Simple cleaning device for semiconductor wafer after acid corrosion and cleaning machine
By designing a simple cleaning device and using ultrasonic cleaning and constant temperature control, the problems of complex structure and high cost of existing cleaning machines have been solved, achieving low-cost and high-efficiency cleaning results.
Patent Information
- Application Number
- CN202422961574.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-02
AI Technical Summary
In the existing technology, the cleaning machines used after acid etching of semiconductor wafers are complex in structure, expensive, and bulky, resulting in high production costs and low cost-effectiveness.
A simple cleaning device was designed, comprising a liquid tank, a washing tank, a temperature regulation component, and a control device. It employs ultrasonic cleaning, constant temperature control, and automatic control. Temperature control and energy-saving cooling are achieved by setting up a radiator, a heater, and a temperature sensor, simplifying the structure and reducing equipment costs.
It achieves the same cleaning effect as conventional cleaning machines, but reduces time, labor, and equipment costs, thus improving cost-effectiveness.
Smart Images
Figure CN223899619U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor wafer manufacturing technology, and in particular to a simple cleaning device and cleaning machine for semiconductor wafers after acid etching. Background Technology
[0002] In the semiconductor industry, acid etching is a crucial process in silicon wafer manufacturing. Acid etching equipment uses an etchant to cause an electrochemical reaction between the etchant and the cleaned, ground silicon wafer. This process removes damaged layers from the wafer surface or chemically thins the wafer. By controlling the etching conditions, the surface and geometric parameters of the silicon wafer are brought to specific standards to meet customer requirements. After acid etching, the product must be cleaned in a cleaning machine to meet production needs.
[0003] However, the cleaning machines used after conventional acid corrosion are complex in structure, expensive, and large in size, resulting in high production costs and low cost-effectiveness.
[0004] Therefore, there is an urgent need for a simple cleaning device and cleaning machine for semiconductor wafers after acid etching to solve the above-mentioned technical problems. Utility Model Content
[0005] The purpose of this invention is to provide a simple cleaning device and machine for semiconductor wafers after acid etching, thereby solving the problems of complex structure, high cost, and large size of conventional cleaning machines used after acid etching, which lead to high production costs and low cost-effectiveness. The various technical effects of the preferred solutions provided by this invention are detailed below.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] This utility model provides a simple cleaning device for semiconductor wafers after acid etching, comprising:
[0008] A cleaning solution tank is used to hold a wafer cleaning solution, and a first ultrasonic device is installed inside the cleaning solution tank.
[0009] A water washing tank, wherein a flow equalization pipe and a second ultrasonic device are provided inside the water washing tank, and an overflow port is provided in the water washing tank;
[0010] Temperature regulation assembly, comprising a radiator, a heater, a temperature sensor, and a water inlet pipe, wherein:
[0011] The radiator, the heater, and the temperature sensor are all located inside the medicine tank;
[0012] The water inlet pipe is connected to the inlet of the radiator via a first branch pipe, and the water inlet pipe is connected to the flow equalization pipe via a second branch pipe; valves are installed on both the first branch pipe and the second branch pipe; the outlet of the radiator is connected to the second branch pipe via a third branch pipe;
[0013] The control device includes the valve, the heater, and the temperature sensor, all of which are electrically connected to the control device.
[0014] Preferably, the overflow port is disposed on the first side wall of the washing tank, the side wall of the washing tank opposite to the first side wall is the second side wall, and the flow equalization pipe is disposed at the bottom of the second side wall.
[0015] Preferably, the width of the overflow outlet is greater than 2 / 3 of the width of the washing tank.
[0016] Preferably, a drain trough is provided on the outside of the washing tank, the drain trough is used to accommodate the overflow from the overflow port, and the drain trough is connected to a drainage pipe.
[0017] Preferably, both the medicine tank and the water washing tank are equipped with filter screens at the bottom.
[0018] Preferably, both the first ultrasonic device and the second ultrasonic device are disposed below the filter, and both are configured to include at least two clustered ultrasonic generators.
[0019] Preferably, the heater includes a heating wire, the outer side of which is wrapped with PFA material.
[0020] Preferably, the radiator includes a PFA coil.
[0021] Preferably, the control device includes a PLC.
