Electrochemical polishing device

Abstract

The utility model discloses an electrochemical polishing device which comprises a stirring pool, a stirring device, a liquid adding device and a detection device, a to-be-polished workpiece and solid particles are placed in the stirring pool, the liquid adding device provides liquid for the stirring pool, the stirring device is arranged in the stirring pool, the stirring device stirs materials in the stirring pool, and the detection device detects the dryness and humidity in the stirring pool. The stirring pool is kept electrified in the grinding process, the solid particles and the liquid are electrified in the stirring pool to conduct electrolytic polishing on the to-be-polished workpiece, the stirring device stirs the solid particles to ensure that the humidity of the solid particles is uniform, meanwhile, the solid particles conduct physical polishing on the to-be-polished workpiece, and the polishing efficiency is improved. The detection device judges whether the solid particles are too dry or not by monitoring the dryness and humidity of the solid particles in the stirring pool in real time, the liquid adding device adjusts the humidity of the solid particles by injecting liquid, the humidity of the solid particles is controlled within a specific range, the electrolytic polishing efficiency is kept within an ideal range, and the overall polishing effect is improved.

Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to an electrochemical polishing apparatus. Background Technology

[0002] With the development of industrial processing technology, precision grinding has been widely used in fields such as machinery manufacturing, electronics industry, and optical devices. Especially in the processing of workpieces with high surface finish requirements, traditional physical polishing technology often cannot meet the needs of modern industry. Therefore, electropolishing technology has gradually become one of the important supplementary technologies.

[0003] Electropolishing technology uses electric current to treat the surface of a workpiece by passing it through a liquid, significantly improving its smoothness. However, the control of solid particle humidity, the supply of polishing fluid, and the conductivity of the fluid are key factors affecting the polishing effect. Traditional electropolishing equipment often uses a fixed fluid supply method, which cannot adjust the fluid supply in real time according to changes in solid particle humidity and current. This leads to unstable current control, resulting in inconsistent polishing effects. Solid-state electrochemical polishing technology has emerged to address this issue, enabling better control of key parameters during the polishing process, such as particle moisture content and surface fluid volume. Studies have shown that particle moisture content and surface fluid volume have a significant impact on polishing effect and polishing rate. Furthermore, solid-state electrochemical polishing technology offers environmental advantages. Traditional electropolishing technology generates a large amount of waste liquid during operation, increasing costs and polluting the environment. Solid-state electrochemical polishing technology, using solid electrolytes, reduces waste liquid generation, better meeting the environmental requirements of modern industry. Utility Model Content

[0004] This application aims to at least solve one of the technical problems existing in the prior art. This application provides an electrochemical polishing apparatus capable of controlling the current of solid particles within a suitable range, thereby greatly improving the polishing effect.

[0005] An electrochemical polishing apparatus according to an embodiment of this application includes:

[0006] A stirring tank is used to place the workpiece to be polished and solid particles in the stirring tank, which is kept powered on.

[0007] A liquid adding device is connected to the mixing tank and is used to provide liquid to the mixing tank.

[0008] A stirring device is disposed in the stirring tank;

[0009] A detection device for detecting the dryness and humidity in the mixing tank.

[0010] The electrochemical polishing apparatus according to the embodiments of this application has at least the following beneficial effects:

[0011] The electrochemical polishing apparatus of this application includes a stirring tank, a stirring device, a liquid adding device, and a detection device. The stirring tank is used to hold the workpiece to be polished and solid particles. The liquid adding device is connected to the stirring tank and is used to supply liquid to the stirring tank. The stirring device is located in the stirring tank and is used to stir the workpiece to be polished, solid particles, and liquid in the stirring tank. The detection device is used to detect the dryness and humidity of the stirring tank. The stirring tank is kept energized during the polishing process. The solid particles and liquid in the stirring tank are electrolytically polished by the current flowing through them. The stirring device stirs the solid particles to ensure uniform humidity, and at the same time, the solid particles also physically polish the workpiece, greatly increasing the polishing efficiency. The detection device monitors the dryness and humidity of the solid particles in the stirring tank in real time to determine whether the solid particles are too dry. The liquid adding device adjusts the humidity of the solid particles by injecting liquid, controlling the humidity of the solid particles within a specific range, so that the electrolytic polishing efficiency is kept within an ideal range, improving the overall polishing effect.

