M320289U provides an improved surface-adhesive heat dissipation structure, which includes a circuit board, a heat dissipation element, and a heat-conducting glue. The heat dissipation element has a heat dissipation cover with a filling hole and a containing space in which a light-emitting element is arranged. The light-emitting element is welded to the circuit board and electrically connected to the copper foil on the circuit board, and the heat dissipation cover is embedded on one side of the light-emitting element so that the light-emitting element is located in the containing space of the heat dissipation element, and the heat-conducting glue is filled in the filling hole to achieve the heat conduction effect of the light-emitting element.

[0004] On the other hand, the technology of Taiwan TW M320289U requires embedding the heat dissipation element with the electronic component, rather than simply positioning it by adhering to the circuit board. When it comes to further improving the production capacity of electronic components through automation, it is difficult to implement in practice. Moreover, the conventional technology of attaching heat sinks through locking is more complex and not conducive to automation. SUMMARY

[0005] The main purpose of the utility model is to solve the problem of the conventional heat dissipation structure that is not convenient to set up when automated.

[0006] The secondary purpose of the utility model is to improve the heat dissipation effect of the heat dissipation structure of electronic components.

[0007] To achieve the above object, the utility model provides a heat dissipation structure of electronic component, this heat dissipation structure contains an electronic component, a radiator and a circuit board. The electronic component has a package shell, multiple pins exposed to the package shell and a top fin exposed to the package shell. The radiator is shaped with a space for accommodating the electronic component and an injection channel communicating with the space, the injection channel allows a solid heat conducting medium to be injected into the space, and the solid heat conducting medium makes the top fin and the radiator have a heat conduction relationship. The circuit board is provided with multiple first copper foils for bonding the multiple pins of the electronic component and a second copper foil for bonding the radiator.

[0008] In an embodiment, the radiator includes multiple fins, and the injection channel is formed in one of the multiple fins.

[0009] In an embodiment, the injection channel has a first port exposed to the radiator and a second port facing the space, and the second port is larger than the first port.

[0010] In an embodiment, the injection channel has an injection section communicating with the first port and a diverging section communicating with the injection section and the second port.

[0011] In an embodiment, the radiator is shaped with an accommodating groove, the accommodating groove belongs to a part of the space, and the accommodating groove communicates with the second port.

[0012] In an embodiment, the second copper foil is divided into at least one first part for bonding the radiator and a second part connected to the at least one first part, and the second part is in contact with the package shell of the electronic component when the electronic component is arranged on the circuit board but does not form a bonding relationship.

[0013] In an embodiment, the radiator is arranged across the electronic component, the radiator includes two adhesive pins, the second copper foil includes two first parts, and the second part of the second copper foil is located between the two first parts.

[0014] In an embodiment, the space on the radiator is formed by a gap.

[0015] In an embodiment, the radiator is shaped with an accommodating groove, the accommodating groove belongs to a part of the space, and the accommodating groove communicates with the second port.

[0016] In an embodiment, at least one of the two first parts includes a radiator bonding area and an auxiliary heat dissipation area connected to the radiator bonding area.

[0017] In one embodiment, the plurality of first copper foils are divided into two groups of first copper foils arranged in intervals, and each of the two groups of first copper foils is provided with the second copper foils on at least three sides, and the second part of the second copper foils is located between the two groups of first copper foils.

[0018] In one embodiment, the two first parts respectively include a heat sink bonding area and two auxiliary heat dissipation areas connected to the heat sink bonding area.

[0019] In one embodiment, the heat dissipation structure includes a plurality of electronic components, and the space of the heat sink provides a plurality of electronic components to be accommodated therein.

[0020] In one embodiment, the heat dissipation structure includes a plurality of electronic components, and the heat sink is shaped to form a plurality of spaces and a plurality of injection channels, each of the plurality of injection channels is arranged corresponding to one of the plurality of spaces, the plurality of electronic components are respectively accommodated in the plurality of spaces, and each of the plurality of spaces provides an accommodated number of electronic components greater than or equal to 1.

