Film strip carrying device and film pasting equipment

Abstract

The utility model provides a film strip carrying device and film pasting equipment. The film strip carrying device comprises a driving mechanism and a heating mechanism. The heating mechanism is mounted on a movable part of the driving mechanism, and the driving mechanism drives the heating mechanism to move between the material taking station and the film pasting station; a heating surface is arranged at the bottom of the heating mechanism, a first visbreaking layer is arranged on the heating surface, and the heating mechanism is used for heating the film strip located at the material taking station, so that the film strip is bonded to the first visbreaking layer; the heating mechanism is further used for pasting the heated film strip to the back plate located at the film pasting station, so that the film strip is bonded to the back plate, and the bonding force between the lower surface of the film strip and the back plate is larger than that between the upper surface of the film strip and the first visbreaking layer. According to the film strip carrying device, the heating mechanism can pick up and carry the film strip and can also heat the film strip so that the film strip can be attached to the back plate, suction pieces such as a suction cup do not need to be arranged, and the structural complexity and cost of the film strip carrying device are reduced.

Description

Technical Field

[0001] This application relates to the field of photovoltaic module production equipment, specifically a film strip handling device and film application equipment. Background Technology

[0002] Photovoltaic modules are typically encapsulated by a backsheet, a lower encapsulating film, cell strings, an upper encapsulating film, and a glass plate. Gaps exist between adjacent cells and between adjacent strings, making it difficult for light energy reaching these gaps to be directly absorbed or utilized. To improve light energy utilization, the industry uses reflective film strips attached to the backsheet at positions corresponding to the gaps between cells and strings. These strips reflect the light energy reaching these gaps onto the glass plate, and then further reflect it onto the cells, thus fully utilizing the light energy in these gaps.

[0003] like Figure 1 As shown, the second membrane strip 200 extending along the short side of the back plate 100 is the membrane strip corresponding to the inter-sheet position, and the first membrane strip 300 extending along the long side of the back plate is the membrane strip corresponding to the inter-string position. The first membrane strip 300 and the second membrane strip 200 intersect perpendicularly, and the number of membrane strips varies with the shape of the component.

[0004] One existing film application method involves placing the second film strip 200 on the back plate, then using a film strip transport device to transport the prepared first film strip 300 from the support platform and lay it onto the back plate 100, and heating the first film strip 300 to bond it to the back plate 100.

[0005] To achieve the handling and heating of the first membrane strip 300, existing membrane strip handling devices typically include an adsorption mechanism and a heating mechanism. The adsorption mechanism includes a suction cup for adsorbing the first membrane strip 300, while the heating mechanism is used to heat the first membrane strip 300 after the suction cup picks it up from the support platform and lays it onto the back plate 100, causing the first membrane strip 300 to release its adhesiveness and adhere to the back plate 100. Because the membrane strip handling device incorporates both an adsorption mechanism and a heating mechanism, it increases the structural complexity and cost of the device. Utility Model Content

[0006] To address the aforementioned technical problems, this application provides a membrane strip handling device, the detailed technical solution of which is as follows:

[0007] A membrane strip transport device includes a drive mechanism and at least one heating mechanism, wherein:

[0008] The heating mechanism is mounted on the moving part of the drive mechanism, which is at least used to drive the heating mechanism to move between the material picking station and the film application station.

[0009] The bottom of the heating mechanism is provided with a heating surface extending in a first direction, and a first anti-adhesion layer is provided on the heating surface. The heating mechanism is used to heat the film strip located at the material handling station, so that the upper surface of the film strip is adhered to the first anti-adhesion layer.

[0010] The heating mechanism is also used to apply the heated film strip to the backing plate located at the film application station, so that the lower surface of the film strip is bonded to the backing plate, wherein the adhesive force between the lower surface of the film strip and the backing plate is greater than the adhesive force between the upper surface of the film strip and the first anti-adhesion layer.

[0011] The membrane strip transport device provided in this application heats the membrane strip to be transported via a heating mechanism, causing the upper surface of the membrane strip to release its adhesiveness and adhere to the first anti-adhesion layer of the heating mechanism. Subsequently, the heating mechanism transports the membrane strip to a backing plate, continuously heating the membrane strip during transport, causing the lower surface of the membrane strip to release its adhesiveness and adhere to the backing plate after it is laid. Because the adhesive force between the lower surface of the membrane strip and the backing plate is greater than the adhesive force between the upper surface of the membrane strip and the first anti-adhesion layer, the heating mechanism can easily separate from the membrane strip after adhesion is completed.

[0012] As can be seen, the heating mechanism of the membrane strip handling device provided in this application can not only pick up and handle the membrane strip, but also heat the membrane strip so that it can be attached to the back plate. Therefore, there is no need to install suction cups or other adsorption components on the membrane strip handling device, which reduces the structural complexity and cost of the membrane strip handling device.

[0013] In some embodiments, the first anti-adhesion layer is a Teflon layer.

[0014] Teflon is a low-tack fluorocarbon coating that can be easily applied to the heating surface of a heating mechanism to form a first anti-tack layer. The low adhesion of this Teflon-based layer ensures smooth separation of the diaphragm strip after it has been attached to the backplate. Furthermore, Teflon's high-temperature resistance makes it ideal for use as a first anti-tack layer on the heating surface of a heating mechanism.

[0015] In some embodiments, the heating mechanism includes a first mounting frame, a first mounting plate, and a plurality of heating heads, wherein: the first mounting frame is connected to a movable part of the driving mechanism; the first mounting plate is disposed on the first mounting frame along a first direction, and the plurality of heating heads are disposed at intervals along the first direction on the first mounting plate, the bottom surfaces of the plurality of heating heads together forming a heating surface; each heating head is buoyantly connected to the first mounting plate, and the heating heads extend downwards from the first mounting plate in their natural state.

[0016] The first mounting bracket is connected to the moving parts of the drive mechanism, and the heating head is mounted on the first mounting plate. This arrangement keeps the heating head away from the drive mechanism, reducing heat conduction from the heating head to the drive mechanism and preventing damage to the drive mechanism due to overheating. Furthermore, since each heating head can float vertically on the first mounting plate, when the heating mechanism descends to heat the film strip at the picking station, each heating head can eventually contact the film strip together through this floating motion, ensuring proper film strip pickup. When the heating mechanism applies the heated film strip to the back plate at the film application station, each heating head can elastically press the film strip downwards, ensuring the film strip is firmly adhered to the back plate while preventing damage to the back plate during application.

[0017] In some embodiments, when the heating mechanism heats the film strip located at the material picking station or applies the heated film strip to the back plate located at the film application station, the heating head floats upward under pressure, and the bottom surface of the first mounting plate contacts the upper surface of the film strip; a second anti-adhesion layer is provided on the bottom surface of the first mounting plate, and the adhesive force between the lower surface of the film strip and the back plate is greater than the adhesive force between the upper surface of the film strip and the second anti-adhesion layer.

[0018] After the heating head contacts the film strip, if the drive mechanism continues to drive the heating head downwards, the heating head will float upwards due to the reaction force of the film strip. By controlling the upward movement of the heating head when picking up or applying the film strip, the bottom surface of the first mounting plate can be used to participate in heating the film strip or not. When the first mounting plate needs to participate in heating the film strip when picking it up, the heating head can be controlled to float upwards until it is flush with the bottom surface of the first mounting plate. This allows the bottom surface of the first mounting plate to contact the upper surface of the film strip, enabling the first mounting plate to cooperate with the heating head to heat the film strip. This accelerates the release of adhesiveness from the upper surface of the film strip, thereby improving the picking efficiency of the heating mechanism. When the first mounting plate needs to participate in heating the film strip when applying it, the heating head can be controlled to float upwards under pressure until it is flush with the bottom surface of the first mounting plate. This allows the bottom surface of the first mounting plate to contact the upper surface of the film strip, enabling the first mounting plate to cooperate with the heating head to press the film strip firmly onto the back plate, further ensuring that the film strip is firmly and flatly adhered to the back plate along its entire length. In addition, since a second anti-adhesion layer is provided on the bottom surface of the first mounting plate, the first mounting plate can be easily detached from the film strip after the film strip is picked up or applied.

[0019] In some embodiments, the second anti-adhesion layer is a Teflon layer.

[0020] Teflon is a low-tack fluorocarbon coating that can be easily applied to the bottom surface of the first mounting plate to form a second anti-tack layer. The low adhesion of this second anti-tack layer ensures that the membrane strip can be easily separated from the backing plate after it has been attached to the first mounting plate. Furthermore, Teflon is heat-resistant, making it ideal for use as a second anti-tack layer on the bottom surface of the first mounting plate.

[0021] In some embodiments, a plurality of strip-shaped first anti-adhesion grooves are provided at intervals along a first direction on the bottom surface of the first mounting plate.

[0022] By setting a first anti-adhesion groove on the bottom surface of the first mounting plate, the contact area between the first mounting plate and the membrane strip is reduced, thereby reducing the adhesion between the first mounting plate and the membrane strip and facilitating detachment from the membrane strip.

[0023] In some embodiments, the first mounting plate is connected to the first mounting bracket via a first heat insulation block; a first heating component is provided inside the first mounting plate, and the first mounting plate heats each heating head via the first heating component; or, each heating head is provided with a first heating component.

[0024] By incorporating a first heat insulation block, heat conduction from the heating head to the drive mechanism is further reduced, preventing overheating damage to the drive mechanism. By installing a first heating component within the first mounting plate, the first mounting plate can uniformly heat all heating heads, thereby improving the heating uniformity of the membrane strip at different locations. Furthermore, by installing a first heating component within each heating head, independent temperature control of each heating head can be achieved, enhancing the heating effect on the membrane strip. For example, the temperature of the heating heads located at both ends of the first mounting plate can be higher than that of other heating heads, allowing the ends of the membrane strip to adhere more firmly to the back plate.

