Display device

By setting a pixel definition layer and a color conversion structure on the display substrate of a Micro-LED display, and setting a filter structure that overlaps with its orthographic projection, the problem of low purity of emitted light in the quantum dot full-color display architecture is solved, and the display effect is improved.

CN223899611UActive Publication Date: 2026-02-10WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202520524620.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-24
Publication Date
2026-02-10
Estimated Expiration
2035-03-24

AI Technical Summary

Technical Problem

In existing Micro-LED displays, the purity of the emitted light from the quantum dot full-color display architecture is relatively low, which affects the display effect.

Method used

A pixel definition layer and a color conversion structure are set on the display substrate, and a filter structure is set on it. The orthogonal projections of the filter structure and the color conversion structure on the display substrate overlap each other, thereby improving the purity of the emitted light.

Benefits of technology

By overlapping the filter structure and the color conversion structure on the display substrate, the purity of the emitted light is improved, thereby enhancing the display effect.

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Abstract

The embodiment of the utility model provides a display device. The display device comprises a display substrate, a pixel definition layer, a color conversion structure and a light filtering structure. The pixel definition layer is arranged on the display substrate, the pixel definition layer comprises a plurality of retaining walls and pixel openings located between the adjacent retaining walls, and the pixel openings are arranged on the display substrate in an array mode. The color conversion structures are arranged in the pixel openings, the light filtering structures are arranged on the sides, away from the display substrate, of the color conversion structures, and orthographic projections of the light filtering structures and the color conversion structures on the display substrate are mutually overlapped. The color conversion structure is arranged in the pixel opening, the orthographic projection of the added filtering structure and the orthographic projection of the color conversion structure on the display substrate are mutually overlapped, the purity of light emitted from the color conversion structure can be improved, and the display effect is improved.
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Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Micro-Light Emitting Diode (Micro-LED) displays have gained increasing attention in recent years due to their technological advantages of high brightness, high transmittance, and high contrast. Currently, the biggest bottleneck in the transition from technology to mass production of Micro-LEDs lies in transferring a large number of chips onto a substrate while maintaining a high yield. Due to the differences between RGB chips, transferring the three types of chips leads to a high defect rate. Furthermore, the differences in RGB chip characteristics result in significant differences in the driving circuits. Given the numerous shortcomings of achieving full-color display using RGB three-color chips, researchers are continuously exploring quantum dot (QD) color conversion schemes to achieve full-color display.

[0003] However, for conventional quantum dot full-color display architectures, the purity of the light emitted through the quantum dot layer (also known as the color conversion structure) is low, which affects the display effect. Utility Model Content

[0004] The purpose of this application is to provide a display device that aims to improve the purity of emitted light in order to enhance the display effect.

[0005] This application provides a display device, including: a display substrate; a pixel definition layer disposed on the display substrate, wherein the pixel definition layer includes a plurality of baffles and pixel openings located between adjacent baffles, and the pixel opening array is disposed on the display substrate; a color conversion structure disposed within the pixel openings; and a light filtering structure disposed on the side of the color conversion structure away from the display substrate, wherein the light filtering structure and the orthographic projection of the color conversion structure on the display substrate overlap each other.

[0006] In some embodiments, the filter structure is located within the pixel opening.

[0007] In some embodiments, the method further includes: a transparent substrate disposed on the side of the pixel definition layer away from the display substrate; wherein the filter structure is located within the pixel opening and between the color conversion structure and the transparent substrate; or the filter structure is located on the side of the transparent substrate away from the display substrate, and the color conversion structure fills the pixel opening.

[0008] In some embodiments, the filter structure is located on the side of the transparent substrate away from the display substrate; the display device further includes a protective layer located on the side of the transparent substrate away from the display substrate and covering the filter structure.

[0009] In some embodiments, the retaining wall includes a first surface and a second surface disposed opposite to each other along a first direction, the first surface being connected to the transparent substrate; the first surface having a first length along a second direction, the second surface having a second length along the second direction, the second direction being perpendicular to the first direction, and the first length being less than or equal to the second length.

[0010] In some embodiments, the retaining wall has a third length along the first direction, and the ratio of the third length to the first length is 2:1 to 10:1.

[0011] In some embodiments, it further includes a reflective layer located between the sidewall of the barrier and the color conversion structure.