[0012] According to some embodiments of this application, the stirring device includes a driving device and a stirring assembly, wherein the stirring assembly is connected to the driving device.

[0013] According to some embodiments of this application, the liquid addition device includes a first water tank, a liquid extraction pipeline, a first main pump, and a liquid injection pipeline. The liquid is placed in the first water tank, the first main pump is connected to the first water tank through the liquid extraction pipeline, and the first main pump is connected to the stirring tank through the liquid injection pipeline.

[0014] According to some embodiments of this application, the liquid addition device includes a second water tank, a first pipeline, a second main pump, a second pipeline, and multiple branch pipelines. The second water tank is connected to the second main pump through the first pipeline. One end of the second pipeline is connected to the second main pump, and the other end of the second pipeline is connected to multiple branch pipelines. The branch pipelines face the stirring tank.

[0015] According to some embodiments of this application, the stirring assembly includes a stirring component and a transmission assembly, wherein the stirring component is connected to the driving device via the transmission assembly.

[0016] According to some embodiments of this application, the stirring assembly includes a plurality of stirring components, the transmission assembly includes a driving gear, a driven gear, a main rotating shaft and a secondary rotating rod, the driving device is connected to the driving gear through the main rotating shaft, the stirring component is connected to the driven gear through the secondary rotating rod, and the driving gear is connected to the driven gear.

[0017] According to some embodiments of this application, the stirring component is provided with multiple rods.

[0018] According to some embodiments of this application, the branch pipeline is configured as four lines.

[0019] According to some embodiments of this application, the stirring components are configured as three.

[0020] According to some embodiments of this application, a lifting device is also included, which is connected to the stirring device. Attached Figure Description

[0021] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 This is a schematic diagram of the structure of an electrochemical polishing apparatus according to an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the structure of an electrochemical polishing apparatus according to another embodiment of this application.

[0024] Figure 3 for Figure 1 A schematic diagram of the electrochemical polishing apparatus of one embodiment is shown from another angle.

[0025] Figure 4 for Figure 3 A schematic diagram of the electrochemical polishing apparatus of one embodiment is shown from another angle.

[0026] Figure 5 for Figure 4 A schematic diagram of the electrochemical polishing apparatus of one embodiment is shown from another angle.

[0027] Figure label:

[0028] Mixing tank 1;

[0029] Liquid addition device 2; first water tank 211; liquid extraction pipeline 212; first main pump 213; liquid injection pipeline 214; second water tank 221; first pipeline 222; second main pump 223; second pipeline 224; branch pipeline 225;

[0030] Stirring device 3; driving device 31; stirring component 32; transmission assembly 33; main rotating shaft 311; driving gear 332; driven gear 333; auxiliary rotating rod 334. Detailed Implementation

[0031] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0032] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships is based on the orientation or positional relationships shown in the accompanying drawings and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] The following reference Figures 1 to 5 The electrochemical polishing apparatus described in the embodiments of this application is described.

[0035] according to Figure 1 , 2As shown in Figures 3, 4, and 5, an electrochemical polishing apparatus according to an embodiment of this application includes a stirring tank 1, a stirring device 3, a liquid adding device 2, and a detection device. The stirring tank 1 contains the workpiece to be polished and solid particles, and the workpiece is polished in the stirring tank 1. The liquid adding device 2 is connected to the stirring tank 1 and provides liquid to the stirring tank 1. The liquid adding device 2 adjusts the humidity of the stirring tank 1 by injecting liquid. The stirring device 3 is disposed in the stirring tank 1 and is used to stir the workpiece to be polished, solid particles, and liquid in the stirring tank 1. The stirring device 3 ensures that the solid particles are evenly distributed in the stirring tank 1 and maintains uniform humidity of the solid particles, preventing solid particles from settling or becoming uneven. This ensures that the workpiece to be polished is in full contact with the solid particles and liquid, thereby improving the electrochemical polishing efficiency. The stirring device 3 also performs a certain degree of physical polishing on the workpiece to be polished through mechanical movement.

