Novel MEMS device vacuum maintaining structure
By designing a combination of rotating components and exhaust channels in MEMS devices, the problems of heat dissipation and vacuum environment maintenance are solved, achieving efficient gas exhaust and heat dissipation, and improving the long-term stability and performance of the devices.
Patent Information
- Application Number
- CN202520527549.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-25
AI Technical Summary
Existing MEMS devices face challenges in heat dissipation and maintaining a vacuum environment. Traditional heat dissipation methods have limited effectiveness, and the gas adsorption materials of getters have limited shelf life, affecting long-term performance.
A novel vacuum maintenance structure for MEMS devices, including a housing, a window, and a negative pressure structure, is designed. It utilizes a rotating component and an exhaust channel to achieve efficient gas discharge and heat dissipation. The rotating component consists of multiple fan blades with an arc-shaped outer wall. The rotation direction is consistent with the opening of the exhaust channel. The fan blades are on the same side as the chip, and the rotating component contacts the chip for heat dissipation.
It achieves efficient vacuum maintenance and significant improvement in heat dissipation performance. The rotating parts optimize the airflow path, reduce gas residence time, improve exhaust efficiency and heat dissipation efficiency, and ensure the stability of the device over a long period of time.
Smart Images
Figure CN223892448U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor packaging, especially to a novel MEMS device vacuum maintenance structure. BACKGROUND
[0002] At present, the vacuum packaging structure design of MEMS device is mainly to provide a protective barrier to ensure that its microstructure is not disturbed by environmental factors such as temperature fluctuations, humidity changes and harmful gases. This packaging technology not only significantly reduces the gas resistance effect of the device, but also greatly improves the long-term stability of its sensitivity and performance.
[0003] In order to realize and maintain this vacuum environment, the application of getter is particularly critical. The getter can continuously and effectively absorb active gas in a closed space, thereby ensuring the vacuum degree of the sealed environment. Currently, the widely used getter forms include columnar and sheet, which rely on special materials covered on the surface to adsorb active gas.
[0004] However, in the running process of MEMS device, the heat dissipation problem is always a thorny problem. The traditional heat dissipation treatment method is mainly to smear heat dissipation silicone grease at the bottom of the device. Although this method can alleviate the heat dissipation problem to a certain extent, it does not fundamentally solve the problem. In addition, although the conventional getter performs well in adsorbing active gas, the gas adsorption material used on its surface has an inherent shelf life limit, which affects its long-term use effect to a certain extent
[0005] Therefore, the present application develops a novel MEMS device vacuum maintenance structure to solve the problems in the prior art. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing a novel MEMS device vacuum maintenance structure to solve the problems in the prior art
[0007] The technical scheme of the utility model is: a novel MEMS device vacuum maintenance structure, comprising:
[0008] The shell is formed with a cavity for accommodating the chip in the shell, and an installation part is formed at the top of the shell, and lead wires are symmetrically arranged on both sides of the shell and connected with external circuits to realize electrical signal transmission.
[0009] The window is arranged on the installation part to form a closed environment in the shell.
[0010] The negative pressure structure comprises an exhaust passage arranged on the side wall of the shell and a rotating part arranged in the shell, and the rotating part rotates to exhaust the gas in the cavity from the exhaust passage, so as to realize the internal negative pressure of the cavity and maintain the internal vacuum.
[0011] Preferably, the rotating component includes a plurality of fan blades arranged in a circumferential array, the fan blades extending in a direction parallel to the rotation axis of the rotating component, the rotation axis being the center line around which the rotating component rotates.
[0012] Preferably, the outer wall surface of the fan blade is an arc surface, and the arc surface is curved toward the direction of rotation of the fan blade.
[0013] Preferably, the opening direction of the exhaust channel is located on the same side of the chip as the rotating component, and the rotation direction of the rotating component is towards the exhaust channel.
[0014] Preferably, the housing is further provided with a heat dissipation structure, which is in contact with the bottom surface of the chip, and the chip is cooled by the airflow circulation of the rotating component.
[0015] Preferably, the rotating component is located between the exhaust channel and the chip, and the rotating component and the chip are at the same height and are both located in the middle of the exhaust channel.
