Novel ceramic heating destressing device

Abstract

The utility model discloses a novel ceramic heating destressing device which comprises two heating assemblies, a die, an embossing assembly, a cooling assembly and a control module, the two heating assemblies are oppositely arranged between the die and the embossing assembly left and right, and the cooling assembly is located on one side of the embossing assembly; the heating assembly comprises a frame and a plurality of ceramic heating plates capable of automatically measuring temperature, a plurality of ceramic heating plate mounting areas which are distributed from top to bottom in an array mode are arranged in the frame, a plurality of ceramic heating plate mounting grooves which are distributed from left to right in an array mode are formed in the ceramic heating plate mounting areas, and ceramic heating plates are arranged in the ceramic heating plate mounting grooves; the frame is connected with the mold or the embossing assembly; the ceramic heating plate is detachably connected with the ceramic heating plate mounting groove; the mold is used for extruding plastic films. Different temperatures can be set for different areas, and the temperatures of the corresponding areas can be stably and flexibly controlled, so that the stress in the plastic film is effectively released; and independent replacement can be achieved, dismounting and mounting are convenient, and the maintenance cost is effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of plastic film processing, especially to a novel ceramic heating stress relieving device. BACKGROUND

[0002] With the high -speed development of plastic film industry, the rising of manual cost, the requirement of industry to equipment is higher and higher, and the cooling forming of plastic film is an important process in film production.

[0003] However, the heating device of prior art is single in heating mode, cannot realize regional temperature control, leads to the stress in the film product and cannot be effectively released, influences the cooling forming of film post -process, and moreover, the maintenance and dismounting are complicated, and the cost is high.

[0004] Therefore, in order to solve the above -mentioned problems, a novel ceramic heating stress relieving device is urgently needed, which can set different temperatures for different regions, can stably and flexibly control the temperature of the corresponding region, can effectively release the stress in the plastic film, and moreover, can be replaced individually, is convenient to dismount, and effectively reduces the maintenance cost. UTILITY MODEL CONTENTS

[0005] To solve the above -mentioned problems, the technical scheme adopted by the utility model is as follows:

[0006] A novel ceramic heating stress relieving device, comprising a heating assembly, a mold, an embossing assembly and a cooling assembly, characterized in that:

[0007] The heating assembly is two, and is arranged oppositely between the mold and the embossing assembly, and the cooling assembly is located on one side of the embossing assembly.

[0008] The heating assembly comprises a frame and a plurality of ceramic heating plates capable of automatic temperature measurement, a plurality of ceramic heating plate mounting areas are arranged in an array from top to bottom in the frame, a plurality of ceramic heating plate mounting grooves are arranged in an array from left to right on the ceramic heating plate mounting area, and a ceramic heating plate is arranged in each ceramic heating plate mounting groove.

[0009] The frame is connected with the mold or the embossing assembly.

[0010] The ceramic heating plate is detachably connected with the ceramic heating plate mounting groove.

[0011] The mold is used for extruding plastic film, and the plastic film passes through the heating assembly, the embossing assembly and the cooling assembly in sequence for embossing and cooling after being heated.

[0012] Further comprising a control module, and the control module is electrically connected with the heating assembly.

[0013] Preferably, the embossing assembly comprises a frame, a rubber roller and an embossing roller;

[0014] The rubber roller and the embossing roller are rotatably connected with the frame, and an embossing channel is formed between the rubber roller and the embossing roller;

[0015] A rubber roller driving assembly is arranged between the rubber roller and the frame, and the rubber roller driving assembly is used to drive the rubber roller to approach or move away from the embossing roller; the rubber roller driving assembly is electrically connected with the control module;

[0016] One of the frames is connected with the rubber roller driving assembly.

[0017] Preferably, the rubber roller driving assembly comprises a driver, a rubber roller connecting seat and a guide rail pair;

[0018] The rubber roller connecting seat is connected with the frame through the guide rail pair, both ends of the rubber roller are connected with the rubber roller connecting seat through bearings, and the driver is connected with the frame and is provided with a screw rod which is threadedly connected with the rubber roller connecting seat;

[0019] One of the frames is connected with the rubber roller connecting seat.

[0020] Preferably, the cooling assembly comprises a plurality of cooling rollers which are rotatably connected with the frame, and the plastic film is wound on the plurality of cooling rollers.

[0021] Preferably, the driver is a servo motor.

[0022] Preferably, the frame is arranged in parallel or inclined to the plastic film.

