Domain controller and movable platform

Abstract

The domain controller comprises a first shell and a second shell which define a containing cavity, and a mounting groove is formed in the inner wall of the first shell; the soaking plate is arranged in the containing cavity and provided with an elastic piece, and the elastic piece can be arranged in the mounting groove; the circuit board is arranged in the containing cavity and provided with a chip, and the vapor chamber is located between the first shell and the circuit board; and the fastening piece is connected with the first shell, the circuit board and the second shell, the elastic piece is compressed in the mounting groove, and the vapor chamber is pressed on the chip under the action of the elastic piece. The utility model further provides a movable platform. According to the domain controller provided by the invention, the pre-pressure formed on the chip by the vapor chamber is only related to the elastic modulus of the elastic piece, and the processing error of each component is strictly controlled, so that the pre-pressure formed on the chip by the vapor chamber is fixed, and the pre-pressure is not similar to the pre-pressure formed on the chip in the prior art. The heat dissipation effect is reduced due to the fact that the soaking plate does not tightly press the chip or the welding spot is broken due to the fact that the pressure on the chip is too large.

Description

Technical Field

[0001] This utility model relates to the field of domain controller manufacturing, and more particularly to a domain controller with a heat dissipation housing, and a method for manufacturing the domain controller. Background Technology

[0002] Currently, domain controllers (or electronic devices) consist of one or more chips mounted on a PCB. As chip performance improves, the heat generated by the chips also increases; therefore, domain controllers typically have heat dissipation structures to ensure that the PCB and chips can function properly.

[0003] Chinese utility model patent with publication number CN217280746U discloses a heat dissipation structure for a chip (such as...). Figure 1 As shown, the circuit board 600 includes a circuit board 600 and a chip 500 disposed thereon, with a heat-conducting mechanism filling the space between the chip 500 and the housing 100. This heat-conducting mechanism includes a connecting assembly 700, and a first heat-conducting layer 400, a metal heat transfer element 300, and a second heat-conducting layer 200 stacked sequentially. The metal heat transfer element 300 is fixed to the circuit board 600 by the connecting assembly 700 (including a pin 701 and an elastic element 702). The drawback of this heat dissipation structure is that:

[0004] 1. The metal heat transfer component 300 and the circuit board 600 are connected by a pin 701 and an elastic component 702. The number of rotations of the nut at the end of the pin 701 determines the compression of the elastic component 702, which in turn determines the compression of the first heat-conducting layer 400. Different numbers of nut rotations result in the first heat-conducting layer 400 not pressing the chip 500 tightly or applying excessive pressure to the chip 500, making it difficult to maintain consistency during assembly.

[0005] 2. A flexible second thermally conductive layer 200 (graphene foam) is added between the metal heat transfer component 300 and the outer shell 100. Graphene foam itself has good surface thermal conductivity, but its thermal conductivity along its thickness direction is poor. If the compression is small, the overall heat dissipation performance will be significantly reduced. It is difficult to control the compression of the second thermally conductive layer 200 (graphene foam) by rotating the nut at the end of the pin 701, and this makes it even more difficult to control the pre-pressure applied to the chip 500, further increasing the difficulty of maintaining consistency.

[0006] 3. The assembly process is complicated. The metal heat transfer component 300 and the circuit board 600 need to be connected first by the pin 701 and the elastic component 702, and then they need to be connected to the outer shell 100, which is not conducive to assembly on an automated production line.

[0007] Chinese invention patent application CN118250968A discloses an electronic device (such as...). Figure 2As shown), the device includes a heat dissipation housing (with a top cover 14 and a base 15), a circuit board 2, and a chip 3, as well as a heat-conducting component 5 and an elastic component 6. To further reduce the gap between the chip 3 and the heat-conducting component 5, a thermal interface material layer 4 is also filled between them. The elastic component 6 includes a spring 61 and a heat pipe 62. The spring 61 is compressed between the heat-conducting component 5 and the first housing wall 11 to reduce the gap between the chip 3 and the heat-conducting component 5, while the heat pipe 62 connects the heat-conducting component 5 and the first housing wall 11 to transfer the heat absorbed by the heat-conducting component 5 from the chip 3 to the heat dissipation housing 1. The heat pipe 62 also has a certain degree of elasticity when compressed between the heat-conducting component 5 and the first housing wall 11. The drawback of this electronic device is:

[0008] 1. The heat-conducting component 5 is pressed against the chip 3 by the elastic force provided by the spring 61 and the heat pipe 62. However, the pressure between the heat-conducting component 5 and the chip 3 is uneven, which leads to uneven thickness of the thermal interface material layer 4. This causes the local hot spot temperature of some high-power chips to exceed the standard, making it difficult to maintain consistency during the assembly process.