[0025] In some embodiments, the number of heating mechanisms is at least three, each heating mechanism is spaced apart on the moving part of the driving mechanism along the second direction, each heating mechanism is used to heat one membrane strip, and each heating head of the heating mechanism has a clearance groove on its bottom surface to avoid the intersection of membrane strips, and the second direction is perpendicular to the first direction.

[0026] The heating structure is configured with at least three heating elements, which enables the film strip transport mechanism of this application to apply at least three film strips to the back plate each time, thereby improving the film strip application efficiency.

[0027] In one film application method, after the second film strip (e.g., the film strip corresponding to the inter-sheet position) is laid onto the back plate, the film strip transport device of this application is used to apply the first film strip (e.g., the film strip corresponding to the inter-series position) onto the back plate. When the first film strip is laid onto the back plate, it intersects the second film strip perpendicularly, creating several intersection points. The thickness at the intersection points of the first and second film strips is greater than the thickness at other locations on the first film strip. Therefore, if the bottom surface of the heating head is flat, when each heating head presses the first film strip onto the back plate, the bottom surface of the heating head will be blocked by the intersection points on the first film strip, causing the heating head to only heat the intersection points and not the rest of the first film strip, thus affecting the film application effect. By creating clearance grooves on the bottom surface of each heating head to avoid the intersection points, the intersection points can enter into the clearance grooves, and the first film strips located near the intersection points can be heated by the heating head, ultimately ensuring the film application effect.

[0028] In some embodiments, among the heating heads on the heating mechanism located at the first side edge, the clearance groove on the heating head near the first end of the first mounting plate is open to the first side and the first end of the first mounting plate, the clearance groove on the heating head near the second end of the first mounting plate is open to the first side and the second end of the first mounting plate, and the clearance groove on the remaining heating heads is open to the first side of the first mounting plate.

[0029] Among the heating heads of the heating mechanism located at the second side edge, the clearance groove on the heating head near the first end of the first mounting plate is open to the second side and the first end of the first mounting plate, the clearance groove on the heating head near the second end of the first mounting plate is open to the second side and the second end of the first mounting plate, and the clearance groove on the remaining heating heads is open to the second side of the first mounting plate.

[0030] Among the heating heads of the remaining heating mechanisms located in the middle, the relief groove on the heating head near the first end of the first mounting plate is open to the first end of the first mounting plate, the relief groove on the heating head near the second end of the first mounting plate is open to the second end of the first mounting plate, and the relief grooves on the remaining heating heads are all rectangular or circular closed grooves.

[0031] By providing clearance grooves on the heating mechanism at the first side edge, the heating mechanism at the first side edge can simultaneously press and adhere the first and second film strips located at the first side edge of the back plate to the back plate. Similarly, by providing clearance grooves on the heating mechanism at the second side edge, the heating mechanism at the second side edge can simultaneously press and adhere the first and second film strips located at the second side edge of the back plate to the back plate. By providing clearance grooves on each heating mechanism located in the middle, each heating mechanism in the middle can simultaneously press and adhere each first and second film strip located in the middle of the back plate to the back plate.

[0032] In some embodiments, each heating head of each heating mechanism is provided with a first heating needle on the heating head near the first end of the first mounting plate and on the heating head near the second end of the first mounting plate. The first heating needle is buoyantly connected to the heating head and located in the clearance groove. The first heating needle is used to heat the end of the film strip.

[0033] Because the heating heads at both ends of the first mounting plate have clearance grooves, the clearance grooves at both ends of the heating heads cannot heat the film strip when it is picked up at the material picking station. As a result, the two ends of the film strip will droop after being picked up, affecting the laying of the film strip onto the back plate. By setting the first heating needle in the clearance groove of the heating head at both ends of the first mounting plate, the first heating needle can heat the end of the film strip when picking up the film strip, so that the film strip adheres to the first heating needle and prevents the end of the film strip from drooping after being picked up. At the same time, when the film strip is attached to the back plate, the first heating needle can press and heat the two ends of the film strip, further ensuring that the two ends of the film strip can adhere to the back plate.

[0034] In some embodiments, the heating mechanism includes a second mounting bracket and a second mounting plate, wherein: the second mounting bracket is buoyantly mounted on the movable part of the drive mechanism; the second mounting plate is disposed on the second mounting bracket along a first direction, and the bottom surface of the second mounting plate constitutes a heating surface.

[0035] The second mounting bracket is connected to the moving parts of the drive mechanism. The second mounting plate, serving as the heating element, is mounted on the second mounting bracket and does not directly contact the drive mechanism, thereby reducing heat conduction from the second mounting plate to the drive mechanism and preventing damage to the drive mechanism due to overheating. Furthermore, since the second mounting bracket can float vertically on the moving parts of the drive mechanism, when the second mounting plate heats the film strip located at the picking station, it can adaptively float and deflect, ensuring that the bottom surface of the second mounting plate is firmly attached to the film strip for heating and picking up the film strip. When the second mounting plate applies the heated film strip to the back plate located at the film application station, it can adaptively float and deflect, ensuring that the second mounting plate presses the film strip firmly against the back plate from all directions, preventing localized loose adhesion or arching of the film strip.

[0036] In some embodiments, the second mounting plate is connected to the second mounting bracket via a second heat insulation block, and the second mounting plate contains a second heating component.

[0037] By incorporating a second heat insulation block, heat conduction from the second mounting plate to the drive mechanism is further reduced. Furthermore, by installing a second heating component within the second mounting plate, the second mounting plate is able to provide uniform heating to the diaphragm strip.

[0038] In some embodiments, the number of heating mechanisms is at least three, each heating mechanism is spaced apart on the moving part of the driving mechanism along the second direction, and the second mounting plate of each heating mechanism is used to heat one membrane strip. The bottom surface of each second mounting plate is provided with a plurality of clearance grooves spaced apart along the first direction to avoid the intersection position of the membrane strips. The second direction is perpendicular to the first direction.

[0039] The heating mechanism is configured with at least three heating elements, enabling the film strip transport mechanism of this application to apply at least three film strips to the back plate each time, thereby improving the film strip application efficiency. By providing a clearance groove on the bottom surface of the second mounting plate to avoid the intersection of film strips, when the second mounting plate applies the first film strip to the back plate, the intersection of the first film strip and the second film strip pre-applied to the back plate can enter the clearance groove. The first film strips located near the intersection can be heated by the heating head, ultimately ensuring the film application effect.

[0040] In some embodiments, the heating mechanism located at the first side edge has an air-proof groove near the first end of the second mounting plate that is open to the first side and the first end of the second mounting plate, an air-proof groove near the second end of the second mounting plate that is open to the first side and the second end of the second mounting plate, and the remaining air-proof grooves that are open to the first side of the second mounting plate.

[0041] The heating mechanism located at the second side edge has an air-proof groove near the first end of the second mounting plate that is open to the second side and the first end of the second mounting plate, an air-proof groove near the second end of the second mounting plate that is open to the second side and the second end of the second mounting plate, and the remaining air-proof grooves that are open to the second side of the second mounting plate.

[0042] The remaining heating mechanisms located in the middle have open clearance slots near the first end of the second mounting plate, open clearance slots near the second end of the second mounting plate, and the remaining clearance slots are rectangular or circular closed slots.

[0043] By providing clearance grooves on the heating mechanism at the first side edge, the heating mechanism at the first side edge can simultaneously press and adhere the first and second film strips located at the first side edge of the back plate to the back plate. Similarly, by providing clearance grooves on the heating mechanism at the second side edge, the heating mechanism at the second side edge can simultaneously press and adhere the first and second film strips located at the second side edge of the back plate to the back plate. By providing clearance grooves on each heating mechanism located in the middle, each heating mechanism in the middle can simultaneously press and adhere each first and second film strip located in the middle of the back plate to the back plate.

[0044] In some embodiments, a plurality of strip-shaped second anti-adhesion grooves are provided at intervals along the first direction on the bottom surface of the second mounting plate, or a plurality of strip-shaped second anti-adhesion grooves are provided at intervals along the first direction on the bottom surface of the second mounting plate, and air blowing holes are also provided in the second anti-adhesion grooves.

[0045] By providing a second anti-adhesion groove on the bottom surface of the second mounting plate, the contact area between the second mounting plate and the membrane strip is reduced, thereby lowering the adhesive force between the second mounting plate and the membrane strip and facilitating detachment from the membrane strip. By providing air holes within the second anti-adhesion groove, when the second mounting plate adheres the membrane strip to the back plate, the air holes blow high-speed airflow onto the membrane strip, allowing the second mounting plate to separate from the membrane strip more smoothly.

[0046] In some embodiments, in each of the second mounting plates, a second heating pin is provided in the clearance groove near the first end of the second mounting plate and in the clearance groove near the second end of the second mounting plate. The second heating pin is buoyantly connected to the second mounting plate. The second heating pin is used to heat the end of the film strip.

[0047] By setting second heating pins in the clearance grooves at both ends of the second mounting plate, when the film strip is picked up, the second heating pins can heat the ends of the film strip, so that the film strip is adhered to the second heating pins, preventing the ends of the film strip from drooping after the film strip is picked up. At the same time, when the second mounting plate is attached to the back plate, the second heating pins can press and heat the ends of the heated film strip, further ensuring that the ends of the film strip can be adhered to the back plate.

