Test switching device and test switching plate
By combining a flexible circuit board with the adapter board, the testing operation space and interface of the embedded chip are expanded, solving the problem of limited adapter board space and realizing more efficient and reliable chip testing.
Patent Information
- Application Number
- CN202520396432.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-06
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-06
AI Technical Summary
In existing technologies, the adapter board cannot be configured with a large space during embedded chip testing, which limits testing efficiency and reliability.
The design combines an adapter board with a flexible circuit board. The flexible circuit board connects to the chip under test through flexible deformation, expanding the test operation space and interface, and improving structural flexibility.
It improves the efficiency and reliability of chip testing, and enhances the flexibility and reliability of testing.
Smart Images
Figure CN223910963U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the chip testing technical field, and in particular to a test adapter and a test adapter board. BACKGROUND
[0002] In the test process of embedded chips, the device layout of the test circuit board is relatively compact, generally a test adapter is arranged on the test circuit board, and the test of the test circuit board on the to-be-tested chip is realized by configuring the to-be-tested chip on the test adapter, but in the prior art, when the test adapter is used to test the embedded chip, the test adapter cannot be arranged with a larger space, and the test points of the test adapter cannot be well led out, thereby limiting the test efficiency and test reliability of the embedded chip, and this situation needs to be changed. CONTENT OF THE UTILITY MODEL
[0003] In view of this, the present application provides a test adapter and a test adapter board to solve the above-mentioned technical problems.
[0004] To achieve the above purpose, according to the first aspect, the technical scheme adopted is:
[0005] A test adapter, comprising:
[0006] A test adapter, comprising:
[0007] A flexible circuit board is connected to the test adapter, and a side of the flexible circuit board away from the test adapter is provided with a plurality of third pads, and the third pads are electrically connected to the to-be-tested chip through the flexible deformation of the flexible circuit board.
[0008] The present application is further provided that: one side of the flexible circuit board extends to the inner layer of the test adapter and is integrally arranged with the test adapter.
[0009] The present application is further provided that: the flexible circuit board is arranged on the side of the test adapter and close to the first surface of the test adapter.
[0010] The present application is further provided that: the test adapter comprises at least two layers of stacked wiring layers, and the flexible circuit board is connected between adjacent wiring layers.
[0011] The present application is further provided that: one side of the wiring layer facing the flexible circuit board is provided with an adhesive layer, and the wiring layer and the flexible circuit board are fixed by the adhesive layer.
[0012] The application is further configured that the first pad is bonded with the chip to be tested, and the second pad is electrically connected with the test circuit board.
[0013] The application is further configured that the first surface of the adapter board is provided with a plurality of connection terminals and vertical conductive adhesive layers, and the vertical conductive adhesive layers are connected with the connection terminals and the gold fingers of the flexible circuit board respectively.
[0014] The application is further configured that the connection terminals and the vertical conductive adhesive layers are arranged on both sides of the chip to be tested and close to the side surface of the adapter board.
[0015] The application is further configured that the vertical projection of the vertical conductive adhesive layer on the adapter board covers the connection terminals and the gold fingers of the flexible circuit board.
[0016] According to the second aspect, the technical scheme adopted is:
[0017] A test adapter board, comprising the test adapter device of any one of the above.
[0018] To sum up, compared with the prior art, the application discloses a test adapter device and a test adapter board, the test adapter device comprises an adapter board and a flexible circuit board, a plurality of first pads are arranged on the first surface of the adapter board to connect a chip to be tested, a plurality of second pads are arranged on the second surface of the adapter board to connect a test circuit board, a plurality of third pads are arranged on the side of the flexible circuit board away from the adapter board, and the third pads are electrically connected with the chip to be tested through the flexible deformation of the flexible circuit board, that is, through the above arrangement, the test operation space and the test interface of the adapter board for the chip to be tested are expanded by the flexible circuit board, the structural flexibility of chip testing is improved, and the test efficiency and test reliability of the chip are improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0020] Figure 1 is a structural schematic view of a first test adapter device of the application;
[0021] Figure 2 is a side view structural schematic view of an adapter board of the application;
[0022] Figure 3 is a structural schematic view of a second test adapter device of the application;
[0023] Figure 4 FIG. 3 is a schematic diagram of a third exemplary test adapter of the present application. DETAILED DESCRIPTION
[0024] Reference will now be made to specific embodiments of the application, examples of which are illustrated in the accompanying drawings. Understanding that the specific embodiments described herein are meant to be illustrative only and not limiting the scope of the application, unless otherwise explicitly indicated herein, the same reference numerals in different drawings denote the same or similar components. The following exemplary embodiments are described in the context of a method and apparatus for wireless communication. Embodiments of the application are not limited to the specific embodiments described herein.