[0009] 2. Although heat pipe 62 plays a role in heat conduction, its temperature uniformity is poor due to its shape. Moreover, the pre-pressure it generates is difficult to control, which can easily cause chip 3 to be subjected to greater stress, posing a risk of chip solder joint cracking.

[0010] 3. The assembly process is complex. It requires first fixing the circuit board 2 to the base 15, then fixing the spring 61 and heat pipe 62 to the top cover 14, and finally connecting the base 15 and the top cover 14. It is difficult to ensure that the heat-conducting component 5 is accurately pressed onto the chip 3 by the spring 61 and heat pipe 62. This is not conducive to assembly on automated production lines. Utility Model Content

[0011] In view of the problems existing in the background art, the first aspect of this utility model provides a domain controller, comprising:

[0012] A first housing and a second housing are formed to enclose the receiving cavity, and an installation groove is formed on the inner wall of the first housing;

[0013] A heat-spreading plate with an elastic element is disposed in the receiving cavity, the elastic element being disposed in the mounting groove;

[0014] A circuit board with a chip is disposed in the receiving cavity, and the heat spreader is located between the first housing and the circuit board;

[0015] Fasteners connecting the first housing, the circuit board, and the second housing; the elastic element is compressed in the mounting groove; the heat spreader is pressed against the chip under the action of the elastic element.

[0016] In some embodiments of this invention, the elastic element can only be compressed linearly in the mounting groove.

[0017] In some embodiments of this utility model, a first positioning feature is provided on the inner wall of the first housing, and a second positioning feature is formed on the heat dissipation plate that can be combined with the first positioning feature. When the first positioning feature is combined with the second positioning feature, the elastic element is just disposed in the mounting groove.

[0018] In some embodiments of this utility model, one of the first positioning feature and the second positioning feature is a pin, and the other is a plug hole that matches the pin.

[0019] In some embodiments of this utility model, a first interface filling layer for heat conduction is provided between the first housing and the heat spreader, and a second interface filling layer for heat conduction is provided between the chip and the heat spreader.

[0020] In some embodiments of this invention, a heat dissipation element is formed at least on the first housing near the heat spreader.

[0021] In some embodiments of this utility model, the second housing is bent to form a plurality of protrusions, and the fasteners fix the second housing, the circuit board and the first housing at the protrusions.

[0022] In some embodiments of this invention, at least one of the bosses forms a support on the back side of the portion of the circuit board on which the chip is disposed.

[0023] In some embodiments of this utility model, a protrusion is formed on the surface of the heat spreader facing the chip, and the area of ​​the protrusion is greater than or equal to the area of ​​the chip.

[0024] A second aspect of this invention provides a mobile platform, comprising: any of the domain controllers described above.

[0025] In the domain controller provided by this utility model, the circuit board is fixedly connected to the first housing and the second housing, so that the position of the circuit board in the receiving cavity is fixed. The heat spreader is located between the first housing and the circuit board, and the compression of the elastic element in the mounting groove is also fixed. That is to say, after the circuit board is fixedly connected to the first housing and the second housing with fasteners, the pre-pressure formed by the heat spreader on the chip is only related to the elastic modulus of the elastic element. By strictly controlling the processing error of each component, the pre-pressure formed by the heat spreader on the chip can be kept constant, and there will be no situation like in the prior art where the heat spreader does not press the chip tightly, resulting in reduced heat dissipation effect or excessive pressure on the chip, resulting in solder joint breakage. Furthermore, the heat spreader can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. Thus, the high lateral thermal conductivity of the heat spreader can be used to achieve a uniform temperature effect, reduce the heat flux density of the system, and allow the heat generated by the chip to be conducted to the first housing more quickly and then dissipated outside the domain controller. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a heat dissipation structure for a chip in the prior art;

