Probe card

Abstract

The utility model provides a probe card, which comprises a PCB (printed circuit board) substrate, a probe module and a clamping structure, and is characterized in that the PCB substrate is provided with a mounting area; the probe module is installed in the installation area and is electrically connected with the PCB substrate. The clamping structure comprises a first clamping piece and a second clamping piece, and the first clamping piece is fixedly connected to the PCB substrate and located on the periphery of the mounting area; the second clamping piece is correspondingly connected with the first clamping piece in a clamping manner, and the second clamping piece has a first state and a second state; when the second clamping member is in the first state, the second clamping member compresses the probe module so as to fix the probe module in the installation area. And when the second clamping piece is in the second state, the second clamping piece relieves the pressing of the probe module so as to restore the free state of the probe module on the mounting area. According to the utility model, the technical problems that the replacement operation of the probe module on the existing probe card is inconvenient and the replacement efficiency is low can be solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor probe card technology, and specifically to a probe card. Background Technology

[0002] A probe card is a testing device used for wafer inspection. It transmits the test signal from the tester to the object under test and sends the response signal from the object under test back to the tester, thereby enabling chip performance testing. When used with other testing and analysis instruments, it can perform comprehensive testing of chip quality and performance, screen out defective products, and reduce unnecessary packaging costs.

[0003] Because the required probe spacing, number of probes, and probe distribution vary depending on the wafer being tested, the probe module and the product under test are matched accordingly, and each probe module can only test one type of product. In existing probe cards, the probe module is typically fixed to the PCB substrate with bolts. When replacing the probe module, a torque screwdriver and a special fixture are required for installation, resulting in inconvenient and inefficient probe module replacement. Utility Model Content

[0004] In view of the problems existing in the prior art, the present invention provides a probe card to improve the technical problems of inconvenient operation and low replacement efficiency of probe module replacement on existing probe cards.

[0005] To achieve the above and other related objectives, this utility model provides a probe card, which includes: a PCB substrate, a probe module, and a snap-fit ​​structure. The PCB substrate has a mounting area; the probe module is mounted in the mounting area and electrically connected to the PCB substrate; the snap-fit ​​structure includes: a first snap-fit ​​member and a second snap-fit ​​member, the first snap-fit ​​member being fixedly connected to the PCB substrate and located on the outer periphery of the mounting area; the second snap-fit ​​member being correspondingly snap-fit ​​connected to the first snap-fit ​​member, and the second snap-fit ​​member having a first state and a second state; wherein, when the second snap-fit ​​member is in the first state, the second snap-fit ​​member presses the probe module to fix the probe module in the mounting area; when the second snap-fit ​​member is in the second state, the second snap-fit ​​member releases the pressure on the probe module to restore the probe module to a free state in the mounting area.

[0006] In one embodiment of the present invention, the snap-fit ​​structure further includes a connecting plate, which is fixedly mounted on the PCB substrate and has a through hole for the probe module to pass through; the first snap-fit ​​component is fixedly mounted on the fixed connecting plate.

[0007] In one embodiment of the present invention, the first snap-fit ​​component includes a first rotating part and a first snap-fit ​​part, which are respectively disposed on both sides of the mounting area; the second snap-fit ​​component includes a second rotating part and a second snap-fit ​​part, which are rotatably connected to the first rotating part and snap-fitted to the first snap-fit ​​part.

[0008] In one embodiment of this utility model, the first rotating part includes a bushing fixed to a connecting plate, and the second rotating part includes a rod rotatably connected to the bushing. The first engaging part includes a hook with its opening facing downwards, and the second engaging part includes a lever. When the first engaging part and the second engaging part are engaged with each other, the lever engages with the hook from its opening.

[0009] In one embodiment of this utility model, the rotation axis between the second rotating part and the first rotating part is perpendicular to the rotation axis of the PCB substrate.

[0010] In one embodiment of the present invention, the second snap-fit ​​component further includes a plurality of pressure feet for pressing the probe module. The plurality of pressure feet are disposed between the second rotating part and the second snap-fit ​​part and are arranged circumferentially around the probe module.

[0011] In one embodiment of the present invention, the first snap-fit ​​component further includes a snap-fit ​​body, which is a metal ring structure. Along the circumferential direction of the snap-fit ​​body, the metal ring is bent toward the axis in its radial direction to form a U-shaped bending section, and the U-shaped bending section forms a pressure foot.

