High-efficiency heat dissipation chip packaging structure

Abstract

The utility model discloses an efficient heat dissipation chip packaging structure, which comprises a shell, a chip body is arranged in the shell and is fixedly connected with the shell, a sealing cover is arranged at the upper part of the shell and is embedded with the shell, and a heat dissipation chip is arranged in the shell. A fixing plate is arranged on the surface of the sealing cover, and a mounting base is arranged on the upper portion of the fixing plate. According to the utility model, the sealing cover is connected with the shell, so that the heat conducting plate is in contact with the chip body, heat generated by the operation of the chip body is transmitted to the semiconductor chilling plate through the heat conducting plate, and the semiconductor chilling plate transmits the heat from the cold end to the hot end after being electrified by utilizing the Peltier effect, so that refrigeration is realized; heat of the cold end is transmitted to the heat conducting plate, heat in the heat conducting plate is transmitted to the semiconductor chilling plate and transmitted to the cooling fins through the hot end, after the cooling fan is started, generated airflow blows through the cooling fins, the heat is taken away and dissipated into air, and the cooling efficiency is greatly improved through the arrangement.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip heat dissipation technical field, more specifically for a kind of high-efficiency heat dissipation chip packaging structure. BACKGROUND

[0002] Storage chip is the concept of embedded system chip in the specific application of storage industry, by embedding software in single chip, realize multifunction and high performance, storage chip can quickly realize the integration of various storage functions on a single chip, ensure the high performance of optimized system, this advantage will make storage chip gradually be regarded as the ideal technical platform of online storage, near-line storage.

[0003] The existing storage chip packaging structure is relatively simple, and high load carrying is easy to generate high heat, and the traditional heat dissipation mode cannot quickly dissipate. Therefore, a new technical scheme is needed to solve. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a high-efficiency heat dissipation chip packaging structure to solve the problems in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of high-efficiency heat dissipation chip packaging structure, comprising: shell, the inside of the shell is provided with chip body and chip body is fixedly connected between shell, the upper portion of the shell is provided with sealing cover and sealing cover is mutually embedded between shell, the surface of the sealing cover is provided with fixed plate and the upper portion of fixed plate is provided with mounting seat, the upper portion of the mounting seat is provided with several groups of heat dissipation fins that are equidistantly distributed, the upper portion of the heat dissipation fin is provided with fixed seat and fixed seat is fixedly connected between heat dissipation fin, the inside of the fixed seat is provided with mounting groove and the inside of mounting groove is provided with support frame, the surface of the support frame is provided with heat dissipation fan, the inside of the mounting seat is provided with semiconductor refrigeration piece and the lower portion of semiconductor refrigeration piece is provided with heat conduction plate, the mutual contact of sealing cover and shell is connected with the upper portion of chip body, the side surface of the shell is provided with terminal seat and terminal seat is electrically connected between chip body.

[0006] As a preferred embodiment of the utility model, the two sides of the mounting seat are provided with connecting plate and connecting plate is fixedly connected between mounting seat, the inside of the connecting plate is provided with fixed bolt and mounting seat is connected between connecting plate and fixed plate by fixed bolt.

[0007] As a preferred embodiment of the utility model, the side surface of the mounting seat is provided with connecting line and connecting line is connected between semiconductor refrigeration piece.

[0008] As a preferred embodiment of the utility model, the inside corner of the shell is provided with a fixed block, and the corresponding position of the fixed block and the sealing cover is provided with a mounting hole.

[0009] As a preferred embodiment of the utility model, the bottom of the shell is provided with a plurality of groups of convex blocks arranged in trapezoidal structures, and the convex blocks are provided with flow guide grooves arranged in triangular structures.

[0010] As a preferred embodiment of the utility model, the inside of the shell is provided with a heat dissipation hole, and the heat dissipation hole is located inside the convex block.