[0048] In some embodiments, the number of heating mechanisms is at least three, each heating mechanism is used to heat one film strip; the driving mechanism includes a moving part and a spacing part, wherein: the spacing part is connected to the movable part of the moving part, and each heating mechanism is spaced apart on the movable part of the spacing part along a second direction, the second direction being perpendicular to the first direction; the moving part is used to drive each heating mechanism to move between the material picking station and the film applying station; the spacing part is used to adjust the spacing between each heating mechanism.

[0049] The heating structure is configured with at least three elements, enabling the film strip transport mechanism of this application to apply at least three film strips to the backplate each time, thereby improving the film strip application efficiency. By configuring the drive mechanism to include a moving part and a spacing part, the drive mechanism can drive each heating element to move between the material picking station and the film application station, so that after each heating element picks up the film strip from the material picking station, it transports and applies the film strip to the backplate at the film application station. In addition, during the transport process, the drive mechanism can adjust the spacing between the film strips so that the spacing between the film strips conforms to the shape of the battery string assembly, improving the compatibility of this application.

[0050] This application also provides a film application device, which includes a carrier device, a first film strip laying device, a carrier platform, and the film strip transport device described in any one of the above embodiments, wherein:

[0051] The load-bearing device is used to support the back plate;

[0052] The first membrane strip laying device is configured to lay the first membrane strip onto the support platform;

[0053] The membrane strip transport device is configured to transport the first membrane strip on the carrier platform to the back plate, so that the first membrane strip is adhered to the back plate.

[0054] By setting up a support device, the back plate is supported; the support platform supports the first film strip laid by the first film strip laying device; and the film strip transport device picks up the first film strip and applies it to the back plate, so that the film application equipment of this application can automatically apply the first film strip.

[0055] In some embodiments, the film application device further includes a second film strip laying device configured to lay a second film strip onto a backing plate, and a film strip transporting device transporting a first film strip onto the backing plate such that the first film strip and the second film strip intersect perpendicularly. The film strip transporting device is also configured to simultaneously heat the first film strip and the second film strip, so that the first film strip and the second film strip are simultaneously bonded to the backing plate.

[0056] After the second film strip laying device pre-lays the second film strip onto the back plate, the film strip transport device then lays the first film strip onto the back plate. By simultaneously heating the first and second film strips, the first and second film strips can be bonded to the back plate at the same time, further improving the film application efficiency. Attached Figure Description

[0057] Figure 1 A schematic diagram of the backing plate after the membrane strips have been applied;

[0058] Figure 2 This is a schematic diagram of the membrane strip transport device in the embodiments of this application;

[0059] Figure 3 This is a schematic diagram of the heating mechanism located at the first side position in the first embodiment of this application from a first perspective.

[0060] Figure 4 This is a schematic diagram of the heating mechanism located at the first side position in the first embodiment of this application from a second perspective;

[0061] Figure 5 This is a schematic diagram showing the partial positional relationship between the heating mechanism and the membrane strip located at the first side position in the first embodiment of this application;

[0062] Figure 6 This is a schematic diagram of the heating mechanism located at the first side position in the first embodiment of this application from a third perspective;

[0063] Figure 7 for Figure 6 AA section view;

[0064] Figure 8 for Figure 6 BB section view;

[0065] Figure 9 This is a partial structural schematic diagram of the heating mechanism located in the middle position in the first embodiment of this application from a first perspective.

[0066] Figure 10 This is a schematic diagram showing the partial positional relationship between the heating mechanism located at the middle position and the membrane strip in the first embodiment of this application;

[0067] Figure 11 This is a partial structural diagram of the heating mechanism located in the middle position in the first embodiment of this application from a second perspective;

[0068] Figure 12 for Figure 11 CC section view;

[0069] Figure 13 This is a schematic diagram of the heating mechanism located at the first side position in the second embodiment of this application from a first perspective.

[0070] Figure 14 This is a schematic diagram of the heating mechanism located at the first side position in the second embodiment of this application from a second perspective.

[0071] Figure 15 This is a schematic diagram of the heating mechanism located at the first side position in the second embodiment of this application from a third perspective;

[0072] Figure 16 for Figure 15 DD sectional view;

[0073] Figure 17 This is a schematic diagram of the film application device in the embodiments of this application.

[0074] Figures 1 to 17 Includes:

[0075] Drive mechanism 1: moving part 11, spacing part 12;

[0076] Heating mechanism 2: First mounting bracket 21, first mounting plate 22, heating head 23, first buffer connector 24, first heating assembly 25, clearance groove 26, first heating needle 27, first anti-adhesion groove 28, second buffer connector 29, first heat insulation block 210, first spring 241, guide post 242, first limiting ring 243, needle rod 271, pressure head 272, second spring 291, second limiting ring 292; second mounting bracket 211, second mounting plate 212, second anti-adhesion groove 213, second heating needle 214, buffer connector 215, third buffer connector 216, second heat insulation block 217, air blowing hole 218;

[0077] Backplate support device 10;

[0078] First membrane strip laying device 20;

[0079] Support platform 30;

[0080] Membrane strip transport device 40;

[0081] Second membrane strip laying device 50;

[0082] Backing plate 100, second membrane strip 200, first membrane strip 300. Detailed Implementation

[0083] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0084] As described in the background section, existing membrane strip handling devices include an adsorption mechanism and a heating mechanism. The adsorption mechanism includes a suction cup for adsorbing the membrane strip, while the heating mechanism is used to heat the membrane strip after the suction cup picks it up from the support platform and lays it onto the back plate, causing the membrane strip to release its adhesiveness and bond with the back plate. Because the membrane strip handling device incorporates both an adsorption mechanism and a heating mechanism, it increases the structural complexity and cost of the device.

[0085] To address the aforementioned problems of existing membrane strip handling devices, this application provides a membrane strip handling device. For example... Figure 2 As shown, the film strip transport device in this embodiment includes a drive mechanism 1 and at least one heating mechanism 2, wherein:

[0086] The heating mechanism 2 is mounted on the moving part of the drive mechanism 1, and the drive mechanism 1 is used to drive the heating mechanism 2 to move between the material picking station and the film applying station.

[0087] The bottom of the heating mechanism 2 is provided with a heating surface extending in a first direction (such as the X direction), and a first anti-adhesion layer is provided on the heating surface. The heating mechanism 2 is used to heat the film strip located at the material picking station, so that the upper surface of the film strip is adhered to the first anti-adhesion layer.

[0088] The heating mechanism 2 is also used to attach the heated film strip to the back plate located at the film application station, so that the lower surface of the film strip is bonded to the back plate, wherein the adhesive force between the lower surface of the film strip and the back plate is greater than the adhesive force between the upper surface of the film strip and the first anti-adhesion layer.

[0089] The optional operating process of the membrane strip transport device in this embodiment is as follows:

[0090] The driving mechanism 1 drives the heating mechanism 2 to the material handling station, causing the first anti-adhesion layer of the heating mechanism 2 to contact the upper surface of the film strip. The heating mechanism 2 heats the film strip, causing the upper surface of the film strip to release its adhesiveness and adhere to the first anti-adhesion layer of the heating mechanism. Due to the short heating time, at this time, the lower surface of the film strip has not yet released its adhesiveness or has released very little adhesiveness, allowing the heating mechanism to easily pick up the film strip from the material handling station.

[0091] Drive mechanism 1 drives heating mechanism 2 to rise, and the film strip is removed from the material handling station. Subsequently, drive mechanism 1 drives heating mechanism 2 to transport the film strip toward the film application station. During this process, heating mechanism 2 continues to heat the film strip, and the lower surface of the film strip fully releases its adhesiveness.

[0092] After the heating mechanism 2 transports the film strip to the film application station, the driving mechanism 1 drives the heating mechanism 2 to descend toward the back plate, so that the lower surface of the film strip is bonded to the back plate.

[0093] Finally, the driving mechanism 1 drives the heating mechanism 2 to rise. Since the adhesive force between the lower surface of the membrane strip and the back plate is greater than the adhesive force between the upper surface of the membrane strip and the first anti-adhesion layer, the heating mechanism 2 can be smoothly separated from the membrane strip.

[0094] As can be seen, the heating mechanism 2 of the film strip transport device in this application embodiment can not only pick up and transport the film strip, but also heat the film strip so that it can be attached to the back plate. Therefore, there is no need to set suction cups or other adsorption components on the film strip transport device, which reduces the structural complexity and cost of the film strip transport device.

[0095] refer to Figure 1As shown, optionally, the second membrane strip 200 can be laid and bonded to the back plate first using the membrane strip transport device in this embodiment, and then the first membrane strip 300 can be laid and bonded to the back plate using the membrane strip transport device in this embodiment; or, the first membrane strip 300 can be laid and bonded to the back plate first using the membrane strip transport device in this embodiment, and then the second membrane strip 200 can be laid and bonded to the back plate using the membrane strip transport device in this embodiment; or, the second membrane strip 200 can be laid only on the back plate first, and then the first membrane strip 300 can be transported and laid on the back plate 100 using the membrane strip transport device in this embodiment, and the second membrane strip 200 can be heated while the first membrane strip 300 is being heated and bonded, so that the first membrane strip 300 and the second membrane strip 200 are bonded to the back plate 100 at the same time.

[0096] Optionally, the first anti-adhesion layer is a Teflon layer. Teflon is a low-adhesion fluorocarbon coating that can be easily applied to the heating surface of the heating mechanism 2 to form the first anti-adhesion layer. The first anti-adhesion layer formed by Teflon has low adhesion, ensuring that the heating mechanism 2 can smoothly separate from the membrane strip after it is attached to the back plate. In addition, Teflon has good high-temperature resistance, making it very suitable as the first anti-adhesion layer applied to the heating surface of the heating mechanism.

