Module combined electrostatic chuck structure

Abstract

The utility model discloses a module combination electrostatic chuck structure which comprises a substrate, a sleeve is installed on the top of the substrate, a heater is fixed to the top end of the sleeve, the bottom face of the heater is connected with the top face of the substrate through a bonding layer, an electrode is fixed to the top of the heater, and a ceramic disc is installed on the electrode. A mounting hole is formed in the edge of the bottom of the base plate, a mounting groove is formed in the center of the bottom of the base plate, a heat dissipation plate is arranged in the mounting groove, the edge of the heat dissipation plate is fixedly connected with the mounting groove through a locking bolt, an insertion strip is fixed to the top of the inner wall of the mounting groove, and the insertion strip is attached to the inner wall of the insertion groove. According to the module combination electrostatic chuck structure, the novel structural design is adopted, the heater, the electrode and the ceramic disc can be integrally separated from the substrate, the heat dissipation mechanism can be conveniently detached and separated from the substrate, the heat dissipation mechanism can be conveniently cleaned, other mechanisms cannot be damaged, the cleaning efficiency is improved, and the cleaning difficulty is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrostatic chucks, and particularly relates to a modular combined electrostatic chuck structure. Background Technique

[0002] An electrostatic chuck is a general term for a super-clean thin sheet carrier and a grasping and handling device suitable for an atmospheric or vacuum environment. The electrostatic adsorption technology used is an advantageous technology that replaces traditional mechanical clamping and vacuum adsorption methods, and has extensive applications in the fields of semiconductors, panel displays, optics, etc.

[0003] The liquid cooling and heat dissipation mechanism of the existing electrostatic chuck is integrally designed with the substrate. When cleaning, the entire electrostatic chuck needs to be transferred for operation. In order to avoid damaging other structures, the overall cleaning speed is slow and the cleaning difficulty is high. Therefore, a modular combined electrostatic chuck structure needs to be designed for the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a modular combined electrostatic chuck structure to solve the problem that the liquid cooling and heat dissipation mechanism of the existing electrostatic chuck is integrally designed with the substrate. When cleaning, the entire electrostatic chuck needs to be transferred for operation. In order to avoid damaging other structures, the overall cleaning speed is slow and the cleaning difficulty is high mentioned in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A modular combined electrostatic chuck structure includes a substrate. A sleeve is installed on the top of the substrate. A heater is fixed at the top of the sleeve. The bottom surface of the heater is connected to the top surface of the substrate through an adhesive layer. An electrode is fixed on the top of the heater. A ceramic disc is installed on the electrode. Installation holes are opened at the bottom edge of the substrate. An installation groove is opened at the center of the bottom of the substrate. A heat dissipation plate is arranged in the installation groove. The edge of the heat dissipation plate is connected and fixed to the installation groove through a locking bolt. A plug strip is fixed at the top of the inner wall of the installation groove. The plug strip is in contact with the inner wall of the slot. The slot is opened on the top of the heat dissipation plate. A liquid inlet hole is opened at the center of the bottom surface of the heat dissipation plate. The liquid inlet hole is communicated with a heat dissipation flow channel. The heat dissipation flow channel is opened in the heat dissipation plate. A guiding flow channel is arranged on the side of the heat dissipation flow channel.

[0006] Preferably, the sleeve and the substrate are snap-connected. The front view sectional shape of the substrate is "convex".

[0007] Preferably, the front view sections of the installation groove and the heat dissipation plate are both "convex", and the installation groove and the heat dissipation plate are snap-connected.

[0008] Preferably, the thickness of the heat dissipation plate is greater than half of the overall thickness of the substrate, and the bottom surface of the heat dissipation plate is on the same horizontal plane as the bottom surface of the substrate.

[0009] Preferably, the inserts and slots are evenly spaced, and the horizontal plane at the bottom of the slot is higher than the horizontal plane at the top of the heat dissipation channel.

[0010] Preferably, the distance from the inner top surface to the inner bottom surface of the heat dissipation channel is greater than half the thickness of the heat dissipation plate, and the heat dissipation channel is configured as an annular shape.

[0011] Preferably, the heat dissipation channels are distributed at equal intervals around the same center, and the bottom end of the outermost heat dissipation channel is provided with a liquid outlet hole.