[0027] Figure 2 This is a schematic diagram of the structure of an electronic device in the prior art;

[0028] Figure 3 Exploded view of the domain controller provided by this utility model;

[0029] Figure 4 for Figure 3 A cross-sectional view of the domain controller shown;

[0030] Figure 5 for Figure 3 A schematic diagram of the structure of the inner wall of the first shell shown in the figure;

[0031] Figure 6 for Figure 3 A schematic diagram of the heat spreader shown in the figure;

[0032] Figures 7a-7e for Figure 3 The assembly flowchart of the domain controller is shown below;

[0033] Figure 8 A flowchart illustrating a method for manufacturing a domain controller according to this utility model;

[0034] Figure 9 A flowchart illustrating another method for manufacturing a domain controller provided by this utility model.

[0035] Explanation of reference numerals in the attached figures:

[0036] Domain controller 100;

[0037] First housing 10; mounting groove 11; heat sink 12; mounting post 13; first positioning feature 14;

[0038] Second housing 20; Boss 21; Part 22 where no boss is formed;

[0039] Heat spreader 30; elastic element 31; protrusion 32; second positioning feature 33;

[0040] Circuit board 40; PCBA main board 41; PCBA daughter board 42;

[0041] Fastener 50;

[0042] Chip 60;

[0043] First interface fill layer 70;

[0044] Second interface fill layer 80;

[0045] Reception cavity A. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0047] like Figure 3 and 4 As shown, one embodiment of this utility model provides a domain controller 100, mainly including a first housing 10, a second housing 20, a heat spreader 30, a circuit board 40, and fasteners 50. The first housing 10 and the second housing 20 form a receiving cavity A, and a mounting groove 11 is formed on the inner wall of the first housing 10. The heat spreader 30 has an elastic element 31 and is disposed in the receiving cavity A, and the elastic element 31 can be disposed in the mounting groove 11. The circuit board 40 has a chip 60 and is disposed in the receiving cavity A, and the heat spreader 30 is located between the first housing 10 and the circuit board 40. The fasteners 50 connect the first housing 10, the circuit board 40, and the second housing 20. The elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed against the chip 60 under the action of the elastic element 31.

[0048] For example, the circuit board 40 can be a blank PCB board, or a PCBA board (Printed Circuit Board Assembly) board on a blank PCB board after being mounted by SMT (Surface Mount Technology).

[0049] For example, the heat spreader 30 can be a metal plate with good heat transfer effect, such as a copper plate, aluminum plate, or iron plate, or a vacuum chamber heat spreader (VC).

[0050] For example, the first housing 10 and the second housing 20 may also be made of metal, such as aluminum or aluminum alloy, copper or copper alloy, or steel, etc., and are die-cast.

[0051] In this embodiment, the circuit board 40 includes a PCBA main board 41 and a PCBA daughter board 42. The PCBA daughter board 42 is disposed on the PCBA main board 41, and the chip 60 is disposed on the PCBA daughter board 42.

[0052] In other embodiments, circuit board 40 may simply be a PCBA board with chip 60 disposed thereon.

[0053] In this embodiment, the elastic element 31 is a spring, which is welded and fixed to the heat spreader 30. A protrusion 32 is also formed on the surface of the heat spreader 30 that is in contact with the chip 60 (i.e., the surface facing the chip 60). The area of ​​the protrusion 32 is greater than or equal to the area of ​​the chip 60, so that the heat spreader 30 can absorb heat from various locations of the chip 60.

[0054] In other embodiments, the elastic element 31 may also be a rubber block (rubber pillar) that is bonded and fixed to the heat spreader 30. The surface of the heat spreader 30 that is in contact with the chip 60 may not have a plane with the protrusion 32, that is, the protrusion 32 is not necessary.

