Circulating nickel liquid medicine electroplating equipment for enhancing magnetic flux of connector

Abstract

The utility model relates to the technical field of electroplating, in particular to circulating type nickel liquid medicine electroplating equipment for enhancing magnetic flux of a connector, which comprises an electroplating bath, a filter cartridge is movably inserted into the inner side of the electroplating bath, and a gap is reserved between the bottom of the filter cartridge and the bottom of the inner side of the electroplating bath. A magnetic flux enhancing assembly is fixedly mounted on the outer side of the electroplating bath, mounting grooves are formed in the bottoms of the two sides of the electroplating bath respectively, the magnetic flux enhancing assembly comprises an electromagnetic coil, a wiring board is fixedly mounted on one side of the electromagnetic coil, and a plug hole is formed in the top of the wiring board. The top of the wiring board is plugged and electrically connected with a cathode frame through a plugging hole; a screw hole is formed in one side, deviating from the wiring board, of the upper end surface of the cathode frame, a screw is mounted in the screw hole in a threaded manner, and a hook is arranged at the bottom of the screw and extends into the inner side of the filter cartridge. The utility model solves the problems that the traditional electroplating equipment cannot effectively improve the magnetic flux of the connector, the electroplating liquid circulation treatment is extensive, and the electroplating process is inaccurate to control.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating technical field, concretely is a kind of cyclic nickel plating solution electroplating equipment of enhanced connector magnetic flux. BACKGROUND

[0002] In the connector manufacturing field, with the continuous miniaturization and high performance of electronic equipment, the performance requirements of the connector are increasingly stringent. As one of the key factors affecting the electrical performance of the connector, the enhancement technology of magnetic flux has become a research hotspot.

[0003] After a large number of searches, a publication number CN222160419U discloses an electroplating device for cold plate, the electroplating device for cold plate includes: tank, the tank is used to contain electroplating solution;A plurality of anodes, a plurality of the anodes are adjacent to the inner side wall of the tank, the anode can be connected to the positive pole of power supply;Mechanical arm, the mechanical arm can move horizontally and vertically, the mechanical arm includes moving plate;First motor, the first motor is arranged on the moving plate and its first rotating shaft passes through the moving plate downward;Hanger, the hanger includes turntable and rotatably connected connection mechanism below the turntable, the turntable connects the first rotating shaft of the first motor, the connection mechanism is used for connecting cold plate, the hanger can be connected to the negative pole of power supply.

[0004] In the prior art, the device can increase the uniformity and density of the plating layer and reduce the plating layer pits when in use. However, there are many deficiencies in improving the magnetic flux. On the one hand, conventional electroplating equipment only focuses on the basic quality of the plating layer, such as uniformity and density, lacks design for magnetic flux enhancement, and cannot meet the demand of modern connectors for high performance. For example, when some connectors transmit high-frequency signals, the signal attenuation is serious due to insufficient magnetic flux, which affects the overall performance of the equipment. On the other hand, the existing electroplating solution circulation and processing system is not fine enough. The ordinary circulation system is difficult to realize precise control of electroplating solution flow, pressure and impurity content, resulting in uneven distribution of metal ions in the electroplating process, which not only affects the quality of the plating layer, but also indirectly affects the magnetic performance of the connector. Therefore, it is urgent to develop an electroplating equipment that can enhance the magnetic flux of the connector and has efficient circulation and precise control function. Therefore, a cyclic nickel plating solution electroplating equipment for enhancing the magnetic flux of the connector is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of cyclic nickel plating solution electroplating equipment for enhancing the magnetic flux of the connector, with the advantages of enhancing the magnetic flux of the connector, optimizing electroplating solution circulation processing and precise control of electroplating process, solving the problems that traditional electroplating equipment cannot effectively improve the magnetic flux of the connector, electroplating solution circulation processing is extensive and electroplating process control is not accurate.

