Die bonder with miniature plastic disc structure

Abstract

The utility model belongs to the technical field of die bonders, and particularly relates to a die bonder with a miniature rubber disc structure, which comprises a base. An adjusting assembly is arranged at the top of the base; a connecting rod is installed in the middle of the adjusting assembly. The end part of the connecting rod is fixedly connected with a fixing ring; the middle part of the fixing ring is rotationally connected with a glue disc body; a glue collecting groove is formed in the top of the glue disc body; a fixing rod is fixedly connected to the bottom of the connecting rod; the end part of the fixing rod is fixedly connected with a supporting plate; a driver is fixedly connected to the top of the supporting plate; the output end of the driver is fixedly connected to the bottom of the glue disc body; a rotating plate is fixedly connected to the bottom of the glue disc body; according to the structure, chips with different thicknesses or sizes can be easily adapted by finely adjusting the height of the glue disc body, so that the chips are accurately aligned with the horizontal position of the glue disc body, glue can be uniformly and accurately smeared on the chips through the dispensing head, and the situation that the dispensing quality is reduced due to the fact that the amount of the glue dipped by the dispensing head is too much or too little is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of die bonder technology, specifically a die bonder with a micro-disc structure. Background Technology

[0002] A die bonder is a mechanical device used to fix crystals and package semiconductors.

[0003] The die bonder is mainly composed of components such as a material picking mechanism, a material pushing mechanism, a dispensing mechanism, a swing arm mechanism, a material unloading mechanism, and a die bonder platform. It uses image recognition to identify and locate the wafer and substrate, and then uses a silver paste pickup device to perform the dispensing work. The micro glue tray in the die bonder is usually used to store the glue. The dispensing needle is controlled to make the dispensing head dip into the glue in the micro glue tray, thereby dispensing the glue onto the substrate.

[0004] In traditional die bonders, the micro glue tray is fixed on the die bonder. During the dispensing process, the dispensing head frequently dips into the same spot, which can easily cause the dispensing head to pick up too much or too little glue, resulting in problems such as reduced dispensing quality and inconsistency.

[0005] Therefore, this utility model provides a die bonder with a micro-disc structure. Utility Model Content

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by this utility model to solve its technical problem is as follows: A die bonder with a micro-disc structure, as described in this utility model, includes a base; an adjustment component is provided on the top of the base; a connecting rod is installed in the middle of the adjustment component; a fixing ring is fixedly connected to the end of the connecting rod; a disc body is rotatably connected to the middle of the fixing ring; a glue collection groove is provided on the top of the disc body; a fixing rod is fixedly connected to the bottom of the connecting rod; a support plate is fixedly connected to the end of the fixing rod; a driver is fixedly connected to the top of the support plate; the output end of the driver is fixedly connected to the bottom of the disc body; a rotating plate is fixedly connected to the bottom of the disc body; and a rotating plate is opened on the top of the support plate. The rotating plate is rotatably connected to the middle of the rotating groove at its end. The structure allows for fine-tuning of the height of the glue tray body to easily accommodate chips of different thicknesses or sizes, ensuring precise horizontal alignment between the chip and the glue tray body. This enables precise control of the dispensing head's position, allowing the glue to be applied evenly and accurately to the chip. This reduces the amount of glue the dispensing head picks up too much or too little, which can lead to a decrease in dispensing quality. Furthermore, the rotating glue tray body allows for better control of the amount and distribution of glue applied, thereby improving glue utilization and making glue application more precise. This also reduces glue waste caused by uneven application or overflow due to the dispensing head picking up glue from the same position.

[0008] Preferably, a collection groove is provided on the top of the glue tray body; a first scraper is slidably connected to the middle of the collection groove; a through hole is provided in the middle of the collection groove; a fixing tube is fixedly connected to the middle of the through hole; an installation component is provided in the middle of the fixing tube; a collection box is installed in the middle of the installation component; a collection hole is provided on the top of the collection box; by providing a collection groove on the edge of the glue tray body through the above structure, glue overflowing during the dispensing process can be collected in a timely manner, reducing glue overflow and dripping onto the equipment or workbench, effectively reusing the overflowing glue, thereby reducing glue waste and lowering production costs.

[0009] Preferably, the mounting assembly includes a fixing plate; the fixing plate is fixedly connected to the middle of the fixing tube; two slots are formed in the middle of the fixing plate; the two slots are arranged opposite each other; a locking block is installed in the middle of the slot; the collection box is fixedly connected to the ends of the two locking blocks; with the above structure, when the glue is full of the collection box, a new collection box can be easily disassembled and replaced, reducing the complex cleaning work of the entire die bonder, making the cleaning work simpler and more convenient, and different sizes of collection boxes can be selected according to actual needs, which can adapt to the needs of different production scales and glue overflow.