[0022] A cleaning machine includes a body and a simple cleaning device for acid etching of semiconductor wafers, wherein the simple cleaning device for acid etching of semiconductor wafers is installed in the body.
[0023] This utility model provides a simple cleaning device for semiconductor wafers after acid etching. It includes a cleaning solution tank for holding the cleaning solution, a water washing tank for removing residual cleaning solution, a temperature regulating component to ensure constant temperature during cleaning, and a control device for intelligent control to achieve automated cleaning. This two-station simple cleaning device is small in size, occupies little space, and is more convenient, energy-efficient, and reduces production costs. The temperature regulating component includes a radiator, heater, temperature sensor, and water inlet pipe. The heater primarily heats the cleaning solution tank to ensure a constant temperature. When the temperature in the tank exceeds the set temperature, the radiator dissipates heat to lower the temperature. The temperature sensor detects the temperature in the tank and feeds it back to the control device, which then controls the heater and radiator to achieve temperature control and constant temperature. By connecting one end of the radiator to the water inlet pipe and the other end to a flow equalization pipe, pure water from the radiator is introduced into the water washing tank, achieving energy-saving cooling.
[0024] The cleaning machine provided by this utility model achieves the same cleaning effect as conventional cleaning machines by using the above-mentioned simple cleaning device, but reduces time, labor and equipment costs. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of an embodiment of a simple cleaning device for semiconductor wafers after acid etching according to this utility model;
[0027] Figure 2 This is a schematic diagram of the water inlet pipe in the simple cleaning device for semiconductor wafers after acid etching according to this utility model;
[0028] Figure 3 This is a control principle diagram of a simple cleaning device for semiconductor wafers after acid etching, according to this utility model.
[0029] In the diagram: 1. Medicine tank; 11. First ultrasonic device;
[0030] 2. Washing tank; 20. Overflow outlet; 21. Flow equalization pipe; 22. Second ultrasonic device; 23. Drainage tank; 201. First side wall; 202. Second side wall;
[0031] 3. Temperature control assembly; 31. Radiator; 32. Heater; 33. Temperature sensor; 34. Water inlet pipe; 341. First branch pipe; 342. Second branch pipe; 343. Third branch pipe;
[0032] 4. Control device; 5. Water supply pipeline; 6. Valves; 7. Flow meter; 8. Filter screen. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0034] Figure 1 This is a structural schematic diagram of this embodiment, as shown below. Figure 1 As shown, this embodiment provides a simple cleaning device for semiconductor wafers after acid etching, including a chemical solution tank 1, a water washing tank 2, a temperature regulating component 3, and a control device 4.
[0035] The liquid tank 1 is used to hold the wafer cleaning liquid, and a first ultrasonic device 11 is installed in the liquid tank.
[0036] Since acid residue and some contaminants remain on the silicon wafer surface after acid etching, the wafer cleaning solution in this embodiment uses a mixture of O4K surfactant and water. O4K contains alkali, which reacts with the silicon wafer surface at a certain temperature to remove contaminants. The first ultrasonic device 11 in this embodiment includes at least two clustered ultrasonic generators. Ultrasonic waves facilitate the removal of impurities from the wafer surface, ensuring effective cleaning. Compared to ordinary ultrasound, clustered ultrasound emits focused waves with less diffusion, making it easier to clean.
[0037] The main purpose of the water washing tank 2 is to remove residual medicine from the medicine tank. In this embodiment, the water washing tank 2 is equipped with a flow equalization pipe 21 and a second ultrasonic device 22, and the water washing tank 2 is equipped with an overflow port 20. The flow equalization pipe 21 is the main water supply pipe for the water washing tank 2, and the second ultrasonic device 22 includes at least two clustered ultrasonic generators to ensure cleaning effectiveness. The overflow port 20 is mainly used to ensure the overflow of pure water.
[0038] To ensure a constant temperature during cleaning of the medicine tank 1, a temperature regulation component 3 is provided, including a radiator 31, a heater 32, a temperature sensor 33, and a water inlet pipe 34. In this embodiment, the radiator 31, heater 32, and temperature sensor 33 are all located inside the medicine tank 1. The heater 32 is mainly used to heat the medicine tank 1 to ensure a constant temperature. When the temperature inside the medicine tank 1 exceeds the set temperature, the radiator 31 dissipates heat to cool it down. The temperature sensor 33 is used to detect the temperature inside the medicine tank 1 and feeds it back to the control device 4. The control device 4 then controls the heater 32 and the radiator 31 to achieve temperature control and constant temperature.
