Laser processing head and laser processing apparatus

Abstract

The utility model discloses a laser machining head and laser machining equipment, and relates to the technical field of laser machining, the laser machining head comprises a shell, a laser device and a detection assembly, and the shell is provided with a mounting cavity and an opening communicating with the mounting cavity; the laser is arranged in the mounting cavity, and a light outlet of the laser and the opening direction of the opening are the same; the detection assembly is arranged on the shell and comprises an acquisition module and a first line laser, and the acquisition module is arranged on one side of the laser; the laser projection range of the first line laser is within the collection range of the collection module. According to the technical scheme, the contour information of the machined workpiece can be accurately detected.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser processing technical field, especially a kind of laser processing head and laser processing equipment. BACKGROUND

[0002] Laser processing equipment is with laser as processing medium, make processing material melt and gasify under laser irradiation and reach the processing purpose of engraving, cutting, welding, marking etc..When laser processing, the shape characteristics such as surface profile and flatness of processing workpiece can influence the precision and quality of laser processing, and the detection accuracy of shape characteristics of processing workpiece in current laser processing equipment is low. SUMMARY

[0003] The utility model discloses a kind of laser processing head and laser processing equipment, to accurately measure the profile image and shape characteristics of processing workpiece.

[0004] To achieve the above object, the laser processing head provided by the utility model comprises:

[0005] A shell is provided with a mounting cavity and an opening communicating with the mounting cavity;

[0006] A laser is arranged in the mounting cavity, and the light outlet of the laser is in the same direction as the opening of the opening;

[0007] A detection assembly is arranged in the shell, and the detection assembly comprises a collection module and a first line laser; the collection module is arranged on one side of the laser; and the laser projection range of the first line laser is within the collection range of the collection module.

[0008] In an embodiment, the first line laser is slidably arranged, and the sliding direction of the first line laser is arranged at an angle with the laser line projected thereby.

[0009] In an embodiment, the detection assembly further comprises a first driving member, which is in transmission cooperation with the first line laser and is used to drive the first line laser to move.

[0010] In an embodiment, at least part of the structure of the first line laser is arranged in the mounting cavity.

[0011] And / or, at least part of the structure of the collection module is arranged in the mounting cavity.

[0012] In an embodiment, the laser processing head comprises a first mounting bracket, the first mounting bracket is mounted on the outside of the shell, and at least one of the first line laser and the collection module is arranged in the first mounting bracket.

[0013] In an embodiment, the laser processing head further comprises a fixing member, the fixing member is provided with a mounting hole, the first linear laser passes through the mounting hole to be mounted on the fixing member;

[0014] And / or, the laser processing head further comprises a first cover, the first cover covers the first linear laser, the first cover is provided with a first light transmission hole, the light outlet of the first linear laser is arranged towards the first light transmission hole.

[0015] In an embodiment, the detection assembly further comprises a second linear laser, the laser projection range of the second linear laser is within the collection range of the collection module, the length direction of the laser lines projected by the first linear laser and the second linear laser intersect.

[0016] In an embodiment, the second linear laser is arranged to be slidable, the sliding direction of the second linear laser is arranged to be at an angle with the length direction of the laser line projected by the second linear laser;

[0017] And / or, the first linear laser is arranged on one side of the collection module along a first direction, the second linear laser is arranged on one side of the collection module along a second direction, the first direction and the second direction intersect.

[0018] In an embodiment, the first linear laser and the second linear laser are both arranged in the mounting cavity;

[0019] Or, the first linear laser and the second linear laser are arranged on the same side of the shell;

[0020] Or, the first linear laser and the second linear laser are arranged on different sides of the shell;

[0021] Or, the laser processing head further comprises a mounting bracket, the first linear laser and the second linear laser are mounted on the mounting bracket, and the mounting bracket is mounted on the shell.

[0022] The present application also proposes a laser processing device, comprising:

[0023] The laser processing head as described in any of the preceding embodiments; and

[0024] A moving assembly connected with the laser processing head, used to drive the laser processing head to move.