[0012] In one embodiment of this utility model, the outer periphery of the probe module is provided with multiple grooves, and each pressure foot is correspondingly engaged in a groove.

[0013] In one embodiment of this utility model, a boss is provided on the side of the PCB substrate facing the probe module, and a connecting plate is mounted on the boss, with the boss and the connecting plate being coaxially arranged.

[0014] In one embodiment of this utility model, the thickness of the connecting plate is h1, the free engagement distance of the snap-fit ​​structure is h2, and after the probe module is installed on the PCB substrate, the measured net height between the bottom wall of the groove and the boss is h3, and h1+h2≤h3.

[0015] In one embodiment of this utility model, the axis of the mounting area and the axis of the connecting plate both coincide with the axis of the PCB substrate.

[0016] In one embodiment of this utility model, an insulating groove is provided on the outer periphery of the installation area.

[0017] In one embodiment of this utility model, the mounting plate covers the opening of the insulating trench.

[0018] This invention relates to a probe clip, which, through a snap-fit ​​structure, allows the second snap-fit ​​member to press against the probe module in a first state, engaging with the first snap-fit ​​member, thus securing the probe module to the mounting area. Conversely, when the second snap-fit ​​member is in a second state, open from the first snap-fit ​​member, it releases the pressure on the probe module, restoring its free position in the mounting area. This design simplifies probe module replacement; simply controlling the snap-fit ​​or open-close mechanism between the second and first snap-fit ​​members allows for switching between the first and second states, thereby controlling the pressing or releasing of the probe module against the PCB substrate. This facilitates connection or removal of the probe module from the PCB substrate. The entire installation process eliminates the need for torque wrenches or specialized tools, simplifying probe module replacement and improving efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the probe card when the probe module is pressed by the snap-fit ​​structure in one embodiment of the present invention;

[0021] Figure 2 for Figure 1 A magnified view of a portion of region A in the middle;

[0022] Figure 3 This is a schematic diagram of the overall three-dimensional structure of the probe card in the open state of the snap-fit ​​structure in one embodiment of the present invention;

[0023] Figure 4 for Figure 3 A magnified view of a portion of region B in the middle;

[0024] Figure 5 This is a schematic diagram of the PCB substrate in one embodiment of the present invention;

[0025] Figure 6 This is a side view of a PCB substrate in one embodiment of the present invention;

[0026] Figure 7 This is an exploded view of the components between the PCB substrate and the probe module in one embodiment of the present invention;

[0027] Figure 8This is a schematic diagram of the structure of the PCB substrate and probe module after the snap-fit ​​structure is removed in one embodiment of the present invention;

[0028] Figure 9 This is a schematic diagram of the probe module in one embodiment of the present invention;

[0029] Figure 10 This is a schematic diagram of the structure of the first and second snap-fit ​​components in an engaged state according to an embodiment of the present invention;

[0030] Figure 11 This is a schematic diagram of the structure of the first and second snap-fit ​​components in the open state in one embodiment of the present invention;

[0031] Figure 12 This is a schematic diagram of the first snap-fit ​​component installed on the connecting plate in one embodiment of the present invention;

[0032] Figure 13 This is a schematic diagram of the structure of the second snap-fit ​​component according to an embodiment of the present invention;

[0033] Figure 14 This is a top view of the probe module being pressed by the snap-fit ​​structure in one embodiment of the present invention;

[0034] Figure 15 for Figure 14 A cross-sectional view along the CC direction;

[0035] Figure 16 for Figure 15 A magnified view of a portion of region D in the middle;

[0036] Figure 17 This is a partial structural diagram of the probe module mounted on a PCB substrate in one embodiment of the present invention;

[0037] Figure 18 This is a schematic diagram of the structure of the snap-fit ​​structure when it is not pressed tightly against the probe module in one embodiment of the present invention.