[0011] Compared with the prior art, the utility model has the beneficial effects as follows:

[0012] The utility model discloses a chip body is set up in the inside of shell and is fixedly connected between chip body and shell, is set up sealing cover on the upper portion of shell and is mutually embedded between sealing cover and shell, is set up fixed plate on the surface of sealing cover and is set up mounting seat on the upper portion of fixed plate, is set up a plurality of groups of heat dissipation fins that are equidistant distribution on the upper portion of mounting seat, is set up fixed seat on the upper portion of heat dissipation fin and is fixedly connected between fixed seat and heat dissipation fin, is set up mounting groove in the inside of fixed seat and is set up support frame in the inside of mounting groove, is set up heat dissipation fan on the surface of support frame, is set up semiconductor refrigerating sheet in the inside of mounting seat and is set up heat conduction plate on the lower portion of semiconductor refrigerating sheet, when the mutual contact of sealing cover and shell is connected with the upper portion of chip body, is set up wiring seat on the side of shell and is electrically connected between wiring seat and chip body, connect between sealing cover and shell, make heat conduction plate and chip body mutually contact, the heat generated by chip body operation is transferred to semiconductor refrigerating sheet through heat conduction plate, semiconductor refrigerating sheet utilizes Peltier effect, after energization, heat is transferred from the cold end to the hot end, thereby realizing refrigeration, the heat of cold end is transferred to heat conduction plate, the heat in heat conduction plate is transferred to semiconductor refrigerating sheet and is transferred to heat dissipation fin by hot end, after the start of heat dissipation fan, air flow blows through heat dissipation fin, and the heat is taken away and dissipated to the air, and the heat dissipation efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is overall structure schematic diagram of the utility model;

[0014] Figure 2 It is mode structure schematic diagram of the utility model;

[0015] Figure 3 It is sealing cover side view structure schematic diagram of the utility model;

[0016] Figure 4 It is section structure schematic diagram of the utility model.

[0017] In the figure: 1, the shell; 2, fixed block; 3, heat dissipation hole; 4, sealing cover; 5, mounting hole; 6, fixed plate; 7, mounting seat; 8, heat dissipation fin; 9, connecting plate; 10, fixed seat; 11, mounting groove; 12, support frame; 13, heat dissipation fan; 14, connecting line; 15, fixing bolt; 16, heat conduction plate; 17, semiconductor refrigeration piece; 18, chip body; 19, bump; 20, flow guide groove. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] Please refer to Figures 1-4 The present application provides a technical solution: an efficient heat dissipation chip packaging structure,

[0020] In view of the above problems to be solved: the existing storage chip packaging structure is relatively simple, and high load carrying is prone to generate high heat, and the traditional heat dissipation mode cannot quickly dissipate heat.

[0021] The solution is as follows: an efficient heat dissipation chip packaging structure, comprising: a shell 1, the inside of the shell 1 is provided with a chip body 18 and the chip body 18 is fixedly connected with the shell 1, the upper part of the shell 1 is provided with a sealing cover 4 and the sealing cover 4 is mutually embedded with the shell 1, the surface of the sealing cover 4 is provided with a fixed plate 6 and the upper part of the fixed plate 6 is provided with a mounting seat 7, the upper part of the mounting seat 7 is provided with a plurality of groups of heat dissipation fins 8 which are distributed at equal intervals, the upper part of the heat dissipation fin 8 is provided with a fixing seat 10 and the fixing seat 10 is fixedly connected with the heat dissipation fin 8, the inside of the fixing seat 10 is provided with a mounting groove 11 and the inside of the mounting groove 11 is provided with a support frame 12, the surface of the support frame 12 is provided with a heat dissipation fan 13, the inside of the mounting seat 7 is provided with a semiconductor refrigeration piece 17 and the lower part of the semiconductor refrigeration piece 17 is provided with a heat conduction plate 16, the sealing cover 4 is in contact with the upper part of the chip body 18 when the sealing cover 4 is connected with the shell 1, the side surface of the shell 1 is provided with a wiring seat and the wiring seat is electrically connected with the chip body 18, the inside of the shell 1 is provided with the chip body 18 and the chip body 18 is fixedly connected with the shell 1, the upper part of the shell 1 is provided with the sealing cover 4 and the sealing cover 4 is mutually embedded with the shell 1, the surface of the sealing cover 4 is provided with the fixed plate 6 and the upper part of the fixed plate 6 is provided with the mounting seat 7, the upper part of the mounting seat 7 is provided with a plurality of groups of heat dissipation fins 8 which are distributed at equal intervals, the upper part of the heat dissipation fin 8 is provided with the fixing seat 10 and the fixing seat 10 is fixedly connected with the heat dissipation fin 8, the inside of the fixing seat 10 is provided with the mounting groove 11 and the inside of the mounting groove 11 is provided with the support frame 12, the surface of the support frame 12 is provided with the heat dissipation fan 13, the inside of the mounting seat 7 is provided with the semiconductor refrigeration piece 17 and the lower part of the semiconductor refrigeration piece 17 is provided with the heat conduction plate 16, the sealing cover 4 is in contact with the upper part of the chip body 18 when the sealing cover 4 is connected with the shell 1, the side surface of the shell 1 is provided with the wiring seat and the wiring seat is electrically connected with the chip body 18, the sealing cover 4 is connected with the shell 1, the heat conduction plate 16 is in contact with the chip body 18, the heat generated by the operation of the chip body 18 is transmitted to the semiconductor refrigeration piece 17 through the heat conduction plate 16, the semiconductor refrigeration piece 17 utilizes the Peltier effect, after being electrified, the heat is transmitted from the cold end to the hot end, so as to realize refrigeration, the heat of the cold end is transmitted to the heat conduction plate 16, the heat in the heat conduction plate 16 is transmitted to the semiconductor refrigeration piece 17 and is transmitted to the heat dissipation fin 8 from the hot end, after the heat dissipation fan 13 is started, air flow blows through the heat dissipation fin 8, the heat is taken away and dissipated into the air, this setting greatly improves the heat dissipation efficiency.

