Chip module capable of being embedded

Abstract

The utility model discloses an embeddable chip module, which relates to the technical field of computers and comprises a packaging carrier, a chip and external connecting pins, the chip is packaged inside the packaging carrier, and the external connecting pins are welded outside the packaging carrier. The external connecting pins are in occlusion connection with external connecting pins on other packaging carriers through mechanical tenon structures, electromagnetic coils are arranged in the external connecting pins, and when the distance between the external connecting pins located on the two different packaging carriers is smaller than a first distance threshold value, the two external connecting pins are magnetically attracted to be automatically occluded, and the two external connecting pins are separated from each other. Therefore, the technical problem of the fixed connection mode of the chip is solved.

Description

Technical Field

[0001] This utility model relates to the field of computers, and more specifically, to a embeddable chip module. Background Technology

[0002] In the field of chip design and manufacturing, traditional pins are usually arranged in planar arrays or pin arrays. Once the design of a traditional chip is completed, its pin functions and connection methods are basically fixed. The fixed pin layout makes it impossible to dynamically adjust the connection combination of its pins when facing different application scenarios, which limits the versatility and application flexibility of the chip. Furthermore, because the pin functions and connection methods are fixed, in order to meet the connection requirements of different functions, a large number of vias and complex routing strategies are required when routing on the circuit board to ensure that each pin can be correctly connected to the specified circuit network. This not only increases the complexity of the circuit board design, but also reduces the space utilization.

[0003] In other words, there is a technical problem with the fixed chip connection method in the existing technology. Utility Model Content

[0004] This utility model provides a nestable chip module to at least solve the technical problem of fixed chip connection methods in the prior art.

[0005] According to one embodiment of the present invention, a configurable chip module is provided, comprising: a packaging carrier, a chip, and external connection pins. The chip is packaged inside the packaging carrier, and the external connection pins are soldered to the outside of the packaging carrier. The external connection pins are engaged with external connection pins on other packaging carriers via a mechanical latch structure. Each external connection pin contains an electromagnetic coil, which is used to automatically engage the two external connection pins magnetically when the distance between the external connection pins located on two different packaging carriers is less than a first distance threshold, thereby forming an electrical connection.

[0006] Alternatively, as an alternative embodiment, the external connecting pins of the mechanical latch structure consist of conductive pin chains and pin teeth.

[0007] Optionally, as an alternative embodiment, the pin chain tooth includes a left pin chain tooth and a right pin chain tooth, wherein a first length between the tip of the left pin chain tooth and the tip of the right pin chain tooth is greater than the width of the pin chain band.

[0008] Optionally, as an alternative embodiment, when there are multiple external connection pins on one side of the packaging carrier, the multiple external connection pins are arranged according to a first interval distance.

[0009] Alternatively, as an optional embodiment, when the external connection pin is used for power supply, the first spacing distance is equal to the length of the pin chain tooth.

[0010] Optionally, as an alternative embodiment, when the external connection pin is used for signal transmission, the first spacing distance is greater than or equal to the length of the pin chain tooth.

[0011] Alternatively, as an optional embodiment, when the current direction in the electromagnetic coil changes, the two interlocking external connection pins separate, breaking the electrical connection.

[0012] Optionally, as an alternative embodiment, the external connection pins are soldered to any one side of the packaging carrier; or, the external connection pins are soldered to any two sides of the packaging carrier; or, the external connection pins are soldered to any three sides of the packaging carrier; or, the external connection pins are soldered to each side of the packaging carrier.

[0013] Alternatively, as an optional embodiment, the external connection pins on the packaging carrier that are in a detached state can be folded and retracted into the packaging carrier.