[0012] Preferably, the diameter of the liquid outlet hole is not less than half the width of the inner side of the heat dissipation channel, and the liquid outlet holes are distributed at equal angles about the center of the heat dissipation channel.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: The module combination electrostatic chuck structure adopts a novel structural design. Through the snap-fit ​​connection between the sleeve and the top of the substrate, not only can the heater, electrode and ceramic disk be separated from the substrate as a whole, but the heat dissipation mechanism can also be easily disassembled and separated from the substrate. The heat dissipation mechanism can be removed and cleaned independently. The heater, electrode and ceramic disk do not participate in the cleaning process and will not cause damage to the heater, electrode and ceramic disk, which greatly improves the cleaning efficiency and reduces the cleaning difficulty. Attached Figure Description

[0014] Figure 1 This is a frontal cross-sectional view of the present invention.

[0015] Figure 2 This is a three-dimensional structural diagram of the sleeve and heater of this utility model;

[0016] Figure 3 This is a schematic diagram of the structure of this utility model from below;

[0017] Figure 4 This is a top view of the heat sink structure of this utility model;

[0018] Figure 5 This is a bottom view cross-sectional structural diagram of the liquid inlet, heat dissipation channel, and guide channel of this utility model.

[0019] In the diagram: 1. Substrate; 2. Sleeve; 3. Heater; 4. Adhesive layer; 5. Electrode; 6. Ceramic disk; 7. Mounting hole; 8. Mounting groove; 9. Heat sink; 10. Locking bolt; 11. Insert; 12. Slot; 13. Liquid inlet; 14. Heat dissipation channel; 15. Guide channel; 16. Liquid outlet. Detailed Implementation

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figure 1-5 , the present invention provides a technical solution: a modular combined electrostatic chuck structure, including a substrate 1, a sleeve 2, a heater 3, an adhesive layer 4, an electrode 5, a ceramic disk 6, a mounting hole 7, a mounting groove 8, a heat dissipation plate 9, a locking bolt 10, an insertion strip 11, a slot 12, a liquid inlet hole 13, a heat dissipation flow channel 14, a guiding flow channel 15 and a liquid outlet hole 16. A sleeve 2 is installed on the top of the substrate 1, a heater 3 is fixed at the top end of the sleeve 2, the bottom surface of the heater 3 is connected to the top surface of the substrate 1 through an adhesive layer 4, an electrode 5 is fixed on the top of the heater 3, a ceramic disk 6 is installed on the electrode 5, a mounting hole 7 is opened at the bottom edge of the substrate 1, a mounting groove 8 is opened at the center of the bottom of the substrate 1, a heat dissipation plate 9 is arranged in the mounting groove 8, the edge of the heat dissipation plate 9 is connected and fixed to the mounting groove 8 through a locking bolt 10, an insertion strip 11 is fixed at the top of the inner wall of the mounting groove 8, the insertion strip 11 is in contact with the inner wall of the slot 12, the slot 12 is opened at the top of the heat dissipation plate 9, a liquid inlet hole 13 is opened at the center of the bottom surface of the heat dissipation plate 9, the liquid inlet hole 13 is communicated with the heat dissipation flow channel 14, the heat dissipation flow channel 14 is opened in the heat dissipation plate 9, and a guiding flow channel 15 is arranged on the side of the heat dissipation flow channel 14.

[0022] In this example, the sleeve 2 and the substrate 1 are in snap connection, and the front view cross-sectional shape of the substrate is "convex". The above structural design enables the sleeve 2 to be stably installed and ensures the stability of the structures connected thereto.

[0023] The front view cross-sections of the mounting groove 8 and the heat dissipation plate 9 are both "convex", and the mounting groove 8 and the heat dissipation plate 9 are in snap connection. The above structural design enables the heat dissipation plate 9 to be stably aligned and connected to the mounting groove 8.

[0024] The thickness of the heat dissipation plate 9 is greater than half of the overall thickness of the substrate 1, and the bottom surface of the heat dissipation plate 9 is on the same horizontal plane as the bottom surface of the substrate 1. The above structural design ensures the flatness of the bottom of the device and the heat dissipation efficiency of the heat dissipation plate 9.

[0025] The insertion strips 11 and the slots 12 are both evenly distributed, and the horizontal plane where the bottom end of the slot 12 is located is higher than the horizontal plane where the top end of the heat dissipation flow channel 14 is located. The above structural design further improves the tightness of the connection between the mounting groove 8 and the heat dissipation plate 9 and increases the contact area between the substrate 1 and the heat dissipation plate 9.

[0026] The distance from the inner top surface to the inner bottom surface of the heat dissipation channel 14 is greater than half the thickness of the heat sink 9. The heat dissipation channel 14 is set as an annular structure. The above structural design ensures that the size of the heat dissipation channel 14 is sufficient so that the coolant can flow through the heat dissipation channel 14 and conduct heat efficiently.