[0097] Of course, other types of low-tack materials can also be used to form the first anti-tack layer, as long as it can ensure that the adhesion between the formed first anti-tack layer and the upper surface of the membrane strip is less than the adhesion between the lower surface of the membrane strip and the backing plate.

[0098] The structure and operation of the heating mechanism 2 in this application will be described exemplarily below through two embodiments.

[0099] First embodiment:

[0100] like Figures 3 to 12 As shown, the heating mechanism 2 in this embodiment includes a first mounting frame 21, a first mounting plate 22, and a plurality of heating heads 23, wherein: the first mounting frame 21 is connected to the movable part of the drive mechanism 1. The first mounting plate 22 is disposed on the first mounting frame 21 along a first direction, and the plurality of heating heads 23 are disposed at intervals along the first direction on the first mounting plate 22. The bottom surfaces of the plurality of heating heads 23 together constitute a heating surface, that is, a first anti-adhesion layer is disposed on the bottom surface of each heating head 23. Each heating head 23 is buoyantly connected to the first mounting plate 22, and in its natural state, the heating heads 23 all extend downward out of the first mounting plate 22.

[0101] Since the heating head 23 does not directly contact the drive mechanism 1, the heat conduction from the heating head 23 to the drive mechanism 1 can be reduced, preventing the drive mechanism 1 from being damaged due to excessive temperature.

[0102] Since each heating head 23 can be connected to the first mounting plate 22 in a floating manner, when the heating mechanism 2 descends and heats the film strip located at the picking station, if the bottom surfaces of each heating head 23 are uneven, the bottom surface of the lower heating head 23 will contact the film strip first, and the higher heating head 23 can continue to descend until the bottom surfaces of all heating heads 23 contact the film strip, thereby ensuring that the film strip can be picked up smoothly.

[0103] Similarly, when the heating mechanism 2 applies the heated film strip to the back plate located at the film application station, each heating head can elastically press the film strip downwards, so that the film strip can be firmly applied to the back plate, while avoiding damage to the back plate during film application.

[0104] like Figures 6 to 7 As shown, optionally, the heating head 23 is vertically and buoyantly connected to the first mounting plate 22 via a first buffer connector 24. The first buffer connector 24 includes a first spring 241, a guide post 242, and a first limiting ring 243. Specifically: the guide post 242 passes through the first mounting plate 22 and is movable up and down along it; the upper end of the guide post 242 passes through the first mounting plate 22 and is fixedly connected to the first limiting ring 243; the heating head 23 is connected to the lower end of the guide post 242. The first spring 241 is sleeved on the guide post 242; the upper end of the first spring 241 abuts against the first mounting plate 22, and the lower end of the first spring 241 abuts against the heating head 23.

[0105] In its natural state, the heating head 23 extends downwards from the first mounting plate 22, and the first spring 241 naturally extends. When the heating head 23 contacts the diaphragm strip, and the first mounting plate 22 continues to descend, the guide post 242 and the heating head 23 are pressed and rise synchronously relative to the first mounting plate 22, and the first spring 241 is compressed and contracts.

[0106] Optionally, when the heating mechanism 2 heats the film strip located at the material handling station or applies the heated film strip to the back plate located at the film application station, the heating head 23 floats upward under pressure, and the bottom surface of the first mounting plate 22 contacts the upper surface of the film strip. A second anti-adhesion layer is provided on the bottom surface of the first mounting plate 22, and the adhesive force between the lower surface of the film strip and the back plate is greater than the adhesive force between the upper surface of the film strip and the second anti-adhesion layer.

[0107] Optionally, by controlling the upward movement of the heating head when taking or applying the film strip, the bottom surface of the first mounting plate can be used to either participate in heating the film strip or not. This can be selectively controlled according to the actual situation.

[0108] For example, when the first mounting plate 22 is required to participate in heating the film strip during film strip picking, the heating head 23 can be controlled to float upwards until it is flush with the bottom surface of the first mounting plate 22, so that the bottom surface of the first mounting plate 22 can contact the upper surface of the film strip, allowing the first mounting plate 22 to cooperate with the heating head 23 to heat the film strip, thereby accelerating the release of adhesiveness from the upper surface of the film strip and improving the picking efficiency of the heating mechanism 2 for the film strip.

[0109] For example, when the first mounting plate 22 is required to participate in heating the film strip during the application of the film strip, the heating head 23 can be controlled to float upwards until it is flush with the bottom surface of the first mounting plate 22, so that the bottom surface of the first mounting plate 22 contacts the upper surface of the film strip. This allows the first mounting plate 22 to cooperate with the heating head 23 to press the film strip onto the back plate, further ensuring that the film strip is firmly and flatly adhered to the back plate along its entire length.

[0110] In addition, since the bottom surface of the first mounting plate 22 is provided with a second anti-adhesion layer, and the adhesion between the lower surface of the film strip and the back plate is greater than the adhesion between the upper surface of the film strip and the second anti-adhesion layer, the first mounting plate 22 can be smoothly removed from the film strip after the film strip is applied.

[0111] Optionally, the second anti-tack layer is a Teflon layer. Of course, other types of low-tack materials can also be used to form the second anti-tack layer, as long as it ensures that the adhesion between the formed second anti-tack layer and the upper surface of the membrane strip is less than the adhesion between the lower surface of the membrane strip and the backing plate.

[0112] like Figure 3 and Figure 6 As shown, to facilitate the fabrication of the first mounting plate 22, the first mounting plate 22 can be configured as two segments along the first direction. The two segments of the first mounting plate 22 can work together to pick up and attach a film strip, or the two segments of the first mounting plate 22 can each pick up and attach a film strip. Of course, the first mounting plate 22 can also be a single, complete mounting plate.

[0113] like Figure 9 As shown, optionally, a plurality of strip-shaped first anti-adhesion grooves 28 are provided at intervals along the first direction on the bottom surface of the first mounting plate 22. The first anti-adhesion grooves 28 can reduce the contact area between the first mounting plate 22 and the film strip, thereby reducing the adhesion between the first mounting plate 22 and the film strip, and further ensuring that the first mounting plate 22 can be smoothly separated from the film strip after it is attached to the back plate with the heating head 23.

[0114] like Figure 3 and Figure 5 As shown, optionally, the first mounting plate 22 is connected to the first mounting bracket 21 via the first heat insulation block 210. This further reduces heat conduction from the heating head 23 to the drive mechanism 1, preventing the drive mechanism 1 from being damaged by heat.

[0115] like Figures 6 to 7 As shown, optionally, a first heating component 25 is provided inside the first mounting plate 22, and the first mounting plate 22 heats each heating head 23 through the first heating component 25.

[0116] The first mounting plate 22 heats each heating head 23 uniformly through the first heating component 25, which can improve the temperature uniformity of each heating head 23 and ultimately make the position where the film strip is pressed by each heating head 23 uniformly heated.

[0117] Of course, a first heating component can also be provided in each heating head 23. In this way, independent temperature control of each heating head 23 can be achieved, meeting the heating requirements at different positions of the membrane strip and improving the heating effect of the membrane strip. For example, by implementing independent temperature control of each heating head 23, the temperature of the heating heads 23 located at both ends of the first mounting plate 22 can be higher than the temperature of other heating heads 23, thereby allowing the two ends of the membrane strip to be more firmly bonded to the back plate.

[0118] The first heating component may include, for example, a heating rod inserted through the first mounting plate 22 or the heating head 23, and may also include a thermocouple for detecting the heating temperature.

[0119] like Figure 2 As shown, optionally, the number of heating mechanisms 2 is at least three, and each heating mechanism 2 is spaced apart on the moving part of the drive mechanism 1 along a second direction (such as the Y direction), with each heating mechanism 2 used to heat one membrane strip. The second direction is perpendicular to the first direction.

[0120] The heating mechanism 2 is configured with at least three heating elements, so that the film strip transport mechanism in this embodiment can apply at least three film strips to the back plate each time, thereby improving the film strip application efficiency.

[0121] like Figure 1 As shown, seven first membrane strips 300 need to be laid on both the first half (e.g., the left half) and the second half (e.g., the right half) of the backplate 100. Figure 2 As shown, optionally, the number of heating mechanisms 2 is set to 7. In this way, the film strip transport device can apply 7 first film strips 300 to the first half or the second half of the back plate 100 at one time through the 7 heating mechanisms 2, thereby further improving the application efficiency of the first film strips 300.

[0122] Of course, by setting the length of the heating mechanism 2 along the first direction to be long enough, each heating mechanism 2 can pick up two first film strips 300 each time and attach the two first film strips 300 to the corresponding positions of the first half and the second half of the back plate 100. That is, the film strip transport device can attach 14 first film strips 300 to the first half and the second half of the back plate 100 at one time through 7 heating mechanisms 2.

[0123] In other embodiments, the number of heating mechanisms 2 can be set to 4, 5, 8, 9, or other numbers as needed.

[0124] refer to Figure 1 As shown, optionally, the second film strip 200 can be laid (without bonding) on ​​the back plate first, and then the film strip transport device in this embodiment can be used to transport the prepared first film strip 300 from the support platform and lay it on the back plate 100. The first film strip 300 is heated to bond it to the back plate 100. At the same time, the second film strip 200, which is perpendicular to the first film strip 300, is also heated and fixed to the back plate. That is, the film strip transport device realizes the synchronous heating and bonding of the first film strip 300 and the second film strip 200, improving the film application efficiency.

[0125] In order for the film strip transport device in this embodiment to simultaneously heat the first film strip 300 and the second film strip 200, the position of the heating head 23 of the film strip transport device can be selected so that the bottom surface of each heating head 23 corresponds to an intersection point of the first film strip 300 and the second film strip 200.

