Low-cost signal loop structure and die thereof
By using a design in which the adapter copper block and the third probe share a single PCB board in the probe test socket, the problems of high cost and long cycle of traditional probe test sockets are solved, and a low-cost and easy-to-maintain signal loop structure is achieved.
Patent Information
- Application Number
- CN202423239074.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Traditional probe test sockets require two PCBs to transmit signals when testing chips with pins on the upper and lower surfaces, resulting in high manufacturing costs, long production cycles, and difficult maintenance.
A low-cost signal loop structure is adopted, which uses a copper adapter block and a third probe to share a PCB board to form a signal loop for the upper and lower surface pins, replacing the second PCB board in the prior art.
It achieves cost reduction and shortened production cycle, while its simple structure and easy maintenance solve the problem of high cost of traditional test sockets.
Smart Images
Figure CN223897484U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of signal loop structure of chip tested by probe, specifically related to a low-cost signal loop structure and its mould. BACKGROUND
[0002] With the development of integrated circuit industry, the structure of chip is more and more complex, the position of pin to be measured is more and more non-standard, the pin is distributed on the upper surface and the lower surface of chip, and the test requirement is gradually improved, which puts forward higher requirements for the structure and manufacturing of test seat. The test seat is a key component, and the pins of different positions of chip can be tested by probe to realize signal transmission between tester and chip to be measured.
[0003] When the traditional probe test seat tests the chip with pins on the upper surface and the lower surface, the pins on the upper surface and the lower surface need to be connected by PCB to transmit signals, and two circuits are formed by the upper and lower PCBs to realize signal transmission, so that the manufacturing cost and period of PCB are long, and the maintenance and replacement cost is high. UTILITY MODEL CONTENT
[0004] To overcome the above problems, the utility model aims at providing a low-cost signal loop structure and its mould, which not only has simple structure design and is easy to maintain, but also shortens the manufacturing period and reduces the cost.
[0005] To achieve the above purpose, the utility model adopts the technical scheme of a low-cost signal loop structure, which comprises a PCB, a first probe, a chip and a second probe, one end of the first probe is in contact with the PCB, the other end is in contact with the upper surface pin of the chip, and further comprises a copper block and a third probe, one end of the second probe is in contact with the lower surface pin of the chip, the other end is in contact with the copper block, one end of the third probe is in contact with the copper block, the other end is in contact with the PCB, forming a complete signal loop, and the copper block and the third probe replace the second PCB in the prior art, so that the whole circuit shares one PCB, reducing the cost.
[0006] Preferably, the first probe, the PCB and the upper surface pin of the chip form an upper loop.
[0007] Preferably, the second probe, the lower surface pin of the chip, the copper block, the third probe and the PCB form a lower loop.
[0008] Preferably, the copper block is L-shaped.
[0009] Preferably, the first probe, the second probe and the third probe are probes of the same model or different models.
[0010] Preferably, the adapter copper block adjusts its shape according to the models of the first probe, the second probe and the third probe, so as to adapt to probes of the same model or different models.
[0011] The utility model also provides a low cost signal loop structure mould, including the upper module and lower module of matching, be provided with PCB board, first probe and third probe in the upper module, be provided with second probe, chip and adapter copper block in the lower module, after the upper module and lower module combine, first probe one end and PCB board contact, the other end and chip's upper surface pin contact, second probe one end and chip's lower surface pin contact, the other end and adapter copper block contact, third probe one end and adapter copper block contact, the other end and PCB board contact, form a completed signal loop.
[0012] Preferably, the first probe and the upper surface pin of the chip form an upper loop, and the second probe, the adapter copper block, the third probe and the PCB board form a lower loop, so as to form the entire signal loop.
[0013] Preferably, the adapter copper block is in the shape of L.
[0014] Preferably, the first probe, the second probe and the third probe are probes of the same model or different models, and the adapter copper block adjusts its shape according to the models of the first probe, the second probe and the third probe.
[0015] The utility model has the advantages of simple design, easy maintenance, shortened production period, reduced cost and effectively solved problem of high test cost. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a structural schematic view of the embodiment;
[0017] Figure 2 It is a structural schematic view of the mould of the embodiment;
[0018] Figure 3 It is a structural schematic view of the mould closing of the embodiment.
[0019] In the figure: 1, PCB board; 2, first probe; 3, chip; 4, second probe; 5, adapter copper block; 6, third probe; 7, upper module; 8, lower module. DETAILED DESCRIPTION
[0020] The preferred embodiments of the utility model will be described in detail below with reference to the drawings, so that the advantages and features of the utility model can be more easily understood by those skilled in the art, and the protection scope of the utility model can be more clearly and explicitly defined.