[0014] This invention relates to an external connection pin with a mechanical latch structure welded onto a packaging carrier. When two pins approach each other, they automatically engage to form a stable electrical connection. When the chip needs to be separated for functional upgrades or mode switching, the latch is released by external force. This simple operation enables the chip to be combined and separated, meeting the needs of different chip pin functional designs and improving space utilization. It solves the technical problem of fixed chip connection methods and low space utilization in the prior art, achieving the technical effect of improving the flexibility of chip connection combination and improving space utilization. Attached Figure Description

[0015] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of a embeddable chip module provided for an embodiment of this utility model;

[0017] Figure 2 A schematic diagram of external connection pins on a fitable chip module provided for an embodiment of this utility model;

[0018] Figure 3 A schematic diagram of an assembly of a nestable chip module provided for an embodiment of this utility model;

[0019] Figure 4 A schematic diagram of another configurable chip module provided in an embodiment of this utility model;

[0020] Figure 5 This is a schematic diagram of the pin chain teeth of an external connection pin on a fitable chip module, provided as an embodiment of the present invention. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that in the description of this utility model, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this utility model are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0023] An embodiment of this utility model provides a embeddable chip module, and the contents related to this utility model are explained herein:

[0024] 1) Chip: A chip is a product that integrates a large number of transistors, resistors, capacitors and other electronic components onto a tiny silicon wafer. Chips are the core of modern electronic devices, responsible for processing data, performing computing tasks and controlling device functions.

[0025] 2) Packaging carrier: refers to the structure in chip packaging used to carry and protect the chip, while providing the necessary electrical connections so that the chip can interact with external circuits.

[0026] 3) Microelectromechanical systems: Systems that integrate microelectronics and micromechanical technologies, enabling the integration of mechanical and electronic functions at the micrometer level.

[0027] 4) Electromagnetic force: A force generated by electric charge and current, which can both attract and repel objects. It can be used as a power source to drive pin separation and connection, achieving the purpose by controlling magnetic materials or electromagnetic devices.

[0028] As an optional embodiment, the aforementioned embeddable chip module includes: a packaging carrier, a chip, and external connection pins. The chip is packaged inside the packaging carrier, and the external connection pins are soldered to the outside of the packaging carrier. The external connection pins are connected to other external connection pins on the packaging carrier via a mechanical latch structure. Each external connection pin contains an electromagnetic coil, used to automatically engage the two external connection pins magnetically when the distance between them located on two different packaging carriers is less than a first distance threshold, thus forming an electrical connection. Figure 1 As shown, Figure 1 The chip 104 is packaged inside the packaging carrier 102, and the external connection pins 106 are soldered to the outside of the packaging carrier 102.

[0029] Optionally, the aforementioned packaging carrier is a structured platform used to carry and package the chip, providing the necessary physical support and electrical connection points, while protecting the chip from damage by the external environment.

[0030] Optionally, the aforementioned external connection pins are protruding metal contacts on the package carrier, used to electrically connect the chip to a circuit board or other external devices.

[0031] It should be noted that, as Figure 1 As shown, the external connection pin 106 has a mechanical latch structure, which allows it to engage with corresponding pins on other packaging carriers based on its unique mechanical latch structure. It automatically forms a connection when needed, providing a stable electrical path, and separates with a simple mechanical action when not needed, providing a basis for dynamic chip function configuration and device upgrades. Optionally, the aforementioned external connection pin has an embedded electromagnetic coil. When the distance between two external connection pins located on different packaging carriers is less than a first distance threshold, the electromagnetic coil is activated, generating a magnetic attraction force that causes the two pins to automatically engage and form a stable electrical connection. Utilizing the characteristics of electromagnetic force, remote automated precise docking is achieved without manual intervention, significantly improving connection efficiency and reliability.

[0032] It should be noted that, in other embodiments not shown, the electromagnetic coil can also be designed to respond to external wireless signals of a specific frequency, further enhancing the flexibility of pin connection management. In this way, even in high-density integration environments, accurate pin identification and seamless connection can be ensured, reducing signal interference or connection failures caused by poor physical contact, and optimizing the overall system's electrical performance and stability.

[0033] In this embodiment of the invention, when the pins on two packaging carriers approach each other, the mechanical latch structure automatically engages and establishes an electrical connection, ensuring the stability of signal transmission and power supply. When it is necessary to change the pin connection or adapt to new functions, a specific external force can be applied to loosen the latch structure, thereby separating the pins and enabling reconfiguration of pin functions. This not only improves the flexibility of the chip in various application environments but also simplifies circuit layout, improves space utilization, and reduces the size of the chip package. It overcomes the inherent limitations of chip pin design in existing technologies, achieving efficient connection and disconnection of chip modules, enhancing the scalability and adaptability of the chip, reducing design costs, and improving the performance and size efficiency of integrated electronic products.