[0055] In this embodiment, a heat sink 12 (e.g., an air-cooled cavity, a water-cooled cavity, and / or heat dissipation fins disposed on the surface of the first housing 10) is formed on the first housing 10, and a mounting post 13 (with internal threads) is formed on its inner wall. Threaded holes / through holes are provided at corresponding positions on the second housing 20 and the PCBA main board 41. Fasteners 50 are screws, which pass through the threaded holes / through holes of the second housing 20 and the PCBA main board 41 in sequence, and then engage with the internal threads on the mounting post 13 of the first housing 10, fixing the three together. The heat sink 12 is located just above the heat spreader 30, and the fluid in the air-cooled cavity or water-cooled cavity can absorb the heat conducted by the heat spreader 30 and discharge it outside the first housing 10 through flow. The heat dissipation fins can conduct the heat conducted by the heat spreader 30 back to the outside of the first housing 10.

[0056] Those skilled in the art should understand that the circuit board 40 is fixedly connected to the first housing 10 and the second housing 20, so that the position of the circuit board 40 in the receiving cavity A is fixed (it can also be seen that the position of the circuit board 40 relative to the first housing 10 and the second housing 20 is fixed). The heat spreader 30 is located between the first housing 10 and the circuit board 40, and the compression of the elastic member 31 in the mounting groove 11 is also fixed (it can also be seen that the pre-pressure formed by the heat spreader 30 on the chip 60 is fixed). In other words, after the circuit board 40 is fixedly connected to the first housing 10 and the second housing 20 using fasteners 50, the pre-pressure formed by the heat spreader 30 on the chip 60 (greater than the minimum allowable stress Fmin of the chip 60 and less than the maximum allowable stress Fmax of the chip 60) is only related to the elastic modulus of the elastic element 31. By strictly controlling the processing errors of each component, the pre-pressure formed by the heat spreader 30 on the chip 60 can be kept constant. Unlike in the prior art, there will be no situation where the heat spreader 30 does not press the chip 60 tightly, resulting in reduced heat dissipation or excessive pressure on the chip 60, leading to solder joint breakage. Furthermore, the heat spreader 30 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. This allows the high lateral thermal conductivity of the heat spreader 30 to achieve a uniform temperature effect, reducing the heat flux density of the system and allowing the heat generated by the chip 60 to be conducted more quickly through the heat spreader 30 to the first housing 10 and then dissipated outside the domain controller 100.

[0057] Furthermore, the elastic element 31 can only be compressed linearly in the mounting groove 11.

[0058] Those skilled in the art should understand that if the elastic element 31 undergoes nonlinear compression within the mounting groove 11, it may cause a change in the pre-pressure formed by the heat spreader 30 on the chip 60. When the elastic element 31 is a spring, rubber pillar, or the like, the diameter of the mounting groove 11 should be substantially equal to the diameter of the elastic element 31 to prevent the elastic element 31 from twisting within the mounting groove 11. When the elastic element 31 is a rubber block or the like, the mounting groove 11 should be substantially the same size and contour as the elastic element 31 to prevent the elastic element 31 from twisting within the mounting groove 11.

[0059] Combination Figure 5 and 6 As shown, the inner wall of the first housing 10 is provided with a first positioning feature 14, and the heat dissipation plate 30 is formed with a second positioning feature 33 that can be combined with the first positioning feature 14. When the first positioning feature 14 and the second positioning feature 33 are combined, the elastic member 31 is just placed in the mounting groove 11.

[0060] Furthermore, one of the first positioning feature 14 and the second positioning feature 33 is a pin, and the other is a socket that matches the pin.

[0061] In this embodiment, the first positioning feature 14 is a plug pin, and the second positioning feature 33 is a plug hole.

[0062] Those skilled in the art will understand that the first positioning feature 14 and the second positioning feature 33 can provide guidance for the heat spreader 30 during assembly to the first housing 10. During assembly, it is only necessary to engage the first positioning feature 14 and the second positioning feature 33 to ensure that the elastic element 31 is precisely positioned in the mounting groove 11, making the assembly process simpler. In addition, the engagement of the first positioning feature 14 and the second positioning feature 33 can effectively prevent the heat spreader 30 from moving laterally (constraining the degree of freedom of the heat spreader 30 on the plane), especially when the domain controller 100 is installed in a vehicle, it can prevent the heat spreader 30 from shaking due to vehicle body vibration or mechanical impact.

[0063] Continue to refer to Figure 3 and 4 As shown, a first interface filling layer 70 for heat conduction is further provided between the first housing 10 and the heat spreader 30, and / or a second interface filling layer 80 for heat conduction is provided between the chip 60 and the heat spreader 30.