[0012] In some embodiments, the barrier includes a second surface facing the display substrate, and the reflective layer is further disposed on the second surface.

[0013] In some embodiments, the system further includes: a first encapsulation layer disposed between the transparent substrate and the display substrate, and covering the pixel definition layer and the color conversion structure.

[0014] In some embodiments, the display substrate includes: a driving substrate; light-emitting devices disposed on the side of the driving substrate facing the transparent substrate, wherein the light-emitting devices are disposed in a one-to-one correspondence with the pixel openings; and a second encapsulation layer disposed between the first encapsulation layer and the driving substrate, and covering the light-emitting devices.

[0015] This application provides a display device in which a color conversion structure is disposed within a pixel opening, and an additional filter structure is superimposed on the orthographic projection of the color conversion structure on the display substrate, thereby improving the purity of the light emitted from the color conversion structure and thus enhancing the display effect. Attached Figure Description

[0016] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0017] Figure 1 This is a schematic cross-sectional view of the fabrication structure provided in some embodiments of this application;

[0018] Figure 2 This is a cross-sectional structural schematic diagram of a display device provided in some embodiments of this application.

[0019] Figure 3 This is a cross-sectional structural schematic diagram of a display device provided in some embodiments of this application;

[0020] Figure 4 This is a schematic diagram of the pixel unit arrangement structure provided in some embodiments of this application;

[0021] Figures 5 to 11 This is a cross-sectional structural diagram of the manufacturing process of the display device provided in some embodiments of this application.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100. Display device;

[0024] 10. Display substrate; 11. Light-emitting device; 12. Driving substrate; 13. Second encapsulation layer;

[0025] 20. Transparent substrate;

[0026] 30. Pixel definition layer; 31. Barrier; 311. First surface; 312. Second surface; 31a. First barrier; 31b. Second barrier; 32. Pixel opening;

[0027] 40. Color conversion structure; 41. Red conversion layer; 42. Green conversion layer; 43. Colorless light-transmitting layer;

[0028] 50. Filter structure; 51. First filter layer; 52. Second filter layer;

[0029] 60. First encapsulation layer; 70. Reflective layer; 80. Protective layer; 90. Circuit board;

[0030] X, first direction; Y, second direction;

[0031] PU, pixel unit; P, pixel; R, red pixel; G, green pixel; B, blue pixel. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0036] Please see Figure 1 , Figure 1 This is a schematic cross-sectional structure diagram showing the fabrication process provided in some embodiments of this application.

[0037] The display device 100 includes a display substrate 10, a pixel definition layer 30, a color conversion structure 40, and a filter structure 50. The pixel definition layer 30 is located on the display substrate 10 and includes a plurality of baffles 31 and pixel openings 32 located between adjacent baffles 31. The pixel openings 32 are arrayed on the display substrate 10, and the color conversion structure 40 is disposed within the pixel openings 32. The filter structure 50 is disposed on the side of the color conversion structure 40 away from the display substrate 10, and the orthographic projections of the filter structure 50 and the color conversion structure 40 on the display substrate 10 overlap.

[0038] In some embodiments, such as Figure 1As shown, the filter structure 50 is located within the pixel opening 32.

[0039] The display device 100 may further include a first encapsulation layer 60, which is located on the display substrate 10 and covers the pixel definition layer 30 and the filter structure 50.

[0040] The filter structure 50 is aligned with the color conversion structure 40 to improve the purity of the light emitted from the color conversion structure 40. The display substrate 10 includes a driving substrate 12, and the light-emitting device 11 is located on the side of the driving substrate 12 facing the transparent substrate 20.

[0041] In this embodiment, both the color conversion structure 40 and the filter structure 50 are disposed within the pixel opening 32, which simplifies the structure. The orthographic projections of the filter structure 50 and the color conversion structure 40 on the display substrate 10 overlap, which can improve the purity of the light emitted from the color conversion structure 40 and thus improve the display effect.

[0042] exist Figure 1 In this embodiment, since both the pixel definition layer 30 and the color conversion structure 40 are disposed on the display substrate 10, the manufacturing process of the pixel definition layer 30 and the color conversion structure 40 is limited in order to reduce damage to the driving circuit and the light-emitting device 11 in the display substrate 10. Since the filter structure 50 is disposed on the color conversion structure 40, the manufacturing process of the filter structure 50 will also affect the color conversion structure 40.