[0126] However, the thickness at the intersection of the first membrane strip 300 and the second membrane strip 200 is greater than the thickness at other locations of the first membrane strip 300. Therefore, if the bottom surface of the heating head 23 is flat, when the heating head 23 presses the first membrane strip 300 down onto the back plate 100, the bottom surface of the heating head 23 will be blocked by the intersection at the corresponding location. This means that the heating head 23 can only heat the intersection and cannot further press down to heat the other locations of the first membrane strip 300 and the second membrane strip 200. Ultimately, this results in a small heated area for the first membrane strip 300 and the second membrane strip 200, affecting the bonding strength between the membrane strip and the back plate 100.

[0127] To solve this problem, such as Figure 4 and Figure 9 As shown, optionally, each heating head 23 of the heating mechanism 2 has a clearance groove 26 on its bottom surface to avoid the intersection of the membrane strips.

[0128] Thus, when the heating mechanism 2 presses the first membrane strip 300 down onto the back plate 100, the clearance grooves 26 on each heating head 23 avoid the intersection at the corresponding position (or, the intersection at the corresponding position enters into the clearance groove 26), thereby ensuring that each heating head 23 of the heating mechanism 2 can cooperate to press and bond the first membrane strip 300 and the second membrane strip 200 around the intersection to the back plate 100.

[0129] like Figure 1 As shown, the first membrane strip 300 at different locations is laid on the back plate 100, and the specific details of its intersection with the second membrane strip 200 are as follows:

[0130] The ends of the first membrane strip 300 laid on both sides of the backplate 100 form right-angle intersection points E with the second membrane strip 200, while the middle portions of the first membrane strip 300 laid on both sides of the backplate 100 form several T-shaped intersection points F with the second membrane strip 200. Furthermore, the membrane strips laid on the first side (such as...) Figure 1 The orientation of the intersection point on the first membrane strip 300 at position I on the upper side is the same as that of the strip being laid to the second side (e.g., ...). Figure 1 The intersection point on the first membrane strip 300 at the lower L position is oriented in the opposite direction, or in other words, the intersection point on the first membrane strip 300 laid to the second side position is mirror-symmetrical with respect to the central axis of the back plate 100 along the length direction with respect to the intersection point on the first membrane strip 300 laid to the first side position.

[0131] The end of the first membrane strip 300, laid in the middle of the backing plate 100, forms a T-shaped intersection F with the second membrane strip 200, while the middle portion of the first membrane strip 300, laid in the middle of the backing plate 100, forms several cross-shaped intersections G with the second membrane strip 200. It should be noted that the middle of the backing plate 100 refers to any position on the backing plate 100 other than the two sides, not specifically the center of the backing plate 100. Similarly, the middle of the first membrane strip 300 refers to any position on the first membrane strip 300 other than the two ends, not specifically the center of the first membrane strip 300.

[0132] Because the shapes and orientations of the intersection points of the first membrane strip 300 laid on the first side position, the first membrane strip 300 laid on the second side position, and the first membrane strip 300 and the second membrane strip 200 laid in the middle of the back plate 100 differ, the clearance grooves 26 on the heating heads 23 of the heating mechanism 2 at different positions need to be adaptively configured to avoid these intersection points.

[0133] Of the at least three heating mechanisms 2 of the membrane strip transport device, the heating mechanism 2 located at the first side edge is used to lay the first membrane strip 300 to the first side position of the back plate 100.

[0134] Optional, such as Figure 4 As shown, in each heating head 23 of the heating mechanism 2 located at the first side edge:

[0135] The clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 is open towards the first side (e.g., the upper side) and the first end (e.g., the left end) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set to L-shape. This arrangement allows the clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 to avoid the right-angle intersection point E of the first end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the right-angle intersection point E.

[0136] The clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 is open towards the first side (e.g., the upper side) and the second end (e.g., the right end) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in an L-shape. This arrangement ensures that the clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 can avoid the right-angle intersection point E of the second end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the right-angle intersection point E.

[0137] The clearance slots on the remaining heating heads 23 are all open towards the first side (as above) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in a U-shape. This arrangement ensures that the clearance slots 26 on the remaining heating heads 23 can avoid the T-shaped intersection F on the first membrane strip 300, and ensures that each of the remaining heating heads 23 can press against the first membrane strip 300 and the second membrane strip 200 around the corresponding T-shaped intersection F.

[0138] As can be seen, by making the above-described arrangement of the heating mechanism 2 located at the first side edge, it can be ensured that the heating mechanism 2 located at the first side edge can avoid the intersection position and attach the first film strip 300 and the second film strip 200 at the first side edge of the back plate 100 to the back plate 100, and ensure that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0139] Of the at least three heating mechanisms 2 of the membrane strip transport device, the heating mechanism 2 located at the second side edge is used to lay the first membrane strip 300 to the second side position of the back plate 100. As described above, the intersection point on the first membrane strip 300 laid to the second side position is mirror-symmetrical to the intersection point on the first membrane strip 300 laid to the first side position.

[0140] Correspondingly, the heating mechanism 2 located at the second side edge can be set to be mirror-symmetrical with the heating mechanism 2 located at the first side edge.

[0141] Specifically, in each heating head 23 of the heating mechanism 2 located at the second side edge:

[0142] The clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 is open towards the second side (e.g., the lower side) and the first end (e.g., the left end) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in an L-shape. This arrangement allows the clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 to avoid the right-angle intersection point E of the first end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the right-angle intersection point E.

[0143] The clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 is open towards the second side (e.g., the lower side) and the second end (e.g., the right end) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in an L-shape. This arrangement allows the clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 to avoid the right-angle intersection point E of the second end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the right-angle intersection point E.

[0144] The clearance slots on the remaining heating heads 23 are all open towards the second side (below) of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in a U-shape. This arrangement allows the clearance slots 26 on the remaining heating heads 23 to avoid the corresponding T-shaped intersection F on the first membrane strip 300. In addition, it ensures that each of the remaining heating heads 23 can press against the first membrane strip 300 and the second membrane strip 200 around the corresponding T-shaped intersection F.

[0145] As can be seen, by making the above-described arrangement of the heating mechanism 2 located at the second side edge, it can be ensured that the heating mechanism 2 located at the second side edge can avoid the intersection position and attach the first film strip 300 and the second film strip 200 at the second side edge of the back plate 100 to the back plate 100, and ensure that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0146] In the at least three heating mechanisms 2 of the membrane strip transport device, each heating mechanism 2 located in the middle correspondingly lays a first membrane strip 300 to the middle of the back plate 100. As mentioned above, the first mounting plate 22 of the heating mechanism 2 may include two sections. Figure 9 Only one section of the central heating mechanism 2 is shown, such as... Figure 9 As shown, in each heating head 23 of the heating mechanism 2 located in the middle:

[0147] The clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 is open towards the first end of the first mounting plate 22. For example, the bottom surface of the heating head 23 is set in a U-shape. This arrangement allows the clearance groove 26 on the heating head 23 near the first end (e.g., the left end) of the first mounting plate 22 to avoid the T-shaped intersection F of the first end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the T-shaped intersection F.

[0148] Similarly, the clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 is open towards the second end of the first mounting plate 22, for example, the bottom surface of the heating head 23 is set in a U-shape. This arrangement allows the clearance groove 26 on the heating head 23 near the second end (e.g., the right end) of the first mounting plate 22 to avoid the T-shaped intersection F of the second end of the first membrane strip 300, and ensures that the heating head 23 can press the first membrane strip 300 and the second membrane strip 200 around the T-shaped intersection F.

[0149] The clearance slots 26 on the remaining heating heads 23 are all rectangular or circular closed slots; for example, the bottom surface of the heating head 23 is set to be annular. This arrangement ensures that the clearance slots on the remaining heating heads 23 can avoid the cross-shaped intersection point G on the first membrane strip 300, and also ensures that each of the remaining heating heads 23 can press against the first membrane strip 300 and the second membrane strip 200 around the corresponding cross-shaped intersection point G.

[0150] As can be seen, by making the above-mentioned arrangement of the heating mechanism 2 in the middle, it can be ensured that the heating mechanism 2 in the middle can avoid the intersection position, and the first film strip 300 and the second film strip 200 in the middle of the back plate 100 can be attached to the back plate 100, and it can be ensured that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0151] like Figure 4 and Figure 9 As shown, optionally, in each heating head 23 of each heating mechanism 2, the heating head 23 near the first end of the first mounting plate 22 and the heating head 23 near the second end of the first mounting plate 22 are provided with a first heating needle 27. The first heating needle 27 is buoyantly connected to the heating head 23 and located in the clearance groove 26. The first heating needle 27 is used to heat the end of the film strip.

[0152] By providing first heating needles 27 on the heating heads 23 at both ends of the heating mechanism 2, when the heating mechanism 2 picks up the film strip, the first heating needles 27 at both ends can press the two ends of the film strip respectively and heat the two ends of the film strip, thereby ensuring that the two ends of the film strip are adhered to the heating mechanism 2. In this way, the two ends of the film strip can be prevented from sagging during the handling process.

[0153] Furthermore, since the first heating pin 27 is located within the recessed groove 26 of the heating head 23, when the heating mechanism 2 applies the first film strip 300 to the back plate, the first heating pins 27 at both ends can respectively press the intersection points at both ends of the first film strip 300, thereby improving the adhesion strength of the first film strip 300 and the second film strip 200 at the intersection points.

[0154] Since the first heating needle 27 is buoyantly connected to the heating head 23, the first heating needle 27 can elastically press the film strip, ensuring the pressing effect while avoiding damage to the back plate.