[0064] For example, the first interface filling layer 70 and the second interface filling layer 80 can be made of materials such as silicone, silicone grease and gel, which are used to fill gaps and have good thermal conductivity.

[0065] Those skilled in the art should understand that the first interface filling layer 70 and the second interface filling layer 80 are thinned (≤0.05 mm) during the assembly process, thereby significantly reducing the thermal resistance between the first housing 10 and the heat spreader 30, and between the chip 60 and the heat spreader 30, so that the heat generated by the chip 60 can be conducted to the first housing 10 more quickly through the heat spreader 30 and then dissipated to the outside of the domain controller 100.

[0066] Continue to refer to Figure 4 As shown, the second housing 20 is further bent to form a plurality of protrusions 21, and the fasteners 50 fix the second housing 20, the circuit board 40 and the first housing 10 at the protrusions 21, and at least one protrusion 21 provides support to the part of the circuit board 40 on which the chip 60 is provided from the back side.

[0067] In this embodiment, a chip 60 can be disposed on the circuit board 40. The second housing 20 is bent to form three protrusions 21: left, middle, and right. The left and right protrusions 21 are provided with threaded holes / through holes, so that two fasteners 50 (screws) pass through the threaded holes / through holes at the left and right protrusions 21 respectively, thus fixing the second housing 20, the circuit board 40, and the first housing 10 together. The middle protrusion 21 is located on the back side (e.g., Figure 4The portion of the circuit board 40 to which the chip 60 is located (as shown below) is attached to and supports the circuit board 40, thereby reducing warping of the circuit board at the chip 60.

[0068] In other embodiments, more chips 60 can be disposed on the circuit board 40, and the number of bosses 21 can also be increased accordingly. In addition, steel gaskets (not shown) with threaded holes can be arranged at the bosses 21, and the steel gaskets on the bosses 21 can be glued to the back side of the circuit board 40 by means of adhesive backing, so that the strength of the second housing 20 at the bosses 21 is greater than that of the rest.

[0069] Those skilled in the art should understand that the multiple protrusions 21 formed on the second housing 20 serve as a reinforcing structure to provide good support for the circuit board 40, and can ultimately transfer the preload of the elastic element 31 to the second housing 20, thereby reducing the stress on the circuit board, reducing the risk of cracking of stress-sensitive devices (such as BGA-packaged chips), and preventing the circuit board 40 from being deformed by compression (the part 22 without protrusions 21 can also prevent external forces from directly impacting the circuit board 40). On the other hand, the protrusions 21 also provide installation space for the fasteners 50, preventing the fasteners 50 (especially when screws are used) from loosening due to external impacts. Furthermore, the first housing 10 does not need to be designed with through holes to accommodate spring screws, thus eliminating the risk of dust and water damage and EMC leakage.

[0070] Furthermore, the domain controller 100 described above can also be used as a mobile platform. The mobile platform can be a car, unmanned aerial vehicle (UAV), remote-controlled car, unmanned boat, or robot. The car can be a driverless vehicle or a manned vehicle, and the UAV can be a drone or other unmanned aerial vehicle. Of course, the mobile platform is not limited to the mobile platforms listed above and can also be other mobile platforms.

[0071] Those skilled in the art should understand that, since the movable platform employs the aforementioned domain controller 100, it possesses all the technical effects brought about by the aforementioned domain controller 100. For example, the circuit board 40 is fixedly connected to the first housing 10 and the second housing 20, so that the position of the circuit board 40 in the receiving cavity A is fixed (it can also be seen that the position of the circuit board 40 relative to the first housing 10 and the second housing 20 is fixed). The heat spreader 30 is located between the first housing 10 and the circuit board 40, and the compression amount of the elastic member 31 in the mounting groove 11 is also fixed (it can also be seen that the pre-pressure formed by the heat spreader 30 on the chip 60 is fixed). In other words, once the circuit board 40 is fixedly connected to the first housing 10 and the second housing 20 using fasteners 50, the pre-pressure formed by the heat spreader 30 on the chip 60 is only related to the elastic modulus of the elastic element 31. By strictly controlling the processing errors of each component, the pre-pressure formed by the heat spreader 30 on the chip 60 can be kept constant. Unlike existing technologies, there will be no situation where the heat spreader 30 does not press the chip 60 tightly, resulting in reduced heat dissipation or excessive pressure on the chip 60, leading to solder joint breakage. Furthermore, the heat spreader 30 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in existing technologies. This allows the high lateral thermal conductivity of the heat spreader 30 to achieve a uniform temperature effect, reducing the heat flux density of the system and enabling the heat generated by the chip 60 to be conducted more quickly through the heat spreader 30 to the first housing 10 and then dissipated outside the domain controller 100.