[0022] Further improved, such as Figure 1As shown: the two sides of the mounting seat 7 are provided with connecting plates 9, and the connecting plates 9 are fixedly connected with the mounting seat 7, the inside of the connecting plate 9 is provided with a fixing bolt 15, and the mounting seat 7 is connected between the connecting plate 9 and the fixed plate 6 through the fixing bolt 15, which enhances the stability of the mounting seat 7. The mounting seat 7, the connecting plate 9 and the fixed plate 6 are tightly connected together through the fixing bolt 15, which prevents loosening caused by vibration or external force during use.

[0023] Further improved, such as Figure 2 As shown: the side of the mounting seat 7 is provided with a connecting line 14, and the connecting line 14 is connected between the semiconductor refrigeration sheet 17, the power supply and signal transmission of the semiconductor refrigeration sheet 17 are more convenient, and the special connecting line 14 is directly connected to the mounting seat 7, avoiding the complex wiring process.

[0024] Further improved, such as Figure 1 As shown: the inside corner of the shell 1 is provided with a fixed block 2, and the fixed block 2 and the sealing cover 4 are provided with mounting holes 5 at the corresponding positions, by arranging the fixed block 2 and the mounting hole 5 at the corresponding positions of the shell 1 and the sealing cover 4, the sealing cover 4 can be more accurately positioned and fixed, ensuring the close fitting between the sealing cover 4 and the shell 1, preventing the entry of external dust due to poor sealing.

[0025] Further improved, such as Figure 4 As shown: the bottom of the shell 1 is provided with a plurality of groups of convex blocks 19 arranged in trapezoidal structure, and the convex blocks 19 are provided with flow guide grooves 20 arranged in triangular structure, which helps to quickly guide the heat generated by the chip body 18 to the bottom.

[0026] Further improved, such as Figure 4 As shown: the inside of the shell 1 is provided with a heat dissipation hole 3, and the heat dissipation hole 3 is located inside the convex block 19, the heat in the flow guide groove 20 can be quickly dissipated through the heat dissipation hole 3.