[0034] As an alternative embodiment, the external connecting pins of the mechanical latch structure consist of conductive pin chains and pin chain teeth.

[0035] It should be noted that, Figure 1 The external connecting pin 106 of the mechanical tenon structure is made of, for example Figure 2 The conductive pin chain 202 and pin chain teeth 204 shown in the figure have unique openable and closable characteristics.

[0036] In some alternative implementations, the engagement method between the external connecting pins of the mechanical latch structure is as follows: Figure 3 Figure 4 As shown, the pins are not in complete contact at this time, and connection and separation can be achieved through specific mechanical or electrical mechanisms.

[0037] By employing the embodiments of this utility model, the pin chain and pin chain teeth enable external connection pins to automatically interlock and form an electrical connection when they come close together. When an external command requires disconnection, the chain teeth can be disengaged by a specific external force, realizing the separation of the pins. This allows for free combination between chips, improving the flexibility of chip design. Furthermore, it allows for the disconnection of some pins when it is necessary to change the pin function without affecting other pins, enabling modification of pin functions. In addition, the interlocking design in this application reduces space waste caused by wiring and improves space utilization.

[0038] As an alternative embodiment, the pin chain teeth include a left pin chain tooth and a right pin chain tooth, wherein a first length between the tip of the left pin chain tooth and the tip of the right pin chain tooth is greater than the width of the pin chain band.

[0039] Optionally, Figure 2 The pin chain tooth 204 specifically includes the left chain tooth and the right chain tooth, such as Figure 5 The first length L between the tip 502 of the left chain tooth and the tip 504 of the right chain tooth is greater than the width d of the foot chain.

[0040] It should be noted that, in other embodiments not shown, the first length L between the tip 502 of the left zipper tooth and the tip 504 of the right zipper tooth, as well as the angle of the zipper tooth, can be adjusted according to the needs of specific application scenarios to adapt to different electrical characteristics and mechanical connection requirements, further enhancing the flexibility and applicability of the zipper-type pin solution.

[0041] By employing the embodiments of this utility model, pin units can be arranged efficiently and densely within a limited space, while ensuring proper isolation between pins to prevent electrical interference. By precisely controlling the relative position and spacing of the left and right chain teeth, the chip edge area can be utilized to the maximum extent without affecting electrical performance, thereby optimizing chip size and improving packaging efficiency, and enhancing the flexibility of chip design.

[0042] As an optional embodiment, when there are multiple external connection pins on one side of the packaging carrier, the multiple external connection pins are arranged at a first interval.

[0043] Optionally, when multiple external connection pins are located on one side of the package carrier, they are arranged according to a first interval. The specific first interval is to ensure that the mechanical latches on adjacent pins can properly engage and disengage. If the interval is too small, interference may occur during the connection process, causing the latches to fail to lock. If the interval is too large, it may reduce the utilization rate of the package carrier and the connection density of the chip. Within the limited space of the package carrier, a reasonable first interval allows for the arrangement of more external connection pins as compactly as possible while maintaining electrical isolation and connection stability.

[0044] In addition, the design also takes into account the flexibility and scalability during chip use, so that without changing the main structure of the chip, the number and position of external connection pins can be adjusted to achieve possible future functional upgrades or compatibility expansions.

[0045] It should be noted that, in other embodiments not shown, the pin spacing can be customized according to specific needs to achieve optimal electrical performance and space utilization efficiency. This ability to dynamically adjust the pin spacing enhances the flexibility and versatility of chip design, enabling it to better adapt to diverse industrial standards and user needs.

[0046] By employing the embodiments of this utility model and precisely controlling the first interval distance, not only can the pin density be reasonably arranged to meet the needs of different application scenarios, but also the electromagnetic interference between adjacent pins can be effectively managed, thereby improving the overall electrical performance.