[0025] The technical scheme of the utility model discloses a first line laser and an acquisition module are arranged on the laser processing head, the first line laser can project line laser on the surface of the workpiece to scan the workpiece, the acquisition module can acquire the deformation laser line on the surface of the workpiece, and the three-dimensional point cloud data of the surface of the workpiece can be obtained, so that the workpiece surface profile image and shape feature can be accurately obtained, and the laser processing precision and quality are improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the structure shown in the drawings without creative labor for the ordinary skilled in the art.

[0027] Figure 1 The structural diagram of the laser processing equipment provided according to some embodiments of the application is provided.

[0028] Figure 2 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0029] Figure 3 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0030] Figure 4 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0031] Figure 5 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0032] Figure 6 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0033] Figure 7 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0034] Figure 8 The structural diagram of the laser processing head provided according to some embodiments of the application is provided.

[0035] BRIEF DESCRIPTION OF DRAWINGS

[0036] 1000, laser processing equipment; 100, laser processing head; 10, shell; 11, air vent; 20, laser; 30, detection assembly; 31, acquisition module; 32, first line laser; 33, second line laser; 34, first driving member; 35, second driving member; 40, first mounting frame; 50, second mounting frame; 60, fixing member; 70, first cover; 71, first light transmission hole; 80, second cover; 81, second light transmission hole; 90, heat dissipation module; 91, heat dissipation fin; X, first direction; Y, second direction;

[0037] 200, rack; 300, moving assembly; 301, first slide rail; 302, second slide rail.

[0038] The realization, functional features and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0040] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0041] In addition, if the embodiments of the utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, taking "A and / or B" as an example, including A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skill in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0042] The laser processing equipment is a processing equipment taking laser as a processing medium to make the processing material melt and gasify under laser irradiation to achieve the processing purposes of carving, cutting, welding, marking and the like. When the laser processing is performed, the surface profile and flatness and the like shape features of the processing workpiece will have an influence on the precision and quality of the laser processing, and the detection accuracy of the shape features of the processing workpiece in the laser processing equipment is low at present.

[0043] Based on the above problems, the utility model provides a laser processing head 100 which can accurately measure the profile image and shape features of the processing workpiece.

[0044] Please refer to Figures 1 to 3 In an embodiment of the utility model, the laser processing head 100 includes a shell 10, a laser 20 and a detection assembly 30, the shell 10 is provided with a mounting cavity and an opening communicating with the mounting cavity, the laser 20 is arranged in the mounting cavity, and the light outlet of the laser 20 is in the same direction as the opening of the opening, the detection assembly 30 is arranged in the shell 10, and the detection assembly 30 includes a collection module 31 and a first line laser 32, the collection module 31 is arranged on one side of the laser 20, and the laser projection range of the first line laser 32 is located in the collection range of the collection module 31.

[0045] The laser processing head 100 can be applied in the laser processing equipment 1000 to emit laser for realizing laser carving, laser welding, laser marking, laser cutting and the like laser processing operation. In the laser processing equipment 1000, a moving assembly 300 for driving the laser processing head 100 to translate is usually further included, and the moving assembly 300 can drive the laser processing head 100 to move in at least one direction, so that the laser processing head 100 can be moved to different positions for processing.

[0046] The laser processing head 100 includes the shell 10 as a bearing base, and the shell 10 can bear and install the laser 20 and the detection assembly 30 and the like structure to make the laser processing head 100 integrally arranged. The shell 10 is provided with a mounting cavity and an opening communicating with the mounting cavity, the laser 20 as a functional component for generating laser is arranged in the mounting cavity, and the light outlet of the laser 20 is arranged towards the opening of the mounting cavity.