[0021] Through the foregoing implementation of the present application, compared with the prior art, the following characteristics are provided:

[0022] The second copper foil of the present application can be used as a heat dissipation path in addition to being used as an adhesive for the heat sink during automated implementation. The injection channel is provided on the heat sink, so that the solid heat conducting medium can be injected into the space through the injection channel. The overall structure of the present application only needs to perform simple positioning, adhesion and injection actions during automated operation, which is more conducive to automated implementation compared with the prior art. In addition to the foregoing, the heat dissipation effect of the structure disclosed by the present application can be effectively improved. The electronic components included in the heat dissipation structure of the present application are not limited to a single implementation, but can be implemented in multiple ways, and the heat sink is adjusted according to the implementation structure. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 FIG. 1 is a structural schematic diagram of a first embodiment of a heat dissipation structure for electronic components of the present application;

[0024] Figure 2 FIG. 2 is an exploded view of the first embodiment of the heat dissipation structure for electronic components of the present application;

[0025] Figure 3 FIG. 3 is a partial structure top view schematic diagram of the first embodiment of the heat dissipation structure for electronic components of the present application;

[0026] Figure 4 FIG. 4 is a cross-sectional schematic diagram (1) of the first embodiment of the heat dissipation structure for electronic components of the present application;

[0027] Figure 5 FIG. 5 is a cross-sectional schematic diagram (2) of the first embodiment of the heat dissipation structure for electronic components of the present application;

[0028] Figure 6 It is cross section schematic view of first embodiment of electronic component's heat dissipation structure of the utility model (three);

[0029] Figure 7 It is cross section schematic view of second embodiment of electronic component's heat dissipation structure of the utility model;

[0030] Figure 8 It is cross section schematic view of third embodiment of electronic component's heat dissipation structure of the utility model;

[0031] Figure 9 It is structure schematic view of fourth embodiment of electronic component's heat dissipation structure of the utility model;

[0032] Figure 10 It is copper foil layout schematic view of fourth embodiment of electronic component's heat dissipation structure of the utility model.

[0033]

Symbol explanation

[0034] 20: heat dissipation structure

[0035] 21: electronic component

[0036] 211: package shell

[0037] 212: pin

[0038] 213: top heat dissipation fin

[0039] 22: radiator

[0040] 221: space

[0041] 222: injection channel

[0042] 223: first port

[0043] 224: second port

[0044] 225: injection section

[0045] 226: gradually expanding section

[0046] 227: sticking foot

[0047] 228: notch

[0048] 229: fin

[0049] 220: accommodating groove

[0050] 23: circuit board

[0051] 231: first copper foil

[0052] 232: second copper foil

[0053] 233: first portion

[0054] 234: second portion

[0055] 235: heat sink bonding area

[0056] 236: auxiliary heat dissipation area

[0057] 237: group

[0058] 40: solid heat conducting medium

[0059] 50: injection structure DETAILED DESCRIPTION

[0060] The utility model discloses detailed explanation and technical content, now just cooperate with the drawing explanation as follows:

[0061] Please refer to Figures 1 to 3 The utility model provides a kind of heat dissipation structure 20 of electronic component, the heat dissipation structure 20 includes an electronic component 21, a heat sink 22 and a circuit board 23.Electron component 21 can be a surface mount technology (SMT) suitable electronic component.The electronic component 21 has a package shell 211, a plurality of pins 212 exposed to the package shell 211, and a top fin 213 exposed to the package shell 211.The appearance style of the package shell 211 and the plurality of pins 212 can be adjusted according to the use requirement.The heat sink 22 is shaped with a space 221 for accommodating the electronic component 21 and an injection channel 222 communicating with the space 221, the injection channel 222 allows a solid heat conducting medium 40 to be injected into the space 221, and the solid heat conducting medium 40 causes the top fin 213 and the heat sink 22 to have a heat conduction relationship.Furthermore, the top position of the top fin 213 is the side of the electronic component 21 opposite to the circuit board 23 after the electronic component 21 is arranged on the circuit board 23.In addition, the top fin 213 can partially cover the top surface of the electronic component 21, or completely cover the top surface of the electronic component 21.On the other hand, after the solid heat conducting medium 40 is filled into the space 221, the top fin 213 and the heat sink 22 can have a heat conduction relationship by filling the space 221, and further, the solid heat conducting medium 40 can also cause the package shell 211 and the heat sink 22 to have a heat conduction relationship.The solid heat conducting medium 40 is a heat dissipation paste or a heat dissipation glue.The circuit board 23 is provided with a plurality of first copper foils 231 and a second copper foil 232, the plurality of first copper foils 231 provide the plurality of pins 212 of the electronic component 21 with bonding, and the second copper foil 232 provides the heat sink 22 with bonding.