[0038] Component designation explanation:

[0039] 100. Probe card; 110. PCB substrate; 111. Mounting area; 1111. Cavity; 112. Boss; 113. Insulating trench; 114. Grip; 120. Probe module; 121. Groove; 122. Probe mounting base; 123. Probe; 130. Snap-fit ​​structure; 131. First snap-fit ​​component; 1311. First rotating part; 1312. First snap-fit ​​part; 1313. Bushing; 1314. Hook; 132. Second snap-fit ​​component; 1321. Second rotating part; 1322. Second snap-fit ​​part; 1323. Presser foot; 1324. Rod; 1325. Snap-fit ​​body; 1326. Lever; 133. Connecting plate. Detailed Implementation

[0040] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. It should also be understood that the terminology used in the embodiments of this utility model is for describing specific implementation schemes and not for limiting the scope of protection of this utility model. Test methods in the following embodiments that do not specify specific conditions are generally performed under conventional conditions or according to the conditions recommended by the respective manufacturers.

[0041] When numerical ranges are given in the embodiments, it should be understood that, unless otherwise specified in this invention, both endpoints of each numerical range and any value between the two endpoints may be selected. Unless otherwise defined, all technical and scientific terms used in this invention, as well as the prior art known to those skilled in the art and the description of this invention, may be implemented using any prior art methods, equipment, and materials similar to or equivalent to those in the embodiments of this invention.

[0042] It should be noted that the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as within the scope of implementation of this utility model.

[0043] Please see Figures 1 to 18 This invention provides a probe card 100. The probe card 100 utilizes a snap-fit ​​structure 130 on a PCB substrate 110. By controlling the snap-fit ​​structure 130 to engage or disengage, the probe module 120 and the PCB substrate 110 can be pressed together or released, thus enabling connection or removal between them. The entire installation process does not require an additional torque wrench or special tools, thereby facilitating the replacement of the probe module 120 on the PCB substrate 110 and improving replacement efficiency.

[0044] Please see Figure 1 , Figure 5 , Figure 7 and Figure 8The probe card 100 of this utility model includes a PCB substrate 110, a probe module 120, and a snap-fit ​​structure 130. A mounting area 111 is provided on one side of the PCB substrate 110, and a cavity 1111 is provided within the mounting area 1111. A wire (not shown in the figure) for electrical connection with the probe module 120 is disposed within the cavity 1111. The probe module 120 is mounted in the mounting area 111, and the connection points on the probe module 120 are electrically connected to the wire within the cavity 1111. It should be noted that the arrangement structure of the wire in the mounting area 111, and the specific structure of the electrical connection between the wire and the probe module 120, can refer to the existing electrical connection structure between the PCB substrate 110 and the probe module 120, and will not be repeated here. The mounting area 111 can be located in the central region of the PCB substrate 110 or in the outer peripheral region of the PCB substrate 110. The PCB substrate 110 can be any shape that meets the usage requirements, such as a rectangular plate structure, a disc-shaped structure, or a polygonal structure. Optionally, in this embodiment, the PCB substrate 110 has an approximately disk-shaped structure. To facilitate the placement and removal of the PCB substrate 110, a gripping portion 114 is also provided on the side of the PCB substrate 110 facing away from the probe module 120, such as... Figure 6 As shown. In order to facilitate the positioning of the mounting area 111 on the PCB substrate 110, preferably, in this embodiment, the mounting area 111 is coaxially arranged with the PCB substrate 110, that is, the mounting area 111 is located at the center of the PCB substrate 110, that is, the axis of the mounting area 111 coincides with the axis of the PCB substrate 110.

[0045] Please see Figures 7 to 9The probe module 120 has an overall cylindrical structure and specifically includes multiple probes 123 and a probe mounting base 122 for mounting the probes 123. The probes 123 extend towards the probe mounting base 122 in the height direction for wafer testing. In other embodiments, the probe module 120 can also have other shapes, such as cuboids or polygonal shapes, depending on the testing requirements of the probes 123. The surface of the probe mounting base 122 facing away from the probes 123 is attached to the surface of the mounting area 111 to achieve electrical connection between the probes 123 and the PCB substrate 110. There are various ways to achieve electrical connection between the probes 123 and the PCB substrate 110. In this embodiment, the probe mounting base 122 has multiple rigid metal contacts on the surface facing away from the probes 123, and these rigid metal contacts are electrically connected to the probes 123. The mounting area 111 has multiple elastic metal contacts on the side facing the probe module 120, and these elastic metal contacts are connected to the conductive areas around the PCB substrate 110. When the surface of the probe mounting base 122 facing away from the probe 123 is in contact with the surface of the mounting area 111, the rigid metal contact and the elastic metal contact abut against each other, causing the elastic metal contact to undergo downward elastic deformation. Under the action of elastic force, the rigid metal contact and the elastic metal contact always maintain contact, thereby realizing the electrical connection between the probe 123 and the PCB substrate 110. In other embodiments, the probe mounting base 122 may have multiple pins on the surface facing away from the probe 123, and the PCB substrate 110 may have multiple insertion holes in the mounting area 111, with one insertion hole corresponding to one pin. When the surface of the probe mounting base 122 facing away from the probe 123 is in contact with the surface of the mounting area 111, the pin-type electrical connection between the probe 123 and the PCB substrate 110 is realized by inserting the pin into the insertion hole.