[0047] The detection assembly 30 is used to detect the structure of the machining workpiece, for example, can be used to detect at least one of the surface profile, surface flatness and thickness of the machining workpiece. The detection assembly 30 comprises a collection module 31 and a first line laser 32, in some embodiments, the collection module 31 is provided as a camera, and the collection module 31 and the laser 20 are arranged towards the same side, so that when the laser processing head 100 is applied to the laser processing equipment 1000, the laser 20 and the collection module 31 are both arranged towards the machining platform of the laser processing equipment 1000. The first line laser 32 comprises a laser 20 and an optical lens, and can project a laser beam on the target area to form a laser line. The first line laser 32 can project a single line, i.e. project a laser line on the target area; the first line laser 32 can also project multiple lines, i.e. project multiple parallel laser lines on the target area. The laser projection range of the first line laser 32 is within the collection range of the collection module 31, i.e. when the laser processing head 100 is applied to the laser processing equipment 1000, the first line laser 32 can project a laser line on the machining platform or the machining workpiece placed on the machining platform; the collection module 31 can collect the projected laser line, thereby obtaining the three-dimensional point cloud data of the machining workpiece, to obtain the three-dimensional structure data of the machining workpiece. Taking the laser 20 emitting laser vertically downward for processing as an example, the laser emitting direction of the first line laser 32 is arranged obliquely compared with the vertical direction. In addition, the detection assembly 30 is arranged on the laser processing head 100, and when the laser processing head 100 is applied to the laser processing equipment 1000, the laser processing head 100 can be driven to translate by the moving assembly 300, so that the detection assembly 30 can be moved to scan the machining workpiece, without the need to arrange other driving structures to drive the detection assembly 30 to move. Optionally, the collection module 31 can be arranged in the mounting cavity or outside the mounting cavity. In addition, the first line laser 32 can be arranged in the mounting cavity or outside the mounting cavity.

[0048] In other embodiments, the collection module 31 can also be a device other than a camera, such as a light detector, etc. Based on the principle of structured light, the principle of time of flight, etc., the data collected by the collection module 31 can realize three-dimensional scanning.

[0049] In an embodiment of the present application, the detection assembly 30 is configured to acquire the profile image of the workpiece surface before laser processing, so that the laser processing parameters can be adjusted according to the profile and height of different positions during laser processing, such as adjusting the height of the laser focal point, so as to improve the laser processing precision. In some embodiments, the acquisition module 31 is a camera, and the first line laser 32 is configured to project a line laser on the surface of the workpiece to be processed to scan the workpiece to be processed, and the acquisition module 31 is configured to acquire the deformed laser line image of the surface of the workpiece to be processed. Any point on the laser line in the line image is extracted, and a ray is formed from the optical center of the camera to the any point on the laser line. The three-dimensional coordinates of the any point in the camera coordinate system are determined through the intersection of the ray and the light knife plane. Thus, the point cloud of the measured object in the camera coordinate system can be obtained, and the point cloud information of the measured object in the world coordinate system can be obtained based on the external parameters of the camera, so that the profile image of the workpiece surface can be accurately acquired. In this way, the position of the laser focal point, the height of the laser processing head 100 or other processing parameters can be adjusted according to the surface height of the workpiece at different positions during laser processing, so as to improve the processing precision.

[0050] In an embodiment of the present application, the detection assembly 30 is configured to acquire the profile image of the workpiece surface after laser processing, so as to detect the laser processing quality, such as detecting the laser engraving precision or detecting the flatness of the weld after laser welding.

[0051] That is, according to the technical solution of the present application, the first line laser 32 and the acquisition module 31 are arranged on the laser processing head 100. The first line laser 32 is configured to project a line laser on the surface of the workpiece to be processed to scan the workpiece to be processed, and the acquisition module 31 is configured to acquire the deformed laser line on the surface of the workpiece to be processed, so as to obtain the three-dimensional point cloud data of the surface of the workpiece to be processed, and accurately acquire the profile image and shape features of the workpiece surface, thereby improving the laser processing precision and quality.

[0052] Optionally, in some embodiments, the laser processing head 100 further comprises a heat dissipation module 90. The heat dissipation module 90 can be arranged in the housing 10 or outside the housing 10. The heat dissipation module 90 is configured to improve the heat dissipation efficiency and prevent the laser 20 from overheating. The heat dissipation module 90 can be at least one of a heat dissipation fin 91, a heat dissipation fan and a water-cooled heat sink. Optionally, in some embodiments, the housing 10 is provided with an air vent 11 communicating with the installation cavity, so as to flow the air in and out of the installation cavity to accelerate heat dissipation.

[0053] Please refer to Figure 4 In some embodiments of the present application, the first line laser 32 is slidably arranged, and the sliding direction of the first line laser 32 is arranged at an angle with the length direction of the projected laser line.

[0054] In this embodiment, the first line laser 32 is slidably arranged. In this way, the position of the first line laser 32 can be adjusted to adjust the projection position of the first line laser 32. The position of the first line laser 32 can be adjusted according to different detection requirements. The first line laser 32 can also be driven to slide to scan the workpiece to obtain a three-dimensional profile image of the surface of the workpiece.