[0010] Preferably, the adjustment assembly includes a rotating seat; the rotating seat is fixedly connected to the top of the base; an adjustment screw is installed in the middle of the rotating seat; an adjustment nut is threadedly connected to the middle of the adjustment screw; two limiting rods are slidably connected to the middle of the adjustment nut; the ends of the two limiting rods are fixedly connected to the top of the rotating seat; the above structure allows for high precision and stability in the cooperation of the adjustment screw and the adjustment nut, enabling rapid up-and-down fine adjustments of the die bonder body, increasing the vertical movement accuracy of the die bonder body, achieving precise die bonding operations, and easily achieving die bonding operations at different heights through simple adjustments, reducing the need to replace the entire die bonder or perform complex adjustments.

[0011] Preferably, a support rod is fixedly connected to the bottom of the fixing ring; a second scraper is fixedly connected to the end of the support rod; the bottom of the second scraper is in contact with the surface of the glue tray body; the above structure can scrape off excess glue on the glue tray body each time glue is applied, and can accurately control the amount of glue used each time. The precise scraping of the second scraper can make the glue evenly distributed on the glue tray body, effectively improving the utilization rate of glue and reducing the situation where uneven distribution of glue during the application process leads to poor crystal bonding effect.

[0012] Preferably, the rotating plate has multiple sets of heat dissipation holes in the middle; each set of two heat dissipation holes forms a group; the multiple sets of heat dissipation holes are equidistantly distributed; the above structure can effectively reduce the accumulation of a large amount of heat generated during the operation of the driver inside the rotating plate, effectively dissipate the heat quickly, and reduce the problem of damage to the internal components of the driver due to overheating caused by heat accumulation.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. The die bonder with a micro-disc structure described in this utility model can easily adapt to chips of different thicknesses or sizes by finely adjusting the height of the dispensing disc body through the above structure, so that the chip and the dispensing disc body are precisely aligned horizontally. It can accurately control the position of the dispensing head, so that the glue can be evenly and accurately applied to the chip through the dispensing head. This reduces the amount of glue that the dispensing head picks up too much or too little, which would lead to a decrease in dispensing quality. Furthermore, the rotating dispensing disc body can better control the amount and distribution of glue applied, thereby improving the utilization rate of glue, making the application of glue more precise, and reducing glue waste caused by uneven application or overflow due to the dispensing head picking up glue in the same position.

[0015] 2. The die bonder with a micro-disc structure described in this utility model has a collection groove on the edge of the dispensing disc body, which can collect the glue overflowing during the dispensing process in a timely manner, reduce glue overflow and dripping onto the equipment or worktable, effectively reuse the overflowing glue, thereby reducing glue waste and lowering production costs. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 This is a perspective view of the present invention;

[0018] Figure 2 This is a cross-sectional view of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the collection box in this utility model;

[0020] Figure 4 This is a schematic diagram of the installation components in this utility model.

