Optical beauty equipment

Abstract

The utility model relates to the technical field of beauty medical instruments, and particularly discloses optical beauty equipment which comprises a light source assembly capable of emitting light to act on skin for beauty treatment; the fluid driving assembly can drive the cooling medium to flow; the circuit board assembly is electrically connected with the light source assembly and the fluid driving assembly; the flow blocking assembly is matched with the circuit board assembly to form a flow guide channel in a surrounding manner; the fluid driving assembly can blow an external cooling medium into the flow guide channel, and the cooling medium is guided by the flow guide channel to flow to the light source assembly and then flow to the outside, so that the cooling medium can take away at least part of heat of the light source assembly and the circuit board assembly. The optical beauty equipment provided by the utility model can effectively solve the problem that the circuit board of the existing beauty equipment is easy to overheat.

Description

Technical Field

[0001] This utility model relates to the field of cosmetic medical device technology, and in particular to an optical cosmetic device. Background Technology

[0002] Many beauty devices utilize laser technology for skin care, such as hair removal devices or laser beauty treatments. These devices typically include a fluid drive assembly, a light source assembly for emitting laser light, and a circuit board for controlling the light emission state of the light source assembly. Since the light source assembly is the core component and generates the most heat, current beauty devices primarily focus on cooling the light source assembly.

[0003] However, as beauty devices become increasingly powerful, the integration of various electronic components in circuit boards is also increasing, leading to a gradual increase in heat generation. Overheating of the circuit board can cause a decline in the performance and lifespan of the beauty device, and may even cause equipment failure or safety accidents. Therefore, in addition to effectively cooling the light source components, how to effectively reduce the heat generation of the circuit board has become a key research focus in the industry.

[0004] Therefore, this application aims to improve existing beauty devices to solve the problem of their circuit boards easily overheating.

[0005] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0006] One objective of this application is to provide an optical beauty device that can effectively solve the problem of overheating of the circuit board in existing beauty devices.

[0007] To achieve the above objectives, this application provides an optical cosmetic device, comprising:

[0008] The light source component can emit light to act on the skin for beauty purposes;

[0009] Fluid-driven components are capable of driving the flow of cooling media;

[0010] The circuit board assembly is electrically connected to the light source assembly and the fluid drive assembly;

[0011] A flow-blocking component, in conjunction with the circuit board assembly, surrounds and forms a flow-guiding channel;

[0012] The fluid drive component can blow external cooling medium into the flow channel. The cooling medium flows to the light source component under the guidance of the flow channel, and then flows to the outside, so that the cooling medium can at least partially remove the heat from the light source component and the circuit board component.

[0013] Optionally, the flow channel has a first opening and a second opening, the fluid drive assembly is disposed near the first opening and blows the cooling medium into the flow channel through the first opening, and the light source assembly is disposed near the second opening, with the cooling medium flowing from the second opening to the light source assembly.

[0014] Optionally, the first opening and the second opening may be of different sizes.

[0015] Optionally, the first opening is larger than the second opening.

[0016] Optionally, the cross-sectional area of ​​the flow channel gradually decreases from the first opening toward the second opening.

[0017] Optionally, the circuit board assembly has a number of electronic components, at least some of which are located near the flow channel.

[0018] Optionally, the flow-blocking component is connected to the circuit board assembly.

[0019] Optionally, the flow-blocking assembly is U-shaped overall.

[0020] Optionally, the flow-blocking assembly includes a first plate, a second plate, and a third plate, with the second plate located between the first plate and the third plate. The first plate and the third plate are disposed opposite to each other. The circuit board assembly is generally flat, and the second plate is disposed opposite to the circuit board assembly.

[0021] Optionally, the first plate and the third plate are not arranged in parallel.

[0022] The beneficial effect of this application is that it provides an optical beauty device in which, when the fluid drive component delivers a cooling medium to the guide channel:

[0023] On the one hand, since the flow channel is formed by the circuit board and the flow-blocking component, the flow channel delivers the cooling medium, which causes the cooling medium to flow from the surface of the circuit board, thereby cooling the circuit board.

[0024] On the other hand, the cooling medium flows to the light source assembly under the guidance of the flow channel, and then flows to the outside. Therefore, the flow channel also causes the cooling medium to flow from the surface of the light source assembly, thereby cooling the light source assembly.

[0025] Therefore, the optical beauty device provided in this application can use a single fluid drive component to cool and dissipate heat from the two heat-generating components, the light source component and the circuit board, thereby solving the problem of overheating of the circuit board in existing beauty devices. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A first-view structural schematic diagram of the optical beauty device provided in the embodiment (outer shell hidden);

[0028] Figure 2 A structural schematic diagram of the optical beauty device provided in the embodiment (with the outer casing hidden);

[0029] Figure 3 A cross-sectional view of the optical beauty device provided in the embodiment in a vertical section;

[0030] Figure 4 A cross-sectional schematic diagram of the optical beauty device provided in the embodiment in a horizontal section;

[0031] Figure 5 A schematic diagram of the bottom surface of the flow-blocking assembly provided in the embodiment;

[0032] Figure 6 This is a schematic diagram showing the connection between the flow-blocking assembly and the circuit board assembly provided in the embodiment.