[0025] It should be noted that, in the present document, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. In other words, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a", "comprising", "has", "has... a", "includes", "including", or "containing", does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that includes the element. The terms "a" and "an" are defined as one or more unless explicitly indicated to the contrary or the context clearly dictates otherwise.
[0026] It should be understood that the specific embodiments described herein are merely exemplary and do not limit the scope of the application.
[0027] In the following description, the suffixes "module", "part" or "unit" used for an element are merely intended for facilitating description of the present application, and do not have specific meanings or roles. Therefore, "module", "part" or "unit" can be mixedly used.
[0028] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely intended to facilitate the description of the present application and simplify the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. In addition, the terms "first", "second", "third", are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.
[0029] The technical solutions shown in the application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not as a limitation on the priority order of the embodiments.
[0030] Please refer to Figures 1 to 4 The test adapter of the application includes an adapter board 1 and a flexible circuit board 2.
[0031] In the specific implementation process, the adapter board 1 has opposite first and second surfaces 1a and 1b, the first surface 1a is provided with a plurality of first pads 11 for connecting the chip under test 3, and the second surface 1b is provided with a plurality of second pads 12 for connecting a test circuit board. The flexible circuit board 2 is connected to the adapter board 1, and the side of the flexible circuit board 2 away from the adapter board 1 is provided with a plurality of third pads 21. The third pads 21 are electrically connected to the chip under test 3 through the flexible deformation of the flexible circuit board 2, thereby expanding the test operation space and test interface of the adapter board 1 for the chip under test 3 by the flexible circuit board 2, improving the structural flexibility of chip testing, and improving the test efficiency and test reliability of the chip.
[0032] Among them, the third pads 21 can also be configured on the flexible circuit board 2 in the form of a gold finger or an elastic probe.
[0033] It should be noted that the flexible circuit board 2 of the application is a bendable and foldable printed circuit board. Compared with the traditional rigid PCB board, the flexible circuit board 2 has higher space adaptability, lightweight and movable connection advantages, so that the test operation space and test interface of the adapter board 1 can be expanded through the connection of the flexible circuit board 2 under the condition that the preset structure space of the adapter board 1 is limited.
[0034] Among them, the flexible circuit board 2 can include an insulating substrate layer, a conductive copper foil layer connected to the insulating substrate layer, a cover film layer wrapped around the conductive copper foil layer, an adhesive layer connected to the cover film layer, and a shielding layer sleeved with the adhesive layer.
[0035] In one example, the first pads 11 are used for bonding connection with the chip under test 3, thereby ensuring effective transmission of electrical signals, i.e. establishing an electrical connection relationship between the adapter board 1 and the chip under test 3 through the first pads 11.
[0036] In addition, the second pads 12 are electrically connected to the test circuit board (not shown), thereby realizing the test work of the test circuit board on the chip under test 3 through the adapter of the adapter board 1.
[0037] In one embodiment, in order to ensure the reliable connection relationship between the adapter plate 1 and the flexible circuit board 2, one side of the flexible circuit board 2 extends to the inner layer of the adapter plate 1 and is integrally arranged with the adapter plate 1, so that the adapter plate 1 and the flexible circuit board 2 can be considered as integrally connected, thereby reducing the space occupation of the adapter plate 1 and improving the integration degree, so as to facilitate the adapter plate 1 to better bear the to-be-tested chip 3.
[0038] Then after the flexible circuit board 2 is integrally arranged with the adapter plate 1, the connection rupture problem caused by external force (such as bending and vibration) between the two can be effectively reduced, and the overall mechanical strength of the test adapter device is improved.