[0043] Based on this, this application provides a display device. Please refer to [link / reference]. Figure 2 , Figure 2 This is a cross-sectional structural schematic diagram of a display device provided in some embodiments of this application.

[0044] The display device includes a display substrate 10, a pixel definition layer 30, a color conversion structure 40, and a light filter structure 50. The pixel definition layer 30 is located on the display substrate 10 and includes a plurality of baffles 31 and pixel openings 32 located between adjacent baffles 31. The pixel openings 32 are arrayed on the display substrate 10, and the color conversion structure 40 is disposed within the pixel openings 32. The light filter structure 50 is disposed on the side of the color conversion structure 40 away from the display substrate 10, and the orthographic projections of the light filter structure 50 and the color conversion structure 40 on the display substrate 10 overlap.

[0045] The display device may also include a transparent substrate 20 disposed on the side of the pixel definition layer 30 away from the display substrate 10.

[0046] In some embodiments, the filter structure 50 is located on the side of the transparent substrate 20 away from the display substrate 10, and the color conversion structure 40 fills the pixel opening 32.

[0047] In some embodiments, the display device further includes a protective layer 80 located on the side of the transparent substrate 20 away from the pixel definition layer 30 and covering the filter structure 50. The protective layer 80 can isolate the filter structure 50 from the external environment, improving device stability.

[0048] For example, the protective layer 80 can be a transparent encapsulating adhesive layer. In this embodiment, a transparent substrate 20 is added, allowing the pixel definition layer 30, color conversion structure 40, and filter structure 50 to all be disposed on the transparent substrate 20. The transparent substrate 20, pixel definition layer 30, color conversion structure 40, and filter structure 50 can constitute a color conversion substrate, thus allowing the display substrate 10 and the color conversion substrate to be fabricated separately. Therefore, the processes do not affect each other, which is beneficial for improving the structural stability of the display substrate 10 and reducing the fabrication difficulty of the color conversion substrate. For example, it will not damage the display substrate 10, increases the selectivity of the pixel definition layer 30 fabrication process, and the fabrication process of the filter structure 50 will not affect the color conversion structure 40.

[0049] In some embodiments, the display device may further include a first encapsulation layer 60 disposed between the transparent substrate 20 and the display substrate 10, and covering the pixel definition layer 30 and the color conversion structure 40. The first encapsulation layer 60 can isolate the pixel definition layer 30 and the color conversion structure 40 from the external environment, and can also provide a medium for connection with the display substrate 10.

[0050] The display substrate 10 may include a light-emitting device 11, a driving substrate 12, and a second encapsulation layer 13. The light-emitting device 11 is disposed on the side of the driving substrate 12 facing the transparent substrate 20, and the light-emitting device 11 is disposed in a one-to-one correspondence with the pixel opening 32. The second encapsulation layer 13 is disposed between the driving substrate 12 and the first encapsulation layer 60, and covers the light-emitting device 11.

[0051] The driving substrate 12 may include a substrate and a driving circuit layer, the driving circuit layer being located on the side of the substrate facing the transparent substrate 20. The driving circuit layer may include driving circuitry, which may include a plurality of thin-film transistors.

[0052] The light-emitting device 11 can be located on the side of the driving circuit layer facing the transparent substrate 20, and the light-emitting device 11 can be arranged in an array on the driving circuit layer.

[0053] The transparent substrate 20 can be a glass substrate. The transparent substrate 20 is located on the light-emitting side of the display substrate 10, that is, the transparent substrate 20 is located on the side of the driving substrate 12 facing the light-emitting device 11.

[0054] The pixel definition layer 30 may include multiple barriers 31 and multiple pixel openings 32. The multiple pixel openings 32 may be arranged in an array, and adjacent two pixel openings 32 are isolated by the barriers 31. One pixel opening 32 may be aligned with one light-emitting device 11, so the number of pixel openings 32 is the same as the number of light-emitting devices 11.

[0055] In some embodiments, the barrier 31 includes a first surface 311 and a second surface 312 disposed opposite to each other along a first direction X, the first direction X being the thickness direction of the display substrate 10, and the first surface 311 being connected to the transparent substrate 20. Figure 2 As shown, the first surface 311 is the upper surface of the retaining wall 31, and the second surface 312 is the lower surface of the retaining wall 31.