[0047] As an optional embodiment, when the external connection pin is used for power supply, the first spacing distance is equal to the length of the pin chain tooth. When the external connection pin is used for power supply, the first spacing distance is equal to the length of the pin chain tooth, ensuring that the chain teeth can be fully embedded into each other's chain teeth in the pin engagement state, forming maximum area contact, thereby providing a stable electrical connection.

[0048] In this embodiment of the invention, when the first spacing distance is equal to the length of the pin chain tooth, the power supply pins form a stable electrical channel in the connected state, which helps to distribute current evenly, reduce hot spots, and improve heat dissipation performance. At the same time, the deep contact increases the current carrying capacity, supporting higher power transmission requirements.

[0049] As an optional embodiment, when the external connection pin is used for signal transmission, the first spacing distance is greater than or equal to the length of the pin chain tooth.

[0050] It should be noted that in this embodiment, when the function of the pin is, for example, to transmit address signals, its layout design follows the "one-to-one" principle. That is, each external connection pin carrying an address signal should be connected to a unique target pin to ensure the accuracy and stability of signal transmission. At this time, the "first interval distance" between external connection pins is set to be greater than the length of the pin chain teeth to ensure that under any circumstances, an address signal pin can only be engaged with the corresponding target pin, avoiding the possibility of accidentally touching other pins, thereby eliminating the risk of signal confusion. The larger interval can also reduce electromagnetic interference and maintain the purity of the signal.

[0051] In certain scenarios, such as data sharing on a data bus or transmission of broadcast signals, a signal pin needs to send a signal to multiple target receiving points. A one-to-many connection method can be considered, allowing a pin to engage with multiple targets simultaneously or selectively. In this case, the first interval distance is set to be equal to the length of the pin chain teeth.

[0052] By employing this embodiment of the invention, the relationship between the first interval distance and the pin chain tooth length is determined based on the function of the pin, thereby improving the flexibility of the pin assembly.

[0053] As an alternative embodiment, when the current direction in the electromagnetic coil changes, the two interlocking external connection pins separate, breaking the electrical connection.

[0054] When the direction of the current in the electromagnetic coil changes, the two interlocking external connection pins separate, breaking the electrical connection. Specifically, by controlling the forward and reverse flow of current in the electromagnetic coil, the connection and disconnection of the pin units can be precisely controlled.

[0055] In this embodiment of the invention, when current flows in the forward direction, the latch structure between the pins locks in place, forming a stable electrical connection. When the current direction reverses, the resulting change in the magnetic field causes the latch to loosen, thereby separating the pins. This provides an efficient and precise pin control method that can change the connection state without physical contact, greatly improving the chip's adaptability and flexibility in various application environments. In other embodiments not shown, the speed and force of pin separation can also be controlled by adjusting the current intensity or frequency to adapt to the needs of different scenarios.

[0056] As an optional embodiment, the external connection pins are soldered to any one side of the packaging carrier; or, the external connection pins are soldered to any two sides of the packaging carrier; or, the external connection pins are soldered to any three sides of the packaging carrier; or, the external connection pins are soldered to each side of the packaging carrier.

[0057] It should be noted that external connection pins can be soldered on any one side of the package carrier. This layout can adapt to single-sided connection applications, simplifying the wiring design on the circuit board. Alternatively, external connection pins can be soldered on any two sides of the package carrier. This double-sided configuration increases the connection points between the chip and external circuits, helping to improve the chip's electrical performance and thermal management capabilities. Furthermore, external connection pins can be soldered on any three sides of the package carrier. This design further enhances the chip's connection flexibility and scalability, suitable for multi-port or high-density interconnection requirements. Or, external connection pins can be soldered on each side of the package carrier, achieving all-round connection coverage and minimizing restrictions on the layout of external circuits, which is especially suitable for high-performance, multi-functional integrated chip designs.

[0058] By employing embodiments of this utility model, and by designing different soldering positions and numbers of external connection pins on the packaging carrier, the optimal pin configuration strategy can be provided under different physical spaces and functional requirements, thereby optimizing the chip's package size, electrical performance, and heat dissipation capabilities, and enhancing the chip's versatility and applicability.

[0059] As an optional embodiment, the external connection pins on the packaging carrier that are in a detached state can be folded and retracted into the packaging carrier.