[0072] like Figures 7a-7e and Figure 8 As shown, one embodiment of this utility model provides a method for manufacturing a domain controller 100, including:

[0073] S101. A first housing 10 with an mounting groove 11 formed on its inner wall is provided, and the inner wall of the first housing 10 is placed upward. A heat spreader 30 with an elastic member 31 is provided, and the elastic member 31 is disposed in the mounting groove 11, so that the heat spreader 30 is stacked on the first housing 10.

[0074] S102. A circuit board 40 with a chip 60 is provided, and the circuit board 40 is stacked on the heat spreader 30 so that the chip 60 is attached to the heat spreader 30.

[0075] S103. The second housing 20 is stacked on the circuit board 40, and the first housing 10 and the second housing 20 form a receiving cavity A, with the heat dissipation plate 30 and the circuit board 40 located in the receiving cavity A.

[0076] S104. The second housing 20, the circuit board 40 and the first housing 10 are connected in sequence by fasteners 50, so that the elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed onto the chip 60 under the action of the elastic element 31.

[0077] For example, the first housing 10 and the heat spreader 30 can be placed on the same processing tray. A first robotic arm or a suction cup picks up the heat spreader 30 and places it on the first housing 10 in a stacked manner. The processing tray is moved to the next step, where a second robotic arm or a suction cup picks up the circuit board 40 and places it on the heat spreader 30 in a stacked manner. The processing tray is moved to the next step, where a third robotic arm or a suction cup picks up the second housing 20 and places it on the circuit board 40 in a stacked manner. The processing tray is moved to the next step, where a fully automatic screw-driving machine sequentially connects the second housing 20, the circuit board 40, and the first housing 10 with fasteners 50 (screws). The circuit board 40 is fixed in a preset position in the receiving cavity A, the elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed onto the chip 60 with pre-pressure under the action of the elastic element 31.

[0078] Alternatively, the first housing 10, the heat spreader 30, the circuit board 40, and the second housing 20 can be placed on the same processing tray, and the same robotic arm or suction cup can be used to sequentially grab or pick up the above components, stack them, and then a fully automatic screw-driving machine can be used to sequentially connect the fasteners 50 (screws) to the second housing 20, the circuit board 40, and the first housing 10. The circuit board 40 is fixed in a preset position in the receiving cavity A, the elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed onto the chip 60 with pre-pressure under the action of the elastic element 31.

[0079] Those skilled in the art should understand that, in the manufacturing process of the domain controller 100, the above-described stacking scheme eliminates the need for segmented assembly of components, and the semi-finished products formed in each step do not need to be flipped. Therefore, the types and quantities of equipment required for the fully automated production line are very small (it can only have robotic arms or suction cups, or fully automated screw-driving machines), which is extremely advantageous for fully automated production and assembly. As mentioned above, after the circuit board 40 is fixedly connected to the first housing 10 and the second housing 20 using fasteners 50, the pre-pressure formed by the heat spreader 30 on the chip 60 is only related to the elastic modulus of the elastic element 31. By strictly controlling the processing errors of each component, the pre-pressure formed by the heat spreader 30 on the chip 60 can be kept constant. Unlike in the prior art, there will be no situation where the heat spreader 30 does not press the chip 60 tightly, resulting in reduced heat dissipation or excessive pressure on the chip 60, leading to solder joint breakage. Furthermore, the heat spreader 30 can be a conventional plate shape, without the need for irregularly shaped heat pipes as in the prior art. This allows the heat spreader 30 to achieve a uniform temperature effect by utilizing its high lateral thermal conductivity, thereby reducing the heat flux density of the system and enabling the heat generated by the chip 60 to be conducted more quickly through the heat spreader 30 to the first housing 10 and then dissipated to the outside of the domain controller 100.