[0055] Optionally, the position of the first line laser 32 can be manually adjusted, or a driving member can be arranged to drive the first line laser 32 to move. The driving member can be, but is not limited to, a motor-screw mechanism, a synchronous belt mechanism, a gear and rack mechanism, and a cylinder pushing mechanism.

[0056] The laser processing head 100 provided in this embodiment can also be used to detect the thickness of the workpiece by the movement distance of the first line laser 32. For example, the first line laser 32 is first used to project a first laser line on the processing platform, the image information of the first laser line is collected by the collecting module 31, and the position of the first laser line in the image is obtained. After the workpiece is placed on the processing platform, the first line laser 32 is used to project a second laser line on the processing platform, the image information of the second laser line is collected by the collecting module 31, and the position of the second laser line in the image is obtained. The first line laser 32 is translated until the position of the second laser line in the image coincides with the position of the first laser line in the image. The movement distance of the first line laser 32 is obtained, and the thickness of the workpiece is calculated by the system.

[0057] Please refer to Figure 4 In some embodiments of the present application, the detection assembly 30 further comprises a first driving member 34 in transmission cooperation with the first line laser 32, for driving the first line laser 32 to move.

[0058] In the embodiment, the first driving member 34 can be, but is not limited to, a motor screw mechanism, a synchronous belt mechanism, a gear and rack mechanism, and a cylinder pushing mechanism, etc. The first driving member 34 drives the first linear laser 32 to slide, so as to improve the automation degree and the use convenience. Optionally, when the first linear laser 32 is arranged in the mounting cavity of the shell 10, the first driving member 34 can be arranged in the mounting cavity, or part of the structure of the first driving member 34 is arranged inside the mounting cavity and the other part is arranged outside the mounting cavity. For example, the motor screw transmission driving mechanism is used as the first driving member 34, the driving motor and the screw rod are arranged outside the mounting cavity, the screw nut sleeved with the screw rod is arranged to connect the first linear laser 32 in the mounting cavity, which can be directly connected, or the first linear laser 32 is connected with the shell 10 through a sliding block, and the screw nut is connected to the sliding block. In some embodiments, the first linear laser 32 is arranged on the first mounting frame 40 outside the mounting cavity, and the first driving member 34 can be arranged on the first mounting frame 40, or part of the structure of the first driving member 34 is arranged inside the first mounting frame 40 and the other part is arranged in the mounting cavity or outside the first mounting frame 40 and the shell 10.

[0059] Please refer to Figure 5 In some embodiments of the present application, at least part of the first linear laser 32 is arranged in the mounting cavity.

[0060] In the embodiment, the first linear laser 32 is arranged in the shell 10, and the light outlet of the first linear laser 32 is arranged outside the opening of the mounting cavity. The shell 10 can protect the first linear laser 32, and the appearance of the laser processing head 100 is regular and unified, the structure of the laser processing head 100 protruding outward is reduced, and the risk of interference and collision of the laser processing head 100 with other devices during movement in the laser processing equipment 1000 is avoided. Optionally, the first linear laser 32 can be located on one side of the laser 20 along the first direction, or on one side of the laser 20 along the second direction, the first direction X is arranged at an angle with the laser line projected by the first linear laser 32, and the second direction Y is parallel to the laser line projected by the first linear laser 32.

[0061] Optionally, the first linear laser 32 can be fixed on a mounting frame, and the mounting frame is fixed in the mounting cavity.

[0062] Please refer to Figure 5 In some embodiments of the present application, at least part of the first linear laser 32 is arranged in the mounting cavity.

[0063] In this way, the shell 10 can protect the collection module 31, and the appearance of the laser processing head 100 is regular and unified, and the structure of the laser processing head 100 protruding outward is reduced, which is beneficial to avoid the risk of interference and collision of the laser processing head 100 with other devices when the laser processing head 100 moves in the laser processing equipment 1000. Optionally, the collection module 31 is located in the mounting cavity and can be arranged on any side of the laser 20.