[0062] Please refer to Figures 2 to 6, now the implementation of the heat dissipation structure 20 is described. When the heat dissipation structure 20 is set in an automated operation, the plurality of pins 212 of the electronic component 21 are first bonded to the plurality of first copper foils 231. Then, the heat sink 22 is placed corresponding to the position of the electronic component 21 and is bonded to the second copper foil 232, at this time the electronic component 21 is located in the space 221 of the heat sink 22, as shown in Figure 5 . Then, the injection channel 222 is injected with the solid heat conducting medium 40 in an injection structure 50 in an automated operation, when the solid heat conducting medium 40 is injected into the space 221, it contacts the heat sink 22 and the electronic component 21 to form a heat conduction relationship, as shown in Figure 4 . In this way, the setting of the heat dissipation structure 20 is completed. As known from the foregoing, the heat dissipation structure 20 of the utility model only needs to implement simple positioning, bonding and injection actions in an automated operation, and the foregoing operations can be realized by mechanical automation, which is more conducive to automation than the conventional need for additional manual locking or fitting. Furthermore, in the implementation, the waste heat generated by the operation of the electronic component 21 can be dissipated not only by the heat sink 22, but also the heat at the position of the electronic component 21 can be conducted in the circuit board 23, guided by the second copper foil 232, and dissipated by the heat sink 22. Therefore, the heat dissipation structure 20 of the utility model not only facilitates automation, but also improves the overall heat dissipation effect.

[0063] Please refer to Figure 3 , in an embodiment, the injection channel 222 has a first port 223 exposed to the heat sink 22 and a second port 224 facing the space 221. The second port 224 is larger than the first port 223, and the utility model increases the flowable range of the solid heat conducting medium 40 into the space 221 through the design of the second port 224, avoiding the solid heat conducting medium 40 from excessively gathering in a single position. In an embodiment, the injection channel 222 can have an injection section 225 communicating with the first port 223, and a diverging section 226 communicating with the injection section 225 and the second port 224, the injection channel 222 does not have a change in caliber in the injection section 225. The implementation of the diverging section 226 is conducive to the injection of the solid heat conducting medium 40, avoiding the influence of the design of a single caliber channel on injection.

[0064] Please refer to Figures 4 to 5In one embodiment, the second copper foil 232 is divided into at least one first portion 233 for bonding the heat sink 22, and a second portion 234 connected to the at least one first portion 233, the second portion 234 is in contact with the package shell 211 of the electronic component 21 when the electronic component 21 is placed on the circuit board 23 but does not form a bonding relationship. Further, when the second copper foil 232 is placed in position, in addition to being disposed adjacent to the plurality of first copper foils 231, the second portion 234 of the second copper foil 232 is located at the position where the electronic component 21 is to be placed, the second portion 234 is not intended to secure the electronic component 21, but to provide a place for the package shell 211 of the electronic component 21 to be placed to form a direct contact heat conduction relationship.

[0065] Referring to Figures 2 to 6 , in this embodiment, when the heat dissipation structure 20 is set up by automatic operation, the plurality of pins 212 of the electronic component 21 are first bonded to the plurality of first copper foils 231, at the same time, the second portion 234 of the second copper foil 232 is located below the electronic component 21 and in contact with the package shell 211 of the electronic component 21. Then, the heat sink 22 is placed in position corresponding to the electronic component 21 and bonded to the at least one first portion 233 of the second copper foil 232, at this time, the electronic component 21 is placed in the space 221 of the heat sink 22, as shown in Figure 5 . Finally, the solid thermal conductive medium 40 is injected into the space 221 through the injection channel 222, so that the solid thermal conductive medium 40 is located in the space 221 while contacting the heat sink 22 and the electronic component 21, forming the aforementioned heat conduction relationship, as shown in Figure 4 . In this embodiment, the arrangement of the second copper foil 232 allows the electronic component 21 to dissipate heat in multiple ways. For example, the aforementioned multiple ways can guide the waste heat from the electronic component 21 to the heat sink 22 through the solid thermal conductive medium 40, so that the heat sink 22 exchanges heat with the outside. In addition to the foregoing, the waste heat can also be guided from the electronic component 21 to the second portion 234 of the second copper foil 232, and then from the second portion 234 to the at least one first portion 233, when the waste heat is introduced into the at least one first portion 233, the waste heat can be conducted to the circuit board 23 or the heat sink 22. The above-mentioned multiple ways can be implemented simultaneously, as shown in Figure 6 . In this way, the heat dissipation structure 20 of the present application has better heat dissipation efficiency for the electronic component 21 compared to the prior art.