[0080] like Figures 7a-7e and Figure 9As shown, one embodiment of this utility model provides another method for manufacturing a domain controller 100, including:

[0081] S201. A first housing 10 with an mounting groove 11 formed on its inner wall is provided, and the inner wall of the first housing 10 is placed upward. A first interface filling layer 70 for heat conduction is coated on the inner wall. A heat spreader 30 with an elastic member 31 is provided, and a second interface filling layer 80 for heat conduction is coated on the side of the heat spreader 30 facing away from the inner wall. The elastic member 31 is disposed in the mounting groove 11, so that the heat spreader 30 is stacked on the first housing 10.

[0082] S202. A circuit board 40 with a chip 60 is provided, and the circuit board 40 is stacked on the heat spreader 30 so that the chip 60 is bonded to the second interface filling layer 80.

[0083] S203. The second housing 20 is stacked on the circuit board 40, and the first housing 10 and the second housing 20 form a receiving cavity A. The heat dissipation plate 30 and the circuit board 40 are located in the receiving cavity A.

[0084] S204. The second housing 20, the circuit board 40 and the first housing 10 are connected in sequence by fasteners 50, so that the elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed onto the chip 60 under the action of the elastic element 31, and the first interface filling layer 70 and the second interface filling layer 80 are squeezed and thinned.

[0085] For example, the first housing 10 and the heat spreader 30 can be placed on the same processing tray. An automated dispensing machine coats the inner wall of the first housing 10 with a first interface filler layer 70 for heat conduction, and coats the side of the heat spreader 30 facing away from the inner wall with a second interface filler layer 80 for heat conduction. A first robotic arm or a suction cup picks up the heat spreader 30 and places it on the first housing 10 in a stacked manner. The processing tray is moved to the next step, where a second robotic arm or a suction cup picks up the circuit board 40 and places it on the heat spreader 30 in a stacked manner. The processing tray is moved to the next step, where a third robotic arm or a suction cup picks up the second housing 20 and places it on the circuit board 40 in a stacked manner. The processing tray is moved to the next process, and the fasteners 50 (screws) are connected to the second housing 20, the circuit board 40 and the first housing 10 in sequence by a fully automatic screw-driving machine. The circuit board 40 is fixed in the preset position in the receiving cavity A, the elastic element 31 is compressed in the mounting groove 11, and the heat spreader 30 is pressed onto the chip 60 with pre-pressure under the action of the elastic element 31. The first interface filling layer 70 and the second interface filling layer 80 are squeezed and thinned.

[0086] Alternatively, the first housing 10, the heat spreader 30, the circuit board 40, and the second housing 20 are placed on the same processing tray. An automated dispensing machine coats the inner wall of the first housing 10 with a first interface filling layer 70 for heat conduction and coats the side of the heat spreader 30 facing away from the inner wall with a second interface filling layer 80 for heat conduction. The same robotic arm or suction cup sequentially grabs or picks up the above components and places them in a stack. Then, a fully automatic screw-driving machine sequentially connects the second housing 20, the circuit board 40, and the first housing 10 with fasteners 50 (screws). The circuit board 40 is fixed in a preset position in the receiving cavity A. The elastic element 31 is compressed in the mounting groove 11. The heat spreader 30 is pressed onto the chip 60 with pre-pressure under the action of the elastic element 31. The first interface filling layer 70 and the second interface filling layer 80 are squeezed and thinned.

[0087] Those skilled in the art should understand that, in the manufacturing process of the domain controller 100, the above-described stacking scheme eliminates the need for segmented assembly of components, and the semi-finished products formed in each step do not require flipping. Therefore, the types and quantities of equipment required for the fully automated production line are very small (it can only have an automated dispensing machine, a robotic arm or suction cup, and a fully automated screw-driving machine), which is extremely advantageous for fully automated production and assembly. In addition to the aforementioned beneficial effects, the first interface filling layer 70 and the second interface filling layer 80 are also compressed to approximately the same degree during the assembly process. The compressed first interface filling layer 70 and the second interface filling layer 80 are uniform and free of voids and air bubbles.