[0027] The heat dissipation channels 14 are distributed at equal intervals around the same center, and the bottom of the outermost heat dissipation channel 14 is provided with a liquid outlet hole 16. The above structural design ensures the liquid cooling effect and also ensures that the coolant can be discharged smoothly.

[0028] The diameter of the outlet hole 16 is not less than half the inner width of the heat dissipation channel 14. The outlet holes 16 are distributed at equal angles with respect to the center of the heat dissipation channel 14. The above structural design ensures smooth flow of coolant and improves cooling efficiency.

[0029] Working principle: During normal operation, the liquid inlet 13 is connected to the liquid supply pipe of the external liquid cooling system, and the liquid outlet 16 is connected to the recovery pipe of the external liquid cooling system. The coolant enters the heat dissipation channel 14 through the liquid inlet 13 and flows smoothly outward through the guide channels 15 set between the equally spaced heat dissipation channels 14. Finally, it is discharged through the liquid outlet 16. When the coolant flows, it absorbs the heat conducted from the substrate 1 to the heat dissipation plate 9, achieving a high-efficiency heat dissipation effect.

[0030] When the electrostatic chuck needs to be disassembled for maintenance and the heat dissipation channel 14 needs to be cleaned, the sleeve 2 is separated from the base plate 1, and the heater 3, electrode 5 and ceramic disk 6, which are not easily damaged, are stored separately. The locking bolt 10 is removed, the heat dissipation plate 9 is taken off, and the heat dissipation channel 14 and the guide channel 15 are rinsed at high speed through the liquid inlet hole 13 and the liquid outlet hole 16. After cleaning, the heat dissipation plate 9 and the sleeve 2 are reconnected and reset to the base plate 1 in sequence. This is the working principle of the modular electrostatic chuck structure.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular electrostatic chuck structure, comprising a substrate (1), characterized in that: A sleeve (2) is installed on the top of the substrate (1), and a heater (3) is fixed on the top of the sleeve (2). The bottom surface of the heater (3) is connected to the top surface of the substrate (1) through an adhesive layer (4). An electrode (5) is fixed on the top of the heater (3), and a ceramic disk (6) is installed on the electrode (5). A mounting hole (7) is opened on the bottom edge of the substrate (1), and a mounting groove (8) is opened in the center of the bottom of the substrate (1). A heat sink (9) is provided in the mounting groove (8), and the heat sink (9) is located on the edge of the heat sink (9). The edge is connected and fixed to the mounting groove (8) by locking bolts (10). The top of the inner wall of the mounting groove (8) is fixed with a strip (11). The strip (11) fits against the inner wall of the slot (12). The slot (12) is opened on the top of the heat sink (9). The center of the bottom surface of the heat sink (9) is provided with a liquid inlet hole (13). The liquid inlet hole (13) is connected to the heat dissipation channel (14). The heat dissipation channel (14) is opened in the heat sink (9). The side of the heat dissipation channel (14) is provided with a guide channel (15).

2. The modular electrostatic chuck structure according to claim 1, characterized in that: The sleeve (2) and the base plate (1) are connected by a snap-fit ​​connection, and the front view cross-sectional shape of the base plate (1) is "convex".

3. The modular electrostatic chuck structure according to claim 1, characterized in that: The front view of the mounting groove (8) and the heat sink (9) are both "convex" shaped, and the mounting groove (8) and the heat sink (9) are connected by a snap-fit ​​connection.

4. The modular electrostatic chuck structure according to claim 1, characterized in that: The thickness of the heat sink (9) is greater than half the overall thickness of the substrate (1), and the bottom surface of the heat sink (9) is on the same horizontal plane as the bottom surface of the substrate (1).

5. The modular electrostatic chuck structure according to claim 1, characterized in that: The insert (11) and slot (12) are evenly spaced, and the bottom of the slot (12) is on a horizontal plane that is higher than the top of the heat dissipation channel (14).

6. The modular electrostatic chuck structure according to claim 1, characterized in that: The distance from the inner top surface to the inner bottom surface of the heat dissipation channel (14) is greater than half the thickness of the heat dissipation plate (9), and the heat dissipation channel (14) is set as an annular shape.

7. The modular electrostatic chuck structure according to claim 1, characterized in that: The heat dissipation channels (14) are distributed at equal intervals around the same center, and the bottom end of the outermost heat dissipation channel (14) is provided with a liquid outlet hole (16).

8. The modular electrostatic chuck structure according to claim 7, characterized in that: The diameter of the liquid outlet hole (16) is not less than half the width of the inner side of the heat dissipation channel (14), and the liquid outlet hole (16) is distributed at equal angles about the center of the heat dissipation channel (14).

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