Optical packaging module

Abstract

An optical packaging module is mainly characterized in that a photonic element is arranged on an electronic module comprising an electronic element, the photonic element is electrically connected with the electronic element so as to carry out optical signal processing, an electromagnetic shielding layer wrapping the photonic element is formed on the electronic module, the electromagnetic shielding layer is filled with a plurality of magnetic metal particles, and the magnetic metal particles are arranged on the electronic module. Therefore, the photonic element has an anti-electromagnetic wave function.

Description

TECHNICAL FIELD

[0001] The present application relates to a packaging structure, in particular, an optical packaging module. BACKGROUND

[0002] With the vigorous development of electronic industry and communication technology, the application of the fifth generation (5G) communication technology has been expanded to the fields of Internet of Things (IoT), Industrial Internet of Things (IIoT), Cloud, artificial intelligence (AI), autonomous cars, and medical treatment, as well as various levels of these fields. With the expansion of application fields and levels, a large amount of data needs to be efficiently transmitted, processed, and stored. Therefore, the industry has entered the era of optical communication, using "light" instead of "electricity" as the carrier of data transmission.

[0003] With the development of optical communication technology, silicon photonics (Silicon Photonics) components and related technologies have also begun to be valued. The existing semiconductor package using silicon photonics technology includes an electronic wafer formed in a packaging structure and a photonic wafer placed on the packaging structure. One side of the photonic wafer is connected to an optical fiber to transmit optical signals to the photonic wafer for communication.

[0004] However, the aforementioned semiconductor package mainly relies on the photonic wafer for signal transmission, and other electromagnetic wave interference can cause problems of reducing signal transmission.

[0005] Therefore, how to overcome the problems of the above-mentioned prior art has become a pressing issue to be solved at present. CONTENT OF THE INVENTION

[0006] To solve the above problems, the present application provides an optical packaging module, comprising: an electronic module; a photonic element disposed on the electronic module and electrically connected to the electronic module; and an electromagnetic shielding layer formed on the electronic module to cover the photonic element.

[0007] The present application further provides a method for manufacturing an optical packaging module, comprising: providing an electronic module; disposing a photonic element on the electronic module and electrically connecting the photonic element to the electronic module; and forming an electromagnetic shielding layer on the electronic module to cover the photonic element.

[0008] In the aforementioned optical packaging module and its manufacturing method, the photonic element is a photonic integrated circuit.

[0009] The electronic module includes an electronic element electrically connected to the photonic element. The electronic element is an electronic integrated circuit.

[0010] The electronic module includes a first circuit structure, an electronic element disposed on the first circuit structure, a plurality of conductive pillars disposed on the first circuit structure, a coating layer covering the electronic element and the plurality of conductive pillars, and a second circuit structure disposed on the coating layer. The first circuit structure and the second circuit structure are electrically connected to each other through the plurality of conductive pillars. The electronic element and the photonic element are electrically connected to each other through the second circuit structure.

[0011] The electromagnetic shielding layer is filled with a plurality of magnetic metal particles. The plurality of magnetic metal particles are oxides of chromium (Cr), iron (Fe), cobalt (Co), or nickel (Ni).

[0012] Therefore, the optical packaging module and the manufacturing method thereof of the present application mainly arrange a photonic element on an electronic module including an electronic element, and electrically connect the photonic element to the electronic element to process optical signals. Meanwhile, an electromagnetic shielding layer covering the photonic element is formed on the electronic module. The electromagnetic shielding layer is filled with a plurality of magnetic metal particles to make the photonic element have an anti-electromagnetic wave function (shielding effect), avoid the photonic element from being interfered by electromagnetic waves to cause signal transmission problems, and strengthen the mechanical strength of the photonic element through the electromagnetic shielding layer covering the photonic element. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figures 1 to 5 The optical packaging module and the manufacturing method thereof of the present application are cross-sectional schematic views.

[0014] REFERENCE NUMERALS

[0015] 2 Optical packaging module

[0016] 20 Electronic module

[0017] 21 Electronic element

[0018] 21a Active surface

[0019] 21b Inactive surface

[0020] 211, 241, 242, 251, 252, 302 Connection pad

[0021] 2110 Conductive block

[0022] 22 Conductive pillar

[0023] 23 Coating layer

[0024] 24 first circuit structure

[0025] 24a first surface

[0026] 24b second surface

[0027] 243, 253 conductive bumps

[0028] 25 second circuit structure

[0029] 30 photonic element

[0030] 40 electromagnetic shielding layer

[0031] 400 magnetic metal particles DETAILED DESCRIPTION

[0032] The present application will be described in detail by specific embodiments, and other advantages and effects of the present application can be easily understood by those skilled in the art from the contents disclosed in the present specification.

