Display manufacturing equipment

Abstract

A display manufacturing apparatus includes: a stage on which a display device is mounted; a cooling member disposed on the stage and configured to cool the display device; and a pressing jig configured to press the cooled display device in the lamination direction.

Description

[0001] Cross-reference to related applications and priority claims

[0002] This patent document claims priority and benefit to Korean Patent Application No. 10-2024-0097548, filed with the Korean Intellectual Property Office (KIPO) on July 23, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display manufacturing equipment and methods. Background Technology

[0004] Various types of display devices are used in a wide range of applications such as mobile devices, televisions, and monitors.

[0005] Display devices are typically manufactured by laminating display panels and cover glass using adhesives.

[0006] In addition, in the process of connecting the driving circuit to drive the display panel, a process of bending and pressing a part of the display panel connected to the driving circuit is performed to utilize space.

[0007] However, there is a problem: during the pressing process after bending the display panel, defects may occur due to the pressing of the display panel. Utility Model Content

[0008] This disclosure will solve the above and other problems, and provide a display manufacturing apparatus and method capable of preventing the display panel from being pressed.

[0009] According to one aspect of this disclosure, a display manufacturing apparatus is provided, comprising: a table on which a display device is mounted; a cooling member disposed on the table and configured to cool the display device; and a pressing fixture configured to press the cooled display device in a lamination direction.

[0010] In some embodiments, the display device may include a window, a panel, and an adhesive layer disposed between the window and the panel, and a cooling member may cool the adhesive layer.

[0011] In some embodiments, the table may include an upper surface on which a display device is mounted, and a cooling member may be disposed on the upper surface.

[0012] In some embodiments, an insertion slot for accommodating a cooling component may be formed on the upper surface of the stage.

[0013] In some embodiments, the platform may be cooled by a cooling component, and the display device may be cooled by the platform.

[0014] In some embodiments, the platform may include a lower surface opposite to the upper surface on which the display device is mounted, and a cooling member may be disposed on the lower surface.

[0015] In some embodiments, the cooling member can include a thermoelectric element.

[0016] In some embodiments, the display manufacturing apparatus can further include a heat dissipation member disposed adjacent to the cooling member.

[0017] In some embodiments, the adhesive layer can include an optically clear adhesive (OCA).

[0018] In some embodiments, the display device can include a window, a panel, an adhesive layer disposed between the window and the panel, and a substrate member connected to one end of the panel, and the display manufacturing apparatus can further include a bending arm configured to bend at least a portion of the panel.

[0019] In some embodiments, the display device can include an overlapping area in which the panel is bent and overlaps the substrate member in a lamination direction, and the cooling member can be disposed to cool the overlapping area.

[0020] In some embodiments, the display manufacturing apparatus can further include a sensing unit configured to detect a temperature of the display device.

[0021] In some embodiments, the display manufacturing apparatus can further include a controller configured to operate the cooling member based on a detection result of the sensing unit.

[0022] In some embodiments, the controller can operate the cooling member such that a temperature of the adhesive layer is in a range of 5℃ to 20℃.

[0023] In some embodiments, the sensing unit can detect a temperature of the adhesive layer.

[0024] In some embodiments, the sensing unit can detect a temperature of the stage.

[0025] According to an aspect of the disclosure, there is provided a display manufacturing apparatus including: a stage on which a display device is mounted, the display device including a window, a panel, and an adhesive layer disposed between the window and the panel; a bending arm configured to bend at least a portion of the panel; a pressing clamp configured to press a substrate member overlapping the panel by bending the panel; and a cooling member configured to cool the adhesive layer, wherein the pressing clamp presses the substrate member in a state in which the adhesive layer is cooled.

[0026] In some embodiments, the display manufacturing apparatus can further include a controller configured to operate the cooling member such that a temperature of the adhesive layer is in a range of 5℃ to 20℃.

[0027] According to an aspect of the disclosure, there is provided a display manufacturing method including: a mounting step of mounting a display device including a window, a panel, and an adhesive layer disposed between the window and the panel on a stage; a bending step in which a bending arm bends at least a portion of the panel; a cooling step in which a cooling member cools the adhesive layer; and a pressing step of pressing the display device in a state in which the adhesive layer is cooled.

[0028] In some embodiments, the cooling step can be performed so that the temperature of the adhesive layer is in a range of 5℃ to 20℃.

[0029] According to example embodiments of the disclosure, pressing of the panel can be prevented in a pressing process by cooling the adhesive layer.

[0030] In addition, an improved pressing state can be maintained without a separate temperature control after the pressing process. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a perspective view of a display manufacturing apparatus according to an example embodiment.

[0032] Figure 2 is a perspective view of a cooling member disposed on an upper surface of a stage according to an example embodiment.

[0033] Figure 3 is a perspective view of a cooling member disposed on a lower surface of a stage according to an example embodiment.

[0034] Figure 4 is a side view of a cooling member disposed on a lower surface of a stage according to an example embodiment.

[0035] Figure 5 schematically illustrates a panel in a display device according to an example embodiment being bent in a bending step.

[0036] Figure 6 schematically illustrates a display device according to an example embodiment in a bent state.