[0046] Please see Figures 2 to 4 The snap-fit ​​structure 130 includes a first snap-fit ​​member 131 and a second snap-fit ​​member 132. The first snap-fit ​​member 131 and the second snap-fit ​​member 132 are snap-fitted together. There are several ways the first snap-fit ​​member 131 and the second snap-fit ​​member 132 can be snap-fitted together. For example, one of the first snap-fit ​​member 131 and the second snap-fit ​​member 132 may have a downward-facing slot, while the other has a locking rod. The locking rod engages with the slot from below, securing the member within the slot and thus achieving the snap-fit ​​connection between the first snap-fit ​​member 131 and the second snap-fit ​​member 132. Alternatively, one of the first snap-fit ​​member 131 and the second snap-fit ​​member 132 may have a groove, while the other has a protrusion. The protrusion elastically deforms and engages with the groove, securing the protrusion within the groove and thus achieving the snap-fit ​​connection between the first snap-fit ​​member 131 and the second snap-fit ​​member 132.

[0047] The first latching member 131 is fixedly connected to the side of the PCB substrate 110 where the mounting area 111 is provided, and is located on the outer periphery of the mounting area 111. The first latching member 131 can be directly fixed to the PCB substrate 110, or it can be indirectly fixed to the PCB substrate 110 through other connectors. The fixing method is not limited, for example, it can be fixed by screws or by adhesive. The second latching member 132 has a first state in which it is engaged with the first latching member 131 and a second state in which it is open from the first latching member 131. When the second latching member 132 is in the first state (e.g., Figure 2 As shown, the second snap-fit ​​member 132 presses against the probe module 120 to fix the probe module 120 to the mounting area 111. When the probe module 120 is fixed to the mounting area 111, the probe module 120 achieves an electrical connection with the mounting area 111 by pressing against the mounting area 111.

[0048] To ensure that the second snap-fit ​​132 effectively presses against the probe module 120 and prevents loosening during operation, optionally, in one embodiment of this utility model, please refer to... Figures 14 to 18 Dimension h1 represents the thickness of the connecting plate 133, and dimension h2 represents the free engagement spacing of the snap-fit ​​structure 130. The free engagement spacing here refers to the distance between the snap-fit ​​structure 130 in the height direction (e.g., when the snap-fit ​​structure 130 is not installed on the PCB substrate 110, and the first snap-fit ​​member 131 and the second snap-fit ​​member 132 are engaged). Figure 18 The engagement spacing formed on the Z-axis (as shown in the middle) is as follows: Figure 18 As shown in dimension h2. Dimension h3 is the measured net height between the bottom wall of the groove 121 of the probe mounting base 122 and the boss 112 on the PCB substrate 110 after the probe module 120 is mounted to the PCB substrate 110, as shown in the figure. Figure 17 The intermediate dimension h3 is shown. The relationship between h1, h2, and h3 should satisfy the condition: h1 + h2 ≤ h3.

[0049] Since the second snap-fit ​​component 132 is an elastic body with bent metal wire, during the clamping assembly, the dimensional difference generated by h1+h2≤h3 can form an interference fit in the clamping direction. The second snap-fit ​​component 132 absorbs this interference fit through elastic deformation, and the elastic restoring force continues to act on the contact surface between the probe module 120 and the PCB substrate 110. The clamping force generated thereby can effectively suppress the problem of clamping force failure caused by external forces such as vibration and collision during operation, and thus effectively ensure the stability of the clamping of the probe module 120 by the second snap-fit ​​component 132, thereby ensuring the stability of the electrical connection between the probe module 120 and the PCB substrate 110 below.