[0027] Working principle: the utility model discloses the inside setting of shell 1 has the chip body 18 and the fixed connection between chip body 18 and shell 1, the upper portion of shell 1 is provided with sealing cover 4 and sealing cover 4 and shell 1 between each other and embeds, the surface of sealing cover 4 is provided with fixed plate 6 and the upper portion of fixed plate 6 is provided with mounting seat 7, the upper portion of mounting seat 7 is provided with several groups of equal interval distribution's radiating fin 8, the upper portion of radiating fin 8 is provided with fixed seat 10 and fixed seat 10 and radiating fin 8 between fixed connection, the inside of fixed seat 10 is provided with mounting groove 11 and the inside of mounting groove 11 is provided with support frame 12, the surface of support frame 12 is provided with radiating fan 13, the inside of mounting seat 7 is provided with semiconductor refrigeration piece 17 and the lower portion of semiconductor refrigeration piece 17 is provided with heat conduction plate 16, when sealing cover 4 and shell 1 connect and mutually contact the upper portion of chip body 18, the side of shell 1 is provided with wiring seat and wiring seat and chip body 18 between electric connection, connect between sealing cover 4 and shell 1, make heat conduction plate 16 and chip body 18 mutually contact, the heat generated by chip body 18 operation is transferred to semiconductor refrigeration piece 17 through heat conduction plate 16, semiconductor refrigeration piece 17 utilizes peltier effect, after energization, heat is transferred from cold end to hot end, thereby realizes refrigeration, the heat of cold end is transferred to heat conduction plate 16, the heat in heat conduction plate 16 is transferred to semiconductor refrigeration piece 17 and by hot end is transferred to radiating fin 8, after radiating fan 13 starts, the air flow generated blows through radiating fin 8, carries away heat and emits to air, this setting greatly improves the radiating efficiency.

[0028] The above shows and describes the basic principles and main features of the present application and the advantages of the present application, for those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0029] Finally, it should be noted that: first, in the description of the present application, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change.

[0030] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent ones. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high-efficiency heat-dissipating chip package structure, characterized in that: Include: The shell (1), the inside of the shell (1) is provided with chip body (18) and chip body (18) and shell (1) fixedly connected, the upper part of the shell (1) is provided with sealing cover (4) and sealing cover (4) and shell (1) are embedded with each other, the surface of the sealing cover (4) is provided with fixed plate (6) and the upper part of the fixed plate (6) is provided with mounting seat (7), the upper part of the mounting seat (7) is provided with several groups of equidistantly distributed heat dissipation fins (8), the upper part of the heat dissipation fin (8) is provided with fixed seat (10) and fixed seat (10) and heat dissipation fin (8) fixedly connected, the inside of the fixed seat (10) is provided with mounting groove (11) and the inside of the mounting groove (11) is provided with support frame (12), the surface of the support frame (12) is provided with heat dissipation fan (13), the inside of the mounting seat (7) is provided with semiconductor refrigeration sheet (17) and the lower part of the semiconductor refrigeration sheet (17) is provided with heat conduction plate (16), the sealing cover (4) is connected with the shell (1) and is in contact with the upper part of the chip body (18), the side of the shell (1) is provided with wiring seat and the wiring seat is electrically connected with the chip body (18).

2. The high-efficiency heat dissipating chip package structure according to claim 1, wherein: The both sides of the mounting seat (7) are provided with connecting plate (9) and the connecting plate (9) is fixedly connected with the mounting seat (7), the inside of the connecting plate (9) is provided with fixed bolt (15) and the mounting seat (7) is connected with the fixed plate (6) through the fixed bolt (15) penetrating the connecting plate (9).

3. The high-efficiency heat dissipating chip package structure of claim 1, wherein: The side of the mounting seat (7) is provided with connecting line (14) and the connecting line (14) is connected with the semiconductor refrigeration sheet (17).

4. The high-efficiency heat dissipating chip package structure of claim 1, wherein: The inside corner of the shell (1) is provided with fixed block (2) and the corresponding position of the fixed block (2) and the sealing cover (4) is provided with mounting hole (5).

5. The high-efficiency heat dissipating chip package structure of claim 1, wherein: The bottom of the shell (1) is provided with several groups of protrusions (19) arranged in trapezoidal structure, the protrusions (19) are provided with flow guide grooves (20) arranged in triangular structure.

6. The high-efficiency heat dissipating chip package structure of claim 1, wherein: The inside of the shell (1) is provided with heat dissipation hole (3) and the heat dissipation hole (3) is located in the inside of the protrusion (19).

Images