[0056] The first surface 311 has a first length along the second direction Y, and the second surface 312 has a second length along the second direction Y. The second direction Y is perpendicular to the first direction X, and the first length is less than or equal to the second length. That is, each retaining wall 31 has a structure that is smaller at the top and larger at the bottom, or a structure that is equal in size at the top and bottom.

[0057] In some embodiments, in the first direction X, along the direction away from the transparent substrate 20 (i.e., from top to bottom in the figure), the length of each barrier 31 gradually increases or remains constant along the second direction Y. Therefore, in the first direction X, along the direction away from the transparent substrate 20, the length of each pixel opening 32 gradually decreases or remains constant along the second direction Y, which can reduce the downward reflection of light on the sidewalls of the barrier 31 and help improve the light extraction efficiency.

[0058] Color conversion structures 40 are arrayed on the transparent substrate 20, and one color conversion structure 40 is located within a pixel opening 32. Therefore, one color conversion structure 40 is aligned with a light-emitting device 11, thereby converting the light emitted by the light-emitting device 11 into light of a specific color.

[0059] Each color conversion structure 40 includes a third surface and a fourth surface disposed opposite to each other along the first direction X, the third surface being connected to the transparent substrate 20. Since the color conversion structure 40 is located within the pixel opening 32, the length of the third surface along the second direction Y in the first direction X, away from the transparent substrate 20, is greater than or equal to the length of the fourth surface along the second direction Y.

[0060] In some embodiments, along the direction away from the transparent substrate 20 in the first direction X, the length of each color conversion structure 40 along the second direction Y gradually decreases or remains constant. For example, along the direction away from the transparent substrate 20 in the first direction X, the cross-sectional area of ​​the color conversion structure 40 in the plane direction perpendicular to the first direction X gradually decreases.

[0061] In some embodiments, the barrier 31 has a third length along the first direction X, and the ratio of the third length to the first length is 2:1 to 10:1. Therefore, more color conversion structure 40 material can be filled into the pixel opening 32, increasing the volume of the color conversion structure 40 and thereby improving the conversion efficiency of the color conversion structure 40.

[0062] For example, the barrier 31 can be formed on the transparent substrate 20 using a nanoimprinting process. The material forming the pixel definition layer 30 can be a photosensitive material. After imprinting, the barrier 31 is cured using a photocuring process, and the material in other light-transmitting areas (i.e., pixel openings 32) needs to be cleaned. Therefore, a larger pixel opening 32 away from the transparent substrate 20 is beneficial for removing material from the pixel opening 32.

[0063] In some embodiments, the light-emitting device 11 is a blue light-emitting device 11, such as a blue LED. The color conversion structure 40 includes a red conversion layer 41, a green conversion layer 42, and a colorless light-transmitting layer 43, which are respectively disposed within one of the pixel openings 32. The red conversion layer 41 can convert the blue light emitted by the blue LED into red light, the green conversion layer 42 can convert the blue light emitted by the blue LED into green light, and the blue light emitted by the blue LED can directly pass through the colorless light-transmitting layer 43. One red conversion layer 41, one green conversion layer 42, and one colorless light-transmitting layer 43 can form a pixel unit PU.

[0064] In some embodiments, the light filtering structure 50 includes a first light filtering layer 51 and a second light filtering layer 52. The first light filtering layer 51 is aligned with the red conversion layer 41, and the second light filtering layer 52 is aligned with the green conversion layer 42. It is understood that the first light filtering layer 51 can filter out blue and green light while transmitting red light, and the second light filtering layer 52 can filter out red and blue light while transmitting green light.

[0065] It should be noted that the transparent substrate 20 surface corresponding to the colorless light-transmitting layer 43 does not need to be provided with a light-filtering structure 50.

[0066] In some embodiments, the barrier 31 includes a first barrier 31a located within a pixel unit PU and a second barrier 31b located between two adjacent pixel units PU. That is, the first barrier 31a is used to isolate adjacent color conversion structures 40 within a pixel unit PU, and the second barrier 31b is used to isolate two adjacent pixel units PU.