[0050] When the second connector 132 is in the second state (e.g.) Figure 4As shown, the second latch 132 disengages from the probe module 120, thus releasing the clamping force on the probe module 120 and restoring it to a free state on the mounting area 111. It should be noted that the free state of the probe module 120 on the mounting area 111 means that when the probe module 120 is placed on the surface of the mounting area 111, it is not fixed to the mounting area 111 in either the axial or radial directions; that is, it is in a free state. In this state, the probe module 120 can be directly removed from the mounting area 111 to complete the removal operation between the probe module 120 and the PCB substrate 110.

[0051] By setting up the snap-fit ​​structure 130, when the probe module 120 needs to be replaced, it is only necessary to control the snap-fit ​​between the second snap-fit ​​132 and the first snap-fit ​​131 to switch between the first and second states, thereby achieving the clamping or loosening between the probe module 120 and the PCB substrate 110, thus facilitating the connection or removal between the probe module 120 and the PCB substrate 110. During the entire installation process, no additional torque wrench or special tools are required, thus simplifying the replacement operation of the probe module 120 and improving replacement efficiency. Simultaneously, since the engagement position between the first snap-fit ​​131 and the second snap-fit ​​132 is relatively fixed, the clamping force exerted by the second snap-fit ​​132 on the probe module 120 is relatively stable each time, thereby reducing the probability of poor contact between the probe module 120 and the PCB substrate 110 due to changes in clamping force, which could lead to abnormal test data or damage to the probe card 100.

[0052] Although the first connector 131 can also be directly fixed to the PCB substrate 110, considering the connection strength and ease of connection of the first connector 131, it is preferable to refer to [the following text is missing]. Figure 3 , Figure 4 , Figure 5 and Figure 10In one embodiment of this utility model, the snap-fit ​​structure 130 further includes a connecting plate 133. The connecting plate 133 is fixedly installed on the side of the PCB substrate 110 where the mounting area 111 is provided, and the connecting plate 133 has a through hole 1331 for the probe module 120 to pass through. The connecting plate 133 can be fixedly connected to the PCB substrate 110 by screws or by adhesive bonding. The first snap-fit ​​member 131 is fixedly installed on the connecting plate 133 to achieve an indirect fixed connection between the first snap-fit ​​member 131 and the PCB substrate 110. The fixing method between the first snap-fit ​​member 131 and the connecting plate 133 is not limited. For example, the first snap-fit ​​member 131 can be integrally formed on the connecting plate 133, or it can be fixedly connected to the connecting plate 133 by screws, etc. The shape of the connecting plate 133 is not limited. It can be any shape such as disc, rectangle, or polygon. The material of the connecting plate 133 can be metal or plastic, etc., as long as the connection strength requirements are met. Preferably, in this embodiment, the connecting plate 133 has a disc structure. The connecting plate 133 can be coaxially arranged with the PCB substrate 110 or not. To facilitate the positioning and installation of the connecting plate 133 on the PCB substrate 110, preferably, in this embodiment, the connecting plate 133 is coaxially arranged with the PCB substrate 110, that is, the axis of the connecting plate 133 coincides with the axis of the PCB substrate 110. The shape of the through hole 1331 on the connecting plate 133 can be a circular hole structure consistent with the shape of the probe module 120, or it can be a square hole structure, as long as the probe module 120 can pass through. To facilitate the positioning and processing of the through hole 1331 on the mounting plate, preferably, in this embodiment, the through hole 1331 is a circular hole structure, and the through hole 1331 is coaxially arranged with the connecting plate 133.

[0053] By setting the connecting plate 133, the first card connector 131 can be fixedly connected to the PCB substrate 110 through the connecting plate 133. This setting reduces the restrictions on the connection method of the first card connector 131 and facilitates the connection of the first card connector 131. At the same time, the setting of the connecting plate 133 can also locally increase the support strength and support stiffness of the PCB substrate 110, which helps to reduce the probability of deformation of the PCB substrate 110 during use, thereby improving the stability of the wafer testing accuracy of the probe 123.