[0036] The workpiece to be polished and solid particles are placed in a mixing tank 1. A liquid adding device 2 injects an appropriate amount of liquid into the mixing tank 1, ensuring the moisture content of the solid particles is within a specific range. The mixing tank 1 is then energized, and current flows through the liquid and solid particles, electropolishing the workpiece. A stirring device 3 continuously agitates the solid particles in the mixing tank 1, physically polishing the workpiece while ensuring uniform distribution and moisture content of the particles, preventing localized over-wetting or under-wetting that would affect the electropolishing effect. The moisture content of the solid particles affects the current applied to them, which in turn affects the polishing effect. Maintaining the moisture content within a specific range results in better polishing. A detection device monitors the moisture content of the solid particles in the mixing tank 1 in real time. When the moisture content falls below a set threshold, the polishing efficiency decreases, and the liquid adding device 2 injects an appropriate amount of liquid into the mixing tank 1 to restore the moisture content to the optimal range. Maintaining the moisture content of the solid particles within the optimal range significantly improves the polishing effect, resulting in a more uniform and smooth surface on the workpiece.

[0037] In some embodiments, the detection device includes a sensor and an ammeter. The sensor is placed in the stirring tank 1, and the ammeter is connected to the sensor. The sensor is used to collect the current data of the solid particles in the stirring tank 1 and transmit the current data to the ammeter. The ammeter displays the current magnitude of the solid particles. The dryness or wetness of the solid particles affects the current magnitude. The operator judges the dryness or wetness of the solid particles by the current magnitude. By detecting the current magnitude, the operator judges whether the solid particles are too dry. The operator operates the liquid addition device 2 to inject liquid into the stirring tank 1, thereby increasing the humidity of the solid particles and increasing the current of the solid particles, keeping the current of the solid particles within an optimal range. The current detection device and the liquid addition device 2 work together to ensure that the solid particles are always kept within a specific humidity range, improving the grinding effect and enhancing the polishing effect.

[0038] The workpiece to be polished and solid particles are placed in a mixing tank 1. A liquid adding device 2 injects an appropriate amount of liquid into the mixing tank 1 to maintain the moisture content of the solid particles within a specific range. The mixing tank 1 is then energized, and current flows through the liquid and solid particles, electrolytically polishing the workpiece. A stirring device 3 continuously stirs the solid particles in the mixing tank 1, physically polishing the workpiece while ensuring uniform distribution and moisture content of the solid particles to prevent localized over-wetting or under-wetting, which would affect the electrolytic polishing effect. The moisture content of the solid particles affects the current applied to them, which in turn affects the polishing effect. When the current is maintained within a specific range, the polishing effect is better. A detection device monitors the current of the solid particles in the mixing tank 1 in real time to determine their moisture content. When the current falls below a set threshold, the solid particles are considered to have low moisture content, reducing polishing efficiency. The liquid adding device 2 then injects an appropriate amount of liquid into the mixing tank 1 to restore the moisture content of the solid particles to the optimal range, thereby increasing the current and maintaining it within the ideal range. During the grinding process, the stability of the current directly affects the electropolishing effect. Maintaining the current to the solid particles within the optimal range will significantly improve the polishing effect, making the workpiece surface more uniform and smooth.

[0039] In some other embodiments, the detection device can be set as a dryness and humidity detection device, which can directly detect the dryness and humidity of the solid particles in the mixing tank 1. When the humidity of the solid particles is low, the liquid adding device 2 injects liquid into the mixing tank 1 to increase the humidity of the solid particles, so that the current of the solid particles is kept within a better range and a higher grinding effect is guaranteed.

[0040] In some embodiments, the electrochemical polishing apparatus further includes an automated feedback device, which is located between the detection device and the liquid addition device 2. The detection device obtains the current data of the solid particles in the stirring tank 1, the automated feedback device processes the current data, and the liquid addition device 2 automatically decides whether to inject liquid into the stirring tank 1 through the automated feedback device, and automatically adjusts the volume of injected liquid. The liquid addition device 2 provides real-time feedback adjustment, thereby adjusting the dryness and humidity of the solid particles, keeping the current of the solid particles within an optimal range, maintaining a high polishing effect, and eliminating the need for manual control by operators, reducing human intervention and accurately controlling the amount of liquid used, thus reducing operating costs while maintaining polishing efficiency.

[0041] In some embodiments, the mixing tank 1 is made of a high-strength, corrosion-resistant material that can withstand the scraping of solid particles and the corrosion of liquids.

[0042] In some embodiments, the stirring tank 1 is connected to a power source, which provides current to the solid particles and liquid in the stirring tank 1.

