Etching device for manufacturing circuit board

Abstract

The utility model discloses an etching device for circuit board manufacturing, and relates to the technical field of circuit board manufacturing. An etching device for circuit board manufacturing comprises a bottom box, the bottom box is communicated with a drain pipe, the top end of the bottom box is fixedly connected with a mounting frame, rotating wheel shafts distributed at equal intervals are rotatably connected in the mounting frame, the mounting frame is fixedly connected with a driving motor, and an output shaft of the driving motor is fixedly connected with the adjacent rotating wheel shafts. An external pipeline is connected to the position of the connecting pipe, etching liquid is guided into the spraying frame through the liquid inlet pipe to be sprayed out, the flow direction of the etching liquid in the connecting pipe can be changed by adjusting the position of the water stop block so as to achieve single-face or double-face etching, then the circuit board is conveyed backwards through rotation of the rotating wheel shaft, and in the backward conveying process of the circuit board, the etching liquid is sprayed out through the spraying frame. The spraying frame sprays out etching liquid to etch the circuit board, the used etching liquid falls into the bottom box to be collected, the cover box can prevent the etching liquid from splashing, and the etched circuit board is sent out from the rear side of the device for subsequent processing.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board manufacturing, especially relates to a kind of etching device for circuit board manufacturing. BACKGROUND

[0002] In modern electronic manufacturing industry, the manufacturing of circuit board is one of the most important links. Etching process, as a key step of circuit board production, is used to remove the unnecessary part of copper foil to form the predetermined circuit pattern. In order to meet the diversified production needs, various types of etching machines have been developed on the market, including but not limited to single-sided etching machine, double-sided etching machine, etc.

[0003] These different types of etching machines have their own characteristics and application scenarios: single-sided etching machine is specially designed for processing circuit board that only needs one side etching. However, the versatility of this kind of equipment is low, and it cannot be directly applied to the case of double-sided etching; double-sided etching machine can etch both sides of the circuit board at the same time, and is suitable for more complex products. Although single-sided etching can be achieved by using photoresist film and other methods to protect the side that does not need etching, this method is complex to operate and increases additional cost and process.

[0004] Although the above-mentioned various types of etching machines have met different production needs to some extent, there are still deficiencies in flexibility and efficiency. Especially for those application scenarios that need both single-sided etching and double-sided etching, the existing solutions either do not have enough versatility or are too cumbersome when switching working modes. For example, although double-sided etching machine can theoretically complete single-sided etching task by additional measures, in fact, it involves additional material preparation (such as photoresist film) and technical operation, which not only increases the cost, but also may cause the decline of production efficiency.

[0005] Therefore, we propose an etching device for circuit board manufacturing, which can flexibly adjust the flow direction of etching liquid according to actual needs, so as to realize efficient single-sided or double-sided etching on the same equipment. SUMMARY

[0006] In order to overcome the low versatility of single-sided etching machine, which cannot be directly applied to the case of double-sided etching, and the double-sided etching machine needs to be assisted by special technology and method when performing single-sided etching, which is complex to operate and increases the cost, the utility model provides an etching device for circuit board manufacturing, which can flexibly adjust the flow direction of etching liquid according to actual needs, so as to realize efficient single-sided or double-sided etching on the same equipment.

[0007] The technical scheme is as follows: an etching device for manufacturing a circuit board, comprising a bottom box, a drainage pipe communicated with the bottom box, an installation frame fixedly connected to the top end of the bottom box, equidistantly distributed rotating shafts rotatably connected in the installation frame, a driving motor fixedly connected to the installation frame, an output shaft of the driving motor fixedly connected with adjacent rotating shafts, a flat belt connected between the rotating shafts through a belt pulley, a cover box fixedly connected to the top end of the installation frame, two horizontally symmetrical spring telescopic rods fixedly connected in the bottom box and the cover box, a spraying frame fixedly connected between the horizontally corresponding two spring telescopic rods, liquid inlet pipes communicated with the spraying frame, a connecting pipe communicated between the top ends of the two liquid inlet pipes, a water inlet joint arranged in the middle of the connecting pipe, and an adjusting assembly arranged on the cover box and used for adjusting the flow direction of etching liquid in the connecting pipe.

[0008] Preferably, the adjusting assembly comprises an electric push rod fixedly connected to the cover box, a connecting rod fixedly connected to the telescopic end of the electric push rod, a water blocking block fixedly connected to the connecting rod and slidingly connected with the connecting pipe, and a closing plate fixedly connected to the connecting rod.

[0009] Preferably, the water blocking block is made of rubber.

[0010] Preferably, the closing plate is arc-shaped and used for adhering to the surface of the connecting pipe to prevent liquid leakage.

[0011] Preferably, the device further comprises a swinging assembly used for controlling the left-right swinging of the spraying frames, the swinging assembly comprising a connecting frame fixedly connected between the two spraying frames, the connecting frame slidingly connected with the installation frame and the cover box, a gas cylinder fixedly connected to the cover box and fixedly connected with the connecting frame.

[0012] Preferably, the device further comprises a suction assembly used for sucking harmful gas generated in etching, the suction assembly comprising an air suction cover communicated with the top end of the cover box and an air suction pipe communicated with the air suction cover.