[0016] Compared with the prior art, the advantages of this utility model are:
[0017] (1) By setting the exhaust channel and rotating component, the gas in the cavity can be discharged efficiently, the gas pressure can be reduced rapidly, and the internal negative pressure state can be achieved and maintained. The opening direction of the rotating component and the exhaust channel is set on the same side of the chip, which optimizes the gas flow path, reduces the gas residence time, improves the exhaust efficiency, and maintains the vacuum in the cavity for a longer time.
[0018] (2) The rotating component is not only used to maintain negative pressure, but also significantly improves the heat dissipation performance of the chip. The airflow generated by the rotation of the rotating component can directly and effectively remove the heat generated by the chip. At the same time, the arc surface design of the fan blade further enhances the airflow guidance effect, reduces airflow resistance, improves flow efficiency, and accelerates the transfer and diffusion of heat. Attached Figure Description
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0020] Figure 1 This is an exploded view of a novel vacuum maintenance structure for a MEMS device according to the present invention.
[0021] Figure 2 This is a side view of a novel vacuum maintenance structure for a MEMS device according to the present invention.
[0022] Figure 3 This is a schematic diagram of the structure of the rotating component described in this utility model.
[0023] The components are: 1. Housing; 2. Chip; 3. Cavity; 4. Mounting part; 5. Window; 6. Negative pressure structure; 61. Exhaust channel; 62. Rotating component; 621. Fan blade; 622. Arc surface; 7. Heat dissipation structure. Detailed Implementation
[0024] The present invention will be further described in detail below with reference to specific embodiments:
[0025] like Figures 1-2 As shown, a novel vacuum maintenance structure for a MEMS device includes a housing 1, a window 5, and a negative pressure structure 6. The housing 1 has a specific cavity 3 inside to accommodate a chip 2, and a mounting part 4 on its top facilitates the installation of the window 5, ensuring a tight seal between the window 5 and the housing 1. Symmetrically arranged leads are positioned on both sides of the housing 1; these leads primarily connect to external circuits to transmit electrical signals. The window 5 is located on the mounting part 4, ensuring a sealed environment is formed inside the housing 1. Window 5 allows for necessary observation or operation of chip 2 while maintaining the sealing of the internal environment; the negative pressure structure 6 includes an exhaust channel 61 and a rotating component 62. The exhaust channel 61 is located on the side wall of the housing 1 as a channel for gas discharge, while the rotating component 62 is located inside the housing 1. By rotating the rotating component 62, the gas in the cavity 3 can be effectively discharged from the exhaust channel 61, thereby reducing the gas pressure in the cavity 3 and achieving the purpose of internal negative pressure. When the rotating component 62 continues to rotate and discharge gas, the cavity 3 will maintain a relative vacuum state.
[0026] Specifically, the opening direction of the rotating component 62 and the exhaust channel 61 is set on the same side of the chip 2, which can maximize exhaust efficiency and reduce potential interference to other parts of the chip 2. The rotating component 62 rotates towards the exhaust channel 61. When the rotating component 62 rotates, it can directly and efficiently discharge the gas in the cavity 3 from the exhaust channel 61. Since the rotation direction of the rotating component 62 is consistent with the opening direction of the exhaust channel 61, the flow path of the gas in the cavity 3 is optimized, making the gas flow smoother and reducing the residence time of the gas in the cavity 3. In addition, the rotating component 62 can effectively push the gas towards the exhaust channel 61 with each rotation, thereby achieving a continuous pushing effect. This not only improves the exhaust efficiency, but also ensures that the cavity 3 can be maintained in a relatively low gas pressure state, that is, a higher vacuum degree.
