Pin cutting device in semiconductor packaging process

Abstract

The utility model discloses a pin cutting device in a semiconductor packaging process, which belongs to the technical field of semiconductor packaging and comprises a pin cutting tool apron fixing block, an assembling groove is formed in the middle of the interior of the pin cutting tool apron fixing block, a pin cutting mechanism is arranged in the assembling groove, a handle fixing seat is mounted on one side of the pin cutting tool apron fixing block, and a pin cutting mechanism is mounted on the handle fixing seat. The driving assembly is arranged, the driving motor is started, the driving shaft drives the fixing shaft to rotate through the connecting structure, and therefore the pressing handle can automatically rotate, manual operation is effectively reduced, the driving shaft is connected with the connecting shaft on the surface of the connecting plate through the threaded cylinder, and disassembly and assembly can be conveniently carried out; the collecting assembly is arranged, the exhaust fan in the mounting box is started, the collecting pipe can suck the cut pins into the collecting box through the generated negative pressure, collecting operation is simple and convenient, and the situation that movement and cutting of semiconductor products are affected by pin accumulation is effectively avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, and specifically relates to a lead-cutting device for semiconductor packaging process. Background Technology

[0002] The semiconductor packaging process is as follows: the wafer from the front-end process is cut into small chips by the dicing process, and then the cut chips are glued onto the islands of the corresponding substrate. Then, the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resin to form the required circuit. Finally, the individual chips are encapsulated and protected with plastic shells.

[0003] Chinese Patent Application No. 202421332191.7 discloses a lead-cutting device for semiconductor packaging processes, mainly comprising a lead-cutting blade holder fixing block, a pressing mechanism, and a lead-cutting mechanism. The lead-cutting mechanism is placed on the lead-cutting blade holder fixing block, and the pressing mechanism is located above the lead-cutting mechanism. The pressing mechanism includes a handle fixing seat and a pressing handle. The lead-cutting mechanism includes a blade fixing seat and a lead-cutting blade. Return springs are arranged on both sides of the blade fixing seat, and a blade fixing pin is inserted into the lead-cutting blade, with both ends of the pin connected to the lower ends of the two return springs. This invention uses a fixed blade fixing seat for positioning and a lead-cutting blade that moves within the blade fixing seat. Defective products that need to be cut after plastic packaging are placed in the positioning slot for positioning. By pressing the handle, the lead-cutting blade is pushed to cut the leads of the defective products, ensuring a consistent cutting length and avoiding the risk of excessively long cut leads in subsequent products.

[0004] In the aforementioned patents, 1. the pressing mechanism requires manual pressing by the operator, which is tiring and requires an automatic pressing structure; 2. after the cutting blade cuts off the leads of defective products, the cut leads are inconvenient to collect. Utility Model Content

[0005] To address the problems mentioned in the background section, this invention provides a lead-cutting device for semiconductor packaging processes, featuring automatic pressing and convenient lead collection.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a lead-cutting device for semiconductor packaging process, including a lead-cutting tool holder fixing block, wherein an assembly groove is provided in the middle of the lead-cutting tool holder fixing block, a lead-cutting mechanism is provided inside the assembly groove, a handle fixing seat is installed on one side of the lead-cutting tool holder fixing block, a fixing shaft is connected inside the handle fixing seat, a pressing handle is fixed on the surface of the fixing shaft, a driving component is connected to one end of the fixing shaft, and a collecting component is provided on one side of the surface of the handle fixing seat.

[0007] Preferably, the drive assembly includes a connecting structure, a mounting bracket, a drive motor, a protective cover, and a drive shaft. The mounting bracket is fixed to the surface of the handle fixing seat, the drive motor is mounted on the upper end of the mounting bracket, the output end of the drive motor is connected to the drive shaft, a connecting structure is installed between the drive shaft and the fixed shaft, and a protective cover is provided on the outside of the drive motor.

[0008] Preferably, the connection structure includes a threaded cylinder, a connecting shaft, and a connecting plate, wherein the connecting plate is fixed to the surface of the fixed shaft, the connecting shaft is fixed to the surface of the connecting plate, and the threaded cylinder is threadedly connected to the surface of the driving shaft.