[0039] Figure 2 This is a schematic diagram of the water inlet pipe structure in this embodiment, as shown below. Figure 2 As shown, after acid etching, this semiconductor wafer is cleaned using a simple cleaning device with two water inlets: a water supply pipe 5 and a water inlet pipe 34.
[0040] In this embodiment, a valve 6 is installed on the water supply pipeline 5, and the valve 6 is electrically connected to the control device 4. The water supply pipeline 5 is mainly used to supply water to the medicine tank 1. In this embodiment, a water level sensor can be installed inside the medicine tank 1, and a water replenishment switch can be installed outside the medicine tank 1. Both the water replenishment switch and the water level sensor are electrically connected to the control device 4.
[0041] With this setup, during use, the valve 6 on the water supply pipe 5 can be opened by the control device 4 to allow water to enter the medicine tank 1. When the preset water level is reached, the water level sensor sends a signal, and the control device 4 controls the valve 6 to close, thereby achieving automatic water replenishment of the medicine tank 1.
[0042] The water inlet pipe 34 is connected to the inlet of the radiator 31 through the first branch pipe 341, and the water inlet pipe 34 is connected to the flow equalization pipe 21 through the second branch pipe 342; valves 6 are installed on both the first branch pipe 341 and the second branch pipe 342; the outlet of the radiator 31 is connected to the second branch pipe 342 through the third branch pipe 343.
[0043] With this setup, when the temperature of the medicine tank 1 is higher than the set temperature, valve 6 on the first branch pipe 341 opens and valve 6 on the second branch pipe 342 closes. At this time, pure water enters the radiator 31 through the inlet pipe 34 via the first branch pipe 341 and then enters the water washing tank 2 through the third branch pipe 343 and the second branch pipe 342.
[0044] In this embodiment, in order to facilitate the monitoring of the flow rate entering the washing tank 2, a flow meter 7 is installed on the side of the second branch pipe 342 near the washing tank 2.
[0045] When the temperature of the medicine tank 1 reaches the set temperature range, the valve 6 on the first branch pipe 341 is closed and the valve 6 on the second branch pipe 342 is opened. At this time, pure water directly enters the second branch pipe 342 through the water inlet pipe 34, and flows into the water washing tank 2 after passing through the flow meter 7.
[0046] The water inlet pipe 34 is connected to the first branch pipe 341 and the second branch pipe 342 respectively, and valves are installed on both the first branch pipe 341 and the second branch pipe 342, which can both cool down the medicine tank and ensure the overflow of the water washing tank.
[0047] Figure 3 This is the control principle diagram of this embodiment, as shown below. Figure 3 As shown, valve 6, heater 32, and temperature sensor 33 are all electrically connected to control device 4. In this embodiment, the control device includes a PLC.
[0048] As an optional implementation, the overflow port 20 is disposed on the first side wall 201 of the washing tank 2, and the side wall of the washing tank 2 opposite to the first side wall 201 is the second side wall 202, and the flow equalization pipe 21 is disposed at the bottom of the second side wall 202.
[0049] Specifically, the equalizing tube 21 is provided with two rows of holes, all of which are vertically upward. The equalizing tube 21 is installed at the bottom opposite the overflow port 20 so that the water entering the washing tank 2 can completely cover the entire washing tank 2, ensuring that the water on the surface of the washing tank 2 flows to the overflow port 20, thereby carrying away the impurities that fall off the wafer.
[0050] In this embodiment, the width of the overflow port 20 is set to be greater than 2 / 3 of the width of the washing tank 2, so as to facilitate the removal of impurities in the tank.
[0051] Furthermore, a drain trough 23 is provided on the outside of the washing tank 2. The drain trough 23 is used to accommodate the overflow from the overflow port 20. The drain trough 23 is connected to the drainage pipe to solve the problems of excessive overflow, slow drainage, and uneven drainage.