[0037] Figure 7 schematically illustrates a pressing jig of a display manufacturing apparatus according to an example embodiment.

[0038] Figure 8 is a graph illustrating a storage modulus of an adhesive layer of a display device according to an example embodiment.

[0039] Figure 9 schematically illustrates a heat conduction process for an adhesive layer of a display device on a cooled stage in an example embodiment.

[0040] Figures 10 to 12 illustrates a pressing improvement effect of a display device according to an example embodiment.

[0041] Figure 13 A block diagram of a display manufacturing apparatus according to an example embodiment is illustrated.

[0042] Figure 14 A flowchart of a display manufacturing method according to an example embodiment is illustrated. DETAILED DESCRIPTION

[0043] The embodiments of the disclosure are provided in order to more completely explain the disclosure to those skilled in the art. The following embodiments can be modified in various different forms, and the scope of the disclosure is not limited to the following embodiments.

[0044] Hereinafter, some embodiments of the disclosure will be described with reference to the accompanying drawings, which are illustrated by way of example. When the same or equivalent components are illustrated in each drawing, the same or equivalent components are designated by the same reference numerals as far as possible even if they are illustrated in different drawings.

[0045] The terms or words used in the disclosure and claims should not be limited to the commonly or dictionary meanings, and should be interpreted based on a concept that an inventor can appropriately define the terms to best explain the essence of an application. Therefore, the embodiments of the disclosure should be considered in a descriptive sense only and not for purposes of limitation.

[0046] The terms used in the disclosure are used to describe specific embodiments and are not intended to limit the disclosure. As used in the disclosure, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0047] When expressions such as "comprise", "include", "consist of", and "have" are used to describe the disclosure, these expressions are to be interpreted in a non-exclusive manner, and are to be interpreted to imply that other components can be present in addition to the described components, unless explicitly stated otherwise, and thus further include other components rather than exclude other components.

[0048] In describing the components in the embodiments of the disclosure, terms such as first, second, A, B, (a), (b), etc. can be used. These terms are only intended to distinguish one component from another component, and the nature, order or sequence of each component is not limited by the terms.

[0049] When a component is described as being "connected" or "coupled" to another component, it should be understood that the component can be directly connected or coupled to the other component, but another component can also be "connected" or "coupled" between the component and the other component.

[0050] Spatial terms such as "under", "below", "lower", "above", and "upper" can be used to facilitate the understanding of one component or feature illustrated in the drawings in relation to another component or feature. These spatial terms are intended to facilitate the understanding of the present disclosure, based on various process states or use states of the present disclosure, and are not intended to limit the present disclosure. For example, if a component or feature in the drawings is flipped, a component or feature described as "under" or "below" would become "above" or "upper". Thus, "under" encompasses the concept of "above" or "below".

[0051] The embodiments described in the present disclosure and the configurations illustrated in the drawings are only the most preferred embodiments of the present disclosure, and do not represent all technical ideas of the present disclosure, and thus it should be understood that various equivalents and modifications can be substituted therefor at the time of filing the present disclosure. In addition, detailed descriptions of well-known functions and configurations that can unnecessarily obscure the gist of the present disclosure can be omitted.

[0052] Hereinafter, a display manufacturing apparatus 100 according to an example embodiment is described in detail with reference to the drawings.

[0053] Figure 1 is a perspective view of the display manufacturing apparatus 100 according to an example embodiment. Figure 2 is a perspective view illustrating that a cooling member 120 according to an example embodiment is disposed on an upper surface 111 of a stage 110. Figure 3 is a perspective view illustrating that a cooling member 120 according to an example embodiment is disposed on a lower surface 112 of a stage 110. Figure 4 is a side view illustrating that a cooling member 120 according to an example embodiment is disposed on a lower surface 112 of a stage 110.

[0054] Referring to Figure 1 and Figure 2 , a display manufacturing apparatus 100 according to an example embodiment of the present disclosure can include a stage 110, a bending arm 130, a press clamp 140 (see Figure 7 ), and a cooling member 120.

[0055] The display manufacturing apparatus 100 according to an example embodiment of the present disclosure can be used to cool a display device 200 (see Figure 6 ) before a press step in a bending process of the display device 200.

[0056] First, the display manufacturing apparatus 100 can include a stage 110. The stage 110 can be provided to support the display device 200 in a state in which the display device 200 is mounted on the stage 110.

[0057] The stage 110 can support the cooling member 120 so that the cooling member 120 can easily cool the display device 200.

[0058] Alternatively, the stand 110 can cool the mounted display device 200 by being cooled by the cooling member 120. The stand 110 can be provided to facilitate heat transfer to the display device 200, thereby cooling the mounted display device 200.

[0059] The stand 110 can include a material that facilitates heat transfer to the display device 200. For example, the stand 110 can include a metal material. For example, the stand 110 can include at least one of gold, silver, copper, aluminum, tungsten, iron alloy, and stainless steel.

[0060] In some embodiments, the stand 110 can be provided in the shape of a plate, have a predetermined thickness, and include a flat mounting surface corresponding to the shape of the display device 200 to be mounted.