[0039] Among them, the first surface 1a and the second surface 1b of the adapter plate 1 can be respectively regarded as the upper surface and the lower surface of the adapter plate 1.
[0040] Among them, the flexible circuit board 2 is arranged on the side of the adapter plate 1 and close to the first surface 1a of the adapter plate 1, so as to reserve space for the first surface 1a and the second surface 1b of the adapter plate 1, improve the test operation space of the adapter plate 1 for the to-be-tested chip 3, that is, in the case of limited space of the adapter plate 1, avoid interfering with the test site of the to-be-tested chip 3, and improve the chip test reliability.
[0041] It should be noted that the flexible circuit board 2 can be arranged on both sides of the adapter plate 1, so that the flexible circuit board 2 on one side of the adapter plate 1 can realize the test connection of the to-be-tested chip 3 through the third solder pad 21, and the flexible circuit board 2 on the other side of the adapter plate 1 can also be used to connect external test equipment, thereby improving the test selectivity of the test adapter device and ensuring efficient chip testing.
[0042] Therefore, in the working process of the test adapter device, the adapter plate 1 has the opposite first surface 1a and second surface 1b to respectively connect the to-be-tested chip 3 and the test circuit board, one side of the flexible circuit board 2 extends to the inner layer of the adapter plate 1 and is integrally arranged with the adapter plate 1, and the flexible circuit board 2 is arranged on the side of the adapter plate 1 and close to the first surface 1a of the adapter plate 1, so that the third solder pad 21 is electrically connected to the to-be-tested chip 3 through the flexible deformation of the flexible circuit board 2 in space, that is, the flexible circuit board 2 expands the test operation space and test interface of the adapter plate 1 for the to-be-tested chip 3, improves the structural flexibility of chip testing, and improves the test efficiency and test reliability of the chip.
[0043] Further, referring to Figure 3 The adapter plate 1 includes at least two stacked wiring layers 13, and the flexible circuit board 2 is connected between adjacent wiring layers 13, so as to realize the integral arrangement of the flexible circuit board 2 and the adapter plate 1.
[0044] The trace layer 13 is provided with an adhesive layer 14 on the side facing the flexible circuit board 2, and the trace layer 13 and the flexible circuit board 2 are fixed by the adhesive layer 14, so as to ensure the firm connection of the flexible circuit board 2 and the adapter board 1, avoid the connection rupture caused by external force, and improve the overall mechanical strength of the test adapter.
[0045] In one embodiment, reference is made to Figure 4 In order to ensure the detachable connection relationship between the adapter board 1 and the flexible circuit board 2, and avoid the overall replacement of the adapter board 1 and the flexible circuit board 2 due to the damage of the flexible circuit board 2, the first surface 1a of the adapter board 1 is provided with a plurality of connection terminals 4, and the gold fingers of the flexible circuit board 2 are electrically connected to the connection terminals 4, so as to realize the modular assembly of the adapter board 1 and the flexible circuit board 2, and improve the maintenance convenience and test flexibility.
[0046] It can be understood that the connection terminal 4 is a test signal led out from the adapter board 1.
[0047] In one example, the connection terminal 4 can be configured on the first surface 1a of the adapter board 1 in the form of a solder pad, and then the gold fingers of the flexible circuit board 2 can be soldered and fixed to the connection terminal 4.
[0048] In one example, the connection terminal 4 can be formed in a pluggable docking, snap connection or pressure connection with the gold fingers of the flexible circuit board 2, so as to ensure the repeated connection and disconnection of the adapter board 1 and the flexible circuit board 2, and improve the structural flexibility.
[0049] In order to further ensure the flexible connection relationship between the adapter board 1 and the flexible circuit board 2, the first surface 1a of the adapter board 1 can also be provided with a vertical conductive adhesive layer 5, the vertical conductive adhesive layer 5 connects the connection terminal 4 and the gold fingers of the flexible circuit board 2 respectively, and the vertical conductive adhesive layer 5 has a certain elasticity and deformability, which can avoid the hard contact between the connection terminal 4 and the gold fingers of the flexible circuit board 2, and change the soldering and fixing mode of the two, so that the flexible circuit board 2 can be quickly and flexibly replaced independently when damaged, greatly reducing the maintenance cost and improving the chip test efficiency.