[0052] As an optional implementation, since some wafers have dark cracks, they may break under the action of ultrasound. Therefore, filter screens 8 are installed at the bottom of both the medicine tank 1 and the water washing tank 2 to prevent fragments from falling.
[0053] In this embodiment, both the first ultrasonic device 11 and the second ultrasonic device 22 are located below the filter screen 8. The filter screen 8 is mainly made of stainless steel mesh. This material does not block ultrasonic waves and does not affect the ultrasonic effect. It can also filter out silicon slag, achieving a fragment-proof effect, improving the cleaning effect, and also helping to extend the service life of the overall device.
[0054] As an optional implementation, the heater 32 in this embodiment includes a heating wire wrapped with PFA material on the outside, and the heat sink includes a PFA coil to ensure that no impurities or metals are precipitated.
[0055] The working principle of this embodiment is as follows: After the acid curing is completed, the product is first placed in the chemical solution tank 1. The first ultrasonic device 11 in the chemical solution tank 1 starts working. The temperature in the chemical solution tank 1 is maintained by the temperature sensor 33 and the control device 4, using the heater 32 and the radiator 31. When the cleaning time is reached, the product is taken out. After the product is taken out of the chemical solution tank 1, it is placed in the water washing tank 2. At this time, the second ultrasonic device 22 in the water washing tank 2 is activated. After the set time is reached, the product cleaning is completed.
[0056] This embodiment also provides a cleaning machine, including a machine body and the aforementioned simplified cleaning device for acid-etched semiconductor wafers, wherein the simplified cleaning device for acid-etched semiconductor wafers is installed in the machine body. By using the aforementioned simplified cleaning device, the cleaning effect is the same as that of a conventional cleaning machine, but the time cost, labor cost, and equipment cost are all reduced.
[0057] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A simple cleaning device for semiconductor wafers after acid etching, characterized in that, include: A cleaning solution tank is used to hold a wafer cleaning solution, and a first ultrasonic device is installed inside the cleaning solution tank. A water washing tank, wherein a flow equalization pipe and a second ultrasonic device are provided inside the water washing tank, and an overflow port is provided in the water washing tank; Temperature regulation assembly, comprising a radiator, a heater, a temperature sensor, and a water inlet pipe, wherein: The radiator, the heater, and the temperature sensor are all located inside the medicine tank; The water inlet pipe is connected to the inlet of the radiator via a first branch pipe, and the water inlet pipe is connected to the flow equalization pipe via a second branch pipe; valves are installed on both the first branch pipe and the second branch pipe; the outlet of the radiator is connected to the second branch pipe via a third branch pipe; The overflow outlet is located on the first side wall of the washing tank, and the side wall of the washing tank opposite to the first side wall is the second side wall. The flow equalization pipe is located at the bottom of the second side wall. The bottom of both the medicine tank and the water washing tank is equipped with a filter screen. The first ultrasonic device and the second ultrasonic device are both located below the filter screen and are both configured to include at least two clustered ultrasonic generators. The control device includes the valve, the heater, and the temperature sensor, all of which are electrically connected to the control device.
2. The simple cleaning apparatus for semiconductor wafers after acid etching according to claim 1, characterized in that: The width of the overflow outlet is greater than 2 / 3 of the width of the washing tank.
3. The simple cleaning apparatus for semiconductor wafers after acid etching according to claim 1 or 2, characterized in that: A drain trough is provided on the outside of the washing tank. The drain trough is used to accommodate the overflow from the overflow port and is connected to a drainage pipe.
4. The simple cleaning apparatus for semiconductor wafers after acid etching according to claim 1 or 2, characterized in that: The heater includes a heating wire, the outside of which is wrapped with PFA material.
5. The simple cleaning apparatus for semiconductor wafers after acid etching according to claim 1 or 2, characterized in that: The radiator includes a PFA coil.
6. The simple cleaning apparatus for semiconductor wafers after acid etching according to claim 1 or 2, characterized in that: The control device includes a PLC.
7. A cleaning machine, characterized in that: The device includes a body and a simple cleaning apparatus for acid etching of semiconductor wafers as described in any one of claims 1-6, wherein the simple cleaning apparatus for acid etching of semiconductor wafers is installed in the body.