[0155] like Figures 11 to 12 As shown, optionally, the first heating needle 27 is buoyantly connected to the heating head 23 via the second buffer connector 29. The first heating needle 27 includes a needle rod 271 and a pressure head 272, and the second buffer connector 29 includes a second spring 291 and a second limiting ring 292. The needle rod 271 passes through the heating head 23 and is movable up and down; its upper end passes through the heating head 23 and is fixedly connected to the second limiting ring 292. The second spring 291 is sleeved on the needle rod 271, with its upper end abutting against the heating head 23 and its lower end abutting against the pressure head 272.

[0156] In its natural state, the first heating needle 27 extends downwards from the heating head 23, and the second spring 291 naturally extends. When the first heating needle 27 contacts the diaphragm strip and the heating head 23 continues to descend, the first heating needle 27 is compressed and rises relative to the heating head 23, while the second spring 291 is compressed and contracts.

[0157] Second Embodiment

[0158] like Figures 13 to 16 As shown, the heating mechanism 2 in this embodiment includes a second mounting bracket 211 and a second mounting plate 212, wherein: the second mounting bracket 211 is movably mounted on the movable part of the drive mechanism 1. The second mounting plate 212 is disposed on the second mounting bracket 211 along a first direction, and the bottom surface of the second mounting plate 212 constitutes a heating surface.

[0159] The second mounting plate 212 is indirectly connected to the heating mechanism 2 through the second mounting bracket 211, which can reduce the heat conduction from the second mounting plate 212 to the driving mechanism 2 and prevent the driving mechanism 1 from being damaged due to excessive temperature.

[0160] Furthermore, since the second mounting bracket 211 can be mounted on the moving parts of the drive mechanism 1 in a floating manner, when the second mounting plate 212 heats the film strip located at the material picking station, the second mounting plate 212 can generate adaptive floating and deflection, thereby ensuring that the bottom surface of the second mounting plate 212 can be pressed tightly against the film strip, thereby implementing uniform heating of the film strip, and ultimately ensuring that all parts of the film strip can be bonded to the bottom surface of the second mounting plate 212.

[0161] When the second mounting plate 212 applies the heated film strip to the back plate located at the film application station, the second mounting plate can adaptively float and deflect, thereby ensuring that the second mounting plate 212 can firmly press all parts of the film strip onto the back plate, preventing the film strip from being partially loosely adhered or arched.

[0162] Optionally, the second mounting bracket 211 can be mounted vertically on the movable part of the drive mechanism 1 via at least two buffer connectors 215 spaced apart along the first direction. The buffer connectors 215 can adopt various existing elastic connection structures that can contract vertically under pressure. For example, the buffer connector 215 includes a guide post and a spring, wherein the upper end of the guide post is movably connected to the movable part of the drive mechanism 1 and can slide up and down, the lower end of the guide post is fixedly connected to the second mounting bracket 211, and the spring is sleeved on the guide post, with the upper end of the spring abutting against the movable part of the drive mechanism 1 and the lower end abutting against the second mounting bracket 211.

[0163] like Figure 13 and Figure 15 As shown, optionally, the second mounting plate 212 is connected to the second mounting bracket 211 via the second heat insulation block 217. This further reduces heat conduction from the second mounting plate 212 to the drive mechanism 1.

[0164] Optionally, a second heating assembly is provided within the second mounting plate 212. The second mounting plate 212 heats the diaphragm strip via the second heating assembly. The second heating assembly may be, for example, a heating rod inserted into the second mounting plate 212, or it may include a thermocouple for detecting the heating temperature.

[0165] Similar to the first embodiment described above, in order to improve the film strip application efficiency, optionally, the number of heating mechanisms 2 is at least three, and each heating mechanism 2 is spaced apart on the moving part of the driving mechanism 1 along the second direction (such as the Y direction), and each heating mechanism 2 is used to heat one film strip.

[0166] refer to Figure 1As shown, optionally, the second film strip 200 can be laid (without bonding) on ​​the back plate first. Then, the film strip transport device in this embodiment of the application is used to transport the prepared first film strip 300 from the support platform and lay it on the back plate 100, and heat the first film strip 300 to bond it to the back plate 100. At the same time, the second film strip 200, which is perpendicular to the first film strip 300, is also heated and fixed to the back plate. That is, the film strip transport device realizes the synchronous heating and bonding of the first film strip 300 and the second film strip 200, improving the film application efficiency.

[0167] However, because the thickness at the intersection of the first membrane strip 300 and the second membrane strip 200 is greater than the thickness at other locations of the first membrane strip 300, if the bottom surface of the second mounting plate 212 is flat, when the second mounting plate 212 presses the first membrane strip 300 down onto the back plate 100, the bottom surface (heating surface) of the second mounting plate 212 will be blocked by the intersections of the first membrane strip 300. This results in the second mounting plate 212 only being able to heat the intersection locations and being unable to further press down to heat the remaining locations of the first membrane strip 300 and the second membrane strip 200. Ultimately, this leads to a small heated area for the first membrane strip 300 and the second membrane strip 200, affecting the bonding strength between the membrane strip and the back plate.

[0168] To solve this problem, such as Figure 14 As shown, optionally, each of the second mounting plates 212 has a plurality of clearance grooves 26 spaced apart along the first direction on its bottom surface to avoid the intersection of the membrane strips.

[0169] Thus, when the heating mechanism 2 presses the first membrane strip 300 down onto the back plate 100, the clearance grooves 26 on each of the second mounting plates 212 avoid the intersection at the corresponding position (or, the intersection at the corresponding position enters into the clearance groove 26), thereby enabling each of the second mounting plates 212 to press and bond the first membrane strip 300 and the second membrane strip 200 to the back plate 100.

[0170] As described in the first embodiment above, the shape and orientation of the first membrane strip 300 laid on the first side position of the back plate 100, the first membrane strip 300 laid on the second side position, and the intersection of the first membrane strip 300 and the second membrane strip 200 laid in the middle of the back plate 100 are different.

[0171] For details regarding the intersection of the first membrane strip 300 and the second membrane strip 200 at different locations, please refer to the relevant description in the first embodiment above. For the sake of brevity, it will not be repeated here.

[0172] In order to avoid the intersection points on the first membrane strip 300, the clearance grooves 26 on the second mounting plate 212 of the heating mechanism 2 at different positions need to be adaptively configured. Specifically:

[0173] Of the at least three heating mechanisms 2 in the membrane strip transport mechanism, the heating mechanism 2 located at the first side edge needs to lay the first membrane strip 300 to the first side position of the back plate 100. The clearance groove on the second mounting plate 212 of this heating mechanism 2 is configured as follows:

[0174] The clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 is open toward the first side (e.g., the upper side) and the first end (e.g., the left end) of the second mounting plate 212. This arrangement allows the clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 to avoid the right-angle intersection point E of the first end of the first membrane strip 300.

[0175] Similarly, the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 is open towards the first side (e.g., the upper side) and the second end (e.g., the right end) of the second mounting plate 212. This arrangement allows the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 to avoid the right-angle intersection point E of the second end of the first membrane strip 300.

[0176] The remaining clearance slots 26 are all open toward the first side (as above) of the second mounting plate 212. This arrangement allows the remaining clearance slots 26 to avoid the T-shaped intersection F on the first membrane strip 300.

[0177] As can be seen, by making the above-described arrangement of the heating mechanism 2 located at the first side edge, it can be ensured that the heating mechanism 2 located at the first side edge can avoid the intersection position and attach the first film strip 300 and the second film strip 200 at the first side edge of the back plate 100 to the back plate 100, and ensure that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0178] Of the at least three heating mechanisms 2 of the membrane strip transport mechanism, the heating mechanism 2 located at the second side edge is used to lay the first membrane strip 300 to the second side position of the back plate 100. As described in the first embodiment above, the intersection point on the first membrane strip 300 laid to the second side position is mirror-symmetrical to the intersection point on the first membrane strip 300 laid to the first side position.

[0179] Correspondingly, the clearance groove 26 on the second mounting plate 212 of the heating mechanism 2 located at the second side edge is as follows:

[0180] The clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 is open towards the second side (e.g., the lower side) and the first end (e.g., the left end) of the second mounting plate 212. This arrangement allows the clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 to avoid the right-angle intersection point E of the first end of the first membrane strip 300.

[0181] Similarly, the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 is open toward the second side (e.g., the lower side) and the second end (e.g., the right end) of the second mounting plate 212. This arrangement allows the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 to avoid the right-angle intersection point E of the second end of the first membrane strip 300.

[0182] The remaining clearance slots 26 are all open toward the second side (as above) of the second mounting plate 212. This arrangement allows the remaining clearance slots 26 to avoid the T-shaped intersection F on the first membrane strip 300.

[0183] As can be seen, by making the above-described arrangement of the heating mechanism 2 located at the second side edge, it can be ensured that the heating mechanism 2 located at the second side edge can avoid the intersection position and attach the first film strip 300 and the second film strip 200 at the second side edge of the back plate 100 to the back plate 100, and ensure that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0184] Of the at least three heating mechanisms 2 in the membrane strip transport mechanism, each heating mechanism 2 located in the middle correspondingly lays the first membrane strip 300 to the middle of the back plate 100. The clearance groove 26 on the second mounting plate 212 of the heating mechanism 2 located in the middle is configured as follows:

[0185] The clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 is open toward the first end of the second mounting plate 212. This arrangement allows the clearance groove 26 near the first end (e.g., the left end) of the second mounting plate 212 to avoid the T-shaped intersection F of the first end of the first membrane strip 300.

[0186] Similarly, the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 is open toward the second end of the second mounting plate 212. This arrangement allows the clearance groove 26 near the second end (e.g., the right end) of the second mounting plate 212 to avoid the T-shaped intersection F of the second end of the first membrane strip 300.