[0006] In order to achieve the above object, the utility model provides the following technical scheme: a kind of circulating nickel plating solution electroplating equipment of enhanced connector magnetic flux, including electroplating tank, filter cartridge is movably inserted in the inside of electroplating tank, and the inside bottom of electroplating tank is left with gap at the bottom of filter cartridge, the outside of electroplating tank is fixedly installed with magnetic flux enhancement component, and the bottom of both sides of electroplating tank is respectively provided with mounting groove, the magnetic flux enhancement component includes electromagnet coil, and the outside of electroplating tank is arranged and does not contact with the outer wall of electroplating tank, wiring board is fixedly installed in the side of electromagnet coil, plug-in hole is formed in the top of wiring board, and cathode holder is electrically connected by being inserted into plug-in hole in the top of wiring board;

[0007] Screw hole is formed in the side of cathode holder upper end face away from wiring board, and screw rod is threadedly installed, the bottom of screw rod is provided with hook and extends into the inside of filter cartridge, and connector body is hung in the bottom of screw rod.

[0008] Preferably, the bottom of the electroplating tank is designed in a conical structure and is provided with a liquid outlet hole, the bottom of the electroplating tank at the liquid outlet hole is connected and mounted with a circulating assembly, the bottom of the electroplating tank is fixedly mounted with a support frame, and the front of the electroplating tank is provided with a control assembly.

[0009] In the design, the bottom of the electroplating tank is designed in a conical structure and is provided with a liquid outlet hole, which enables the electroplating solution to flow out of the bottom of the electroplating tank more smoothly, facilitates connection with the circulating assembly to form an electroplating solution circulation, the circulating assembly is provided to realize the recycling of the electroplating solution, ensuring the activity and uniformity of the electroplating solution, the support frame is provided to realize stable support of the electroplating tank, ensuring the stability of the overall equipment, and the control assembly is provided to realize centralized control and adjustment of various parameters in the electroplating process, improving the precision and operability of the electroplating process.

[0010] Preferably, the circulating assembly includes a reflux pipe and a liquid return pipe, one end of the reflux pipe is communicated with the liquid outlet hole, a filter is mounted on the reflux pipe, the filter is provided with a control valve, one end of the liquid return pipe is communicated with the reflux pipe, a circulating pump is mounted on the liquid return pipe, and the other end of the liquid return pipe extends into the inside of the electroplating tank.

[0011] In the design, the reflux pipe is provided and one end thereof is communicated with the liquid outlet hole, which realizes the introduction of the electroplating solution in the electroplating tank for circulation treatment, the filter and its control valve are provided to realize effective filtration of impurities in the electroplating solution and adjust the filtration precision and flow according to actual needs, the liquid return pipe is provided and one end thereof is communicated with the reflux pipe and the other end extends into the inside of the electroplating tank, which realizes the return of the filtered electroplating solution into the electroplating tank, and the circulating pump is provided to provide power for the circulation of the electroplating solution, ensuring the stability and continuity of the electroplating solution circulation.

[0012] Preferably, the control assembly comprises a controller, and an anode frame is mounted on both sides of the controller through the second connecting line respectively, and the anode frame is embeddedly mounted on the inner side of the mounting groove.

[0013] In the design, by setting the controller, the controller as the control core of the whole electroplating equipment realizes unified management and adjustment of various parameters of the electroplating process; by setting the second connecting line, the controller and the anode frame are electrically connected, so that the controller can accurately control the anode frame; by setting the anode frame and embeddingly mounting the anode frame on the inner side of the mounting groove, the anode frame is provided for the electroplating process, so that the electroplating reaction can be carried out normally, and the design of the mounting groove makes the anode frame stable.

[0014] Preferably, the wiring board is electrically connected with the controller through the first connecting line, and the controller is further electrically connected with the circulating pump.

[0015] In the design, the wiring board and the controller are electrically connected through the first connecting line, so that the controller can control the magnetic flux enhancement assembly, adjust the magnetic field strength of the electromagnetic coil, and further affect the deposition of metal ions in the electroplating process; the controller is electrically connected with the circulating pump, so that the controller can control the running state of the circulating pump, such as adjusting the rotating speed of the circulating pump to change the circulating speed of the electroplating solution, thereby realizing comprehensive and accurate control of the whole electroplating process.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] The utility model discloses a magnetic flux enhancement assembly is arranged, reaches the effect that the magnetic flux of connector is enhanced. Traditional electroplating equipment often lacks the design specially aiming at improving the magnetic flux, and the magnetic flux enhancement assembly in the equipment includes the electromagnetic coil that is arranged on the outer side of the electroplating tank and does not contact the outer wall of the electroplating tank. When the electromagnetic coil is powered through the wiring board, the electromagnetic coil will generate a magnetic field. This magnetic field can act on the electroplating environment in the electroplating tank, especially around the connector body that is suspended through the screw rod bottom hook inside the filter cartridge. The existence of the magnetic field can change the motion trajectory and deposition mode of metal ions in the electroplating process, so that the metal ions are more orderly deposited on the surface of the connector body, thereby enhancing the magnetic flux of the connector, improving the electrical performance of the connector, and solving the problem that the traditional electroplating equipment cannot effectively improve the magnetic flux of the connector.