[0061] However, as Figure 1 and Figure 2 illustrated in the above, the stand 110 can generally be described as having a rectangular hexahedral shape, but this is an example. The shape of the stand 110 is not limited thereto, and it is obvious that the stand 110 can be configured in any shape as long as the cooling member 120 described below can be disposed.

[0062] Referring to Figure 1 , the stand 110 can include a mounting surface on which the display device 200 is mounted. Here, the mounting surface can be described as an upper surface 111.

[0063] In some embodiments, the cooling member 120 can be disposed on the upper surface 111 of the stand 110. The cooling member 120 can be disposed on the upper surface 111 of the stand 110 such that the heat absorption portion is in contact with the display device 200. In this case, the stand 110 can support the cooling member 120 such that the cooling member 120 directly cools the display device 200.

[0064] Referring to Figure 2 , an insertion groove 111a can be formed in a downwardly recessed shape on the upper surface 111 of the stand 110. The cooling member 120 can be inserted into the insertion groove 111a of the stand 110. Here, the insertion groove 111a formed on the upper surface 111 can be described as a first insertion groove.

[0065] For example, the cooling member 120 can be disposed on the upper surface 111 of the stand 110 at a position corresponding to the overlapping area A (see Figure 6 ) of the display device 200. The insertion groove 111a can be formed on the upper surface 111 of the stand 110 at a position corresponding to the overlapping area A of the display device 200, and the cooling member 120 can be disposed to be inserted into the insertion groove 111a. However, the present disclosure is not limited thereto. For example, a plurality of cooling members 120 can be disposed on the upper surface 111 of the stand 110 at a plurality of positions spaced apart from each other.

[0066] The upper surface 111 of the stand 110 can have a shape corresponding to a surface of the display device 200 in a state in which the cooling member 120 is inserted into the insertion groove 111a. For example, a surface of the heat-absorbing portion of the cooling member 120 and the upper surface 111 of the stand 110 can be formed at the same height. Accordingly, even when the pressing jig 140 presses the display device 200, the cooling member 120 can be prevented from pressing the display device 200.

[0067] A heat dissipation hole (not shown) can be formed in the stand 110 to communicate with the heat-generating portion of the cooling member 120. This can prevent the stand 110 itself from being heated by the heat-generating portion.

[0068] Reference Figure 3 In some embodiments, the stand 110 can include a lower surface 112 opposite the upper surface 111 on which the display device 200 is mounted, and the cooling member 120 can be disposed on the lower surface 112 of the stand 110.

[0069] The cooling member 120 can be disposed on the lower surface 112 of the stand 110 so that the stand 110 can be cooled by the cooling member 120. The cooling member 120 can be disposed on the lower surface 112 of the stand 110 so that the heat-absorbing portion is in contact with the lower surface 112 of the stand 110. In this case, the stand 110 can be cooled by the cooling member 120.

[0070] For example, an insertion groove 112a can be formed in a shape concave upward on the lower surface 112 of the stand 110, and the cooling member 120 can be inserted into the insertion groove 112a. Here, the insertion groove 112a formed on the lower surface 112 can be described as a second insertion groove.

[0071] For example, the cooling member 120 can be disposed on the lower surface 112 of the stand 110 at a position corresponding to the overlapping area A of the display device 200. However, the present disclosure is not limited thereto. For example, as Figure 4 For example, as illustrated in FIG. 1B, a plurality of cooling members 120 can be disposed on the lower surface 112 of the stand 110 at a plurality of positions spaced apart from each other to rapidly cool the stand 110.

[0072] The stand 110 can fix and support the display device 200 mounted on the upper surface 111. The stand 110 can further include a fixing device for fixing the display device 200. For example, the stand 110 can fix the display device 200 by sucking and adsorbing air, but is not limited thereto.

[0073] The stand 110 can support the display device 200 mounted on the upper surface 111. In the bending step, the stand 110 can fix and support the display device 200 with respect to the rotation of the bending arm 130. Alternatively, the stand 110 can support the display device 200 in the pressing direction in which the display device 200 is pressed by the pressing jig 140 in the pressing step.

[0074] In addition, the table 110 can be provided adjacent to the bending arm 130, and a relative position of the table 110 with respect to the bending arm 130 can be changed.

[0075] Referring to Figure 1 , the display manufacturing apparatus 100 according to an example embodiment of the disclosure can include a bending arm 130.

[0076] The bending arm 130 can be disposed adjacent to the table 110 to bend one end of the panel 240 (see Figure 5 ) of the display device 200.

[0077] In some embodiments, the bending arm 130 can bend one end of the panel 240 of the display device 200 to form a bent portion.

[0078] Figure 5 The panel 240 of the display device 200 according to an example embodiment is schematically illustrated as being bent in a bending step. Figure 6 The display device 200 according to an example embodiment is schematically illustrated in a bent state.

[0079] Referring to Figure 5 , for example, in the bending step, the bending arm 130 can adsorb a lower surface of one end of the panel 240 to bend one end of the panel 240 while moving toward an upper surface of the panel 240.

[0080] As one end of the panel 240 is bent by the bending arm 130, one end of the panel 240 and the substrate member 260 connected to one end of the panel 240 can overlap with respect to the panel laminate 200' in a lamination direction.