[0009] Preferably, the connection structure further includes a square groove and a square block, wherein a square block is fixed on the surface of the drive shaft, and a square groove is formed inside the connection shaft at a position corresponding to the square block.

[0010] Preferably, the collection component includes a collection pipe, a collection structure, an exhaust fan, and a mounting box, wherein the mounting box is mounted on the lower surface of the handle fixing seat, the exhaust fan is placed at the upper part of the mounting box, the collection structure is provided at the lower part of the mounting box, and the collection pipe is connected between the mounting box and the foot cutting mechanism.

[0011] Preferably, the collection structure includes rollers, a connecting frame, and a collection box, wherein the collection box is placed at the lower end of the mounting box, the connecting frame is fixed on both sides of the bottom of the collection box, and the rollers are connected inside the connecting frame.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model is equipped with a drive component, which enables the drive motor to start and the drive shaft to drive the fixed shaft to rotate through the connecting structure, thereby enabling the downward handle to rotate automatically, effectively reducing manual operation. The drive shaft is connected to the connecting shaft on the surface of the connecting plate through a threaded cylinder, which can be easily disassembled and assembled.

[0014] 2. This utility model is equipped with a collection component, which activates the exhaust fan inside the installation box. The resulting negative pressure allows the collection tube to draw the cut leads into the collection box. The collection operation is simple and convenient, effectively preventing the accumulation of leads from affecting the movement and cutting of semiconductor products. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present utility model;

[0016] Figure 2 This is the front view of the present invention;

[0017] Figure 3 This is a perspective view of the drive component of this utility model;

[0018] Figure 4 This is a perspective view of the collection component of this utility model;

[0019] In the diagram: 1. Assembly slot; 2. Pipe cutting tool holder fixing block; 3. Collection assembly; 31. Collection pipe; 32. Collection structure; 321. Roller; 322. Connecting frame; 323. Collection box; 33. Exhaust fan; 34. Mounting box; 4. Drive assembly; 41. Connecting structure; 411. Square slot; 412. Square block; 413. Threaded cylinder; 414. Connecting shaft; 415. Connecting plate; 42. Mounting frame; 43. Drive motor; 44. Protective cover; 45. Drive shaft; 5. Handle fixing seat; 6. Press-down handle; 7. Cutting tool mechanism; 8. Fixing shaft. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] Please see Figure 1-4 The present invention provides the following technical solution: a lead cutting device for semiconductor packaging process, including a lead cutting tool holder fixing block 2, an assembly groove 1 is provided in the middle of the lead cutting tool holder fixing block 2, a lead cutting mechanism 7 is provided in the assembly groove 1, a handle fixing seat 5 is installed on one side of the lead cutting tool holder fixing block 2, a fixing shaft 8 is connected inside the handle fixing seat 5, a pressing handle 6 is fixed on the surface of the fixing shaft 8, a driving component 4 is connected to one end of the fixing shaft 8, and a collecting component 3 is provided on one side of the surface of the handle fixing seat 5.

[0023] Specifically, the drive assembly 4 includes a connecting structure 41, a mounting bracket 42, a drive motor 43, a protective cover 44, and a drive shaft 45. The mounting bracket 42 is fixed to the surface of the handle mounting base 5. The drive motor 43 is mounted on the upper end of the mounting bracket 42. The output end of the drive motor 43 is connected to the drive shaft 45. A connecting structure 41 is installed between the drive shaft 45 and the fixed shaft 8. A protective cover 44 is provided on the outside of the drive motor 43.

[0024] By adopting the above technical solution, the drive motor 43 at the upper end of the mounting bracket 42 is started, so that the drive shaft 45 drives the fixed shaft 8 to rotate through the connecting structure 41, thereby allowing the pressing handle 6 to rotate automatically, reducing manual operation, and the protective cover 44 can protect the drive motor 43.

[0025] Specifically, the connecting structure 41 includes a threaded cylinder 413, a connecting shaft 414, and a connecting plate 415. The connecting plate 415 is fixed to the surface of the fixed shaft 8, and the connecting shaft 414 is fixed to the surface of the connecting plate 415. The threaded cylinder 413 is threadedly connected to the surface of the connecting shaft 414 and the drive shaft 45.