[0018] The utility model discloses a circulation assembly is set up, reached the effect that the electroplating solution circulation treatment is optimized. The electroplating solution circulation treatment mode of traditional electroplating equipment is relatively extensive, and the flow and impurity content of electroplating solution are difficult to control accurately. The bottom of the electroplating tank of the equipment adopts the conical structure design and is provided with a liquid outlet hole, and one end of the reflux pipe of the circulation assembly is communicated with the liquid outlet hole, and the electroplating solution flows out from the bottom of the electroplating tank and enters the reflux pipe. The filter with control valve is installed on the reflux pipe, and the precision of filtration and the flow of electroplating solution can be adjusted according to actual demand, and the impurities in the electroplating solution can be effectively removed. One end of the liquid return pipe is communicated with the reflux pipe, and the other end extends to the inside of the electroplating tank, and the circulation pump is installed on the liquid return pipe, and the filtered electroplating solution can be stably sent back to the electroplating tank, forming a cycle. This fine circulation treatment mode ensures the quality and stability of the electroplating solution, and solves the problem of extensive electroplating solution circulation treatment of traditional electroplating equipment.

[0019] The utility model discloses a control assembly is set up, reached the effect that the electroplating process is accurately controlled. The traditional electroplating equipment is difficult to accurately regulate each parameter in the electroplating process. The control assembly of the equipment includes the controller, and the controller both sides are installed with anode frame through second connecting wire respectively, and the anode frame is embedded and installed in the inside of the installation groove of the bottom of both sides of the electroplating tank. The terminal block is electrically connected with the controller through the first connecting line, and the controller is also electrically connected with the circulation pump. Through the controller, the current, voltage and other parameters between the anode frame and the cathode frame can be accurately adjusted, and the speed and quality of electroplating are controlled. At the same time, the circulation pump can also be controlled, and the circulation speed of electroplating solution is adjusted, the accurate control of the whole electroplating process is realized, and the problem of inaccurate electroplating process control of traditional electroplating equipment is solved. ACCURACY

[0020] Figure 1 It is the front view structure schematic drawing of the utility model;

[0021] Figure 2 It is the electroplating tank section structure schematic drawing of the utility model;

[0022] Figure 3 It is the circulation assembly structure schematic drawing of the utility model;

[0023] Figure 4 It is the magnetic flux enhancement assembly structure schematic drawing of the utility model;

[0024] Figure 5 It is the control assembly structure schematic drawing of the utility model.

[0025] As shown in the figure: 1, electroplating tank; 11, filter cartridge; 12, liquid outlet hole; 13, mounting groove; 14, support frame; 2, circulating assembly; 21, return pipe; 211, filter; 221, circulating pump; 22, liquid return pipe; 3, magnetic flux enhancement assembly; 31, electromagnetic coil; 32, wiring board; 321, plug-in hole; 322, first connecting line; 33, cathode frame; 34, screw rod; 35, connector body; 4, control assembly; 41, controller; 42, second connecting line; 43, anode frame. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0027] Embodiment one

[0028] As shown in the figure: 1, electroplating tank; 11, filter cartridge; 12, liquid outlet hole; 13, mounting groove; 14, support frame; 2, circulating assembly; 21, return pipe; 211, filter; 221, circulating pump; 22, liquid return pipe; 3, magnetic flux enhancement assembly; 31, electromagnetic coil; 32, wiring board; 321, plug-in hole; 322, first connecting line; 33, cathode frame; 34, screw rod; 35, connector body; 4, control assembly; 41, controller; 42, second connecting line; 43, anode frame. Figures 1 to 5 As shown in the figure: 1, electroplating tank; 11, filter cartridge; 12, liquid outlet hole; 13, mounting groove; 14, support frame; 2, circulating assembly; 21, return pipe; 211, filter; 221, circulating pump; 22, liquid return pipe; 3, magnetic flux enhancement assembly; 31, electromagnetic coil; 32, wiring board; 321, plug-in hole; 322, first connecting line; 33, cathode frame; 34, screw rod; 35, connector body; 4, control assembly; 41, controller; 42, second connecting line; 43, anode frame.