[0023] Preferably, the frame is provided with a silicon carbide-based coating on the side surface facing the plastic film.

[0024] Compared with the prior art, the utility model has the beneficial effects that:

[0025] The utility model can set different temperatures for different areas, can stably and flexibly control the temperature of the corresponding area, can be individually replaced, is convenient to disassemble and assemble, and effectively reduces the maintenance cost. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is the structural schematic diagram of the utility model;

[0027] Figure 2 It is the structural schematic diagram of the heating assembly in the utility model;

[0028] Among them: heating assembly 1, mold 2, frame 3, rubber roller 4, embossing roller 5, rubber roller driving assembly 6, cooling roller 7, frame 11, ceramic heating plate 12, driver 61, rubber roller connecting seat 62, guide rail pair 63, screw rod 64, ceramic heating plate mounting area 111, ceramic heating plate mounting groove 111a. DETAILED DESCRIPTION

[0029] For the purpose of facilitating the understanding of the present application, a more comprehensive description of the present application will be given below with reference to the relevant drawings. The drawings show preferred embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", "upper", "lower", "front", "rear", and similar terms as used herein are for the purpose of illustration only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0032] The present application will be further described below in conjunction with the drawings and the specific embodiments:

[0033] As shown in the drawings, a new ceramic heating stress relief device includes a heating assembly 1, a mold 2, an embossing assembly, and a cooling assembly. The heating assembly 1 is arranged between the mold 2 and the embossing assembly, and the cooling assembly is arranged on one side of the embossing assembly. Figures 1-2 The heating assembly 1 includes a frame 11 and a plurality of ceramic heating plates 12 capable of automatic temperature measurement. The frame 11 is provided with a plurality of ceramic heating plate mounting areas 111 arranged in an array from top to bottom. The ceramic heating plate mounting areas 111 are provided with a plurality of ceramic heating plate mounting grooves 111a arranged in an array from left to right. The ceramic heating plate mounting grooves 111a are each provided with a ceramic heating plate 12.

[0034] The frame 11 is connected to the mold 2 or the embossing assembly.

[0035] The ceramic heating plate 12 is detachably connected to the ceramic heating plate mounting groove 111a.

[0036]

[0037] ​The mold 2 is used for extruding plastic film 100, which is heated by the heating assembly 1 and then embossed by the embossing assembly and cooled by the cooling assembly in turn;

[0038] Further comprising a control module (not shown in the figure), which is electrically connected with the heating assembly 1.

[0039] In this embodiment, when the molten plastic film 100 is extruded from the mold 2 and passes through the heating assembly 1 during production, the heating assembly 1 generates heat to heat the plastic film 100, which is to release the internal stress of the plastic film 100, and then the plastic film 100 is embossed by the embossing assembly first and then cooled by the cooling assembly; since the heating assembly 1 is composed of the ceramic heating plate 12 and the frame 11, a plurality of automatic temperature measuring ceramic heating plates 12 are detachably arranged in the ceramic heating plate mounting groove 111a, which can set different temperatures for different areas of the plastic film 100 compared with the lamp tube type heating structure of the prior art, and under the action of the control module, the ceramic heating plates 12 in each area can maintain the temperature of the corresponding area stable according to the set temperature, so that the internal stress of the plastic film 100 is effectively released; and they can be replaced individually, which is convenient for disassembly and effectively reduces the maintenance cost.

[0040] Further, as shown in Figure 1 、 2 The embossing assembly comprises a rack 3, a rubber roller 4 and an embossing roller 5;

[0041] The rubber roller 4 and the embossing roller 5 are rotatably connected with the rack 3, and the rubber roller 4 and the embossing roller 5 form an embossing channel therebetween;

[0042] The rubber roller 4 and the rack 3 are provided with a rubber roller driving assembly 6, which is used to drive the rubber roller 4 to approach or move away from the embossing roller 5; the rubber roller driving assembly 6 is electrically connected with the control module;

[0043] One of the frames 11 is connected with the rubber roller driving assembly 6.

[0044] In this embodiment, the rubber roller driving assembly 6 is used to drive the rubber roller 4 to approach or move away from the embossing roller 5 to control the size of the embossing channel, so that the plastic film 100 extruded by the mold 2 can pass through the embossing channel before the equipment is started, and then the rubber roller driving assembly 6 drives the rubber roller 4 to approach the embossing roller 5 to the set position.

[0045] In this embodiment, the position of the rubber roller 4 is controlled at the same time to drive one side of the heating assembly 1 to approach or move away from the plastic film 100, so as to reduce the steps of adjustment and control and ensure the synchronization and stability of adjustment.