[0064] Referring to Figure 3 and Figure 8 In some embodiments of the present application, the laser processing head 100 comprises a first mounting frame 40, the first mounting frame 40 is mounted on the outer side of the shell 10, and at least one of the first line laser 32 and the collection module 31 is arranged on the first mounting frame 40.

[0065] In this embodiment, the first mounting frame 40 is connected and fixed to the outer wall of the shell 10, the first line laser 32 of the detection assembly 30 can be arranged on the first mounting frame 40, or the collection module 31 can be arranged on the first mounting frame 40, or both the first line laser 32 and the collection module 31 can be arranged on the first mounting frame 40. The first mounting frame 40 facilitates the structural expansion and design of the laser processing head 100, and improves the flexibility of the structural design of the laser processing head 100 and the convenience of disassembly and assembly.

[0066] Optionally, the first mounting frame 40 can be provided in a plate structure, a frame structure or a shell structure, for example, a containing space can be arranged in the first mounting frame 40, and at least one of the first line laser 32 and the collection module 31 is arranged in the containing space.

[0067] Referring to Figures 3 to 6 In some embodiments of the present application, the laser processing head 100 further comprises a fixing member 60, the fixing member 60 is provided with a mounting hole, and the first line laser 32 is arranged in the mounting hole to be mounted on the fixing member 60.

[0068] In this embodiment, the fixing member 60 can be provided in a ring structure, a cylindrical structure or other shapes, and the mounting hole is arranged on the fixing member 60, and the first line laser 32 is inserted into the mounting hole to be connected with the fixing member 60; in this way, the first line laser 32 is stably mounted and is convenient to disassemble and assemble. Optionally, the first line laser 32 can be interference fitted in the mounting hole, or can be threadedly connected with the mounting hole or fixed by using a jackscrew structure, which is not limited herein.

[0069] Referring to Figure 8 In some embodiments of the present application, the laser processing head 100 further comprises a first cover 70, the first cover 70 covers the first line laser 32, and the first cover 70 is provided with a first light transmission hole 71 corresponding to the light outlet of the first line laser 32.

[0070] In the embodiment, the first cover 70 is arranged in the laser processing head 100, the first cover 70 covers the first linear laser 32 to protect the first linear laser 32 and reduce the risk of damage of the first linear laser 32. The first cover 70 is provided with a first light-transmitting hole 71, and the laser emitted by the first linear laser 32 can be emitted outward through the first light-transmitting hole 71.

[0071] Please refer to Figure 3 , Figure 6 and Figure 8 In some embodiments of the present application, the detection assembly 30 further comprises a second linear laser 33, the laser projection range of the second linear laser 33 is located in the collection range of the collection module 31, and the length directions of the laser lines projected by the first linear laser 32 and the second linear laser 33 intersect.

[0072] In the embodiment, the second linear laser 33 is arranged in the detection assembly 30, and the second linear laser 33 can be arranged in the mounting cavity or outside the mounting cavity. The second linear laser 33 can also be used to project a laser line to the processing platform and the processing workpiece on the processing platform, and the laser line projected by the second linear laser 33 can also be collected by the collection module 31. The second linear laser 33 can be single-line projection, that is, a laser line is formed in the projection area; the second linear laser 33 can also be multi-line projection, that is, a plurality of parallel laser lines are formed in the projection area. Taking the laser 20 vertically downwardly emitting laser for processing as an example, the laser emission direction of the second linear laser 33 is arranged obliquely compared with the vertical direction.

[0073] In the embodiment, the length directions of the laser line projected by the first linear laser 32 and the laser line projected by the second linear laser 33 are different. This arrangement can increase the scanning range and the reference points of imaging by using two linear lasers 20, so as to improve the measurement accuracy and the degree of restoration of the target topography. In addition, the first linear laser 32 and the second linear laser 33 can be arranged at different projection angles, so that the detection assembly 30 can scan the workpiece in two directions, the accuracy is higher, and different scanning requirements and working environments can also be adapted.

[0074] In an embodiment of the present application, the detection assembly 30 is used for detecting the flatness of the placed processing workpiece, a plurality of first laser lines arranged in parallel are projected on the surface of the workpiece by the first linear laser 32, a plurality of second laser lines arranged in parallel are projected on the surface of the workpiece by the second linear laser 33, so as to form a linear laser grid on the surface of the workpiece, the image of the laser grid is collected, and whether the workpiece surface is flat is judged according to whether the laser grid is deformed.