[0050] Further, the connection terminal 4 and the vertical conductive adhesive layer 5 are arranged on both sides of the chip under test 3 and close to the side surface of the adapter board 1, so as to reasonably plan the test operation space of the first surface 1a of the adapter board 1, that is, in the case of limited space of the adapter board 1, the test site of the chip under test 3 is avoided, and the test operation space and test interface of the adapter board 1 for the chip under test 3 are expanded through the flexible circuit board 2, so as to improve the structural flexibility of chip test, and improve the test efficiency and test reliability of the chip.
[0051] It should be noted that the vertical projection of the vertical conductive adhesive layer 5 on the adapter plate 1 covers the gold fingers of the flexible circuit board 2 and the connection terminals 4, so as to ensure the integrity of the conductive paths of the adapter plate 1 and the flexible circuit board 2, avoid signal distortion or open circuit problems caused by misalignment or poor contact, and completely fill the space between the flexible circuit board 2 and the connection terminals 4, so as to ensure the contact area of the two and improve the signal transmission quality, that is, while providing reliable electrical connection, the mechanical bonding strength of the adapter plate 1 and the flexible circuit board 2 is enhanced, so as to improve the test efficiency and test reliability of the chip.
[0052] The application further discloses a test adapter plate comprising the test adapter device according to any one of the above embodiments. For other working principles and processes of the test adapter plate, refer to the above description of the test adapter device.
[0053] The test adapter device and the test adapter plate are described in detail above. The principles and implementation manners of the application are described by using specific examples. It should be noted that the description of each embodiment in the application has its own emphasis. The parts not described or recorded in one embodiment can be referred to the related description of other embodiments.
[0054] The above is only the preferred embodiment of the application, and does not limit the patent scope of the application. Each technical feature of the technical solution of the application can be combined arbitrarily. In order to make the description simple, each technical feature in the above embodiments is not described in all possible combinations. Any equivalent structure or equivalent process conversion, or direct or indirect application in other related technical fields, as long as the combination of technical features does not exist contradiction, is also included in the patent protection scope of the application.
Claims
1. A test adapter, comprising: The utility model relates to a test adapter device, comprising: a adapter board having opposite first and second surfaces, the first surface is provided with a plurality of first pads and is used for connecting a chip to be tested, and the second surface is provided with a plurality of second pads and is used for connecting a test circuit board; a flexible circuit board connected to the adapter board, and a plurality of third pads provided on a side of the flexible circuit board away from the adapter board, the third pads being electrically connected to the chip to be tested through flexible deformation of the flexible circuit board.
2. The test adapter of claim 1, wherein, The flexible circuit board extends to an inner layer of the adapter board and is integrally arranged with the adapter board.
3. The test adapter of claim 2, wherein, The flexible circuit board is arranged on a side of the adapter board close to the first surface of the adapter board.
4. The test adapter of claim 1, wherein, The adapter board comprises at least two stacked wiring layers, and the flexible circuit board is connected between adjacent wiring layers.
5. The test adapter of claim 4, wherein, The wiring layer is provided with an adhesive layer on a side facing the flexible circuit board, and the wiring layer and the flexible circuit board are fixed by the adhesive layer.
6. The test adapter of claim 1, wherein, The first pads are bonded to the chip to be tested, and the second pads are electrically connected to the test circuit board.
7. The test adapter of claim 1, wherein, The first surface of the adapter board is provided with a plurality of connection terminals and vertical conductive adhesive layers, and the vertical conductive adhesive layers are respectively connected to the connection terminals and the gold fingers of the flexible circuit board.
8. The test adapter of claim 7, wherein, The connection terminals and the vertical conductive adhesive layers are arranged on both sides of the chip to be tested and close to the side of the adapter board.
9. The test adapter of claim 7, wherein, The vertical projection of the vertical conductive adhesive layers on the adapter board covers the connection terminals and the gold fingers of the flexible circuit board.
10. A test adapter, characterized by The test adapter board comprises the test adapter device according to any one of claims 1 to 9.