[0033] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to the present specification are only used to understand and read the contents disclosed in the present specification by those skilled in the art, and do not define the limiting conditions for the implementation of the present application, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "one", "first" and "second" used in the present specification are only for the convenience of clear understanding and description, and are not used to limit the scope of the implementation of the present application. The change or adjustment of the relative relationship without substantially changing the technical content is also considered as the scope of the implementation of the present application.

[0034] Referring to Figures 1 to 5 , a cross-sectional schematic view of the method for manufacturing the optical packaging module of the present application.

[0035] As Figure 1 shown, at least one electronic element 21 is combined with the first circuit structure 24.

[0036] The electronic element 21 has an opposite active surface 21a and a non-active surface 21b, and the first circuit structure 24 has an opposite first surface 24a and a second surface 24b. The electronic element 21 is placed on the second surface 24b of the first circuit structure 24 with the non-active surface 21b.

[0037] The active surface 21a of the electronic component 21 and the first and second surfaces 24a, 24b of the first circuit structure 24 each have a plurality of connection pads 211, 241, 242. The plurality of connection pads 211 of the electronic component 21 have a plurality of conductive bumps 2110 formed thereon, and the plurality of connection pads 242 of the second surface 24b of the first circuit structure 24 have a plurality of conductive posts 22 formed thereon.

[0038] The electronic component 21 of the present embodiment can be an active component, a passive component, or a combination thereof. In the present embodiment, the electronic component 21 is an electronic IC (EIC).

[0039] As shown in FIG. 1, a plurality of conductive posts 22 are formed on the plurality of connection pads 242 of the second surface 24b of the first circuit structure 24. Figure 2 A coating layer 23 is formed on the second surface 24b of the first circuit structure 24 to cover the electronic component 21 and the plurality of conductive posts 22. The top surface of the coating layer 23 is coplanar with the top ends of the plurality of conductive posts 22 and the plurality of conductive bumps 2110, so that the top ends of the plurality of conductive posts 22 and the plurality of conductive bumps 2110 are exposed outside the top surface of the coating layer 23.

[0040] The coating layer 23 is formed of an insulating material, such as a polyimide (PI) encapsulation or an epoxy encapsulation.

[0041] A second circuit structure 25 is then formed on the top ends of the plurality of conductive posts 22 and the top surface of the coating layer 23. The bottom and top surfaces of the second circuit structure 25 each have a plurality of connection pads 251, 252. The plurality of connection pads 251 of the bottom surface of the second circuit structure 25 are respectively electrically connected to the plurality of conductive posts 22 and the plurality of conductive bumps 2110, and the plurality of connection pads 252 of the top surface of the second circuit structure 25 each have a conductive bump 253, such as a solder ball, formed thereon.

[0042] The first and second circuit structures 24, 25 each include an insulating layer and a circuit layer. The insulating layer can be formed of a polybenzoxazole (PBO), a polyimide (PI), a prepreg (PP), or another dielectric material. The circuit layer can be a redistribution layer (RDL), and the circuit layer can be formed of copper or another conductive material.

[0043] As shown in FIG. 1, a plurality of conductive posts 22 are formed on the plurality of connection pads 242 of the second surface 24b of the first circuit structure 24. Figure 3 As shown in FIG. 1, a plurality of conductive posts 22 are formed on the plurality of connection pads 242 of the second surface 24b of the first circuit structure 24.

[0044] As shown in Figure 4 The photon element 30 is disposed on the electronic module 20 and is electrically connected to the electronic module 20 in a flip-chip manner through a plurality of connection pads 302 on the bottom surface of the photon element 30 and a plurality of connection pads 252 and a plurality of conductive bumps 253 on the top surface of the second circuit structure 25. The plurality of conductive bumps 253 can also be covered with an underfill.

[0045] The photon element 30 of the present embodiment is, for example, a photonic IC (PIC) for converting an optical signal into an electronic signal and transmitting the electronic signal to an electronic element 21 in the electronic module 20 for processing or storage.