[0021] Referring to Figure 1 As shown in the figure, the embodiment discloses a low-cost signal loop structure, which comprises a PCB board 1, a first probe 2, a chip 3, a second probe 4, a copper adapter 5 and a third probe 6. One end of the first probe 2 is in contact with the PCB board 1, and the other end is in contact with the upper surface pin of the chip 3. One end of the second probe 4 is in contact with the lower surface pin of the chip 3, and the other end is in contact with the copper adapter 5. One end of the third probe 6 is in contact with the copper adapter 5, and the other end is in contact with the PCB board 1, forming a complete signal loop. In the structure, the first probe 2, the PCB board 1 and the upper surface pin of the chip 3 form an upper loop to detect the upper surface pin of the chip 3. The second probe 4, the lower surface pin of the chip 3, the copper adapter 5, the third probe 6 and the PCB board 1 form a lower loop to detect the lower surface pin of the chip 3. The two loops share one PCB board 1.
[0022] The copper adapter 5 is in the shape of L. The first probe 2, the second probe 4 and the third probe 6 are probes of the same model or different models. The copper adapter 5 is adjusted in shape according to the models of the first probe 2, the second probe 4 and the third probe 6, so as to adapt to the probes of the same model or different models.
[0023] Referring to Figures 2-3 As shown in the figure, a low-cost signal loop structure mold comprises a matched upper module 7 and a lower module 8. The upper module 7 is provided with a PCB board 1, a first probe 2 and a third probe 6. The lower module 8 is provided with a second probe 4, a chip 3 and a copper adapter 5. The upper module 7 can be vertically moved and pressed to combine with the lower module 8. After the combination, the first probe 2, the second probe 4 and the third probe 6 are compressed to a test state by an axial force. One end of the first probe 2 is in contact with the PCB board 1, and the other end is in contact with the upper surface pin of the chip 3. One end of the second probe 4 is in contact with the lower surface pin of the chip 3, and the other end is in contact with the copper adapter 5. One end of the third probe 6 is in contact with the copper adapter 5, and the other end is in contact with the PCB board 1, forming a complete signal loop. In the structure, the first probe 2, the PCB board 1 and the upper surface pin of the chip 3 form an upper loop to detect the upper surface pin of the chip 3. The second probe 4, the lower surface pin of the chip 3, the copper adapter 5, the third probe 6 and the PCB board 1 form a lower loop to detect the lower surface pin of the chip 3. The two loops share one PCB board 1. Such a structure can facilitate after-sales maintenance and replacement, reduce production cost and shorten the cycle.
[0024] The adapter copper block 5 is arranged in an L shape, the first probe 2, the second probe 4 and the third probe 6 are probes of the same type or probes of different types, and the adapter copper block 5 adjusts the shape thereof according to the types of the first probe 2, the second probe 4 and the third probe 6 so as to adapt to the probes of the same type or the probes of different types.
[0025] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.
Claims
1. A low-cost signal loop structure, comprising a PCB board, a first probe, a chip, and a second probe, wherein one end of the first probe contacts the PCB board, and the other end contacts a pin on the upper surface of the chip, characterized in that, It also includes a copper adapter block and a third probe. One end of the second probe contacts the pin on the lower surface of the chip, and the other end contacts the copper adapter block. One end of the third probe contacts the copper adapter block, and the other end contacts the PCB board, forming a complete signal loop.
2. The low-cost signal loop structure according to claim 1, characterized in that, The first probe forms an upper loop with the upper surface pins of the PCB board and the chip.
3. The low-cost signal loop structure according to claim 1, characterized in that, The second probe, together with the lower surface pins of the chip, the adapter copper block, the third probe, and the PCB board, forms a lower circuit.
4. The low-cost signal loop structure according to claim 1, characterized in that, The adapter copper block is L-shaped.
5. The low-cost signal loop structure according to claim 1, characterized in that, The first probe, the second probe, and the third probe are either the same type of probe or different types of probes.
6. The low-cost signal loop structure according to claim 5, characterized in that, The shape of the adapter copper block is adjusted according to the model of the first probe, the second probe, and the third probe.
7. A low-cost signal loop structure mold, comprising a matching upper module and a lower module, characterized in that, The upper module contains a PCB board, a first probe, and a third probe. The lower module contains a second probe, a chip, and a copper adapter block. After the upper and lower modules are combined, one end of the first probe contacts the PCB board, and the other end contacts the upper surface pin of the chip. One end of the second probe contacts the lower surface pin of the chip, and the other end contacts the copper adapter block. One end of the third probe contacts the copper adapter block, and the other end contacts the PCB board, forming a complete signal loop.
8. A low-cost signal circuit structure mold according to claim 7, characterized in that, The first probe forms an upper circuit with the PCB board and the upper surface pins of the chip, and the second probe forms a lower circuit with the lower surface pins of the chip, the adapter copper block, the third probe, and the PCB board.
9. A low-cost signal circuit structure mold according to claim 7, characterized in that, The adapter copper block is L-shaped.
10. A low-cost signal circuit structure mold according to claim 9, characterized in that, The first probe, the second probe, and the third probe are probes of the same model or probes of different models, and the shape of the adapter copper block is adjusted according to the model of the first probe, the second probe, and the third probe.