[0081] Here, an area in which one end of the panel 240 and the substrate member 260 overlap with respect to the panel laminate 200' can be described as an overlap area A (for example, Figure 6 in FIG. 20A).

[0082] At the end of the bending step, in a state in which the overlap area A is formed, a pressing force in the lamination direction can be applied to the display device 200 by the bending arm 130.

[0083] Figure 7 The pressing clamp 140 of the display manufacturing apparatus 100 according to an example embodiment is schematically illustrated.

[0084] Referring to Figure 6 and Figure 7 The display device 200 manufactured by the display manufacturing apparatus 100 according to an example embodiment of the disclosure can include a panel laminate 200' and a substrate member 260 electrically connected to the panel 240. The panel laminate 200' can indicate a lamination structure other than the substrate member 260 of the display device 200.

[0085] The panel laminate 200' can include a window 210, a panel 240, and an adhesive layer 220 interposed between the window 210 and the panel 240. In this case, the panel laminate 200' can further include a POL layer 230 between the window 210 and the panel 240, and a cover panel 250 (see Figure 9 ) can be disposed on a rear surface of the panel 240.

[0086] More specifically, the display device 200 can include a window 210 disposed in direct contact with the upper surface 111 of the table 110. The window 210 is the uppermost layer of the display device 200, and can protect the display device 200 from the external environment, and prevent impact, scratches, dust, moisture, etc. For example, the window 210 can use tempered glass or a plastic material. For example, the window 210 can also be configured to include a touch sensor.

[0087] The window 210 can be laminated and attached to the panel 240. The panel 240 can be electrically connected to a substrate member 260 to display an actual image. The panel 240 can include a liquid crystal display (LCD) panel 240, an organic light emitting diode (OLED) panel 240, and other screen display panels 240. The panel 240 can not only include a flat panel 240, but can include a panel 240 having a curved surface or a flexible panel 240 that can be bent.

[0088] The window 210 and the panel 240 can be laminated and attached by the adhesive layer 220. The adhesive layer 220 can include various known adhesives. For example, the adhesive layer 220 can include an optically clear adhesive (OCA). For example, the adhesive layer 220 can use a thermosetting adhesive or a UV-cured adhesive.

[0089] Here, the adhesive layer 220 can include an optically clear adhesive (OCA). The adhesive layer 220 can be used to be attached transparently between the window 210 and the panel 240. The optically clear adhesive is optically transparent, and can maintain the clarity of the display device 200. The optically clear adhesive has high transparency, low moisture absorption, and good adhesive strength, and can minimize the gap between the layers to reduce reflection and improve touch sensitivity. The optically clear adhesive can include a UV-cured type and a thermosetting type.

[0090] For example, a POL layer 230 can be disposed between the window 210 and the panel 240. The POL layer 230 can be used to control the polarization of light and control the directionality of light in the display device 200 to improve visual clarity and contrast. The POL layer 230 can optimize the light transmittance of the display device 200, and reduce unnecessary reflected light to improve visibility.

[0091] A cover panel 250 can be disposed on a rear surface of the panel 240. The cover panel 250 can serve to protect the panel 240 and structurally support the display device 200. The cover panel 250 can protect the panel 240 from external impact from the rear side and increase the strength of the entire display device 200. The cover panel 250 can include various materials, such as plastic, metal, and composite materials.

[0092] The substrate member 260 can be electrically connected to one end of the panel 240. As Figure 5 illustrated in the middle, the one end of the panel 240 connected to the substrate member 260 can be bent by the bending arm 130.

[0093] The one end of the panel 240 can include a straight section 241 and a bent section 243 bent by the bending arm 130. A BPL layer 280 can be formed in the bent section 243 to disperse stress during bending. For example, the BPL layer 280 can include a material having good flexibility and durability, such as polyimide or polyethylene terephthalate (PET), and can prevent cracking or disconnection while maintaining flexibility of the panel 240 during bending.

[0094] The substrate member 260 can be connected to one end of the panel 240. For example, the substrate member 260 can include a driving circuit board and a driving element 261, etc.

[0095] The driving circuit board can be equipped with a driving integrated circuit that generates a data signal and a gate signal for allowing pixels of the panel 240 to emit light, and supplies the data signal and the gate signal to data lines and gate lines. The driving circuit board can apply a chip on glass (COG) or chip on film (COF) method. Alternatively, the driving circuit board can apply a flexible printed circuit board (FPCB), and can include the driving element 261 and a protective cover 290 covering the driving element 261.

[0096] The substrate member 260 can be arranged to overlap the panel 240 by bending one end of the panel 240 with respect to the panel laminate 200' in a lamination direction. Here, the panel 240 is bent and at least a portion of the one end of the panel 240 overlapping the substrate member 260 in the lamination direction with respect to the panel laminate 200' can be described as an overlapping area A (for example, Figure 6 A in FIG. 1B).

[0097] Referring again to Figure 7 in the present disclosure, the overlapping area A can be formed by bending performed by the bending arm 130 in a state in which the display device 200 is mounted on the table 110.