[0033] In the picture:

[0034] 1. Circuit board assembly;

[0035] 2. Flow-blocking assembly; 201. Outflow window; 202. First plate; 203. Second plate; 204. Third plate;

[0036] 3. Light source assembly;

[0037] 4. Fluid drive components;

[0038] 5. Flow channel; 501. First opening; 502. Second opening. Detailed Implementation

[0039] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0040] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0041] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0042] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0043] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0044] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0045] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0046] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0047] This application provides an optical beauty device suitable for various occasions such as beauty salons, medical beauty institutions, and home personal care. Through optical technology combined with an efficient heat dissipation system, the device can provide users with a professional, safe, and comfortable beauty and skin care experience.

[0048] Specifically, the optical beauty device provided in this embodiment can be a hair removal device or a laser beauty device, etc., and this application does not limit it.

[0049] The following is a detailed description of the structure of this optical beauty device.

[0050] See Figures 1-4 The optical cosmetic device provided in this application includes:

[0051] Light source component 3 can emit light to act on the skin for beauty purposes.

[0052] The fluid drive component 4 is capable of driving the flow of the cooling medium.

[0053] Circuit board assembly 1 is electrically connected to light source assembly 3 and fluid drive assembly 4.

[0054] The flow-blocking component 2, together with the circuit board component 1, surrounds and forms the flow-guiding channel 5.

[0055] The fluid drive component 4 can blow external cooling medium into the guide channel 5. Under the guidance of the guide channel 5, the cooling medium flows to the light source component 3 and then to the outside, so that the cooling medium can at least partially remove the heat from the light source component 3 and the circuit board component 1.

[0056] Compared with the prior art, the optical beauty device of this application has the following advantages: When the fluid drive component 4 delivers cooling medium to the flow channel 5, on the one hand, since the flow channel 5 is formed by the circuit board and the baffle component 2, the delivery of cooling medium to the flow channel 5 will cause the cooling medium to flow from the surface of the circuit board, thereby cooling the circuit board; on the other hand, the cooling medium flows to the light source component 3 under the guidance of the flow channel 5, and then flows to the outside through the outlet window 201. Therefore, the delivery of cooling medium to the flow channel 5 will also cause the cooling medium to flow from the surface of the light source component 3, thereby cooling the light source component 3.

[0057] Therefore, the optical beauty device provided in this application can use a single fluid drive component 4 to cool down the two heat-generating components, the light source component 3 and the circuit board, thereby solving the problem of the circuit board of existing beauty devices being prone to overheating.

[0058] In some embodiments, see Figure 5 The flow channel 5 has a first opening 501 and a second opening 502. The air outlet of the fluid drive component 4 is positioned close to the first opening 501, blowing the cooling medium into the flow channel 5 through the first opening 501. Furthermore, the shape and size of the air outlet of the fluid drive component 4 can be made substantially the same as the shape and size of the first opening 501, allowing for a seamless connection between the air outlet and the first opening 501. This enables the fluid drive component 4 to maximize the blowing of the cooling medium into the flow channel 5, reducing the diversion of the cooling medium. Alternatively, the flow channel 5 can have only the first opening 501 and the second opening 502, forming a fixed fluid channel within the flow channel 5 from the first opening 501 to the second opening 502, further reducing the diversion of the cooling medium. Then, by positioning the light source component 3 close to the second opening 502, the cooling medium flows from the second opening 502 of the flow channel 5 to the light source component 3, achieving maximum heat dissipation.

[0059] In some embodiments, see Figure 5 By making the first opening 501 and the second opening 502 different in size, the flow rate of the cooling medium is different at the openings of different sizes. Thus, by adjusting the different sizes of the first opening 501 and the second opening 502, the flow rate of the cooling medium in the guide channel 5 can be effectively adjusted, thereby achieving a better heat dissipation effect.

[0060] In some embodiments, see Figure 5Since the first opening 501 is larger than the second opening 502, the flow rate of the cooling medium at the first opening 501 is less than that at the second opening 502. This allows the cooling medium to enter the first opening 501 and then accelerate its flow out towards the second opening 502 and towards the light source assembly 3, thereby accelerating heat dissipation.

[0061] In some embodiments, see Figure 5 The cross-sectional area of ​​the flow channel 5 gradually decreases from the first opening 501 toward the second opening 502. Utilizing the principle of fluid mechanics, the smaller the cross-sectional area of ​​the fluid channel, the greater the flow velocity. Thus, a gradually accelerating fluid flow channel is formed in the flow channel 5 from the first opening 501 toward the second opening 502, allowing the cooling medium to flow very quickly, thereby achieving rapid heat dissipation.