[0043] In some embodiments, the solid particles may be silicon dioxide, aluminum oxide, cerium oxide, etc. In other embodiments, the solid particles may also be solid conductive media for electrochemical polishing, such as modified cation exchange resin particles.

[0044] according to Figure 1 , 2 As shown in Figures 3, 4, and 5, in one embodiment of this application, the stirring device 3 includes a driving device 31 and a stirring assembly. The stirring assembly is connected to the driving device 31, and the driving device 31 is used to drive the stirring assembly to stir in the stirring tank 1.

[0045] according to Figure 1 , 2 As shown in Figures 4 and 5, in one embodiment of this application, the liquid adding device 2 includes a first water tank 211, a liquid extraction pipe 212, a first main pump 213, and a liquid injection pipe 214. Liquid is placed in the first water tank 211. One end of the liquid extraction pipe 212 is connected to the first water tank 211, and the other end is connected to the first main pump 213. The first water tank 211 is connected to the first main pump 213 via the liquid extraction pipe 212. One end of the liquid injection pipe 214 is connected to the first main pump 213, and the other end is connected to a stirring tank 1. The stirring tank 1 is connected to the first main pump 213 via the liquid injection pipe 214. The first main pump 213 is used to pump the liquid from the first water tank 211 into the stirring tank 1.

[0046] During the grinding process, the detection device monitors the current of the solid particles in the mixing tank 1 in real time to determine the dryness and moisture content of the solid particles. When the current of the solid particles is lower than a set threshold, the moisture content of the solid particles is low, and the polishing effect of the solid particles decreases. The first main pump 213 of the liquid adding device 2 starts working, pumping liquid from the first water tank 211 to the first main pump 213 through the liquid extraction pipe 212, and then injecting the liquid into the mixing tank 1 through the liquid injection pipe 214, increasing the liquid volume in the mixing tank 1, thereby increasing the moisture content of the solid particles, increasing the current of the solid particles, and keeping the current of the solid particles within a specific range to ensure a high polishing effect.

[0047] according to Figure 1 , 3As shown in Figures 4 and 5, in one embodiment of this application, the liquid adding device 2 includes a second water tank 221, a first pipeline 222, a second main pump 223, a second pipeline 224, and multiple branch pipelines 225. The second water tank 221 contains liquid. One end of the first pipeline 222 is connected to the second water tank 221, and the other end is connected to the second main pump 223. The second water tank 221 is connected to the second main pump 223 via the first pipeline 222. The inlet end of the second pipeline 224 is connected to the second main pump 223, and the outlet end of the second pipeline 224 is connected to multiple branch pipelines 225, all of which face the mixing tank 1. The second main pump 223 is connected to the mixing tank 1 via the second pipeline 224 and the branch pipelines 225. The multiple branch pipelines 225 are all located at different positions on the upper part of the mixing tank 1. The second main pump 223 is used to pump liquid from the second water tank 221 to the mixing tank 1.

[0048] During the grinding process, the detection device monitors the current of the solid particles in the mixing tank 1 in real time, thereby determining the dryness and wetness of the solid particles. When the current of the solid particles is lower than the set threshold, the wetness of the solid particles is low, and the polishing effect of the solid particles decreases. The second main pump 223 of the liquid adding device 2 starts to work, pumping liquid from the second water tank 221 to the second main pump 223 through the first pipeline 222, and then the liquid flows through the second pipeline 224 into multiple branch pipelines 225. The multiple branch pipelines 225 are set at different positions at the upper end of the mixing tank 1, and the outlet of the branch pipelines 225 faces the mixing tank 1. The liquid flows to different positions in the mixing tank 1 through multiple different branch pipelines 225, making the wetness of the solid particles in the mixing tank 1 more uniform, avoiding local over-wetness or over-dryness of the solid particles, which would lead to uneven polishing effect at different positions of the workpiece under test.

[0049] according to Figure 1 , 3 As shown in Figures 4 and 5, in one embodiment of this application, the stirring device 3 includes a stirring component 32 and a transmission assembly 33. The stirring component 32 is connected to the driving device 31 via the transmission assembly 33. The driving device 31 drives the stirring component 32 to rotate and stir via the transmission assembly 33. The driving device 31 drives the transmission assembly 33, which in turn drives the stirring component 32 to rotate. The stirring component 32 rotates and stirs in the stirring tank 1, making the humidity of the solid particles more uniform and the current energy of the solid particles at different positions in the stirring tank 1 more stable. This allows the workpiece to be tested to fully contact the solid particles and liquid for electrolytic polishing. The stirring component 32's stirring of the solid particles improves the efficiency of electrolytic polishing, while the solid particles also physically polish the workpiece to be polished.