[0098] To fix the shape in the bent state, the display device 200 can be pressed in the lamination direction by the pressing clamp 140. For example, the pressing clamp 140 can press the above-described overlapping area A.

[0099] In some embodiments, a pressing jig 140 can be provided to press the display device 200 in a lamination direction in a state in which the display device 200 is mounted on the table 110.

[0100] For example, the pressing jig 140 can include a first pressing portion 141 to press a region adjacent to the bending section 243 and a second pressing portion 142 to press a region adjacent to the substrate member 260. For example, the first pressing portion 141 and the second pressing portion 142 can be arranged to be spaced apart from each other. For example, the first pressing portion 141 and the second pressing portion 142 can be arranged not to press a region adjacent to the driving element 261.

[0101] According to example embodiments of the disclosure, a pressing jig 140 can be provided to press the display device 200 in a state in which the display device 200 is cooled by the cooling member 120.

[0102] Figure 8 A graph illustrating a storage modulus of the adhesive layer 220 of the display device 200 according to example embodiments is shown by way of example. More specifically, Figure 8 A temperature-dependent storage modulus converted to a logarithmic scale is shown by way of example. The storage modulus indicates the ability of a material to store energy when deformed, and is an elastic value that is a measure of a material's resistance to deformation.

[0103] For example, Figure 8 A hardness of the adhesive layer 220 that resists deformation when the adhesive layer 220 uses an optically clear adhesive (OCA) can be indicated.

[0104] Referring to Figure 8 , the adhesive layer 220 with which the display device 200 uses to laminate and attach the window 210 and the panel 240 can advantageously have a relatively low storage modulus in order to prevent the generation of air bubbles during the attachment process and to improve the adhesive strength.

[0105] Thus, as Figure 8 shown by way of example in FIG. 6, the attachment process is performed at room temperature (approximately 25°C) at a level of a low storage modulus value of approximately 0.23 MPa.

[0106] However, in the bending process, in the bending step and / or the pressing step, the substrate member 260 can be pressed by the bending arm 130 and / or the pressing jig 140 in the overlapped state of the substrate member 260. Thus, when the adhesive layer 220 has a low storage modulus value as described above (e.g., at room temperature), the adhesive layer 220 can be pressed by the substrate member 260. Thus, as Figure 10 shown by way of example in FIG. 7, the waviness of the display device 200 can have a value of approximately 0.122, and a pressing defect (e.g., see (a) of FIG. 8) can occur in the display device 200. Figure 11 Thus, as

[0107] Accordingly, the disclosure suggests a method of cooling the display device 200 before the bending step, in order to prevent press defects that can occur in the bending step and / or the pressing step of the bending process.

[0108] As Figure 8 illustrated in , because the storage modulus of the adhesive layer 220 is inversely proportional to temperature, the disclosure can be configured such that the adhesive layer 220 has sufficient hardness to resist press deformation by cooling the display device 200 and lowering the temperature of the adhesive layer 220.

[0109] According to example embodiments of the disclosure, the cooling of the display device 200 can be completed before the bending step or the pressing step in which actual pressing is performed on the adhesive layer 220. For example, the display device 200 can be cooled by the cooling member 120 before the bending step. For example, the adhesive layer 220 of the display device 200 can be cooled by the cooling member 120 before the bending step.

[0110] When the display device 200 is cooled by the cooling member 120, the storage modulus of the adhesive layer 220 can be improved. For example, as Figure 8 illustrated in , when the adhesive layer 220 is cooled to 10℃, the storage modulus increases to approximately 1.11 MPa.

[0111] That is, the disclosure can ensure sufficient hardness that can prevent pressing of the press jig 140 by cooling the adhesive layer 220 before the bending step and increasing the storage modulus value.

[0112] Referring again to Figure 1 , the display manufacturing apparatus 100 according to example embodiments of the disclosure can include a cooling member 120.

[0113] The cooling member 120 can cool the display device 200 mounted on the stage 110. The cooling member 120 can cool the adhesive layer 220 of the display device 200. The cooling member 120 can cool the overlapping area A of the display device 200, and more particularly, can cool the adhesive layer 220 located in the overlapping area A of the display device 200.

[0114] The cooling member 120 can directly cool the display device 200. Alternatively, the cooling member 120 can cool the stage 110, and cool the display device 200 through the cooled stage 100.

[0115] In some embodiments, the cooling member 120 can include a thermoelectric element. The cooling member 120 can be a thermoelectric element including a heat absorbing portion and a heat generating portion. The cooling member 120 can include at least one thermoelectric element.

[0116] A thermoelectric element uses the Peltier effect to transfer heat by passing an electric current through different types of metallic or semiconducting elements.

[0117] For example, the cooling member 120 can be configured such that an electric current flows by connecting both ends of an N-type semiconductor and a P-type semiconductor with a metal electrode. When power is supplied to the cooling member 120, an electric current flows through the N-type semiconductor and the P-type semiconductor. When the electric current flows from the N-type semiconductor to the P-type semiconductor, heat is absorbed (cooled) at the junction. In contrast, when the electric current flows from the P-type semiconductor to the N-type semiconductor, heat is released (heated).