[0187] The remaining clearance slots 26 are all rectangular or circular closed slots. This arrangement ensures that the remaining clearance slots 26 can avoid the cross-shaped intersection point G on the first membrane strip 300.

[0188] As can be seen, by making the above-mentioned arrangement of the heating mechanism 2 in the middle, it can be ensured that the heating mechanism 2 in the middle can avoid the intersection position, and the first film strip 300 and the second film strip 200 in the middle of the back plate can be attached to the back plate 100, and it can be ensured that the first film strip 300 and the second film strip 200 can be firmly bonded to the back plate 100.

[0189] like Figure 14As shown, optionally, a plurality of strip-shaped second anti-adhesion grooves 213 are provided at intervals along the first direction on the bottom surface of the second mounting plate 212. The second anti-adhesion grooves 213 reduce the contact area between the second mounting plate 212 and the film strip, thereby reducing the adhesive force between the second mounting plate 212 and the film strip, and further ensuring that the second mounting plate 212 can smoothly separate from the film strip after it is attached to the back plate.

[0190] Optionally, the second anti-adhesion groove 213 is also provided with an air blowing hole 218. After the second mounting plate 212 attaches the membrane strip to the back plate, the air blowing hole 218 blows a high-speed airflow onto the membrane strip, so that the second mounting plate 212 can separate from the membrane strip more quickly.

[0191] like Figure 13 and Figure 15 As shown, optionally, in each of the second mounting plates 212, a second heating pin 214 is provided in the clearance groove near the first end of the second mounting plate 212 and in the clearance groove near the second end of the second mounting plate 212. The second heating pin 214 is buoyantly connected to the second mounting plate 212 and is used to heat the end of the film strip.

[0192] By providing second heating pins 214 at both ends of the second mounting plate 212, when the second mounting plate 212 picks up the film strip, the second heating pins 214 at both ends can press the two ends of the film strip respectively and heat the two ends of the film strip, thereby ensuring that the two ends of the film strip are adhered to the second heating pins 214. In this way, the two ends of the film strip can be prevented from sagging during the handling process.

[0193] Furthermore, since the second heating pin 214 is located in the recessed groove, when the second mounting plate 212 attaches the first film strip 300 to the back plate, the second heating pins 214 at both ends can respectively press the intersection of the two ends of the first film strip 300, thereby improving the adhesion between the first film strip 300 and the second film strip 200 at the intersection.

[0194] Since the second heating pin 214 can be floatingly connected to the second mounting plate 212, the second heating pin 214 can perform elastic pressing on the film strip, ensuring the pressing effect while avoiding damage to the back plate.

[0195] like Figures 15 to 16As shown, optionally, the second heating needle 214 is connected to the second mounting plate 212 in a floating manner via the third buffer connector 216. Optionally, the third buffer connector 216 includes a third spring. The second mounting plate 212 has a mounting hole corresponding to the position of the second heating needle 214. The second heating needle 214 passes through the mounting hole and is also provided with an outwardly protruding limiting portion. A limiting step that cooperates with the limiting portion is provided in the mounting hole. The third spring is sleeved on the second heating needle 214 and located in the mounting hole. The upper end of the third spring abuts against the second mounting plate 212, and the lower end of the third spring abuts against the limiting portion.

[0196] In its natural state, the second heating needle 214 extends downwards from the second mounting plate 212, and the third spring naturally extends. When the second heating needle 214 contacts the diaphragm strip and the second mounting plate 212 continues to descend, the second heating needle 214 is compressed and rises relative to the second mounting plate 212, and the third spring is compressed and contracts.

[0197] like Figure 2 As shown, for the case where the number of heating mechanisms 2 is at least three, and each heating mechanism 2 is used to heat one film strip, optionally, the driving mechanism 1 includes a moving part 11 and a separating part 12, wherein: the separating part 12 is connected to the movable part of the moving part 11, and each heating mechanism 2 is spaced apart on the movable part of the separating part 12 along a second direction (such as the Y direction).

[0198] The moving part 11 is used to drive each heating mechanism 2 to move between the material picking station and the film applying station. The spacing part 12 is used to adjust the spacing between each heating mechanism 2.

[0199] By configuring the drive mechanism 1 to include a moving part 11 and a spacing part 12, on the one hand, the drive mechanism 1 can drive each heating mechanism 2 to move between the material picking station and the film application station, so that after each heating mechanism 2 picks up the film strip from the material picking station, it transports the film strip and applies it to the back plate at the film application station. On the other hand, during the transport process, the spacing part 12 can adjust the spacing between the film strips so that the spacing between the film strips conforms to the shape of the battery string assembly, thereby improving the compatibility of the film strip transport device of this application.

[0200] The moving part 11 can be any existing moving device capable of driving the heating mechanism 2 to translate and move up and down. For example, the moving part 11 is composed of a translation drive module and a lifting drive module, wherein the translation drive module is used to drive the heating mechanism 2 to translate, and the lifting drive module is used to drive the heating mechanism 2 to move up and down. Alternatively, the moving part 11 can be a multi-axis robot arm.

[0201] The spacing section 12 employs various existing spacing drive mechanisms capable of adjusting the spacing between each heating mechanism 2. For example, the spacing section 12 includes at least three linear drive elements (e.g., cylinders, lead screw modules, etc.) corresponding one-to-one with each heating mechanism 2. Each linear drive element simultaneously drives each heating mechanism 2 to translate along a second direction, thereby adjusting the spacing between the heating mechanisms 2. Alternatively, the spacing section 12 may be a linear motor with multiple movers, with each heating mechanism 2 correspondingly connected to one of the movers of the linear motor. The linear motor drives each heating mechanism 2 to translate along the second direction uniformly, thereby adjusting the spacing between the heating mechanisms 2.

[0202] Based on the same concept, this application also provides a membrane strip transport method, which can be implemented by the membrane strip transport device in any of the above embodiments, the membrane strip transport method comprising:

[0203] S1. Turn on the heating mechanism to heat the heating surface of the heating mechanism and the first anti-adhesion layer.

[0204] S2. Control the drive mechanism to drive the heating mechanism to move to the material picking station, so that the first anti-adhesion layer of the heating mechanism is attached to the upper surface of the film strip located at the material picking station, and the film strip is bonded to the first anti-adhesion layer.

[0205] S3. Control the drive mechanism to drive the heating mechanism to move, and transport the film strip from the material picking station to the film application station. During the movement, control the heating mechanism to continuously heat the film strip.

[0206] S4. Control the drive mechanism to drive the heating mechanism to press down the film strip and adhere the film strip to the back plate located at the film application station.

[0207] S5. Control the drive mechanism to drive the heating mechanism to lift and detach from the back plate, so that the first anti-adhesion layer of the heating mechanism is separated from the film strip.

[0208] The membrane strip handling method in this embodiment heats the membrane strip to be handled by a heating mechanism, causing the upper surface of the membrane strip to release its adhesiveness and adhere to the first anti-adhesion layer of the heating mechanism. Subsequently, the heating mechanism handles the membrane strip to the backing plate and can continuously heat the membrane strip during the handling process, causing the lower surface of the membrane strip to release its adhesiveness and thus adhere to the backing plate after it is laid on it.

[0209] Since the adhesive force between the lower surface of the membrane strip and the back plate is greater than the adhesive force between the upper surface of the membrane strip and the first anti-adhesion layer, the heating mechanism can be easily separated from the membrane strip after the bonding of the membrane strip is completed.

[0210] Optionally, the heating mechanism can heat the membrane strip at a temperature of 80℃ to 150℃.

[0211] In existing membrane strip handling mechanisms, after the membrane strip is laid onto the back plate, the heating mechanism heats the membrane strip. In order to enable the membrane strip to release its stickiness as soon as possible and ensure the working cycle, the heating temperature of the heating mechanism is generally set to a high temperature of over 200°C. This heating temperature increases the risk of membrane strip carbonization.

[0212] When using the film strip handling method of this application for film strip application, the heating mechanism can continuously heat the film strip during the process of transporting the film strip to the film application station. The film strip is heated for a long time, so setting the heating temperature to 80℃-150℃ can ensure that the film strip can fully release its adhesiveness. In addition, the heating temperature of 80℃-150℃ reduces the risk of the film strip being carbonized.

[0213] Since the membrane strip handling method in this application embodiment can be implemented by the membrane strip handling device in any of the above embodiments, further implementation details can be found in the relevant descriptions of the implementation of the membrane strip handling device in the previous embodiments, and will not be repeated here.

[0214] Based on the same concept, this application also provides a film application device, such as... Figure 17 As shown, the film-applying device in this embodiment includes a carrier device 10, a first film strip laying device 20, a carrier platform 30, and a film strip transport device 40, wherein the film strip transport device 40 is the film strip transport device in any of the above embodiments of this application.

[0215] The support device 10 is used to support the back panel 100, and the station where the support device 10 is located is the aforementioned film application station.

[0216] The first film strip laying device 20 is configured to lay the first film strip onto the support platform 30, and the workstation where the support platform 30 is located is the aforementioned material picking station.

[0217] The membrane strip transport device 40 is configured to transport the first membrane strip on the carrier platform 30 to the back plate 100, so that the first membrane strip is adhered to the back plate.

[0218] By setting up the support device 10, the back plate 100 is supported. The support platform 30 supports the first film strip laid by the first film strip laying device 20, and the film strip transport device 40 picks up the first film strip and applies it to the back plate 100, thereby enabling the film application equipment in this embodiment to automatically apply the first film strip.