[0050] In some embodiments, the drive device 31 may be configured as a motor drive device 31, a hydraulic drive device 31, or other drive devices 31.

[0051] according to Figure 1 , 3 As shown in Figures 4 and 5, in one embodiment of this application, the stirring device 3 includes a plurality of stirring components 32, and the transmission assembly 33 includes a driving gear 332, a plurality of driven gears 333, a main rotating shaft 311, and a plurality of auxiliary rotating rods 334. One end of the main rotating shaft 311 is connected to the driving device 31, and the other end of the main rotating shaft 311 is connected to the driving gear 332. The driving device 31 is connected to the driving gear 332 through the main rotating shaft 311. One end of the auxiliary rotating rod 334 is connected to the stirring component 32, and the other end of the auxiliary rotating rod 334 is connected to the driven gear 333. The stirring component 32 is connected to the driven gear 333 through the auxiliary rotating rod 334, and the driving gear 332 and the driven gear 333 are connected by gear engagement.

[0052] The drive unit 31 starts, driving the drive gear 332 to rotate via the main rotating shaft 311. The drive gear 332 is connected to the driven gear 333, which in turn drives each driven gear 333 to rotate. The stirring component 32 is connected to the driven gear 333 via the auxiliary rotating rod 334. Each stirring component 32 rotates synchronously and stirs the particles through the cooperation of the driven gear 333 and the drive gear 332. The use of multiple stirring components 32 ensures more thorough stirring, resulting in more uniform moisture content of the solid particles in the stirring tank 1, more stable current, and high-quality electrolytic polishing. Simultaneously, the multiple stirring components 32 allow for more thorough physical polishing of the workpiece by the solid particles. This improves the overall grinding effect and increases polishing efficiency.

[0053] according to Figure 1 , 3 As shown in Figures 4 and 5, in one embodiment of this application, the stirring component 32 is provided with a plurality of rods, which can be configured as curved rods. Each stirring component 32 can be provided with six rods.

[0054] In some other embodiments, the stirring component 32 may also be provided with four, eight, or ten rods.

[0055] In some other embodiments, the rod may also be configured as a stirring blade.

[0056] according to Figure 1 , 3As shown in Figures 4 and 5, in one embodiment of this application, the liquid addition device 2 includes a second water tank 221, a first pipeline 222, a second main pump 223, a second pipeline 224, and four branch pipelines 225. The inlet end of the second pipeline 224 is connected to the second main pump 223, and the outlet end of the second pipeline 224 is connected to the inlet of the four branch pipelines 225. The inlet ends of the four branch pipelines 225 are all connected to the outlet of the second pipeline 224, and the outlet ends of the branch pipelines 225 all face into the mixing tank 1. The outlet ends of the four branch pipelines 225 are evenly distributed around the outer periphery of the mixing tank 1. Under the action of the second main pump 223, liquid is pumped from the second water tank 221 to the second main pump 223 through the first pipeline 222, flows in from the inlet end of the second pipeline 224, flows out from the outlet end of the second pipeline 224 and enters the inlet end of the four branch pipelines 225, and finally flows out from the outlet end of the branch pipeline 225 facing the mixing tank 1 and flows into different positions in the mixing tank 1. The liquid flows to different positions in the mixing tank 1 through the four different branch pipelines 225, which can make the humidity of the solid particles in the mixing tank 1 more uniform, prevent the solid particles from being too wet or too dry in some places, thereby achieving stable current and obtaining better polishing effect.

[0057] according to Figure 1 , 3 As shown in Figures 4 and 5, in one embodiment of this application, the stirring assembly includes three stirring components 32, and the transmission assembly 33 includes a driving gear 332, three driven gears 333, a main rotating shaft 311, and three auxiliary rotating rods 334. The driving device 31 is connected to the driving gear 332 through the main rotating shaft 311. Each stirring component 32 is connected to the corresponding driven gear 333 through the corresponding auxiliary rotating rod 334. The three driven gears 333 are evenly distributed on the outer periphery of the driving gear 332 and are geared to the driving gear 332.

