Hot pressing device for epoxy resin plate production
By introducing a demolding mechanism into the hot pressing device used in epoxy resin board production, and utilizing a combination of memory springs and telescopic rods, rapid demolding of epoxy resin boards is achieved, solving the problem of increased production time in existing technologies and improving production capacity.
Patent Information
- Application Number
- CN202520483608.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-19
AI Technical Summary
Existing hot pressing equipment for epoxy resin board production cannot quickly demold after hot pressing, resulting in increased production time and decreased overall capacity.
A hot pressing device including a demolding mechanism was designed. By using a combination of memory springs and telescopic rods, the hot-pressed epoxy resin board is automatically pushed out through elastic potential energy, avoiding waiting for cooling or manual processing.
It enables rapid demolding, reduces production time per batch, and increases overall capacity.
Smart Images

Figure CN223890357U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of safety engineering, and specifically relates to a hot pressing device for epoxy resin plate production. BACKGROUND
[0002] Epoxy resin plate is also called insulation plate, epoxy plate and 3240 epoxy plate. Epoxy resin refers to an organic high molecular compound containing two or more epoxy groups in the molecule. Except for a few exceptions, the relative molecular mass of epoxy resin is not high. The molecular structure of epoxy resin is characterized by containing active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reaction with various types of curing agents to form insoluble and infusible high polymers with three-dimensional network structure.
[0003] According to the search, the Chinese utility model patent discloses a hot pressing device for epoxy resin plate production (publication number: CN214522578U), which comprises a workbench, a support leg is installed at the bottom of the workbench, a lower uniform heating plate is installed at the upper end of the workbench, a lower heating mechanism is installed at the bottom of the lower uniform heating plate, the two sides of the workbench are connected with the two ends of the mounting frame body, a press is installed at the upper middle of the mounting frame body, a pressing plate is connected to the lower end of the rod body of the press, guide rods are installed at the two upper ends of the pressing plate, the two guide rods are movably connected with the guide holes on the mounting frame body, an upper uniform heating plate is installed at the inner lower end of the pressing plate, an upper heating mechanism is installed on the inner side wall of the upper uniform heating plate, holes are formed in the lower sides of the mounting frame body, and a hot air mechanism is installed in the holes.
[0004] In the above-mentioned patent, the setting of the pressing plate can realize rapid placement and pressing, and is convenient for rapid heating, has high stability and is easy to use. The time can be saved, and the efficiency is high during pressing. The structure is simple, and the two sides are convenient for auxiliary heating. However, after the epoxy resin plate completes the hot pressing process, the epoxy resin plate cannot be quickly demolded and taken out, and the mold needs to be completely cooled or manually handled, which increases the production time of a single batch and may reduce the overall production capacity.
[0005] Therefore, the utility model provides a hot pressing device for epoxy resin plate production to solve the above-mentioned problems. UTILITY MODEL CONTENTS
[0006] The utility model provides a hot pressing device for epoxy resin plate production, which aims to solve the problems in the background art.
[0007] In order to achieve the above object, the utility model provides the following technical scheme: A hot pressing device for epoxy resin plate production, the hot pressing device for epoxy resin plate production includes workbench, support frame set up on the workbench, top plate set up on the support frame, pressing plate set up in the bottom of the top plate, lower support mould set up on the workbench and demoulding mechanism for automatically demoulding hot pressing epoxy resin plate set up in the inside of the lower support mould.
[0008] The demoulding mechanism includes the recess that is opened in the inside of the lower support mould, the telescopic rod that is set up in the inside of the recess, the push board that is set up on the movable end of the telescopic rod, the memory spring that is set up on the telescopic rod, the first electric heating wire that is set up in the inside of the pressing plate and the heat plate that is set up in the bottom of the pressing plate.
[0009] Further, in the above-mentioned hot pressing device for epoxy resin plate production, the push plate is matched with the recess, one end of the memory spring is connected to the bottom of the recess, and the other end of the memory spring is connected to the bottom of the push plate.
[0010] Further, in the above-mentioned hot pressing device for epoxy resin plate production, the top of the workbench is connected with a vertical plate, one side of the vertical plate is connected with a ventilation pipe, and the ventilation pipe penetrates through the vertical plate.
[0011] Further, in the above-mentioned hot pressing device for epoxy resin plate production, the inside of the ventilation pipe is connected with a second electric heating wire, the inside of the ventilation pipe is connected with a fan, and the inside of the ventilation pipe is connected with a filter plate.
[0012] Further, in the above-mentioned hot pressing device for epoxy resin plate production, the top of the top plate is connected with a press, the movable end of the press penetrates through the top plate and is connected with the top of the pressing plate, the inside of the top plate is connected with a sleeve, and the sleeve penetrates through the top plate.