[0054] In one embodiment of this utility model, please refer to Figure 4 , Figure 10 , Figure 11 , Figure 12 and Figure 13The first snap-fit ​​component 131 includes a first rotating portion 1311 and a first snap-fit ​​portion 1312. Both the first rotating portion 1311 and the first snap-fit ​​portion 1312 are fixedly disposed on the connecting plate 133, and are respectively disposed on both sides of the mounting area 111 along the radial direction of the connecting plate 133. The second snap-fit ​​component 132 includes a snap-fit ​​body 1325, a second rotating portion 1321, and a second snap-fit ​​portion 1322. Both the second rotating portion 1321 and the second snap-fit ​​portion 1322 are fixedly connected to the snap-fit ​​body 1325. When the second snap-fit ​​component 132 and the first snap-fit ​​component 131 are engaged, such as... Figure 10 As shown, the snap-fit ​​body 1325 extends at least partially above the through hole 1331 and presses against the outer edge of the probe module 120 to fix the probe module 120 to the mounting area 111, as... Figure 2 As shown. The second rotating part 1321 is rotatably connected to the first rotating part 1311, and the second snap-fit ​​part 1322 is snap-fitted to the first snap-fit ​​part 1312. There are various ways to rotatably connect the first rotating part 1311 and the second rotating part 1321. For example, one of the first rotating part 1311 and the second rotating part 1321 can be a pin hole, and the other can be a pin shaft, which is rotatably inserted into the pin hole to achieve the rotatable connection between the first rotating part 1311 and the second rotating part 1321. Alternatively, the second rotating part 1321 and the first rotating part 1311 can be hinged together, etc.

[0055] Optionally, in this embodiment, please refer to Figures 10 to 13 The first rotating part 1311 includes a bushing 1313, which can be one or more. In this embodiment, two bushings 1313 are provided, and the two bushings 1313 are coaxially arranged. Both bushings 1313 are fixed to the connecting plate 133. The second rotating part 1321 includes a rod 1324, which can be one or more. In this embodiment, two rods 1324 are provided, and both rods 1324 are connected to the snap-fit ​​body 1325. The two rods 1324 are rotatably connected to the two bushings 1313, thereby realizing the rotatable connection between the first rotating part 1311 and the second rotating part 1321. The first snap-fit ​​part 1312 includes a hook 1314, which is fixedly connected to the connecting plate 133, and the opening of the hook 1314 faces downward. The second latching part 1322 includes levers 1326, and the number of levers 1326 is the same as the number of hooks 1314. The levers 1326 are connected to the latching body 1325. When the first latching member 131 and the second latching member 132 are engaged with each other, the levers 1326 are engaged from the opening into the hooks 1314 and fixed in the hooks 1314, so that the latching body 1325 keeps pressing against the probe module 120.

[0056] With this configuration, when the probe module 120 needs to be replaced, the first latching part 1312 and the second latching part 1322 are opened, and the latching body 1325 is moved along the rotation direction of the first rotating part 1311 and the second rotating part 1321 until the second latching part 132 is completely disengaged from the probe module 120. Then, the probe module 120 is removed from the mounting area 111, completing the removal of the probe module 120. When a new probe module 120 needs to be placed back on the mounting area 111, the latching body 1325 is rotated again in the opposite direction until it is in the pressing position of the probe module 120. The first latching part 1312 and the second latching part 1322 are then engaged again, so that the latching body 1325 presses against the probe module 120, thus completing the re-fixing and installation of the probe module 120. Because of the presence of a first rotating part 1311 and a second rotating part 1321, when the second locking member 132 switches between the first and second states, it does not need to be completely removed from the first locking member 131; they only need to rotate relative to each other. This facilitates the opening and closing of the first locking member 131 and the second locking member 132, making operation convenient.

[0057] In other embodiments, the bushing 1313 may be disposed on the snap-fit ​​body 1325, and the rod 1324 that rotatably engages with the bushing 1313 may be disposed on the connecting plate 133. The hook 1314 may be disposed on the snap-fit ​​body 1325, and the lever 1326 that engages with the hook 1314 may be disposed on the connecting plate 133.

[0058] Provided that the switching position requirement of the second latching member 132 between the first and second states is met, the rotation direction between the first rotating part 1311 and the second rotating part 1321 is not specifically limited, but preferably, please refer to Figure 3 , Figure 10 and Figure 11 In one embodiment of this utility model, the rotation axis between the second rotating part 1321 and the first rotating part 1311 is perpendicular to the rotation axis of the PCB substrate 110. With this configuration, when the second latching member 132 is opened or closed relative to the first latching member 131, the latching body 1325 will move away from or closer to the probe module 120 along the height direction of the probe module 120. This makes it easier for the latching body 1325 to loosen or tighten the probe module 120 in the height direction.