[0058] The drive unit 31 starts, driving the drive gear 332 to rotate via the main rotating shaft 311. The drive gear 332 is connected to three driven gears 333, which in turn drive the three driven gears 333 to rotate. Each driven gear 333 is connected to a corresponding rotating rod. Each stirring component 32 rotates synchronously and stirs the solid particles in the stirring tank 1 through the cooperation of its corresponding driven gear 333 and drive gear 332. The three stirring components 32 ensure more comprehensive and thorough stirring of the solid particles in the stirring tank 1, resulting in more uniform humidity of the solid particles, more stable current, and high-quality electrolytic polishing. Simultaneously, the three stirring components 32 allow the solid particles to more thoroughly perform physical polishing on the workpiece to be polished. With the addition of four branch pipes 225 of the liquid separation device, the liquid can flow into the stirring tank 1 from four directions. After being stirred by the three stirring components 32, the solid particles can be prevented from being too wet or too dry in some places, thus improving the effect of electrolytic polishing. While the stirring components 32 are stirring the solid particles, the solid particles are also physically polished on the workpiece to be polished. The electrochemical polishing device of this application improves the effect of electrolytic polishing while combining physical polishing and electrolytic polishing, and also improves the overall polishing efficiency.

[0059] according to Figure 1 , 3 As shown in Figures 4 and 5, in one embodiment of this application, the electrochemical polishing apparatus further includes a lifting device, which is connected to the stirring device 3. The lifting device is used to drive the stirring device 3 to rise and fall in the stirring tank 1, so as to avoid solid particles settling at the bottom and uneven humidity.

[0060] In some embodiments, the lifting device can also drive the lifting of different stirring components 32 respectively, so that the different stirring components 32 are at different heights in the stirring tank 1, which is conducive to the uniformity of the humidity of solid particles.

[0061] In the description of this specification, the use of terms such as "an embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. An electrochemical polishing apparatus, characterized in that: include A stirring tank is used to place the workpiece to be polished and solid particles in the stirring tank, which is kept powered on. A liquid adding device is connected to the mixing tank and is used to provide liquid to the mixing tank. A stirring device is disposed in the stirring tank; A detection device for detecting the dryness and humidity in the mixing tank.

2. The electrochemical polishing apparatus according to claim 1, characterized in that: The stirring device includes a driving device and a stirring assembly, and the stirring assembly is connected to the driving device.

3. The electrochemical polishing apparatus according to claim 1, characterized in that: The liquid addition device includes a first water tank, a liquid extraction pipeline, a first main pump, and a liquid injection pipeline. The liquid is placed in the first water tank. The first main pump is connected to the first water tank through the liquid extraction pipeline, and the first main pump is connected to the stirring tank through the liquid injection pipeline.

4. The electrochemical polishing apparatus according to claim 1, characterized in that: The liquid addition device includes a second water tank, a first pipeline, a second main pump, a second pipeline, and multiple branch pipelines. The second water tank is connected to the second main pump through the first pipeline. One end of the second pipeline is connected to the second main pump, and the other end of the second pipeline is connected to multiple branch pipelines. The branch pipelines face the mixing tank.

5. The electrochemical polishing apparatus according to claim 2, characterized in that: The stirring assembly includes a stirring component and a transmission assembly, and the stirring component is connected to the driving device through the transmission assembly.

6. The electrochemical polishing apparatus according to claim 5, characterized in that: The stirring assembly includes multiple stirring components, and the transmission assembly includes a driving gear, a driven gear, a main rotating shaft, and a secondary rotating rod. The driving device is connected to the driving gear through the main rotating shaft, the stirring components are connected to the driven gear through the secondary rotating rod, and the driving gear is connected to the driven gear.

7. The electrochemical polishing apparatus according to claim 5 or 6, characterized in that: The stirring component is provided with multiple rods.

8. The electrochemical polishing apparatus according to claim 4, characterized in that: The branch pipeline is configured as four lines.

9. The electrochemical polishing apparatus according to claim 6, characterized in that: The stirring components are configured in three parts.

10. The electrochemical polishing apparatus according to claim 1, characterized in that: It also includes a lifting device, which is connected to the stirring device.

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