[0062] In some embodiments, see Figure 4 The circuit board assembly 1 has several electronic components, at least some of which are located near the flow channel 5. Furthermore, electronic components that generate significant heat during operation can be concentrated as much as possible at the location of the circuit board in the flow channel 5 and / or near that location. This allows the cooling medium to effectively and directly remove heat from the circuit board assembly 1 as it flows within the flow channel 5, maintaining the circuit board assembly 1 in a favorable temperature environment and effectively extending its service life.

[0063] In some embodiments, see Figure 6 The flow-blocking assembly 2 is connected to the circuit board assembly 1. This connection ensures the integrity and sealing of the flow-guiding channel 5, preventing leakage of the cooling medium during flow and maximizing the cooling effect. This connection method also simplifies the overall structure of the equipment, reduces assembly and maintenance complexity, and lowers manufacturing costs. Simultaneously, this structure effectively conducts the heat generated by the circuit board assembly 1 to the cooling medium through the flow-blocking assembly 2, improving heat exchange efficiency, further reducing the operating temperature of the circuit board, extending the lifespan of electronic components, and reducing equipment failures caused by overheating.

[0064] In some embodiments, see Figure 5 and Figure 6The baffle assembly 2 is U-shaped. This U-shaped design provides a closed flow path for the cooling medium, which helps improve the uniformity of the cooling medium flow and reduces eddies and turbulence, thereby improving heat dissipation efficiency. The U-shaped structure also increases the mechanical strength of the baffle assembly 2, enabling it to better resist external forces, maintain shape stability, and resist deformation. Furthermore, this design facilitates cleaning and maintenance because the U-shaped channel reduces corners and gaps, minimizing the accumulation of dirt and dust.

[0065] In some embodiments, see Figure 5 and Figure 6 The flow-blocking assembly 2 includes a first plate 202, a second plate 203, and a third plate 204. The second plate 203 is located between the first plate 202 and the third plate 204, which are positioned opposite each other. The circuit board assembly 1 is generally flat, with the second plate 203 positioned opposite to it. The design of the first plate 202, the second plate 203, and the third plate 204 forms a three-sided enclosed flow-guiding space, which improves the stability and sealing of the flow-guiding channel 5. The second plate 203, positioned opposite to the circuit board assembly 1, can effectively conduct heat from the circuit board assembly 1 to the cooling medium, achieving efficient heat dissipation. This modular design also facilitates the installation and replacement of the circuit board assembly 1, improving the maintainability of the equipment.

[0066] In some embodiments, see Figure 5 The first plate 202 and the third plate 204 are not parallel. This non-parallel design helps to create a pressure difference in the flow channel 5, which enhances the flow dynamics of the cooling medium and improves heat dissipation efficiency. Furthermore, the non-parallel design increases the cross-sectional area variation of the flow channel 5, helping to distribute the cooling medium more evenly during flow and reducing localized overheating. This structure also has a certain anti-backflow function, preventing the cooling medium from flowing in the opposite direction during the process, ensuring the stability and reliability of the heat dissipation system.

[0067] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An optical beauty device, characterized in that, include: The light source component can emit light to act on the skin for beauty purposes; Fluid-driven components are capable of driving the flow of cooling media; The circuit board assembly is electrically connected to the light source assembly and the fluid drive assembly; A flow-blocking component, in conjunction with the circuit board assembly, surrounds and forms a flow-guiding channel; The fluid drive component can blow external cooling medium into the flow channel. The cooling medium flows to the light source component under the guidance of the flow channel, and then flows to the outside, so that the cooling medium can at least partially remove the heat from the light source component and the circuit board component.

2. The optical beauty device according to claim 1, characterized in that, The flow channel has a first opening and a second opening. The fluid drive assembly is positioned close to the first opening and blows the cooling medium into the flow channel through the first opening. The light source assembly is positioned close to the second opening, and the cooling medium flows from the second opening to the light source assembly.

3. The optical beauty device according to claim 2, characterized in that, The first opening and the second opening are different in size.

4. The optical beauty device according to claim 2, characterized in that, The first opening is larger than the second opening.

5. The optical cosmetic device according to claim 2, characterized in that, The cross-sectional area of ​​the flow channel gradually decreases from the first opening toward the second opening.

6. The optical cosmetic device according to any one of claims 1 to 5, characterized in that, The circuit board assembly has a number of electronic components, at least some of which are located near the flow channel.

7. The optical cosmetic device according to any one of claims 1 to 5, characterized in that, The flow-blocking component is connected to the circuit board assembly.

8. The optical cosmetic device according to any one of claims 1 to 5, characterized in that, The flow-blocking component is U-shaped overall.

9. The optical cosmetic device according to any one of claims 1 to 5, characterized in that, The flow-blocking assembly includes a first plate, a second plate, and a third plate. The second plate is located between the first plate and the third plate. The first plate and the third plate are arranged opposite to each other. The circuit board assembly is generally flat. The second plate is arranged opposite to the circuit board assembly.

10. The optical cosmetic device according to claim 9, characterized in that, The first plate and the third plate are not arranged in parallel.

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