[0075] Optionally, in the embodiment, the first linear laser 32 and the second linear laser 33 can be arranged in the housing 10; one of the first linear laser 32 and the second linear laser 33 can be arranged in the housing 10 and the other one can be arranged outside the housing 10; or both of the first linear laser 32 and the second linear laser 33 can be arranged outside the housing 10, which is not limited herein.

[0076] Please refer to Figure 3 In some embodiments of the present application, the first linear laser 32 is arranged at one side of the acquisition module 31 along the first direction X, and the second linear laser 33 is arranged at one side of the acquisition module 31 along the second direction Y, and the first direction X and the second direction Y intersect.

[0077] In the embodiment, the first linear laser 32 and the second linear laser 33 are arranged at different sides of the acquisition module 31 to have a larger space and range for arranging the first linear laser 32 and the second linear laser 33, so as to avoid the laser light path of the first linear laser 32 intersecting with the laser light path of the second linear laser 33, thereby avoiding the problem of beam crosstalk, so as to avoid imaging inaccuracy and ensure the three-dimensional scanning imaging precision and accuracy.

[0078] Optionally, a fixing member 60 can be arranged for fixing the second linear laser 33, the fixing member 60 can be arranged in a ring structure, a cylindrical structure or other shapes, and a mounting hole is arranged on the fixing member 60, and the second linear laser 33 is inserted into the mounting hole to be connected with the fixing member 60; in this mounting mode, the second linear laser 33 is stably mounted and is convenient to disassemble and assemble. Optionally, the second linear laser 33 can be interference fitted in the mounting hole, or can be threadedly connected with the mounting hole or fixed by using a jackscrew structure, which is not limited herein.

[0079] Please refer to Figure 8 In some embodiments of the present application, a second cover 80 can be arranged in the laser processing head 100, and the second cover 80 covers the second linear laser 33 to protect the second linear laser 33 and reduce the damage risk of the second linear laser 33. The second cover 80 is provided with a second light transmission hole 81, and the laser emitted by the second linear laser 33 can be emitted outward through the second light transmission hole 81.

[0080] Please refer to Figure 4 In some embodiments of the present application, the second linear laser 33 can be slidably arranged, and the sliding direction of the second linear laser 33 is arranged at an angle with the laser line projected thereby.

[0081] In the embodiment, the second line laser 33 is slidably arranged. In this way, the position of the second line laser 33 can be adjusted to adjust the projection position of the second line laser 33. The position of the second line laser 33 can be adjusted according to different detection requirements, or the second line laser 33 can be driven to slide to scan the workpiece to obtain a three-dimensional profile image of the surface of the workpiece.

[0082] Optionally, the position of the second line laser 33 can be manually adjusted, or a driving mechanism can be arranged to drive the second line laser 33 to move. The driving mechanism can be, but is not limited to, a motor-screw mechanism, a synchronous belt mechanism, a gear-and-rack mechanism, and a cylinder pushing mechanism.

[0083] In some embodiments, the first line laser 32 and the second line laser 33 can project two intersecting laser lines on the machining platform, and the position of the intersection of the two laser lines in the image can be obtained. After the workpiece is placed on the machining platform, the first line laser 32 and the second line laser 33 project laser lines on the surface of the workpiece, and the first line laser 32 and the second line laser 33 are moved to form a laser line intersection at the same position in the collected image. The movement distance of the first line laser 32 and the second line laser 33 can be obtained, and the thickness of the workpiece can be calculated by the system.

[0084] Please refer to Figure 4 In some embodiments of the present application, the detection assembly 30 further comprises a second driving member 35 in transmission cooperation with the second line laser 33, for driving the second line laser 33 to move.

[0085] In the embodiment, the second driving member 35 can be, but is not limited to, a motor-screw mechanism, a synchronous belt mechanism, a gear-and-rack mechanism, and a cylinder pushing mechanism. The second driving member 35 drives the second line laser 33 to slide, so as to improve the degree of automation and improve the convenience of use.