[0021] In the diagram: 1. Base; 10. Connecting rod; 11. Fixing ring; 12. Glue tray body; 13. Glue collection tank; 14. Fixing rod; 15. Support plate; 16. Driver; 17. Rotating plate; 18. Rotating groove; 2. Collection tank; 21. First scraper; 22. Through hole; 23. Fixing tube; 24. Collection box; 25. Collection hole; 3. Mounting assembly; 31. Fixing plate; 32. Slot; 33. Block; 4. Adjustment assembly; 41. Rotating seat; 42. Adjusting screw; 43. Adjusting nut; 44. Limiting rod; 5. Support rod; 51. Second scraper; 6. Heat dissipation hole; 7. Filter screen. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0023] like Figure 1 and Figure 2 As shown, a die bonder with a miniature adhesive tray structure according to an embodiment of the present invention includes a base 1; an adjustment assembly 4 is provided on the top of the base 1; a connecting rod 10 is installed in the middle of the adjustment assembly 4; a fixing ring 11 is fixedly connected to the end of the connecting rod 10; an adhesive tray body 12 is rotatably connected to the middle of the fixing ring 11; an adhesive collection groove 13 is provided on the top of the adhesive tray body 12; a fixing rod 14 is fixedly connected to the bottom of the connecting rod 10; a support plate 15 is fixedly connected to the end of the fixing rod 14; a driver 16 is fixedly connected to the top of the support plate 15; and the output end of the driver 16 is fixedly connected to the adhesive tray. The bottom of the body 12; a rotating plate 17 is fixedly connected to the bottom of the glue tray body 12; a rotating groove 18 is opened on the top of the support plate 15; the end of the rotating plate 17 is rotatably connected to the middle of the rotating groove 18; during operation, the glue tray body 12 is placed on one side of the dispensing position, and then the base 1 is installed and fixed on the die bonder. The height of the glue tray body 12 is adjusted by the adjusting component 4 to adapt to different types of dispensing heads. The glue is placed on the glue tray body 12, and the glue is stored in the middle of the glue collection tank 13. During the dispensing process, the dispensing head is first rotated by the control system. The dispensing head moves to the glue collection tank 13 to pick up an appropriate amount of glue. Simultaneously, the driver 16 is activated during dispensing, controlling the rotation speed of the driver 16's output. As the driver 16 rotates, it drives the glue tray body 12 to rotate in the middle of the fixing ring 11. As the glue tray body 12 rotates, the rotating plate 17 rotates simultaneously in the middle of the support plate 15, protecting the driver 16. After the dispensing head picks up the glue, it rotates again to precisely apply the glue to the substrate. This structure allows for fine-tuning of the height of the glue tray body 12, easily adapting to chips of different thicknesses or sizes, ensuring precise horizontal alignment between the chip and the glue tray body 12. It allows for precise control of the dispensing head's position, ensuring the glue is evenly and accurately applied to the chip. This reduces the amount of glue picked up by the dispensing head, which can lead to a decrease in dispensing quality. Furthermore, the rotating glue tray body 12 better controls the amount and distribution of glue applied, thereby improving glue utilization and making glue application more precise. This reduces glue waste caused by uneven application or overflow due to the dispensing head picking up glue in the same position.

[0024] like Figures 2 to 4As shown, a collection groove 2 is provided on the top of the glue tray body 12; a first scraper 21 is slidably connected to the middle of the collection groove 2; a through hole 22 is provided in the middle of the collection groove 2; a fixing tube 23 is fixedly connected to the middle of the through hole 22; an installation component 3 is provided in the middle of the fixing tube 23; a collection box 24 is installed in the middle of the installation component 3; a collection hole 25 is provided on the top of the collection box 24; during operation, when the dispensing head is dipped in glue for a long time, the glue will overflow on the glue tray body 12. When the glue flows towards the edge of the glue tray body 12, the glue first flows into the collection groove 2. After the dispensing work is completed, the first scraper 21 is moved to slide inside the collection groove 2. The first scraper 21 collects the glue inside the collection groove 2. When it passes through the through hole 22, the glue enters the collection box 24 through the fixed tube 23, thereby collecting the overflowing glue. With the above structure, the collection groove 2 is opened on the edge of the glue tray body 12, which can collect the glue overflowing during the dispensing process in a timely manner, reduce the glue overflowing and dripping onto the equipment or workbench, effectively reuse the overflowing glue, thereby reducing glue waste and lowering production costs.

[0025] like Figures 2 to 4 As shown, the mounting assembly 3 includes a fixing plate 31; the fixing plate 31 is fixedly connected to the middle of the fixing tube 23; two slots 32 are formed in the middle of the fixing plate 31; the two slots 32 are arranged opposite each other; a locking block 33 is installed in the middle of the slot 32; the collection box 24 is fixedly connected to the ends of the two locking blocks 33; during operation, after the glue is collected into the collection box 24, the collection box 24 is rotated. At this time, the two locking blocks 33 rotate from one end of the slot 32 to the other end. When the locking blocks 33 correspond to the ends of the slots 32, the collection box 24 is moved downwards. At this time, the locking blocks 33 are moved out from the middle of the slots 32, and the collection box 24 is moved downwards. Disassembly is performed, and the collected glue is processed. When installing the collection box 24, first move the end of the locking block 33 corresponding to the end of the locking slot 32 upward. After the end of the locking block 33 moves to the top of the mounting component 3, rotate it. The locking block 33 is locked in the middle of the mounting component 3 for fixation. With the above structure, when the glue is full of the collection box 24, it can be easily disassembled and replaced with a new collection box 24, reducing the complex cleaning work of the entire die bonder and making the cleaning work simpler and more convenient. In addition, different sizes of collection boxes 24 can be selected according to actual needs to adapt to different production scales and glue overflow requirements.