[0118] Here, a side of the cooling member 120 that absorbs heat can be described as a heat absorbing portion or a cooling portion, and a side of the cooling member 120 that releases heat can be described as a heat generating portion or a heat releasing portion.

[0119] The cooling member 120 can be disposed on one side of the table 110.

[0120] For example, the cooling member 120 can be disposed on the upper surface 111 of the table 110 (for example, see Figure 2 ). For example, the cooling member 120 can be disposed on the upper surface 111 of the table 110 at a position corresponding to the overlapping area A of the display device 200. The cooling member 120 can be inserted into an insertion groove 111a formed on the upper surface 111 of the table 110.

[0121] The cooling member 120 can be disposed on the upper surface 111 of the table 110 such that the heat absorbing portion is in direct contact with the display device 200. In this case, the cooling member 120 can directly cool the display device 200.

[0122] When power is supplied to the cooling member 120 in a state in which the heat absorbing portion is in contact with the display device 200, the display device 200 can be cooled by the heat absorbing portion absorbing heat of the display device 200.

[0123] In this case, the table 110 can include a heat dissipation hole (not shown) adjacent to the heat generating portion of the cooling member 120. For example, a heat dissipation member for dissipating absorbed heat can be connected to the heat generating portion of the cooling member 120.

[0124] For example, the cooling member 120 can also be disposed on the lower surface 112 of the table 110 (for example, see Figure 3 ). For example, a plurality of cooling members 120 can be disposed on the lower surface 112 of the table 110 at a plurality of positions spaced apart from each other (for example, see Figure 4 ). For example, the cooling member 120 can be disposed on the lower surface 112 of the table 110 at a position of the lower surface 112 corresponding to the overlapping area A (for example, Figure 6 ) of the display device 200.

[0125] The cooling member 120 can be disposed on the lower surface 112 of the stand 110 such that the heat absorbing portion directly contacts the lower surface 112 of the stand 110. For example, the heat generating portion of the cooling member 120 can be disposed to protrude from the lower surface 112 of the stand 110 such that the heat generating portion does not contact the lower surface 112 of the stand 110. In this case, the cooling member 120 can directly cool the stand 110.

[0126] When power is supplied to the cooling member 120 in a state in which the heat absorbing portion contacts the stand 110, the stand 110 can be cooled by the heat absorbing portion absorbing heat of the stand 110. Because the display device 200 is mounted on the upper surface 111 of the stand 110, the display device 200 can be cooled by the stand 100.

[0127] In this case, a heat dissipation member for dissipating heat absorbed from the heat absorbing portion of the cooling member 120 can be connected to the stand 110.

[0128] The display manufacturing apparatus 100 according to an example embodiment of the disclosure can include a heat dissipation member (not shown) for dissipating heat released through the heat generating portion of the cooling member 120.

[0129] The heat dissipation member can be disposed adjacent to the heat generating portion of the cooling member 120. The heat dissipation member can be disposed to directly contact the heat generating portion of the cooling member 120.

[0130] For example, the heat dissipation member can include a heat dissipation fan and can be configured to dissipate heat released from the heat generating portion to the outside of the stand 110. For example, the heat dissipation member can be configured to dissipate heat released from the heat generating portion to the outside of the stand 110 by circulation of a cooling fluid.

[0131] However, the disclosure is not limited thereto, and it is obvious that the heat dissipation member according to the disclosure can use any known heat dissipation device configured to dissipate heat released from the heat generating portion of the cooling member 120 to the outside of the stand 110.

[0132] The display device 200 can be cooled by being mounted on the stand 110 on which the cooling member 120 is disposed.

[0133] Figure 9 A heat conduction process of the adhesive layer 220 of the display device 200 on the cooled stand 110 in an example embodiment is schematically illustrated.

[0134] For example, when the cooling member 120 is disposed on the upper surface 111 of the stand 110, the display device 200 can contact the heat absorbing portion of the cooling member 120, heat transfer can occur between the adhesive layer 220 and the heat absorbing portion through the window 210, and the adhesive layer 220 can be cooled.

[0135] Alternatively, for example, when the cooling member 120 is disposed on the lower surface 112 of the table 110, the table 110 can be cooled by the cooling member 120. In this case, the display apparatus 200 can be cooled through the table 110. Heat transfer can occur between the adhesive layer 220 and the table 110 through the window 210, and the adhesive layer 220 can be cooled.

[0136] Figure 13 A block diagram of a display manufacturing apparatus 100 according to an example embodiment is illustrated.

[0137] Referring to Figure 13 The display manufacturing apparatus 100 according to an example embodiment can further include a sensing unit 160 and a controller 150.

[0138] The sensing unit 160 can be provided to detect a temperature of the display apparatus 200.

[0139] For example, the sensing unit 160 can include a first sensing unit 161 to detect a temperature of the adhesive layer 220 and / or a second sensing unit 162 to detect a temperature of the table 110.

[0140] The controller 150 can be configured to detect a temperature of the display apparatus 200 through the sensing unit 160, and to operate the cooling member 120 so that the adhesive layer 220 falls within a preset temperature range to cool the display apparatus 200. Here, the preset temperature range can be a temperature range in which the adhesive layer 220 has a sufficient hardness so that the adhesive layer 220 is not pressed.