[0046] In this embodiment, the structure can control the distance between the two sides of the plastic film 100 and the heating assembly 1, and can control the distance between the two sides to be equal or not equal, so as to meet different processing requirements.

[0047] Further, as shown in Figure 1 、 2 The rubber roller driving assembly 6 includes a driver 61, a rubber roller connecting seat 62, and a guide rail pair 63.

[0048] The rubber roller connecting seat 62 is connected with the rack 3 through the guide rail pair 63, both ends of the rubber roller 4 are connected with the rubber roller connecting seat 62 through bearings, the driver 61 is connected with the rack 3, and a driving end is provided with a screw rod 64 which is threadedly connected with the rubber roller connecting seat 62.

[0049] One of the frames 11 is connected with the rubber roller connecting seat 62.

[0050] In this embodiment, the driving structure composed of the screw rod 64, the guide rail pair 63, and the driver 61 can stably and accurately control the embossing channel.

[0051] Further, as shown in Figure 1 In order to improve the cooling and forming effect of the plastic film 100, the cooling assembly includes a plurality of cooling rollers 7 which are rotatably connected with the rack 3, and the plastic film 100 is wound around the plurality of cooling rollers 7.

[0052] Further, as shown in Figure 1 、 2 In order to improve the driving precision and anti-extrusion stability of the rubber roller 4, the driver 61 is a servo motor.

[0053] Further, as shown in Figure 1 In order to meet different processing requirements of the plastic film 100, the frame 11 is arranged in parallel or inclined to the plastic film 100.

[0054] Further, in order to improve the high-temperature resistance and heat radiation effect of the frame 11, and achieve energy-saving and efficient heating, a side surface of the frame 11 facing the plastic film 100 is provided with a silicon carbide-based coating.

[0055] For those skilled in the art, based on the above described technical solutions and concepts, various corresponding changes and modifications can be made, and all of these changes and modifications should belong to the protection scope of the claims of the present utility model patent.

Claims

1. A novel ceramic heating stress relief device, comprising a heating assembly, a mold, an embossing assembly and a cooling assembly, characterized in that: the heating assembly is provided with two frames arranged oppositely on the left and right between the mold and the embossing assembly, and the cooling assembly is arranged on one side of the embossing assembly; the heating assembly comprises a frame and a plurality of ceramic heating plates capable of automatic temperature measurement, a plurality of ceramic heating plate mounting areas are arranged in an array from top to bottom in the frame, a plurality of ceramic heating plate mounting grooves are arranged in an array from left to right on the ceramic heating plate mounting areas, and a ceramic heating plate is arranged in each ceramic heating plate mounting groove; the frame is connected with the mold or the embossing assembly; the ceramic heating plate is detachably connected with the ceramic heating plate mounting groove; the mold is used for extruding a plastic film, and the plastic film is heated by passing through the heating assembly, and then sequentially passes through the embossing assembly and the cooling assembly for embossing and cooling; a control module is further included, and the control module is electrically connected with the heating assembly.

2. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the embossing assembly comprises a rack, a rubber roller and an embossing roller; the rubber roller and the embossing roller are rotatably connected with the rack, and an embossing channel is formed between the rubber roller and the embossing roller; a rubber roller driving assembly is arranged between the rubber roller and the rack, the rubber roller driving assembly is used for driving the rubber roller to approach or move away from the embossing roller, and the rubber roller driving assembly is electrically connected with the control module; one of the frames is connected with the rubber roller driving assembly.

3. A novel ceramic heating stress relieving device as claimed in claim 2, wherein, the rubber roller driving assembly comprises a driver, a rubber roller connecting seat and a guide rail pair; the rubber roller connecting seat is connected with the rack through the guide rail pair, both ends of the rubber roller are connected with the rubber roller connecting seat through bearings, the driver is connected with the rack, and a driving end is provided with a screw rod which is threadedly connected with the rubber roller connecting seat; one of the frames is connected with the rubber roller connecting seat.

4. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the cooling assembly comprises a plurality of cooling rollers rotatably connected with the rack, and the plastic film is wound around the plurality of cooling rollers.

5. A novel ceramic heating stress relieving device as claimed in claim 3, wherein, the driver is a servo motor.

6. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the frame is arranged in parallel or inclined to the plastic film.

7. A new ceramic heating stress relief device as claimed in claim 1, wherein, a silicon carbide-based coating is arranged on the surface of the side of the frame facing the plastic film.

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