[0066] Referring to Figures 2 to 6In one embodiment, the heat sink 22 includes two adhesive feet 227, and the second copper foil 232 includes two first portions 233, and the second portion 234 of the second copper foil 232 is located between the two first portions 233. In detail, when the heat sink 22 is arranged, the heat sink 22 is arranged with the two adhesive feet 227 corresponding to the two first portions 233, and the two first portions 233 are located on two opposite sides of the second portion 234, so that the heat dissipation structure 20 is arranged on the electronic element 21. In addition, in another embodiment, the space 221 on the heat sink 22 is formed by a gap 228. The two adhesive feet 227 can be formed on two sides of the gap 228, so that the heat sink 22 can be arranged and positioned with the gap 228 corresponding to the position of the electronic element 21, and the two adhesive feet 227 are arranged on the two first portions 233, so that the heat sink 22 can be more accurately arranged and positioned.

[0067] In addition, in another embodiment, at least one of the two first portions 233 includes a heat sink bonding area 235 and an auxiliary heat dissipation area 236 connected to the heat sink bonding area 235. The auxiliary heat dissipation area 236 does not contact the electronic element 21 and the heat sink 22, and the auxiliary heat dissipation area 236 increases the area of the second copper foil 232 directly exchanging heat with the outside. When the heat sink bonding area 235 receives the waste heat transferred by the second portion 234, the heat sink bonding area 235 can transfer the waste heat to the auxiliary heat dissipation area 236, and the auxiliary heat dissipation area 236 directly exchanges heat with the outside, so as to improve the heat dissipation efficiency of the heat dissipation structure 20. Further, in another embodiment, the two first portions 233 respectively include the heat sink bonding area 235 and the auxiliary heat dissipation area 236 connected to the heat sink bonding area 235, and the heat sink bonding area 235 is located between the two auxiliary heat dissipation areas 236, so that each of the two first portions 233 has the auxiliary heat dissipation effect provided by the auxiliary heat dissipation area 236.

[0068] Please refer to Figures 3 to 6In one embodiment, the plurality of first copper foils 231 are divided into two groups 237 arranged at intervals, each of the two groups 237 facing at least the second portion 234 of the second copper foil 232, and the plurality of pins 212 of the electronic component 21 are bonded to the positions corresponding to the two groups 237. In another embodiment, at least three sides of each of the two groups 237 are provided with the second copper foil 232, and the second portion 234 of the second copper foil 232 is located between the two groups 237. That is, each of the two first portions 233 has two auxiliary heat dissipation areas 236, and the two auxiliary heat dissipation areas 236 are located at two opposite sides of the heat sink bonding area 235 and face at least two of the three sides of one of the two groups 237, and the second portion 234 faces one of the at least three sides, so that the second copper foil 232 approximately surrounds each of the two groups 237, so that the overall heat dissipation effect of the heat dissipation structure 20 is more comprehensive.

[0069] As described above, in another embodiment, the heat sink 22 includes a plurality of fins 229 extending away from the electronic component 21 and arranged at intervals from each other, and the plurality of fins 229 increase the area of the heat sink 22 in contact with the outside environment, thereby improving the heat exchange capacity of the heat sink 22. The injection channel 222 is formed in one of the plurality of fins 229, and the position of the injection channel 222 is mainly corresponding to the position of the electronic component 21.

[0070] As shown in the drawings, Figure 7 In one embodiment, the heat sink 22 is formed with a receiving groove 220, which is a part of the space 221, and the receiving groove 220 is connected to the second port 224. After the receiving groove 220 is positioned on the heat sink 22, the receiving groove 220 faces the electronic component 21. The size of the receiving groove 220 can be determined according to the area of the physical heat conduction medium 40 in contact with the electronic component 21, so as to prevent the physical heat conduction medium 40 from overflowing the space 221.