[0067] In the cross-section at the same location, the length of the first barrier 31a along the second direction Y can be less than the length of the second barrier 31b along the second direction Y. This provides more space for circuit design of the corresponding driving circuit layer between adjacent pixel units PU. For example, the length of the first surface 311 of the first barrier 31a along the second direction Y is less than the length of the first surface 311 of the second barrier 31b along the second direction Y, and the length of the second surface 312 of the first barrier 31a along the second direction Y is less than the length of the second surface 312 of the second barrier 31b along the second direction Y.

[0068] In some embodiments, the display device further includes a reflective layer 70 disposed between the sidewall of the barrier 31 and the color conversion structure 40. The reflective layer 70 can improve light reflectivity, reduce blue light leakage, and reduce color crosstalk.

[0069] In some embodiments, the reflectivity of the reflective layer 70 is not less than 90%, and the reflective layer 70 may be a metal reflective layer 70, such as aluminum, silver, etc.

[0070] In some embodiments, the barrier 31 includes a second surface 312 facing the display substrate 10, and the reflective layer 70 is also located on the second surface 312. That is, the reflective layer 70 is located on the surfaces of the barrier 31 other than the first surface 311 connected to the transparent substrate 20, i.e., the reflective layer 70 is located on the sidewall and fourth surface of the barrier 31, which can further improve the utilization rate of light.

[0071] In some embodiments, the filter structure 50 is located on the side of the transparent substrate 20 away from the color conversion structure 40, that is, the filter structure 50 and the color conversion structure 40 are respectively disposed on both sides of the transparent substrate 20, so that the color conversion structure 40 will not affect the filter structure 50 during manufacturing.

[0072] In some embodiments, the length of the driving substrate 12 along the second direction Y is greater than the length of the transparent substrate 20 along the second direction Y, for forming a bonding portion of the driving substrate 12. The display device may further include a circuit board 90 bonded to the bonding portion.

[0073] Please see Figure 3 , Figure 3This is a cross-sectional structural schematic diagram of a display device provided in some embodiments of this application. The display device is related to... Figure 2 The main difference in the display device lies in the filter structure 50.

[0074] The filter structure 50 is located between the color conversion structure 40 and the transparent substrate 20, and is situated within the pixel opening 32. For example... Figure 3 As shown, the filter structure 50 is in direct contact with the color conversion structure 40, which helps to further improve the purity of light. Furthermore, there is no need to provide a protective layer 80 to protect the filter structure 50, thus simplifying the structure.

[0075] Please see Figure 4 , Figure 4 This is a schematic diagram of the pixel unit arrangement structure provided in some embodiments of this application.

[0076] The display device includes an array of multiple pixel units PU, each pixel unit PU comprising multiple pixels P. The spacing between adjacent pixel units PU is greater than the spacing between adjacent pixels P within a single pixel unit PU. Each pixel P includes a red pixel R, a green pixel G, and a blue pixel B. The red pixel R corresponds to the red conversion layer 41, the green pixel G corresponds to the green conversion layer 42, and the blue pixel B corresponds to the colorless light-transmitting layer 43 within the pixel opening 32.

[0077] In other words, the spacing between the red conversion layer 41 and the green conversion layer 42 is the same as the spacing between the red pixel R and the green pixel G, the spacing between the green conversion layer 42 and the blue conversion layer is the same as the spacing between the green pixel G and the blue pixel B, and the spacing between conversion layers of the same color is the same as the spacing between pixels of the same color P.

[0078] Please combine Figures 5 to 11 , Figures 5 to 11 This is a cross-sectional structural diagram of the manufacturing process of the display device provided in some embodiments of this application.

[0079] See Figure 5 A light-emitting device 11 is formed on one side of the transparent substrate 20.

[0080] The filter structure 50 can be protected by an organic layer until the color conversion substrate process is completed, at which point it can be removed.

[0081] See Figure 6 A pixel definition layer 30 is formed on the other side of the transparent substrate 20.

[0082] The reflectivity of the pixel definition layer 30 material can be no less than 70%. The pixel definition layer 30 structure can be achieved using nanoimprinting to achieve a high aspect ratio design of 2:1 to 10:1. The pixel definition layer 30 material can be a photosensitive material. After imprinting, a photocuring process is used to cure the barrier 31 portion, and the material in other light-transmitting areas needs to be cleaned. Forming the pixel definition layer 30 on the transparent substrate 20 using nanoimprinting not only achieves a high aspect ratio but also avoids damage to the circuitry of the display substrate 10 caused by pressure.