[0013] Further, in the above-mentioned hot pressing device for epoxy resin plate production, the inside of the sleeve is slidably connected with a guide rod, one end of the guide rod is connected with the top of the pressing plate, and two guide rods are distributed on the two sides of the press.
[0014] Compared with the prior art, the utility model has the advantages of:
[0015] The utility model discloses simple structure, convenient to use, through the setting of demoulding mechanism, the inside temperature of lower support mould starts to drop after the hot pressing of epoxy resin plate is completed, and memory spring starts to be hard, and the elastic potential energy of memory spring pushes the push plate upwards, and the movable end of telescopic link starts to extend, and the well -pressed epoxy resin plate is pushed out from the inside of lower support mould through the upward movement of push plate, the well -pressed epoxy resin plate can be taken out quickly at this moment, and it is not necessary to wait for the complete cooling of mould or manual processing, and single batch production time reduces, and the overall productivity is improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a structure diagram of a kind of hot pressing device for epoxy resin plate production Figure 1 ;
[0017] Figure 2 It is a structure diagram of a kind of hot pressing device for epoxy resin plate production Figure 2 ;
[0018] Figure 3 It is a section view schematic diagram of workbench in a kind of hot pressing device for epoxy resin plate production;
[0019] Figure 4 It is the installation schematic diagram of memory spring in a kind of hot pressing device for epoxy resin plate production;
[0020] Figure 5 It is the installation schematic diagram of first electric heating wire in a kind of hot pressing device for epoxy resin plate production;
[0021] Figure 6 It is the installation schematic diagram of filter plate in a kind of hot pressing device for epoxy resin plate production.
[0022] In the drawing:
[0023] 1, workbench;2, support frame;3, top plate;4, pressing plate;5, lower support mould;6, recess;7, telescopic link;8, push plate;9, memory spring;10, first electric heating wire;11, heat plate;12, vertical plate;13, ventilation pipe;14, second electric heating wire;15, fan;16, filter plate;17, press;18, sleeve;19, guide rod. DETAILED DESCRIPTION
[0024] The technical scheme in the utility model embodiments will be described clearly and completely below in conjunction with the drawings of the utility model embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0025] The utility model provides a hot pressing device for epoxy board production, like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 , the hot pressing device for epoxy board production includes workbench 1, the support frame 2 of setting in workbench 1, the top plate 3 of setting in support frame 2, the pressing plate 4 of setting in the bottom of top plate 3, the lower support mould 5 of setting in workbench 1 and the demoulding mechanism for automatically demoulding the hot pressing epoxy board of setting in lower support mould 5 inside.
[0026] The demoulding mechanism includes the recess 6 of being opened in lower support mould 5 inside, the telescopic rod 7 of setting in recess 6 inside, the push plate 8 of setting in the movable end of telescopic rod 7, the memory spring 9 of being set on telescopic rod 7, the first electric heating wire 10 of setting in pressing plate 4 inside and the uniform heating plate 11 of setting in the bottom of pressing plate 4.
[0027] The push plate 8 is adapted to the recess 6, one end of the memory spring 9 is connected to the bottom of the recess 6, and the other end of the memory spring 9 is connected to the bottom of the push plate 8.
[0028] When the hot pressing device for epoxy board production is used, first, the entire device is placed in a suitable position by the supporting legs at the bottom of the workbench 1, then the epoxy board to be hot pressed is placed inside the lower support mould 5, then the pressing plate 4 starts to move down, the first electric heating wire 10 and the uniform heating plate 11 are driven to move down synchronously by the movement of the pressing plate 4, until the pressing plate 4 enters the inside of the lower support mould 5, the inside of the lower support mould 5 is heated by the cooperation between the first electric heating wire 10 and the uniform heating plate 11, at this time the memory spring 9 becomes soft and loses elastic potential energy, the plurality of push plates 8 move down until they move into the recess 6, at the same time the telescopic rod 7 starts to contract, then the hot pressing of the epoxy board is completed, then the pressing plate 4 with the first electric heating wire 10 and the uniform heating plate 11 starts to rise, at this time the temperature inside the lower support mould 5 starts to drop, the memory spring 9 starts to harden, the push plate 8 is pushed upward by the elastic potential energy of the memory spring 9, the movable end of the telescopic rod 7 starts to extend, the hot pressed epoxy board is pushed out from the inside of the lower support mould 5 by the upward movement of the push plate 8, at this time the hot pressed epoxy board can be quickly taken out without waiting for the mold to cool completely or manual handling, the single batch production time is reduced, and the overall production capacity is improved.