[0059] In one embodiment of this utility model, please refer to Figure 2 , Figure 10 and Figure 13The snap-fit ​​body 1325 includes multiple pressure feet 1323 that press against the probe module 120. These pressure feet 1323 are disposed between the second rotating part 1321 and the second snap-fit ​​part 1322. When the first snap-fit ​​member 131 and the second snap-fit ​​member 132 are engaged, the multiple pressure feet 1323 are arranged circumferentially around the probe module 120, forming multiple pressing and fixing points on the outer periphery of the probe module 120. This allows for the formation of multiple pressing points in the circumferential direction of the probe module 120, which is more conducive to improving the pressing stability of the probe module 120, thereby improving the stability of the electrical connection between the probe 123 and the PCB substrate 110.

[0060] Multiple pressure feet 1323 can be evenly arranged or unevenly arranged along the circumference of the snap-fit ​​body 1325, as long as they can stably and reliably press the probe module 120 onto the PCB substrate 110. The specific structure of the pressure feet 1323 is not limited; they can be a pressing sheet structure, a pressing ring structure, or any other structure capable of pressing the probe module 120. Optionally, in this embodiment, please refer to... Figure 13 The snap-fit ​​body 1325 is a metal ring structure formed by bending iron wire, and the main body of the metal ring structure is an approximately circular structure. In the circumferential direction of the snap-fit ​​body 1325, the iron wire at the corresponding position is bent towards the axis along the radial direction of the metal ring to form a U-shaped bend, which forms the pressure foot 1323. Multiple pressure feet 1323 are arranged in a circumferential array along the metal ring. This arrangement can generate a more uniform and stable clamping force in the circumferential direction of the probe module 120.

[0061] In one embodiment of this utility model, please refer to Figure 2 and Figure 9 The probe mounting base 122 has multiple grooves 121 on its outer periphery. The positions of the grooves 121 correspond to the positions of the pressure feet 1323, and the shapes of the grooves 121 and pressure feet 1323 match. Each pressure foot 1323 is engaged in a corresponding groove 121. Specifically, in this embodiment, the groove 121 is a U-shaped groove structure that matches the shape of the pressure foot 1323. By providing grooves 121 on the probe mounting base 122 and engaging the pressure feet 1323 in the grooves 121, the probe module 120 can be pressed by the pressure feet 1323, achieving axial positioning of the probe module 120 relative to the mounting area 111. At the same time, the engagement with the grooves 121 also achieves circumferential positioning of the probe module 120 relative to the mounting area 111. This reduces the probability of rotation of the probe module 120 during use and further improves the mounting stability of the probe module 120 on the PCB substrate 110.

[0062] To facilitate the installation of the connecting plate 133 on the PCB substrate 110, optionally, in one embodiment of this utility model, please refer to... Figure 1 and Figure 5 A boss 112 is provided on the side of the PCB substrate 110 facing the probe module 120. The connecting plate 133 is mounted on the boss 112, and the boss 112 and the connecting plate 133 are coaxially arranged. By providing the boss 112, the processing area of ​​the mounting surface on the PCB substrate 110 can be reduced, effectively reducing processing costs. At the same time, it can better ensure the contact state between the connecting plate 133 and the PCB substrate 110, thereby making the clamping of the pressure foot 1323 on the probe module 120 more stable. Furthermore, the provision of the boss 112 can further increase the local support strength and support stiffness of the PCB substrate 110, which helps to reduce the probability of deformation of the PCB substrate 110 during use, thereby better ensuring the detection accuracy of the probe 123 on the wafer.

[0063] In one embodiment of this utility model, please refer to Figure 5 and Figure 15 An insulating trench 113 is provided on the outer periphery of the mounting area 111. The insulating trench 113 includes an inner trench wall and an outer trench wall arranged coaxially. The outer peripheral surface of the mounting area 111 forms the inner trench wall of the insulating trench 113, and an isolation space is formed between the inner trench wall and the outer trench wall. The depth of the insulating trench 113 is unlimited along the thickness direction of the PCB substrate 110, based on the design basis of meeting the support strength of the PCB and the insulation requirements of the mounting area 111. By setting the insulating trench 113, additional physical isolation can be formed on the PCB substrate 110, further enhancing the insulation performance between the mounting area 111 and other areas on the PCB substrate 110, reducing the probability of electrical short circuits between different areas, thereby further improving the testing stability of the probe module 120 on the connection area.