[0083] See Figure 7 A reflective layer 70 is formed on the surface of the retaining wall 31.

[0084] A metal reflective layer 70 can be formed on the surface of the barrier 31 by vapor deposition (the non-coated areas are pre-shielded with photoresist). Performing metal deposition on the transparent substrate 20 can avoid short-circuiting the lines of the driving circuit layer in the display substrate 10.

[0085] See Figure 8 A color conversion structure 40 is formed within the pixel opening 32.

[0086] The red conversion layer 41, green conversion layer 42 and colorless light-transmitting layer 43 can be sequentially filled in the pixel opening 32 using ink printing technology. The height of the color conversion structure 40 is not higher than the height of the barrier wall 31, but not lower than 90% of the height of the barrier wall 31.

[0087] See Figure 9 A first encapsulation layer 60 is formed on the transparent substrate 20, covering the pixel definition layer 30 and the color conversion structure 40.

[0088] A highly sealed adhesive layer structure can be used to encapsulate the color conversion substrate. The encapsulation process can be carried out by vapor deposition or spin coating. The main purpose is to protect the color conversion structure 40 from water and oxygen and maintain the stability of the color conversion structure 40.

[0089] See Figure 10 A light-emitting device 11 is formed on the driving substrate 12.

[0090] The blue LED chip can be fixed on the driving substrate 12 by transfer bonding. The transfer method can be stamp transfer or laser transfer.

[0091] See Figure 11 A second encapsulation layer 13 covering the light-emitting device 11 is formed on the driving substrate 12.

[0092] See Figure 2 The display substrate 10 and the color conversion substrate are aligned and bonded together to form a complete full-color display device.

[0093] Specifically, the first encapsulation layer 60 and the second encapsulation layer 13 can be aligned and bonded together to combine the display substrate 10 and the color conversion substrate.

[0094] The above description of the embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application; those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display device, characterized in that, include: Display substrate; A pixel definition layer is disposed on the display substrate, and the pixel definition layer includes a plurality of baffles and pixel openings located between adjacent baffles, and the pixel opening array is disposed on the display substrate; A color conversion structure is disposed within the pixel opening; A filter structure is disposed on the side of the color conversion structure away from the display substrate, and the orthographic projection of the filter structure and the color conversion structure on the display substrate overlaps with each other.

2. The display device according to claim 1, characterized in that, The filter structure is located within the pixel opening.

3. The display device according to claim 1, characterized in that, Also includes: A transparent substrate is disposed on the side of the pixel definition layer away from the display substrate; Wherein, the filter structure is located within the pixel opening, and the filter structure is located between the color conversion structure and the transparent substrate; or the filter structure is located on the side of the transparent substrate away from the display substrate, and the color conversion structure fills the pixel opening.

4. The display device according to claim 3, characterized in that, The filter structure is located on the side of the transparent substrate away from the display substrate; the display device further includes: A protective layer is located on the side of the transparent substrate away from the display substrate and covers the filter structure.

5. The display device according to claim 3, characterized in that, The retaining wall includes a first surface and a second surface disposed opposite to each other along a first direction, and the first surface is connected to the transparent substrate; The first surface has a first length along a second direction, the second surface has a second length along the second direction, the second direction is perpendicular to the first direction, and the first length is less than or equal to the second length.

6. The display device according to claim 5, characterized in that, The retaining wall has a third length along the first direction, and the ratio of the third length to the first length is 2:1 to 10:

1.

7. The display device according to claim 1, characterized in that, Also includes: A reflective layer is located between the sidewall of the retaining wall and the color conversion structure.

8. The display device according to claim 7, characterized in that, The barrier includes a second surface facing the display substrate, and the reflective layer is further disposed on the second surface.

9. The display device according to claim 3, characterized in that, Also includes: A first encapsulation layer is disposed between the transparent substrate and the display substrate, and covers the pixel definition layer and the color conversion structure.

10. The display device according to claim 9, characterized in that, The display substrate includes: Drive substrate, A light-emitting device is disposed on the side of the driving substrate facing the transparent substrate, and the light-emitting device is disposed in a one-to-one correspondence with the pixel opening; A second encapsulation layer is disposed between the first encapsulation layer and the driving substrate, and covers the light-emitting device.