[0141] For example, the controller 150 can detect a temperature of the display apparatus 200 through the sensing unit 160, and control a current, a voltage applied to the cooling member 120, and / or an operation time of the cooling member 120.

[0142] For example, the controller 150 can operate the cooling member 120 based on a detection result of the sensing unit 160 so that a temperature of the adhesive layer 220 is within a range of 5℃ to 20℃. Preferably, the controller 150 can operate the cooling member 120 so that the temperature of the adhesive layer 220 is within a range of 13℃ to 17℃. If the temperature of the adhesive layer 220 falls below 5℃, a defect can occur due to condensation of water vapor during a process step. In contrast, if the temperature of the adhesive layer 220 exceeds 20℃, an energy storage modulus value is not high, and thus an effect of preventing pressing is reduced.

[0143] For example, the controller 150 can control an operation of the cooling member 120 based on a temperature of the adhesive layer 220 detected by the first sensing unit 161. Alternatively, the controller 150 can control an operation of the cooling member 120 based on a temperature of the table 110 detected by the second sensing unit 162.

[0144] Figures 10 to 12 The pressing improvement effect of the display device 200 according to the example embodiment is exemplified.

[0145] In the present disclosure, when the controller 150 operates the cooling member 120 to cool the adhesive layer 220 to 10℃, the storage modulus of the adhesive layer 220 is 1.11 MPa, and is increased by about 4.8 times compared to the storage modulus of 0.23 MPa when the temperature of the adhesive layer 220 is 25℃ (see Figure 8 ).

[0146] In Figure 10 , the pressing improvement effect of the display device 200 according to the example embodiment is confirmed by the waviness representing the height change of the surface of the display device 200 visible to the naked eye.

[0147] Figure 10 The average value of the waviness (error bar represents standard deviation) when the pressing step is performed at room temperature according to the example embodiment is exemplified, and the average value of the waviness when the pressing step is performed on the adhesive layer 220 in a cooled state is exemplified.

[0148] Referring to Figure 10 , in the example embodiment of the present disclosure, when the pressing step is performed in a state where the cooling member 120 is operated to cool the adhesive layer 220 to 10℃, the average value of the waviness of the display device 200 is 0.111, which is improved by about 10% compared to the average value '0.122' of the waviness of the display device 200 when the pressing step is performed at room temperature (for example, 25℃) without cooling the display device 200.

[0149] As exemplified in (b) of Figure 11 , in the example embodiment of the present disclosure, when the pressing step is performed in a state where the cooling member 120 is operated to cool the adhesive layer 220 to 10℃, it can be visually confirmed that no pressing of the adhesive layer 220 occurs.

[0150] In Figure 12 , the degree of pressing of the adhesive layer (for example, OCA) 220 is confirmed by multiple visual inspections by an inspector.

[0151] In Figure 12 , the degree of pressing when the pressing step of the display device 200 is performed is quantified based on the following criteria, and the average value (error bar represents standard deviation) is shown.

[0152] Referring to Figure 12When the pressing step is performed at room temperature (e.g., 25℃) without cooling the display device 200, the pressing level of the adhesive layer 220 is recorded as an average of 1.2. On the other hand, when the pressing step is performed in a state where the adhesive layer 220 of the display device 200 is cooled to 10℃ using the cooling member 120 according to an example embodiment of the present disclosure, the pressing level of the adhesive layer 220 is recorded as an average of 0.5, and is improved by about 60%. Figure 12 The pressing level in the above table is classified as follows: if Lv=0, the pressing is not visible to the naked eye; if Lv=1, the visibility of the pressing is poor even if the inspector knows the location of the pressing; if Lv=2, the pressing is weakly visible if the inspector knows the location of the pressing; if Lv=3, the pressing is visible to any inspector if the inspector knows the location of the pressing; if Lv=4, most of the inspectors who see the pressing recognize that the pressing needs to be improved; if Lv=5, the pressing is clearly visible to the public).

[0153] Figure 14 A flowchart of a display manufacturing method according to an example embodiment is illustrated.

[0154] The following description refers to Figures 1 to 14 A display manufacturing method according to an example embodiment is described.

[0155] First, the display manufacturing method according to an example embodiment can include a mounting step S910 of mounting the above-described display device 200 on the mounting surface of the table 110.

[0156] The display manufacturing method according to an example embodiment can include a cooling step S920 in which the cooling member 120 cools the adhesive layer 220. In some embodiments, the cooling step S920 can be performed before or at least simultaneously with the bending step S930. For example, the cooling step S920 can start after the mounting step S910 and can be completed before the bending step S930.

[0157] However, the present disclosure is not limited thereto. In some embodiments, the cooling step S920 can start after the mounting step S910 and can be completed before the pressing step S940. For example, this is because the pressing force on the display device 200 can be smaller in the bending step S930 than in the pressing step S940. In addition, in this case, since the hardness of the panel 240 increases before the bending step S930, damage that the bending arm 130 can cause to the panel 240 during bending can be prevented.