[0086] In some embodiments of the present application, the second line laser 33 is slidably arranged, and the sliding direction of the second line laser 33 is arranged at an angle with the length direction of the laser line projected by the second line laser 33. In this way, the workpiece can be scanned in different directions by moving the first line laser 32 and the second line laser 33, so as to improve the detection accuracy of the profile of the surface of the workpiece.

[0087] In addition, in some embodiments, one of the first line laser 32 and the second line laser 33 can be slidably arranged.

[0088] Please refer to Figure 6In some embodiments of the present application, the first linear laser 32 and the second linear laser 33 are arranged in the mounting cavity; in this way, the first linear laser 32 and the second linear laser 33 are accommodated in the housing 10, which can reduce the risk of damage to the first linear laser 32 and the second linear laser 33, and make the appearance of the laser processing head 100 neat and unified. Optionally, the first linear laser 32 and the second linear laser 33 are arranged on the same side of the laser 20; or the first linear laser 32 is arranged on one side of the laser 20 along the first direction X, and the second linear laser 33 is arranged on one side of the laser 20 along the second direction Y.

[0089] In combination with reference to Figure 7 and Figure 8 In some embodiments of the present application, the first linear laser 32 and the second linear laser 33 are arranged on the same side of the housing 10.

[0090] In this embodiment, the first linear laser 32 and the second linear laser 33 are arranged on the same side of the housing 10; for example, a first mounting bracket 40 can be arranged on the outside of the housing 10, and the first linear laser 32 and the second linear laser 33 can be arranged on the first mounting bracket 40; in this way, the installation positions of the first linear laser 32 and the second linear laser 33 are compact, which facilitates the disassembly and assembly of the first linear laser 32 and the second linear laser 33. In some embodiments, the acquisition module 31 is also arranged on the first mounting bracket 40, which facilitates the overall disassembly and assembly of the detection assembly 30; optionally, the first linear laser 32 and the second linear laser 33 can be arranged on the same side of the acquisition module 31; or the first linear laser 32 is arranged on one side of the acquisition module 31 along the first direction X, and the second linear laser 33 is arranged on one side of the acquisition module 31 along the second direction Y.

[0091] In combination with reference to Figure 3 and Figure 4 In some embodiments of the present application, the first linear laser 32 and the second linear laser 33 are arranged on different sides of the housing 10.

[0092] In this embodiment, the first linear laser 32 and the second linear laser 33 are arranged on different sides of the housing 10; for example, the first mounting bracket 40 can be arranged on one side of the housing 10 along the first direction X, and the second mounting bracket 50 can be arranged on one side of the housing 10 along the second direction Y; the first linear laser 32 is mounted on the first mounting bracket 40, and the second linear laser 33 is mounted on the second mounting bracket 50.

[0093] Optionally, the first mounting bracket 40 can be arranged in a plate structure, a frame structure or a shell structure; for example, a receiving space can be arranged in the first mounting bracket 40, and the first linear laser 32 can be arranged in the receiving space.

[0094] Optionally, the second mounting rack 50 can be provided in a plate structure, a frame structure or a housing structure, for example, a receiving space can be provided in the second mounting rack 50, and the second line laser 33 is arranged in the receiving space.

[0095] In some embodiments of the present application, the laser processing head 100 further comprises a mounting bracket, the first line laser 32 and the second line laser 33 are mounted on the mounting bracket, and the mounting bracket is mounted on the housing 10.

[0096] In the embodiment, the mounting bracket is arranged outside the housing 10, and the first line laser 32 and the second line laser 33 are arranged on the mounting bracket. At this time, the mounting positions of the first line laser 32 and the second line laser 33 are compact, the first line laser 32 and the second line laser 33 are integrated on the same module, and the first line laser 32 and the second line laser 33 are convenient to disassemble and assemble. In some embodiments, the acquisition module 31 is also arranged on the mounting bracket, and the detection assembly 30 is convenient to disassemble and assemble as a whole. Optionally, the first line laser 32 and the second line laser 33 can be arranged on the same side of the acquisition module 31; or the first line laser 32 is arranged on one side of the acquisition module 31 along the first direction X, and the second line laser 33 is arranged on one side of the acquisition module 31 along the second direction Y. Optionally, the mounting bracket can be located on one side of the housing 10 along the first direction X, or on one side of the housing 10 along the second direction Y; wherein the first direction X is arranged at an angle with the laser line projected by the first line laser 32, and the second direction Y is parallel to the laser line projected by the first line laser 32.