[0029] The screw rod 34 bottom is provided with a hook and extends into the filter cartridge 11 inside, and the screw rod 34 bottom hangs the connector body 35.

[0030] Specifically, by setting the magnetic flux enhancement assembly 3, the effect of enhancing the magnetic flux of the connector is achieved. Traditional electroplating equipment often lacks a design specifically aimed at improving the magnetic flux, while the magnetic flux enhancement assembly 3 in the present device includes an electromagnetic coil 31 arranged outside the electroplating tank 1 and not in contact with the outer wall of the electroplating tank 1. When the electromagnetic coil 31 is powered through the wiring board 32, the electromagnetic coil 31 will generate a magnetic field. This magnetic field can act on the electroplating environment inside the electroplating tank 1, especially around the connector body 35 suspended inside the filter cartridge 11 through the bottom hook of the screw rod 34. The presence of the magnetic field can change the trajectory and deposition mode of metal ions during the electroplating process, allowing metal ions to deposit more orderly on the surface of the connector body 35, thereby enhancing the magnetic flux of the connector, improving the electrical performance of the connector, and solving the problem of traditional electroplating equipment that cannot effectively enhance the magnetic flux of the connector.

[0031] By setting the circulation assembly 2, the effect of optimizing the electroplating solution circulation treatment is achieved. The electroplating solution circulation treatment method of traditional electroplating equipment is relatively extensive and it is difficult to accurately control the flow and impurity content of the electroplating solution. The bottom of the electroplating tank 1 of the present device is designed in a conical structure and has a liquid outlet hole 12. One end of the reflux pipe 21 of the circulation assembly 2 communicates with the liquid outlet hole 12, and the electroplating solution flows out from the bottom of the electroplating tank 1 into the reflux pipe 21. A filter 211 with a control valve is installed on the reflux pipe 21, which can adjust the filtering precision and the flow of the electroplating solution according to actual needs, effectively removing impurities in the electroplating solution. One end of the backflow pipe 22 communicates with the reflux pipe 21, and the other end extends to the inside of the electroplating tank 1. A circulating pump 221 is installed on the backflow pipe 22, which can stably send the filtered electroplating solution back into the electroplating tank 1, forming a circulation. This fine circulation treatment method ensures the quality and stability of the electroplating solution, solving the problem of extensive electroplating solution circulation treatment of traditional electroplating equipment.

[0032] By setting the control assembly 4, the effect of precisely controlling the electroplating process is achieved. It is difficult to accurately control various parameters during the electroplating process in traditional electroplating equipment. The control assembly 4 of the present device includes a controller 41, and an anode rack 43 is installed on both sides of the controller 41 through a second connection line 42. The anode rack 43 is embedded and installed inside the mounting slot 13 at the bottom of both sides of the electroplating tank 1. The wiring board 32 is electrically connected to the controller 41 through a first connection line 322, and the controller 41 is also electrically connected to the circulating pump 221. Through the controller 41, the current, voltage, and other parameters between the anode rack 43 and the cathode rack 33 can be accurately adjusted to control the speed and quality of electroplating. At the same time, the circulating pump 221 can also be controlled to adjust the circulation speed of the electroplating solution, achieving precise control of the entire electroplating process, solving the problem of inaccurate electroplating process control of traditional electroplating equipment.

[0033] Example Two

[0034] In order to realize smooth circulation of electroplating solution, effective filtration of impurities, precise control of electroplating process and stable operation of equipment, as shown in Figures 2 to 5 In this embodiment, the bottom of the electroplating tank 1 is designed in a conical structure and provided with a liquid outlet hole 12, the bottom of the electroplating tank 1 at the liquid outlet hole 12 is connected and installed with a circulating assembly 2, the bottom of the electroplating tank 1 is fixedly installed with a support frame 14, and the front of the electroplating tank 1 is provided with a control assembly 4.