[0158] The display manufacturing method according to an example embodiment can include a bending step S930 in which a portion of the panel 240 is bent by the bending arm 130 in a state in which the display device 200 is mounted on the table 110. For example, since the pressing of the display device 200 can occur during the bending of the panel 240 in the bending step S930, the cooling step S920 can be completed before the pressing of the display device 200 occurs in the bending step S930.

[0159] The controller 150 can detect the temperature of the display device 200 through the sensing unit 160 to check whether the adhesive layer 220 has been cooled to have a preset temperature range.

[0160] In other words, the display manufacturing method according to an example embodiment can include a pressing step S940 of pressing the display device 200 in a state in which the adhesive layer 220 is cooled.

[0161] Through the above-described display manufacturing method, the pressing of the display device 200 can be prevented in the bending step S930 and / or the pressing step S940 of the bending process.

[0162] According to the display manufacturing apparatus 100 and the display manufacturing method according to the example embodiments of the disclosure described above, the panel 240 is prevented from being pressed during the pressing process by cooling the adhesive layer 220, having an effect of reducing display defects.

[0163] According to the display manufacturing apparatus 100 and the display manufacturing method according to the example embodiments of the disclosure, there is an effect of maintaining an improved pressing state after the pressing process without performing separate temperature control.

[0164] So far, even though all components constituting the embodiments of the disclosure are described as being integrated into one or combined to operate, the disclosure is not necessarily limited to the embodiments. That is, within the scope of the purpose of the disclosure, one or more of all components can be selectively combined to operate. Unless otherwise defined, all terms, including technical terms or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the disclosure belongs. The terms used are generally used according to the meaning commonly used in the art, unless otherwise defined in the disclosure, and are not to be interpreted in an ideal or overly formal sense.

[0165] The above description is merely an example for the technical idea of the present disclosure, and a person having ordinary knowledge in the field to which the present disclosure pertains can make various modifications and changes without departing from the essential characteristics of the present disclosure. Accordingly, the embodiments disclosed in the present disclosure are not intended to limit the technical idea of the present disclosure, but to explain it, and the scope of the technical idea of the present disclosure is not limited by these embodiments. The scope of protection of the present disclosure should be interpreted by the following claims, and all technical ideas within the equivalent scope thereof should be interpreted as being included in the scope of rights of the present disclosure.

[0166] [REFERENCE NUMERALS]

[0167] 100: display manufacturing apparatus

[0168] 110: table

[0169] 111: upper surface

[0170] 111a: insertion groove

[0171] 112: lower surface

[0172] 112a: insertion groove

[0173] 160: sensing unit

[0174] 161: first sensing unit

[0175] 162: second sensing unit

[0176] 120: cooling member

[0177] 130: bending arm

[0178] 140: pressing jig

[0179] 141: first pressing portion

[0180] 142: second pressing portion

[0181] 150: controller

[0182] 240: panel

[0183] 241: straight section

[0184] 243: bending section

[0185] 200: display device

[0186] 200': panel laminate

[0187] A: overlapping area

[0188] 210: window

[0189] 220: adhesive layer

[0190] 230: POL

[0191] 250: Cover panel

[0192] 260: Substrate member

[0193] 261: Drive element

[0194] 270: Protective film

[0195] 280: BPL layer

Claims

1. A display manufacturing apparatus, characterized by comprising: Comprising: a table on which a display device is mounted; a cooling member provided on the table and configured to cool the display device; and a pressing jig configured to press the cooled display device in a lamination direction.

2. The display manufacturing apparatus of claim 1, wherein The display device includes a window, a panel, and an adhesive layer provided between the window and the panel, and wherein the cooling member cools the adhesive layer.

3. The display manufacturing apparatus of claim 1, wherein The table includes an upper surface on which the display device is mounted, the cooling member is provided on the upper surface, and wherein an insertion groove accommodating the cooling member is formed on the upper surface of the table.

4. The display manufacturing apparatus of claim 1, wherein The table is cooled by the cooling member, the display device is cooled through the table, and wherein the table includes an upper surface on which the display device is mounted and a lower surface opposite to the upper surface, the cooling member is provided on the lower surface.

5. The display manufacturing apparatus of claim 1, wherein The cooling member includes a thermoelectric element, and the display manufacturing apparatus further includes a heat dissipation member provided adjacent to the cooling member.

6. The display manufacturing apparatus of claim 2, wherein The adhesive layer includes an optically transparent adhesive, and the display device further includes a substrate member connected to one end of the panel, and wherein the display manufacturing apparatus further includes a bending arm configured to bend at least a portion of the panel.

7. The display manufacturing apparatus of claim 6, wherein The display device includes an overlapping region in which the panel is bent and overlaps with the substrate member in the lamination direction, wherein the cooling member is provided to cool the overlapping region, and The display manufacturing apparatus further includes a sensing unit configured to detect a temperature of the display device.

8. The display manufacturing apparatus of claim 7, wherein, The display manufacturing apparatus further includes: a controller configured to operate the cooling member based on a detection result of the sensing unit.

9. The display manufacturing apparatus of claim 8, wherein, The controller operates the cooling member so that a temperature of the adhesive layer is in a range of 5℃ to 20℃.

10. The display manufacturing apparatus of claim 7, wherein, The sensing unit detects a temperature of the adhesive layer.

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