[0097] Please refer to Figure 1 The utility model further provides a kind of laser processing equipment 1000, the laser processing equipment 1000 includes laser processing head 100 and mobile assembly 300, and the specific structure of the laser processing head 100 refers to above-mentioned embodiment. Laser processing equipment 1000 further includes rack 200, rack 200 is as the bearing base of laser processing equipment 1000, for supporting and installing other devices of laser processing equipment 1000, and processing platform for placing processing workpiece is provided on rack 200;Laser processing head 100 is installed on mobile assembly 300, and located above processing platform, and laser processing head 100 can be driven to move to different positions by mobile assembly 300.

[0098] Optionally, the moving assembly 300 comprises a first slide rail 301 and a second slide rail 302 intersecting with each other, the second slide rail 302 is slidably arranged on the first slide rail 301, and the laser processing head 100 is slidably arranged on the second slide rail 302; the moving assembly 300 further comprises a first driving mechanism for driving the second slide rail 302 to slide along the first slide rail 301, and a second driving mechanism for driving the laser processing head 100 to slide along the second slide rail 302. The first driving mechanism can be arranged as a motor-screw mechanism, a synchronous belt transmission mechanism, a gear and rack transmission mechanism, a cylinder pushing mechanism, etc., and the second driving mechanism can also be arranged as a motor-screw mechanism, a synchronous belt transmission mechanism, a gear and rack transmission mechanism, a cylinder pushing mechanism, etc., which are not specifically limited here.

[0099] Since the laser processing equipment 1000 proposed in the present application adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0100] The above is only an exemplary embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A laser machining head, characterized by, The laser processing head comprises a housing, a laser, and a detection assembly. The housing is provided with a mounting cavity and an opening communicating with the mounting cavity. The laser is arranged in the mounting cavity, and the light outlet of the laser is in the same direction as the opening. The detection assembly is arranged in the housing and comprises a collection module and a first line laser. The first line laser is slidably arranged, and the sliding direction of the first line laser forms an angle with the laser line projected thereby.

2. The laser machining head of claim 1, wherein The detection assembly further comprises a first driving member in transmission cooperation with the first line laser for driving the first line laser to move.

3. The laser machining head of claim 2, wherein, At least part of the structure of the first line laser is arranged in the mounting cavity.

4. The laser machining head of claim 1, wherein At least part of the structure of the collection module is arranged in the mounting cavity. The laser processing head further comprises a first mounting frame mounted on the outer side of the housing, and at least one of the first line laser and the collection module is arranged in the first mounting frame.

5. The laser machining head of claim 1, wherein The laser processing head further comprises a fixing member provided with a mounting hole, and the first line laser is arranged in the mounting hole to be mounted on the fixing member.

6. The laser machining head of claim 1, wherein The laser processing head further comprises a first cover arranged on the first line laser, and the first cover is provided with a first light transmission hole, and the light outlet of the first line laser is arranged towards the first light transmission hole. The detection assembly further comprises a second line laser, and the laser projection range of the second line laser is within the collection range of the collection module.

7. The laser machining head as defined in any one of claims 1 to 6, characterized in that The first line laser and the second line laser project intersecting laser lines.

8. The laser machining head of claim 7, wherein, The second line laser is slidably arranged, and the sliding direction of the second line laser forms an angle with the length direction of the laser line projected thereby. The first line laser is arranged on one side of the collection module along a first direction, and the second line laser is arranged on one side of the collection module along a second direction, and the first direction intersects the second direction.

9. The laser machining head of claim 7, wherein The first line laser and the second line laser are arranged in the mounting cavity. Alternatively, the first line laser and the second line laser are arranged on the same side of the housing. Alternatively, the first line laser and the second line laser are arranged on different sides of the housing. Alternatively, the laser processing head further comprises a mounting bracket, and the first line laser and the second line laser are mounted on the mounting bracket, and the mounting bracket is mounted on the housing.

10. A laser processing apparatus characterized by comprising: The laser processing head as claimed in any one of claims 1 to 9; and A moving assembly connected with the laser processing head for driving the laser processing head to move. ​ ​

Images