[0026] By adopting the above technical solution, the drive shaft 45 is aligned with the connecting shaft 414 on the surface of the connecting plate 415. Then, the threaded cylinder 413 is rotated to mesh with the surfaces of the drive shaft 45 and the connecting shaft 414, which makes it easy to connect the drive shaft 45 and the fixed shaft 8.

[0027] Specifically, the connecting structure 41 also includes a square groove 411 and a square block 412. The square block 412 is fixed on the surface of the drive shaft 45, and the square groove 411 is formed inside the connecting shaft 414 at a position corresponding to the square block 412.

[0028] By adopting the above technical solution, the square block 412 is inserted into the square groove 411, which can position the drive shaft 45, so that the drive shaft 45 is accurately aligned with the fixed shaft 8 and is less likely to rotate relative to the fixed shaft 8.

[0029] In this embodiment, defective products from the semiconductor packaging process are placed on the upper end of the lead cutting tool holder fixing block 2. The stepped lead cutting tool holder fixing block 2 positions the product. The downward pressing handle 6 inside the handle fixing seat 5 rotates downward, which can activate the lead cutting mechanism 7 in the assembly slot 1 to cut the product's leads. The drive motor 43 at the upper end of the mounting bracket 42 is activated, causing the drive shaft 45 to drive the fixed shaft 8 to rotate through the connecting structure 41. This allows the downward pressing handle 6 to rotate automatically, reducing manual operation. The protective cover 44 can protect the drive motor 43, aligning the drive shaft 45 with the connecting shaft 414 on the surface of the connecting plate 415. Then, the threaded cylinder 413 is rotated to engage with the surfaces of the drive shaft 45 and the connecting shaft 414, facilitating the connection between the drive shaft 45 and the fixed shaft 8. The square block 412 is inserted into the square groove 411, which can position the drive shaft 45, ensuring accurate correspondence between the drive shaft 45 and the fixed shaft 8 and preventing relative rotation.

[0030] Example 2

[0031] The difference between this embodiment and Embodiment 1 is that the collecting component 3 includes a collecting pipe 31, a collecting structure 32, an exhaust fan 33, and a mounting box 34. The mounting box 34 is mounted on the lower surface of the handle fixing seat 5. The exhaust fan 33 is placed inside the upper part of the mounting box 34, and the collecting structure 32 is provided inside the lower part of the mounting box 34. The collecting pipe 31 connects the mounting box 34 to the foot-cutting mechanism 7.

[0032] By adopting the above technical solution, the exhaust fan 33 inside the installation box 34 is started, which generates negative pressure in the collection pipe 31, thereby sucking the cut-off pipe feet into the collection structure 32, thus avoiding affecting the subsequent cutting-off pipe feet operation.

[0033] Specifically, the collection structure 32 includes rollers 321, connecting frames 322, and a collection box 323. The collection box 323 is placed inside the lower part of the mounting box 34, and the connecting frames 322 are fixed to both sides of the bottom of the collection box 323. The rollers 321 are connected inside the connecting frames 322.

[0034] By adopting the above technical solution, the collection box 323 can conveniently store the pins, and the roller 321 at the lower end of the connecting frame 322 can reduce friction, making the collection box 323 easy to move and replace.

[0035] In this embodiment, the exhaust fan 33 inside the mounting box 34 is activated to create negative pressure in the collection pipe 31, thereby sucking the cut-off pipe leads into the collection structure 32 to avoid affecting subsequent pipe cutting operations. The collection box 323 can conveniently store the pipe leads. The rollers 321 at the lower end of the connecting frame 322 roll to reduce friction, making it easy to move and replace the collection box 323.

[0036] The structure and working principle of the lead-cutting mechanism 7 in this utility model have been disclosed in a lead-cutting device for semiconductor packaging process disclosed in Chinese patent application No. 202421332191.7. Its working principle is that the lead-cutting blade moves downward under force, and the blade fixing pin moves downward simultaneously, causing the reset springs on both sides of the blade fixing seat to be stretched under force. When the force on the lead-cutting blade is removed, the reset springs reset, causing the lead-cutting blade to return to the initial position.

[0037] In this utility model, the exhaust fan 33 is a previously disclosed technology, and the selected model is T35.