[0027] Furthermore, the positioning of the rotating component 62 not only enables efficient exhaust but also significantly improves the heat dissipation performance of the chip 2. Specifically, the rotating component 62 is positioned between the exhaust channel 61 and the chip 2, allowing the airflow generated during its rotation to more effectively carry away the heat generated by the chip 2 and smoothly discharge it through the exhaust channel 61. The rotating component 62 and the chip 2 are at the same height, both corresponding to the middle of the exhaust channel 61, making the airflow more direct and smooth. This reduces potential eddies and resistance within the channel and increases the gas flow velocity, thereby enhancing the heat dissipation effect. Moreover, when the rotating component 62 rotates, it generates stronger centrifugal force, pushing the gas towards the exhaust channel 61 and accelerating the gas discharge process. This allows heat to be discharged more directly through the exhaust channel 61, significantly improving the heat dissipation efficiency of the chip 2. Simultaneously, the rotation of the rotating component 62 also causes the gas in the cavity 3 to be extracted more quickly, further reducing the gas pressure within the cavity 3 and providing a more stable and efficient vacuum environment for the housing 1.
[0028] In this embodiment, as Figure 3 As shown, the rotating component 62 includes multiple circumferentially arrayed fan blades 621. The fan blades 621 extend along a direction parallel to the rotation axis of the rotating component 62, which is the center line around which the rotating component 62 rotates, ensuring the uniform distribution and rotational stability of the fan blades 621. The outer wall surface of the fan blades 621 is an arc surface 622, curved towards the direction of rotation, which better guides airflow, making airflow smoother as it passes through the fan blades 621, reducing airflow resistance, and improving airflow efficiency. During the rotation of the fan blades 621, the arc surface 622 design not only helps maintain the vacuum environment within the housing 1 and effectively exhausts gas from the cavity 3, but also achieves airflow circulation, carrying away the heat generated by the chip 2, thereby accelerating heat transfer and diffusion and significantly improving the heat dissipation performance of the chip 2.
[0029] To avoid overheating inside the housing 1, a heat dissipation structure 7 is provided inside the housing 1. The heat dissipation structure 7 is in contact with the bottom surface of the chip 2. The chip 2 is cooled by the airflow circulation of the rotating component 62. The airflow circulation generated by the rotating component 62 can accelerate the transfer and diffusion of heat, effectively conduct the heat generated by the chip 2 away, carry the heat away from the heat dissipation structure 7, and discharge it outside the housing 1 through the exhaust channel 61, thus avoiding the accumulation and retention of heat.
[0030] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.
Claims
1. A novel vacuum maintenance structure for MEMS devices, characterized in that, include: The housing (1) has a cavity (3) inside for accommodating the chip (2) and a mounting part (4) is provided on the top. The housing (1) has symmetrical leads on both sides for connecting to an external circuit to realize electrical signal transmission. A window (5) is provided on the mounting part (4) to form a sealed environment inside the housing (1); The negative pressure structure (6) includes an exhaust channel (61) disposed on the side wall of the housing (1) and a rotating component (62) disposed in the housing (1). By rotating the rotating component (62), the gas in the cavity (3) is discharged from the exhaust channel (61), thereby achieving negative pressure inside the cavity (3) and maintaining internal vacuum.
2. The novel vacuum maintenance structure for MEMS devices according to claim 1, characterized in that: The rotating component (62) includes a plurality of fan blades (621) arranged in a circular array, the fan blades (621) extending in a direction parallel to the rotation axis of the rotating component (62), the rotation axis being the center line around which the rotating component (62) rotates.
3. The novel vacuum maintenance structure for MEMS devices according to claim 2, characterized in that: The outer wall surface of the fan blade (621) is an arc surface (622), and the arc surface (622) is curved toward the rotation direction of the fan blade (621).
4. The novel vacuum maintenance structure for MEMS devices according to claim 1, characterized in that: The opening direction of the exhaust channel (61) is located on the same side of the chip (2) as the rotating component (62), and the rotation direction of the rotating component (62) is towards the exhaust channel (61).
5. The novel vacuum maintenance structure for MEMS devices according to claim 1, characterized in that: The housing (1) is also provided with a heat dissipation structure (7), which is in contact with the bottom surface of the chip (2). The chip (2) is cooled by the airflow circulation of the rotating component (62).
6. The novel vacuum maintenance structure for MEMS devices according to claim 1, characterized in that: The rotating component (62) is located between the exhaust channel (61) and the chip (2), and the rotating component (62) and the chip (2) are at the same height and are both located in the middle of the exhaust channel (61).