[0088] Furthermore, a first positioning feature 14 is formed on the inner wall of the first housing 10, and a second positioning feature 33 is formed on the heat spreader 30. After the first positioning feature 14 and the second positioning feature 33 are combined, the elastic member 31 is just placed in the mounting groove 11, so that the heat spreader 30 is stacked on the first housing 10.

[0089] Those skilled in the art will understand that the first positioning feature 14 and the second positioning feature 33 can provide guidance for the heat spreader 30 during assembly to the first housing 10. During assembly, it is only necessary to engage the first positioning feature 14 and the second positioning feature 33 to ensure that the elastic element 31 is precisely positioned in the mounting groove 11, making the assembly process simpler. In addition, the engagement of the first positioning feature 14 and the second positioning feature 33 can effectively prevent the heat spreader 30 from moving laterally (constraining the degree of freedom of the heat spreader 30 on the plane), especially when the domain controller 100 is installed in a vehicle, it can prevent the heat spreader 30 from shaking due to vehicle body vibration or mechanical impact.

[0090] Furthermore, the provided second housing 20 is bent to form a plurality of protrusions 21, and fasteners 50 fix the second housing 20, circuit board 40 and first housing 10 at the protrusions 21, and at least one protrusion 21 provides support to the portion of circuit board 40 on which chip 60 is provided from the back side.

[0091] Those skilled in the art should understand that the multiple protrusions 21 formed on the second housing 20 serve as a reinforcing structure to provide good support for the circuit board 40, and can ultimately transfer the preload of the elastic element 31 to the second housing 20, thereby reducing the stress on the circuit board, reducing the risk of cracking of stress-sensitive devices (such as BGA-packaged chips), and preventing the circuit board 40 from being deformed by compression (the part 22 without protrusions 21 can also prevent external forces from directly impacting the circuit board 40). On the other hand, the protrusions 21 also provide installation space for the fasteners 50, preventing the fasteners 50 (especially when screws are used) from loosening due to external impacts. Furthermore, the first housing 10 does not need to be designed with through holes to accommodate spring screws, thus eliminating the risk of dust and water damage and EMC leakage.

[0092] In the description of this specification, the references to terms such as "certain embodiments," "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0093] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not restrictive. Although this utility model has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model do not depart from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A domain controller, characterized in that, include: A first housing and a second housing are formed to enclose the receiving cavity, and an installation groove is formed on the inner wall of the first housing; A heat-spreading plate with an elastic element is disposed in the receiving cavity, the elastic element being disposed in the mounting groove; A circuit board with a chip is disposed in the receiving cavity, and the heat spreader is located between the first housing and the circuit board; Fasteners connecting the first housing, the circuit board, and the second housing; the elastic element is compressed in the mounting groove; the heat spreader is pressed against the chip under the action of the elastic element.

2. The domain controller according to claim 1, characterized in that: The elastic element can only be compressed linearly in the mounting groove.

3. The domain controller according to claim 1, characterized in that: The inner wall of the first housing is provided with a first positioning feature, and the heat spreader is formed with a second positioning feature that can be combined with the first positioning feature. When the first positioning feature and the second positioning feature are combined, the elastic element is just placed in the mounting groove.

4. The domain controller according to claim 3, characterized in that: One of the first positioning feature and the second positioning feature is a pin, and the other is a socket that matches the pin.

5. The domain controller according to claim 1, characterized in that: A first interface filling layer for heat conduction is provided between the first housing and the heat spreader, and / or a second interface filling layer for heat conduction is provided between the chip and the heat spreader.

6. The domain controller according to claim 1, characterized in that: At least a portion of the first housing adjacent to the heat spreader is provided with a heat dissipation element.

7. The domain controller according to claim 1, characterized in that: The second housing is bent to form a plurality of protrusions, and the fasteners fix the second housing, the circuit board and the first housing at the protrusions.

8. The domain controller according to claim 7, characterized in that: At least one of the bosses forms a support on the back side of the portion of the circuit board on which the chip is disposed.

9. The domain controller according to claim 1, characterized in that: A protrusion is formed on the surface of the heat spreader facing the chip, and the area of ​​the protrusion is greater than or equal to the area of ​​the chip.

10. A mobile platform, characterized in that, include: The domain controller as described in any one of claims 1-9.

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