[0035] In the design, by setting the bottom of the electroplating tank 1 in a conical structure and providing the liquid outlet hole 12, the electroplating solution can flow out more smoothly from the bottom of the electroplating tank 1, which is convenient for connecting with the circulating assembly 2 to form electroplating solution circulation; by setting the circulating assembly 2, the recycling of electroplating solution is realized, which ensures the activity and uniformity of the electroplating solution; by setting the support frame 14, the stable support of the electroplating tank 1 is realized, which ensures the stability of the whole equipment; by setting the control assembly 4, the centralized control and adjustment of various parameters of the electroplating process are realized, which improves the precision and operability of the electroplating process.

[0036] Further, the circulating assembly 2 includes a reflux pipe 21 and a liquid return pipe 22, one end of the reflux pipe 21 is communicated with the liquid outlet hole 12, a filter 211 is installed on the reflux pipe 21, the filter 211 is provided with a control valve, one end of the liquid return pipe 22 is communicated with the reflux pipe 21, a circulating pump 221 is installed on the liquid return pipe 22, and the other end of the liquid return pipe 22 extends to the inside of the electroplating tank 1.

[0037] In the design, by setting the reflux pipe 21 and making one end thereof communicated with the liquid outlet hole 12, the electroplating solution in the electroplating tank 1 is introduced out for recycling treatment; by setting the filter 211 and its control valve, effective filtration of impurities in the electroplating solution is realized, and the filtration precision and flow can be adjusted according to actual needs; by setting the liquid return pipe 22 so that one end thereof is communicated with the reflux pipe 21 and the other end extends to the inside of the electroplating tank 1, the filtered electroplating solution can return to the electroplating tank 1; by setting the circulating pump 221, power is provided for the circulation of the electroplating solution, which ensures the stability and continuity of the electroplating solution circulation.

[0038] Further, the control assembly 4 includes a controller 41, the controller 41 is installed with an anode frame 43 on both sides through a second connecting line 42, and the anode frame 43 is embeddedly installed on the inside of the installation groove 13.

[0039] In the design, by setting the controller 41, the control core of the whole electroplating equipment is realized, and various parameters of the electroplating process are uniformly managed and adjusted; by setting the second connecting line 42, the controller 41 is electrically connected with the anode frame 43, so that the controller 41 can accurately control the anode frame 43; by setting the anode frame 43 and embedding it in the inside of the mounting groove 13, the anode for the electroplating process is provided, and the normal progress of the electroplating reaction is ensured, and the design of the mounting groove 13 makes the anode frame 43 stable.

[0040] Further, the terminal block 32 is electrically connected with the controller 41 through the first connecting line 322, and the controller 41 is also electrically connected with the circulating pump 221.

[0041] In the design, the terminal block 32 is electrically connected with the controller 41 through the first connecting line 322, so that the controller 41 can control the magnetic flux enhancement assembly 3, adjust the magnetic field strength of the electromagnetic coil 31, and further affect the deposition of metal ions in the electroplating process; the controller 41 is electrically connected with the circulating pump 221, so that the controller 41 can control the running state of the circulating pump 221, such as adjusting the rotating speed of the circulating pump 221 to change the circulating speed of the electroplating solution, thereby realizing comprehensive and accurate control of the whole electroplating process.

[0042] When the utility model is used, appropriate nickel medicine water electroplating solution is added into the electroplating tank 1, the liquid level is moderate, most of the filter cylinder 11 is immersed in the electroplating solution, and the electroplating solution does not overflow. The connector body 35 is hung on the hook at the bottom of the screw rod 34. By rotating the screw rod 34, the height and position of the connector body 35 inside the filter cylinder 11 are adjusted, so that it is in a suitable electroplating position. The cathode frame 33 is inserted into the terminal block 32 through the insertion hole 321, and good electrical connection is ensured.