[0060] Optionally, the aforementioned external connection pins are designed to be foldable. The folding and storage of the pins can be achieved by springs, hinges or microelectromechanical systems (MEMS) components, allowing the pins to unfold to the engagement position under external force (such as manual operation or automatic control) and automatically fold back into the storage slot when there is no external force, thus realizing the automatic switching between its engagement and disengagement states.

[0061] When not in use, the pins can be folded along a preset axis or joint and stored inside the chip package housing or edge area, allowing the package to present a more compact state when certain pins are not in use, thereby adapting to various installation environments and space requirements, and promoting the miniaturization and high-density integration of the overall design.

[0062] It's also understandable that, due to the excellent thermal conductivity of the pin units themselves, the external connection pins in their separated state are directly exposed to the external environment, enabling them to conduct heat generated inside the chip to the outside more quickly, avoiding the risk of performance degradation or damage caused by heat accumulation. Furthermore, by strategically arranging the separated pins, an airflow guiding structure can be formed, directing cool air more effectively past the chip's heat source location, enhancing heat dissipation efficiency and significantly improving heat dissipation performance without significantly increasing the chip package size.

[0063] Different production processes may require chips to connect to different sensors and actuators. Chips using the zipper-type pin design of this application can achieve rapid adaptation to different production processes by controlling the connection and combination of pins in the field via software, greatly improving the versatility and application flexibility of the chip. The zipper-type pin design, with its detachable characteristics, allows for the folding or storage of corresponding pins when certain functions are not in use, effectively reducing the overall size of the chip package. Furthermore, this application allows for more flexible adjustment of the pin connection direction and position, adjusting the connection position according to the circuit board's wiring requirements, reducing the number of vias, making the circuit board wiring simpler, improving the space utilization of the circuit board, and contributing to a more compact system design. By separating the pins when needed, the spacing between pins can be effectively increased, reducing electromagnetic interference between signals. Optimized heat dissipation and current carrying capacity allow the chip to better dissipate the heat generated during operation, withstand greater current, and improve the stability and reliability of the packaged chip, better meeting the demands of high-load operation.

[0064] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0065] The above provides a detailed description of the embeddable chip module provided by this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only intended to help understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A embeddable chip module, characterized in that, include: The package includes a carrier, a chip, and external connection pins. The chip is encapsulated inside the package carrier, and the external connection pins are soldered to the outside of the package carrier. The external connection pins are connected to other external connection pins on other package carriers via a mechanical latch structure. Each external connection pin contains an electromagnetic coil, which is used to automatically engage the two external connection pins magnetically when the distance between the external connection pins located on two different package carriers is less than a first distance threshold, thus forming an electrical connection.

2. The embeddable chip module according to claim 1, characterized in that, The external connecting pins of the mechanical latch structure consist of conductive pin chains and pin chain teeth.

3. The embeddable chip module according to claim 2, characterized in that, The pin chain teeth include a left pin chain tooth and a right pin chain tooth, and the first length between the tip of the left pin chain tooth and the tip of the right pin chain tooth is greater than the width of the pin chain band.

4. The embeddable chip module according to claim 2, characterized in that, When the packaging carrier has multiple external connection pins on one side, the multiple external connection pins are arranged at a first interval.

5. The embeddable chip module according to claim 4, characterized in that, When the external connection pin is used for power supply, the first interval distance is equal to the length of the pin chain tooth.

6. The embeddable chip module according to claim 4, characterized in that, When the external connection pin is used for signal transmission, the first interval distance is greater than or equal to the length of the pin chain tooth.

7. The embeddable chip module according to claim 1, characterized in that, When the direction of the current in the electromagnetic coil changes, the two interlocking external connection pins separate, breaking the electrical connection.

8. The embeddable chip module according to claim 1, characterized in that, The external connection pins are soldered to any one side of the packaging carrier; or, The external connection pins are welded to any two sides of the packaging carrier; or, The external connection pins are soldered to any three sides of the packaging carrier; or, The external connection pins are soldered to each side of the packaging carrier.

9. The embeddable chip module according to any one of claims 1-8, characterized in that, The external connecting pins on the packaging carrier that are in a detached state can be folded and stored inside the packaging carrier.

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