[0038] The working principle and usage process of this utility model are as follows: When using this utility model, defective products from the semiconductor packaging process are placed on the upper end of the lead-cutting tool holder fixing block 2. The stepped lead-cutting tool holder fixing block 2 positions the product. Rotating the downward-pressing handle 6 inside the handle fixing seat 5 activates the lead-cutting mechanism 7 in the assembly slot 1 to cut the product's leads. This activates the drive motor 43 at the upper end of the mounting bracket 42, causing the drive shaft 45 to drive the fixed shaft 8 to rotate through the connecting structure 41. This allows the downward-pressing handle 6 to rotate automatically, reducing manual operation. The protective cover 44 protects the drive motor 43, aligning the drive shaft 45 with the connecting shaft 414 on the surface of the connecting plate 415. Rotating the threaded cylinder 413 allows it to mesh with the surfaces of the drive shaft 45 and the connecting shaft 414, facilitating the connection between the drive shaft 45 and the fixed shaft 8. The square block 412 engages with the square groove 411, positioning the drive shaft 45 and ensuring accurate alignment between the drive shaft 45 and the fixed shaft 8, preventing relative rotation. Activating the exhaust fan 33 inside the mounting box 34 creates negative pressure in the collection pipe 31, drawing the cut-off pipe ends into the collection structure 32, preventing them from interfering with subsequent pipe cutting operations. The collection box 323 conveniently stores the pipe ends. The rollers 321 at the lower end of the connecting frame 322 reduce friction, allowing the collection box 323 to be easily moved and replaced.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lead-cutting device for a semiconductor packaging process, comprising a lead-cutting tool holder fixing block (2), wherein an assembly groove (1) is provided in the middle of the lead-cutting tool holder fixing block (2), a lead-cutting mechanism (7) is provided inside the assembly groove (1), a handle fixing seat (5) is installed on one side of the lead-cutting tool holder fixing block (2), a fixing shaft (8) is connected inside the handle fixing seat (5), and a pressing handle (6) is fixed on the surface of the fixing shaft (8), characterized in that: One end of the fixed shaft (8) is connected to the drive assembly (4), and a collection assembly (3) is provided on one side of the surface of the handle fixing seat (5).

2. The semiconductor packaging process lead cutting device according to claim 1, characterized in that: The drive assembly (4) includes a connecting structure (41), a mounting bracket (42), a drive motor (43), a protective cover (44), and a drive shaft (45). The mounting bracket (42) is fixed on the surface of the handle fixing seat (5). The drive motor (43) is mounted on the upper end of the mounting bracket (42). The output end of the drive motor (43) is connected to the drive shaft (45). A connecting structure (41) is installed between the drive shaft (45) and the fixed shaft (8). A protective cover (44) is provided on the outside of the drive motor (43).

3. The semiconductor packaging process lead cutting device according to claim 2, characterized in that: The connection structure (41) includes a threaded cylinder (413), a connecting shaft (414), and a connecting plate (415). The connecting plate (415) is fixed on the surface of the fixed shaft (8), the connecting shaft (414) is fixed on the surface of the connecting plate (415), and the threaded cylinder (413) is threadedly connected to the surface of the connecting shaft (414) and the drive shaft (45).

4. The semiconductor packaging process lead cutting device according to claim 3, characterized in that: The connecting structure (41) further includes a square groove (411) and a square block (412), wherein the square block (412) is fixed on the surface of the drive shaft (45), and the square groove (411) is opened inside the connecting shaft (414) at the position corresponding to the square block (412).

5. A semiconductor packaging process lead cutting device according to claim 1, characterized in that: The collection component (3) includes a collection pipe (31), a collection structure (32), an exhaust fan (33), and a mounting box (34). The mounting box (34) is installed on the lower surface of the handle fixing seat (5). The exhaust fan (33) is placed in the upper part of the mounting box (34). The collection structure (32) is provided in the lower part of the mounting box (34). The collection pipe (31) is connected between the mounting box (34) and the foot cutting mechanism (7).

6. A lead-cutting device for a semiconductor packaging process according to claim 5, characterized in that: The collection structure (32) includes rollers (321), connecting frame (322) and collection box (323). The collection box (323) is placed at the lower end of the installation box (34). The connecting frame (322) is fixed on both sides of the bottom of the collection box (323). The rollers (321) are connected inside the connecting frame (322).

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