[0043] The controller 41 is opened, and the circulating pump 221 is started through the controller 41. The electroplating solution flows into the return pipe 21 from the liquid outlet hole 12 at the bottom of the electroplating tank 1. The electroplating solution is filtered in the filter 211 in the return pipe 21, and the precision of filtration and the flow of the electroplating solution can be adjusted through the control valve of the filter 211 as needed. The filtered electroplating solution flows back to the inside of the electroplating tank 1 under the action of the circulating pump 221 through the liquid return pipe 22, forming the circulation of the electroplating solution.

[0044] The terminal block 32 is powered through the controller 41, and then the electromagnetic coil 31 generates a magnetic field. The magnetic field acts on the electroplating environment in the electroplating tank 1, enhances the magnetic flux around the connector body 35, and affects the deposition of metal ions in the electroplating process.

[0045] The controller 41 energizes the anode frame 43 through the second connecting line 42, and an electric field is formed between the anode frame 43 and the cathode frame 33. Under the joint action of the electric field and the magnetic field, the metal ions in the electroplating solution move to the surface of the connector body 35 and deposit, and the electroplating of the connector body 35 is started.

[0046] When the predetermined electroplating time is reached, the power supply of the anode frame 43 and the cathode frame 33 is first turned off by the controller 41, and the electroplating process is stopped. The circulating pump 221 is turned off, and the circulation of the electroplating solution is stopped. The controller 41 is turned off. The connector body 35 is taken out of the electroplating solution by rotating the screw rod 34. The taken-out connector body 35 is subjected to subsequent processing such as cleaning and drying.

[0047] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A circulating nickel plating solution plating device for enhancing the magnetic flux of a connector, comprising a plating tank (1), a filter cartridge (11) movably inserted in the inside of the plating tank (1), a gap being left between the bottom of the filter cartridge (11) and the inside bottom of the plating tank (1), a magnetic flux enhancement assembly (3) fixedly installed on the outside of the plating tank (1), and installation grooves (13) respectively formed in the bottom of the plating tank (1) on both sides thereof, characterized in that: the magnetic flux enhancement assembly (3) comprises an electromagnetic coil (31) arranged on the outside of the plating tank (1) and not in contact with the outer wall of the plating tank (1), a wiring board (32) fixedly installed on one side of the electromagnetic coil (31), a cathode holder (33) plugged and electrically connected to the top of the wiring board (32) through a plug hole (321) formed in the top of the wiring board (32); a screw hole is formed in the upper end face of the cathode holder (33) away from the wiring board (32), and a screw rod (34) is threadedly installed in the screw hole, the bottom of the screw rod (34) is provided with a hook and extends into the inside of the filter cartridge (11), and the connector body (35) is hung from the bottom of the screw rod (34). The bottom of the plating tank (1) is designed in a conical structure and provided with a liquid outlet hole (12), the bottom of the plating tank (1) at the liquid outlet hole (12) is continuously installed with a circulating assembly (2), the bottom of the plating tank (1) is fixedly installed with a support frame (14), and the front face of the plating tank (1) is provided with a control assembly (4).

2. The circulating nickel plating equipment for enhancing the magnetic flux of connectors according to claim 1, characterized in that, The circulating assembly (2) comprises a reflux pipe (21) and a liquid return pipe (22), one end of the reflux pipe (21) is in communication with the liquid outlet hole (12), a filter (211) is installed on the reflux pipe (21), the filter (211) is provided with a control valve, one end of the liquid return pipe (22) is in communication with the reflux pipe (21), a circulating pump (221) is installed on the liquid return pipe (22), and the other end of the liquid return pipe (22) extends into the inside of the plating tank (1).

3. The circulating nickel plating equipment for enhancing the magnetic flux of connectors according to claim 2, characterized in that, The control assembly (4) comprises a controller (41), an anode holder (43) is installed on each side of the controller (41) through a second connecting line (42), and the anode holder (43) is embeddedly installed in the inside of the installation groove (13).

4. The enhanced circulation type nickel plating apparatus of claim 2, wherein the magnetic flux of the connector is enhanced. The wiring board (32) is electrically connected to the controller (41) through a first connecting line (322), and the controller (41) is also electrically connected to the circulating pump (221).

5. The enhanced circulation type nickel plating apparatus of claim 1, wherein the magnetic flux of the connector is enhanced. ​

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