[0026] like Figure 1As shown, the adjustment assembly 4 includes a rotating seat 41; the rotating seat 41 is fixed to the top of the base 1; an adjustment screw 42 is installed in the middle of the rotating seat 41; an adjustment nut 43 is threadedly connected to the middle of the adjustment screw 42; two limiting rods 44 are slidably connected to the middle of the adjustment nut 43; the ends of the two limiting rods 44 are fixed to the top of the rotating seat 41; during operation, when fine-tuning the glue tray body 12, first hold the top of the adjustment screw 42 and rotate it. At this time, the end of the adjustment screw 42 rotates in the middle of the rotating seat 41, and the adjustment nut 43 moves up and down by rotating the adjustment screw 42. The adjustment nut 43 slides in the middle of the two limiting rods 44 at the same time. Through the above structure, the adjustment screw 42 and the adjustment nut 43 have high precision and stability, and can quickly fine-tune the glue tray body 12 up and down. It can increase the vertical movement accuracy of the glue tray body 12, realize precise die bonding operation, and easily achieve die bonding operation at different heights through simple adjustment, reducing the need to replace the entire die bonding machine or complex adjustment work.

[0027] like Figure 1 and Figure 2 As shown, a support rod 5 is fixedly connected to the bottom of the fixing ring 11; a second scraper 51 is fixedly connected to the end of the support rod 5; the bottom of the second scraper 51 is in contact with the surface of the glue tray body 12; during operation, while the glue tray body 12 rotates, the second scraper 51 scrapes the glue on the top of the glue tray body 12, causing the glue to concentrate on the top of the glue tray body 12 and cleaning the surface of the glue tray body 12. Through the above structure, excess glue on the glue tray body 12 can be scraped off each time glue is applied, and the amount of glue used each time can be precisely controlled. The precise scraping of the second scraper 51 can make the glue evenly distributed on the glue tray body 12, effectively improving the utilization rate of glue and reducing the situation where uneven distribution of glue during the application process leads to poor crystal bonding effect.

[0028] like Figure 1 and Figure 2 As shown, multiple sets of heat dissipation holes 6 are opened in the middle of the rotating plate 17; each set consists of two heat dissipation holes 6; the multiple sets of heat dissipation holes 6 are equidistantly distributed; during operation, when the driver 16 is running, the heat inside the driver 16 is discharged into the rotating plate 17, and the heat accumulated inside the rotating plate 17 is exchanged with the external airflow through the multiple heat dissipation holes 6. The above structure can effectively reduce the accumulation of a large amount of heat generated during the operation of the driver 16 inside the rotating plate 17, effectively and quickly dissipate the heat, and reduce the problem of damage to the internal components of the driver 16 due to overheating caused by heat accumulation.

[0029] like Figure 1 and Figure 2As shown, a filter screen 7 is provided in the middle of the heat dissipation hole 6; the filter screen 7 is fixed in the middle of the heat dissipation hole 6; during operation, as the airflow flows through the heat dissipation hole 6, the filter screen 7 filters the dust and impurities in the airflow. The above structure can effectively reduce the amount of dust and impurities in the air entering the interior of the rotating plate 17 through the middle of the heat dissipation hole 6, and reduce the wear and damage caused by dust and impurities adhering to the surface of the driver 16 for a long time.