[0071] According to the foregoing technical concept, the heat dissipation structure 20 of the electronic component is not limited to providing heat dissipation for a single electronic component 21. In one embodiment in which the heat dissipation structure 20 includes a plurality of electronic components 21, the space 221 of the heat sink 22 can be designed to accommodate a plurality of electronic components 21 at the same time, and the physical heat conduction medium 40 injected into the space 221 through the injection channel 222 is in contact with a plurality of electronic components 21 in the space 221, as shown in the drawings. Figure 8 In addition to the foregoing embodiments, the heat sink 22 can be formed with a plurality of spaces 221 and a plurality of injection channels 222, as shown in the drawings. Figure 9The spaces 221 are spaced apart, and the portion of the heat sink 22 between any two adjacent spaces 221 can be implemented by the adhesive feet 227. Therefore, the circuit board 23 corresponding to the position of the adhesive feet 227 can be a part of the second copper foil 232, which in this embodiment can be roughly fishbone-shaped. Please refer to Figure 10 In terms of the aforementioned distinction between the first portion 233 and the second portion 234, the second copper foil 232 can be segmented sequentially into the first portion 233, the second portion 234, the first portion 233, the second portion 234, and the first portion 233. On the other hand, the injection channels 222 are each arranged corresponding to one of the spaces 221, and the electronic components 21 are respectively accommodated in the spaces 221. Further, the number of the electronic components 21 arranged in each of the spaces 221 is greater than or equal to 1, that is, the size of each of the spaces 221 can be adjusted according to the implementation requirements, so that each of the spaces 221 can accommodate at least one of the corresponding number of electronic components 21 based on the implementation requirements. As mentioned above, the electronic components 21 in the aforementioned embodiment are in parallel relationship in terms of circuit layout.

Claims

1. A heat dissipation structure for an electronic component, characterized in that, A heat sink is formed with a space for accommodating the electronic component and an injection passage communicating with the space, the injection passage allowing a solid heat-conductive medium to be injected into the space, the solid heat-conductive medium establishing a heat-conduction relationship between the top heat sink and the heat sink. The heat sink includes a plurality of fins, and the injection passage is formed in one of the fins. The injection passage has a first port exposed to the heat sink and a second port facing the space, the second port being larger than the first port. The injection passage has an injection section communicating with the first port and a diverging section communicating with the injection section and the second port. The heat sink is formed with an accommodating groove, the accommodating groove being part of the space, and the accommodating groove communicates with the second port.

2. The heat dissipating structure for an electronic component according to claim 1, wherein The second copper foil is divided into at least one first portion for providing the heat sink with adhesion and a second portion connecting the at least one first portion, the second portion being in contact with the package of the electronic component but not in adhesion relationship with the package when the electronic component is disposed on the circuit board.

3. The heat dissipating structure for an electronic component according to claim 1 or 2, wherein The heat sink is disposed across the electronic component, the heat sink includes two adhesive feet, the second copper foil includes two first portions, and the second portion of the second copper foil is located between the two first portions.

4. The heat dissipating structure for an electronic component according to claim 3, wherein The space on the heat sink is formed by a gap.

5. The heat dissipating structure for an electronic component according to claim 4, wherein At least one of the first portions includes a heat sink adhesion region and an auxiliary heat dissipation region connected to the heat sink adhesion region.

6. The heat dissipating structure for electronic components according to claim 1, wherein The first copper foils are divided into two groups arranged at intervals, and at least three sides of each of the two groups are provided with the second copper foil, and the second portion of the second copper foil is located between the two groups.

7. The heat dissipating structure for an electronic component according to claim 6, wherein The two first portions respectively include a heat sink adhesion region and two auxiliary heat dissipation regions connected to the heat sink adhesion region.

8. The heat dissipating structure for an electronic component according to claim 7, wherein The space on the heat sink is formed by a gap.

9. The heat dissipating structure for electronic components according to claim 7, wherein The heat dissipation structure includes a plurality of electronic components, and the space of the heat sink provides a plurality of electronic components to be accommodated therein.

10. The heat dissipating structure for electronic components according to claim 6, wherein The heat dissipation structure includes a plurality of electronic components, and the heat sink is formed with a plurality of spaces and a plurality of injection passages, each of the plurality of injection passages is arranged corresponding to one of the plurality of spaces, a plurality of electronic components are respectively accommodated in the plurality of spaces, and each of the plurality of spaces provides the number of accommodated electronic components to be greater than or equal to 1.

11. The heat dissipating structure for electronic components according to claim 6, wherein ​ 12. The heat dissipating structure for electronic components according to claim 1, wherein ​ 13. The heat dissipating structure for electronic components according to claim 1, wherein ​ 14. The heat dissipating structure for electronic components according to claim 1, wherein ​

Images