[0046] As shown in Figure 5 A molding process is performed to form an electromagnetic shielding layer 40 covering the photon element 30 on the electronic module 20, wherein the electromagnetic shielding layer 40 is filled with a plurality of magnetic metal particles 400, such as chromium (Cr), iron (Fe), cobalt (Co), or nickel (Ni) oxides, to obtain the optical packaging module 2 of the present application.

[0047] The present application also provides an optical packaging module 2, comprising: an electronic module 20; a photon element 30 disposed on and electrically connected to the electronic module 20; and an electromagnetic shielding layer 40 formed on the electronic module and covering the photon element 30.

[0048] In an embodiment, the electronic module 20 includes an electronic element 21 electrically connected to the photon element 30.

[0049] In an embodiment, the electronic module 20 further includes a first circuit structure 24, an electronic element 21 disposed on the first circuit structure 24, a plurality of conductive pillars 22 disposed on the first circuit structure 24, a covering layer 23 covering the electronic element 21 and the plurality of conductive pillars 22, and a second circuit structure 25 disposed on the covering layer 23, wherein the first circuit structure 24 and the second circuit structure 25 are electrically connected to each other through the plurality of conductive pillars 22.

[0050] In an embodiment, the electronic element 21 is electrically connected to the second circuit structure 25, and the photon element 30 is disposed on the second circuit structure 25 and electrically connected to the second circuit structure 25. That is, the second circuit structure 25 is disposed between the electronic element 21 and the photon element 30, so that the electronic element 21 and the photon element 30 are electrically connected to each other through the second circuit structure 25.

[0051] In an embodiment, the electronic element 21 is an electronic IC (EIC).

[0052] In an embodiment, the photonic element 30 is a photonic IC (PIC).

[0053] In an embodiment, the electromagnetic shielding layer 40 is filled with a plurality of magnetic metal particles 400, such as oxides of chromium (Cr), iron (Fe), cobalt (Co), or nickel (Ni).

[0054] In summary, the optical packaging module of the present application mainly sets a photonic element on an electronic module containing electronic elements, and electrically connects the photonic element to the electronic elements for processing optical signals. Meanwhile, an electromagnetic shielding layer is formed on the electronic module to cover the photonic element. The electromagnetic shielding layer is filled with a plurality of magnetic metal particles to make the photonic element have an anti-electromagnetic wave function (shielding effect), so as to avoid the problem of signal transmission reduction caused by electromagnetic wave interference on the photonic element. Moreover, the mechanical strength of the photonic element can be strengthened by the electromagnetic shielding layer covering the photonic element.

[0055] The above embodiments are used to illustrate the principles and effects of the present application, but not for limiting the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the claims.

Claims

1. An optical package module, characterized by comprising: The application relates to an electronic module, a photonic element, and an electromagnetic shielding layer. The application relates to an electronic module, a photonic element, and an electromagnetic shielding layer. The application relates to an electronic module, a photonic element, and an electromagnetic shielding layer. The photonic element is a photonic integrated circuit. The electronic module comprises an electronic element electrically connected to the photonic element.

2. The optical package module of claim 1, wherein, The electronic element is an electronic integrated circuit.

3. The optical packaging module as described in claim 1, characterized in that, The electronic module comprises a first circuit structure, an electronic element disposed on the first circuit structure, a plurality of conductive columns disposed on the first circuit structure, a covering layer covering the electronic element and the plurality of conductive columns, and a second circuit structure disposed on the covering layer.

4. The optical packaging module as described in claim 3, characterized in that, The first circuit structure and the second circuit structure are electrically connected to each other through the plurality of conductive columns.

5. The optical packaging module as described in claim 1, characterized in that, The electronic element and the photonic element are electrically connected to each other through the second circuit structure.

6. The optical packaging module as described in claim 5, characterized in that, The electromagnetic shielding layer is filled with a plurality of magnetic metal particles.

7. The optical packaging module as described in claim 5, characterized in that, The plurality of magnetic metal particles are oxides of chromium (Cr), iron (Fe), cobalt (Co), or nickel (Ni).

8. The optical packaging module as described in claim 1, characterized in that, ​ 9. The optical packaging module as described in claim 8, characterized in that, ​

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