[0219] Optionally, the film-applying device in this embodiment further includes a second film strip laying device 50, which is configured to lay the second film strip onto the back plate. The film strip transport device 40 then transports the first film strip onto the back plate 100, such that the first film strip and the second film strip intersect perpendicularly. The film strip transport device 40 is also configured to simultaneously heat the first film strip and the second film strip, so that the first film strip and the second film strip are simultaneously bonded to the back plate.

[0220] After the second film strip laying device 50 lays the second film strip on the back plate 100, the film strip transport device 40 then applies the first film strip to the back plate 100 and heats the first and second film strips at the same time, so that the first and second film strips are bonded to the back plate at the same time, further improving the film application efficiency.

[0221] like Figure 1 As shown, the first film strip 300 needs to be applied to both the first half (left half) and the second half (right half) of the back plate 100. To improve the efficiency of applying the first film strip 300, optionally, the support platform 30, the film strip transport device 40, and the second film strip laying device 50 are all configured as two sets. In this way, the film application equipment in this embodiment can simultaneously apply two sets of first film strips 300 to the first half and the second half of the back plate 100.

[0222] This application provides a sufficiently detailed and specific description. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within its protection scope. The scope of protection claimed in this application is defined by the claims, not by the above descriptions in the embodiments. Without contradiction, some optional components in one embodiment can also be used in another embodiment, and some preferred structures of the same component in one embodiment are also applicable to another embodiment. Furthermore, there may be slight differences in the wording of the names of certain components in different embodiments; these slight differences will not affect the understanding of the technical solution of the present invention by those skilled in the art.

Claims

1. A membrane strip transport device, characterized in that, The film strip conveying device, used for attaching film strips to a backing plate, includes a drive mechanism and at least one heating mechanism, wherein: The heating mechanism is mounted on the movable part of the driving mechanism, and the driving mechanism is at least used to drive the heating mechanism to move between the material picking station and the film applying station. The bottom of the heating mechanism is provided with a heating surface extending in a first direction, and a first anti-adhesion layer is provided on the heating surface. The heating mechanism is used to heat the film strip located at the material handling station, so that the upper surface of the film strip is adhered to the first anti-adhesion layer. The heating mechanism is also used to attach the heated film strip to the backing plate located at the film application station, so that the lower surface of the film strip is bonded to the backing plate, wherein the adhesive force between the lower surface of the film strip and the backing plate is greater than the adhesive force between the upper surface of the film strip and the first anti-adhesion layer.

2. The membrane strip transport device as described in claim 1, characterized in that, The first anti-adhesion layer is a Teflon layer.

3. The membrane strip transport device as described in claim 1, characterized in that, The heating mechanism includes a first mounting bracket, a first mounting plate, and a plurality of heating heads, wherein: The first mounting bracket is connected to the movable part of the drive mechanism; The first mounting plate is disposed on the first mounting frame along the first direction, and a plurality of heating heads are disposed at intervals along the first direction on the first mounting plate, with the bottom surfaces of the plurality of heating heads together forming the heating surface; Each of the heating heads is connected to the first mounting plate in a floating manner, and each heating head extends downwards out of the first mounting plate in its natural state.

4. The membrane strip transport device as described in claim 3, characterized in that: When the heating mechanism heats the film strip located at the material picking station or applies the heated film strip to the back plate located at the film applying station, the heating head floats upward under pressure, and the bottom surface of the first mounting plate contacts the upper surface of the film strip. The bottom surface of the first mounting plate is provided with a second anti-adhesion layer, and the adhesion between the lower surface of the film strip and the back plate is greater than the adhesion between the upper surface of the film strip and the second anti-adhesion layer.

5. The membrane strip transport device as described in claim 4, characterized in that, The second anti-adhesion layer is a Teflon layer.

6. The membrane strip transport device as described in claim 4, characterized in that, The bottom surface of the first mounting plate is provided with a plurality of strip-shaped first anti-adhesion grooves at intervals along the first direction.

7. The membrane strip transport device as described in claim 3, characterized in that, The first mounting plate is connected to the first mounting bracket via the first heat insulation block; The first mounting plate is provided with a first heating component, and the first mounting plate heats each of the heating heads through the first heating component; or, each of the heating heads is provided with a first heating component.

8. The membrane strip transport device as described in claim 3, characterized in that: The number of heating mechanisms is at least three, and each heating mechanism is spaced apart on the moving part of the driving mechanism along the second direction. Each heating mechanism is used to heat one membrane strip. Each heating head of the heating mechanism has a clearance groove on its bottom surface to avoid the intersection of the membrane strips. The second direction is perpendicular to the first direction.

9. The membrane strip transport device as described in claim 8, characterized in that: In the heating mechanism located at the first side edge, the clearance groove on the heating head near the first end of the first mounting plate is open to the first side and the first end of the first mounting plate, the clearance groove on the heating head near the second end of the first mounting plate is open to the first side and the second end of the first mounting plate, and the clearance groove on the remaining heating heads is open to the first side of the first mounting plate. Of the heating heads of the heating mechanism located at the second side edge, the clearance groove on the heating head near the first end of the first mounting plate is open to the second side and the first end of the first mounting plate, the clearance groove on the heating head near the second end of the first mounting plate is open to the second side and the second end of the first mounting plate, and the clearance groove on the remaining heating heads is open to the second side of the first mounting plate. Of the heating heads of the remaining heating mechanisms located in the middle, the clearance groove on the heating head near the first end of the first mounting plate is open toward the first end of the first mounting plate, the clearance groove on the heating head near the second end of the first mounting plate is open toward the second end of the first mounting plate, and the clearance groove on the remaining heating heads is a rectangular or circular closed groove.

10. The membrane strip transport device as described in claim 8, characterized in that, In each of the heating heads of each heating mechanism, the heating head near the first end of the first mounting plate and the heating head near the second end of the first mounting plate are each provided with a first heating needle. The first heating needle is buoyantly connected to the heating head and located in the clearance groove. The first heating needle is used to heat the end of the film strip.

11. The membrane strip transport device as claimed in claim 1, characterized in that, The heating mechanism includes a second mounting bracket and a second mounting plate, wherein: The second mounting bracket can be mounted vertically on the moving part of the drive mechanism; The second mounting plate is disposed on the second mounting bracket along the first direction, and the bottom surface of the second mounting plate constitutes the heating surface.

12. The membrane strip transport device as described in claim 11, characterized in that, The second mounting plate is connected to the second mounting frame via the second heat insulation block, and the second mounting plate contains a second heating component.

13. The membrane strip transport device as described in claim 11, characterized in that: The number of heating mechanisms is at least three. Each heating mechanism is spaced apart on the moving part of the driving mechanism along the second direction. The second mounting plate of each heating mechanism is used to heat one membrane strip. The bottom surface of each second mounting plate is provided with a plurality of clearance grooves spaced apart along the first direction to avoid the intersection of membrane strips. The second direction is perpendicular to the first direction.

14. The membrane strip transport device as described in claim 13, characterized in that, The heating mechanism located at the first side edge has an open-cut groove near the first end of the second mounting plate that faces the first side and the first end of the second mounting plate, an open-cut groove near the second end of the second mounting plate that faces the first side and the second end of the second mounting plate, and the remaining open-cut grooves that face the first side of the second mounting plate. The heating mechanism located at the second side edge has an open-cut groove near the first end of the second mounting plate that faces the second side and the first end of the second mounting plate, an open-cut groove near the second end of the second mounting plate that faces the second side and the second end of the second mounting plate, and the remaining open-cut grooves that face the second side of the second mounting plate. The remaining heating mechanisms located in the middle have the following openings: the clearance groove near the first end of the second mounting plate is open towards the first end of the second mounting plate; the clearance groove near the second end of the second mounting plate is open towards the second end of the second mounting plate; and the remaining clearance grooves are rectangular or circular closed grooves.

15. The membrane strip transport device as described in claim 11, characterized in that, The bottom surface of the second mounting plate is provided with a plurality of strip-shaped second anti-adhesion grooves spaced apart along the first direction, or, The bottom surface of the second mounting plate is provided with a plurality of strip-shaped second anti-adhesion grooves at intervals along the first direction, and the second anti-adhesion grooves are also provided with air blowing holes.

16. The membrane strip transport device as described in claim 13, characterized in that, In each of the second mounting plates, a second heating pin is provided in the clearance groove near the first end of the second mounting plate and in the clearance groove near the second end of the second mounting plate. The second heating pin is buoyantly connected to the second mounting plate. The second heating needle is used to heat the end of the film strip.

17. The membrane strip transport device as claimed in claim 1, characterized in that, The number of heating mechanisms is at least three, and each heating mechanism is used to heat one membrane strip. The drive mechanism includes a moving part and a separating part, wherein: The spacing section is connected to the movable component of the moving part, and each of the heating mechanisms is spaced apart and connected to the movable component of the spacing section along a second direction, the second direction being perpendicular to the first direction; The moving part is used to drive each of the heating mechanisms to move between the material picking station and the film applying station; The spacing section is used to adjust the distance between each of the heating mechanisms.

18. A film application device, characterized in that, The film application equipment includes a carrier device, a first film strip laying device, a carrier platform, and a film strip transport device as described in any one of claims 1 to 17, wherein: The supporting device is used to support the back plate; The first membrane strip laying device is configured to lay the first membrane strip onto the support platform; The membrane strip transport device is configured to transport the first membrane strip on the carrier platform to the back plate, such that the first membrane strip is adhered to the back plate.

19. The film application device as described in claim 18, characterized in that, The film application equipment further includes a second film strip laying device, which is configured to lay a second film strip onto the back plate. The film strip transporting device transports the first film strip onto the back plate such that the first film strip and the second film strip intersect perpendicularly. The film strip transporting device is also configured to simultaneously heat the first film strip and the second film strip, so that the first film strip and the second film strip are simultaneously adhered to the back plate.

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