[0029] For example, in order to facilitate heating of the side surface of the epoxy board to be hot pressed, as shown in Figure 1 、 Figure 3 、 Figure 4 and Figure 6 , the top of the workbench 1 is connected with a vertical plate 12, one side of the vertical plate 12 is connected with a ventilation pipe 13, and the ventilation pipe 13 penetrates through the vertical plate 12.
[0030] The inside of the ventilation pipe 13 is connected with the second electric heating wire 14, the inside of the ventilation pipe 13 is connected with the fan 15, and the inside of the ventilation pipe 13 is connected with the filter plate 16.
[0031] When the heat pressing device for the epoxy resin plate production is used, the pressing plate 4 starts to move downwards, the first electric heating wire 10 and the heat plate 11 are driven to move downwards synchronously by the movement of the pressing plate 4, until the pressing plate 4 enters the inside of the lower supporting die 5, when the inside of the lower supporting die 5 is heated by the cooperation between the first electric heating wire 10 and the heat plate 11, the second electric heating wire 14 and the fan 15 are started, the fan 15 blows the hot air heated by the second electric heating wire 14 to the two sides of the epoxy resin plate, so as to complete the heating of the side edges of the epoxy resin plate, the dust blown by the fan 15 is prevented from being blown to the epoxy resin plate by the action of the filter plate 16, after the heat pressing is completed, the second electric heating wire 14 is closed, the fan 15 continues to rotate, the epoxy resin plate and the memory spring 9 are cooled by the rotation of the fan 15, so that the heat-pressed epoxy resin plate can be quickly taken out.
[0032] For example, in order to guide the pressing plate 4 when it descends, as shown in Figure 1 、 Figure 2 and Figure 5 , the top of the top plate 3 is connected with the press 17, the movable end of the press 17 penetrates the top plate 3 and is connected with the top of the pressing plate 4, the inside of the top plate 3 is connected with the sleeve 18, and the sleeve 18 penetrates the top plate 3.
[0033] The inside of the sleeve 18 is slidably connected with the guide rod 19, one end of the guide rod 19 is connected with the top of the pressing plate 4, and the two guide rods 19 are distributed on the two sides of the press 17.
[0034] When the heat pressing device for the epoxy resin plate production is used, the epoxy resin plate to be heat-pressed is placed in the inside of the lower supporting die 5, then the press 17 is started, the movable end of the press 17 pushes the pressing plate 4, the first electric heating wire 10 and the heat plate 11 downwards, the guide rod 19 is driven to move downwards synchronously by the movement of the pressing plate 4, and the guide rod 19 and the sleeve 18 cooperate to guide the pressing plate 4 during movement.
[0035] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A hot pressing device for producing epoxy resin boards, characterized in that: It includes a workbench (1), a support frame (2) set on the workbench (1), a top plate (3) set on the support frame (2), a pressing plate (4) set at the bottom of the top plate (3), a lower support mold (5) set on the workbench (1), and a demolding mechanism set inside the lower support mold (5) for automatically demolding the hot-pressed epoxy resin board. The demolding mechanism includes a groove (6) formed inside the lower support mold (5), a telescopic rod (7) set inside the groove (6), a push plate (8) set on the movable end of the telescopic rod (7), a memory spring (9) sleeved on the telescopic rod (7), a first electric heating wire (10) set inside the pressing plate (4), and a heat spreader (11) set at the bottom of the pressing plate (4).
2. The hot pressing device for producing epoxy resin boards according to claim 1, characterized in that: The push plate (8) is adapted to the groove (6), one end of the memory spring (9) is connected to the bottom of the groove (6), and the other end of the memory spring (9) is connected to the bottom of the push plate (8).
3. The hot pressing device for producing epoxy resin boards according to claim 1, characterized in that: The top of the workbench (1) is connected to a vertical plate (12), and a ventilation pipe (13) is connected to one side of the vertical plate (12), the ventilation pipe (13) passing through the vertical plate (12).
4. The hot pressing device for producing epoxy resin boards according to claim 3, characterized in that: The ventilation duct (13) is internally connected to a second electric heating wire (14), a fan (15) is internally connected to the ventilation duct (13), and a filter plate (16) is internally connected to the ventilation duct (13).
5. The hot pressing device for producing epoxy resin boards according to claim 1, characterized in that: A press (17) is connected to the top of the top plate (3). The movable end of the press (17) passes through the top plate (3) and is connected to the top of the pressing plate (4). A sleeve (18) is connected inside the top plate (3). The sleeve (18) passes through the top plate (3).
6. The hot pressing device for producing epoxy resin boards according to claim 5, characterized in that: The sleeve (18) is slidably connected to a guide rod (19), one end of which is connected to the top of the pressing plate (4), and two guide rods (19) are distributed on both sides of the press (17).
Citation Information
Patent Citations
Hot pressing device for epoxy resin plate production
CN214522578U