[0064] In one embodiment of this utility model, please refer to Figure 5 and Figure 15 The mounting plate covers the opening of the insulating trench 113. The mounting plate is positioned above the insulating trench 113. The diameter of the through hole 1331 on the connecting plate 133 matches the outer diameter of the probe mounting base 122. Therefore, in the radial direction, the connecting plate 133 extends above the opening of the insulating trench 113, covering the opening of the insulating trench 113. By having the connecting plate 133 cover the opening of the insulating trench 113, the probability of dust and impurities falling into the insulating trench 113 is reduced, thereby ensuring the insulation performance of the insulating trench 113.

[0065] This invention relates to a probe clip, which, through a snap-fit ​​structure, allows the second snap-fit ​​member to press against the probe module in a first state, engaging with the first snap-fit ​​member, thus securing the probe module to the mounting area. Conversely, when the second snap-fit ​​member is in a second state, open from the first snap-fit ​​member, it releases the pressure on the probe module, restoring its free position in the mounting area. This design simplifies probe module replacement; simply controlling the snap-fit ​​or open-close mechanism between the second and first snap-fit ​​members allows for switching between the first and second states, thereby enabling the probe module to be pressed against or released from the PCB substrate. This facilitates connection and removal of the probe module from the PCB substrate. The entire installation process eliminates the need for torque wrenches or specialized tools, simplifying probe module replacement and improving efficiency. Therefore, this invention effectively overcomes some practical problems in existing technologies, demonstrating significant utility and application value.

[0066] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A probe card, characterized in that, include: A PCB substrate, wherein the PCB substrate has a mounting area; A probe module is installed in the mounting area and is electrically connected to the PCB substrate. The snap-fit ​​structure includes: The first connector is fixedly connected to the PCB substrate and is located on the outer periphery of the mounting area; The second connector is connected to the first connector via a snap-fit, and the second connector has a first state and a second state. When the second latch is in the first state, the second latch presses against the probe module to fix the probe module to the mounting area; when the second latch is in the second state, the second latch releases the pressure on the probe module to restore the probe module to its free state in the mounting area.

2. The probe card according to claim 1, characterized in that, The snap-fit ​​structure further includes a connecting plate, which is fixedly mounted on the PCB substrate and has a through hole for the probe module to pass through; the first snap-fit ​​component is fixedly mounted on the connecting plate.

3. The probe card according to claim 2, characterized in that, The first snap-fit ​​component includes a first rotating part and a first snap-fit ​​part, which are respectively disposed on both sides of the mounting area; the second snap-fit ​​component includes a second rotating part and a second snap-fit ​​part, which are rotatably connected to the first rotating part and snap-fitted to the first snap-fit ​​part.

4. The probe card according to claim 3, characterized in that, The first rotating part includes a bushing, which is fixed to the connecting plate. The second rotating part includes a rod, which is rotatably connected to the bushing. The first locking part includes a hook with its opening facing downwards. The second locking part includes a lever. When the first locking part and the second locking part are engaged with each other, the lever is engaged into the hook from the opening.

5. The probe card according to claim 3, characterized in that, The axis of rotation between the second rotating part and the first rotating part is perpendicular to the axis of rotation of the PCB substrate.

6. The probe card according to claim 3, characterized in that, The second snap-fit ​​component further includes a plurality of pressure feet for pressing the probe module. The plurality of pressure feet are disposed between the second rotating part and the second snap-fit ​​part and are arranged circumferentially around the probe module.

7. The probe card according to claim 6, characterized in that, The first snap-fit ​​component also includes a snap-fit ​​body, which is a metal ring structure. Along the circumference of the snap-fit ​​body, the metal ring is bent toward the axis in its radial direction to form a U-shaped bend, and the U-shaped bend forms the pressure foot.

8. The probe card according to claim 6, characterized in that, The probe module has multiple grooves on its outer periphery, and each pressure foot is correspondingly engaged in one of the grooves.

9. The probe card according to claim 8, characterized in that, The PCB substrate has a boss on the side facing the probe module, and the connecting plate is mounted on the boss, with the boss and the connecting plate being coaxially arranged.

10. The probe card according to claim 9, characterized in that, The thickness of the connecting plate is h1, the free engagement spacing of the snap-fit ​​structure is h2, and after the probe module is installed on the PCB substrate, the measured net height between the bottom wall of the groove and the boss is h3, and h1+h2≤h3.

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