[0030] During operation, the glue tray body 12 is positioned on one side of the dispensing position, and the base 1 is fixed to the die bonder. The height of the glue tray body 12 is adjusted by the adjusting component 4 to accommodate different types of dispensing heads. Glue is placed on the glue tray body 12 and stored in the glue collection tank 13. During dispensing, the dispensing head, controlled by the control system, first rotates to the glue collection tank 13 to pick up an appropriate amount of glue. Simultaneously, the driver 16 is activated, controlling the rotation speed of the driver 16's output. As the driver 16 rotates, it drives the glue tray body 12 to rotate in the middle of the fixing ring 11. As the glue tray body 12 rotates, the rotating plate 17 rotates simultaneously in the middle of the support plate 15. The drive 16 is protected by the rotating plate 17. After the dispensing head picks up glue, it rotates again to accurately apply the glue to the substrate. During the long-term glue application process, glue will overflow onto the glue tray body 12. As the glue flows towards the edge of the glue tray body 12, it first flows into the collection tank 2. After the dispensing is completed, the first scraper 21 is moved to slide inside the collection tank 2, collecting the glue inside the collection tank 2. When it passes through the through hole 22, the glue enters the collection box 24 through the fixing tube 23, thus collecting the overflowing glue. After the glue is collected in the collection box 24, the collection box is rotated. 24. At this time, as the collection box 24 rotates, the locking block 33 rotates from one end of the slot 32 to the other. When the locking block 33 corresponds to the end of the slot 32, the collection box 24 is moved downwards. At this time, the locking block 33 moves out from the middle of the slot 32, and the collection box 24 is disassembled. The collected glue is then processed. When installing the collection box 24, first move the locking block 33 upwards corresponding to the end of the slot 32. After the end of the locking block 33 moves to the top of the mounting component 3, rotate it. The locking block 33 is then locked in the middle of the mounting component 3 for fixation. When fine-tuning the glue tray body 12, first hold the top of the adjusting screw 42 and rotate it. At this time, the end of the adjusting screw 42 rotates... The middle part of the seat 41 rotates, and the adjusting nut 43 moves up and down by rotating the adjusting screw 42. At the same time, the adjusting nut 43 slides in the middle of the two limiting rods 44. During the dispensing process, while the glue tray body 12 rotates, the second scraper 51 scrapes the glue on the top of the glue tray body 12, so that the glue is concentrated on the top of the glue tray body 12 and the surface of the glue tray body 12 is cleaned. When the driver 16 runs, the heat inside the driver 16 is discharged into the rotating plate 17. The heat accumulated inside the rotating plate 17 is exchanged with the external airflow through multiple heat dissipation holes 6. During the flow of air through the heat dissipation holes 6, the filter screen 7 filters the dust and impurities in the airflow.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A die bonder with a micro-disc structure, comprising a base (1); characterized in that: The base (1) is provided with an adjustment component (4) at the top; a connecting rod (10) is installed in the middle of the adjustment component (4); a fixing ring (11) is fixedly connected to the end of the connecting rod (10); a glue tray body (12) is rotatably connected to the middle of the fixing ring (11); a glue collection groove (13) is provided at the top of the glue tray body (12); a fixing rod (14) is fixedly connected to the bottom of the connecting rod (10); a support plate (15) is fixedly connected to the end of the fixing rod (14); a driver (16) is fixedly connected to the top of the support plate (15); the output end of the driver (16) is fixedly connected to the bottom of the glue tray body (12); a rotating plate (17) is fixedly connected to the bottom of the glue tray body (12); a rotating groove (18) is opened at the top of the support plate (15); the end of the rotating plate (17) is rotatably connected to the middle of the rotating groove (18).

2. The die bonder with a micro-disc structure according to claim 1, characterized in that: The top of the rubber disc body (12) is provided with a collection groove (2); a first scraper (21) is slidably connected in the middle of the collection groove (2); a through hole (22) is provided in the middle of the collection groove (2); a fixing tube (23) is fixedly connected in the middle of the through hole (22); an installation component (3) is provided in the middle of the fixing tube (23); a collection box (24) is installed in the middle of the installation component (3); and a collection hole (25) is provided on the top of the collection box (24).

3. A die bonder with a micro-disc structure according to claim 2, characterized in that: The installation assembly (3) includes a fixing plate (31); the fixing plate (31) is fixedly connected to the middle of the fixing tube (23); two slots (32) are opened in the middle of the fixing plate (31); the two slots (32) are arranged opposite to each other; a card block (33) is installed in the middle of the slot (32); the collection box (24) is fixedly connected to the ends of the two card blocks (33).

4. A die bonder with a micro-disc structure according to claim 3, characterized in that: The adjusting assembly (4) includes a rotating seat (41); the rotating seat (41) is fixedly connected to the top of the base (1); an adjusting screw (42) is installed in the middle of the rotating seat (41); an adjusting nut (43) is threadedly connected to the middle of the adjusting screw (42); two limiting rods (44) are slidably connected to the middle of the adjusting nut (43); the ends of the two limiting rods (44) are fixedly connected to the top of the rotating seat (41).

5. A die bonder with a micro-disc structure according to claim 4, characterized in that: The bottom of the fixing ring (11) is fixedly connected to a support rod (5); the end of the support rod (5) is fixedly connected to a second scraper (51); the bottom of the second scraper (51) is in contact with the surface of the rubber disc body (12).

6. A die bonder with a micro-disc structure according to claim 5, characterized in that: The rotating plate (17) has multiple sets of heat dissipation holes (6) in the middle; each set of two heat dissipation holes (6) is a group; the multiple sets of heat dissipation holes (6) are distributed at equal intervals.

7. A die bonder with a micro-disc structure according to claim 6, characterized in that: A filter screen (7) is provided in the middle of the heat dissipation hole (6); the filter screen (7) is fixedly connected to the middle of the heat dissipation hole (6).

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