[0013] The device has the following advantages: the etching liquid is introduced into the spraying frames through the liquid inlet pipes from the connecting pipe, the position of the water blocking block is adjusted to change the flow direction of the etching liquid in the connecting pipe, single-sided or double-sided etching is realized, then the circuit board is conveyed backward through the rotating shafts, the etching liquid sprayed from the spraying frames etches the circuit board in the conveying process, the used etching liquid falls into the bottom box for collection, the cover box prevents the etching liquid from splashing, and the etched circuit board is sent out from the rear side of the device for subsequent processing. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a three-dimensional structure schematic view of the device.

[0015] Figure 2 It is a three-dimensional structure schematic view of the bottom box, the installation frame and the cover box of the device.

[0016] Figure 3 It is the stereogram structure schematic view of the spring telescopic rod, the spraying frame and the liquid inlet pipe and other components of the utility model.

[0017] Figure 4 It is the stereogram structure schematic view of the spraying frame, the liquid inlet pipe and the connecting pipe of the utility model.

[0018] Figure 5 It is the stereogram structure schematic view of the cover box, the electric push rod and the connecting pipe and other components of the utility model.

[0019] Figure 6 It is the stereogram structure schematic view of the connecting rod, the water baffle and the closing plate and other components of the utility model.

[0020] Figure 7 It is the stereogram structure schematic view of the air cylinder, the installation frame and the cover box and other components of the utility model.

[0021] Figure 8 It is the stereogram structure schematic view of the connecting frame, the air cylinder and the spraying frame of the utility model.

[0022] In the above drawing: 1: bottom box, 2: drain pipe, 3: installation frame, 4: runner shaft, 5: drive motor, 6: flat belt, 7: cover box, 8: spring telescopic rod, 9: spraying frame, 10: liquid inlet pipe, 11: connecting pipe, 12: electric push rod, 13: connecting rod, 14: water baffle, 15: closing plate, 16: connecting frame, 17: air cylinder, 18: air suction cover, 19: air suction pipe. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] Embodiment 1: an etching device for manufacturing a circuit board, as shown in Figures 1-6As shown, including the bottom box 1, drain pipe 2, mounting frame 3, rotating shaft 4, drive motor 5, flat belt 6, cover box 7, spring telescopic rod 8, spray frame 9, liquid inlet pipe 10, connecting pipe 11 and adjusting assembly, the bottom box 1 right side lower part is connected with drain pipe 2, the bottom box 1 upper side is fixedly connected with mounting frame 3, the mounting frame 3 is rotatably connected with equidistantly distributed rotating shaft 4, the mounting frame 3 left side front part is fixedly connected with drive motor 5, the output shaft of drive motor 5 is fixedly connected with the most front rotating shaft 4, the rotating shaft 4 right end is connected with flat belt 6 through belt pulley, the mounting frame 3 upper side middle part is fixedly connected with cover box 7, the cover box 7 and the bottom box 1 inside left and right sides are all fixedly connected with spring telescopic rod 8, the left and right corresponding two spring telescopic rods 8 are fixedly connected with spray frame 9 between, the upper spray frame 9 front side right part is connected with one liquid inlet pipe 10, the lower spray frame 9 right side is connected with another liquid inlet pipe 10, the two liquid inlet pipes 10 upper ends are connected with connecting pipe 11 between, the connecting pipe 11 middle part is equipped with water inlet joint, the cover box 7 is equipped with adjusting assembly for adjusting the flow direction of etching liquid in connecting pipe 11.

[0025] In use, the staff connects the pipeline to the connecting pipe 11, and then introduces the etching liquid into the connecting pipe 11, the etching liquid in the connecting pipe 11 enters the spray frame 9 through the liquid inlet pipe 10 and sprays out, the staff can adjust the flow direction of the etching liquid in the connecting pipe 11 through the adjusting assembly to realize single-sided or double-sided etching, then the staff places the circuit board to be etched on the rotating shaft 4, drives the front rotating shaft 4 to rotate through the drive motor 5, under the action of the flat belt 6, the other rotating shafts 4 also rotate together, the rotating shaft 4 rotates to convey the circuit board backward, the circuit board is etched by the etching liquid sprayed by the spray frame 9 in the process of conveying backward, the used etching liquid falls into the bottom box 1 for collection, and the cover box 7 can prevent the etching liquid from splashing, the etched circuit board is sent out from the rear of the device for subsequent processing.

[0026] As shown in Figure 1 , Figure 5 and Figure 6 , the adjusting assembly comprises an electric push rod 12, a connecting rod 13, a water blocking block 14 and a closing plate 15, the cover box 7 right side upper part is fixedly connected with the electric push rod 12, the telescopic end of the electric push rod 12 is fixedly connected with the connecting rod 13, the connecting rod 13 right end is fixedly connected with the water blocking block 14, the water blocking block 14 is located in the connecting pipe 11 and is in sliding connection with the connecting pipe 11, the water blocking block 14 is made of rubber material, the connecting rod 13 right part is fixedly connected with the closing plate 15, the closing plate 15 is arc-shaped and is used for adhering to the surface of the connecting pipe 11 to prevent liquid leakage.

[0027] In the initial state, the water block 14 is located at the water inlet joint in the middle of the connecting pipe 11, and the etching solution input by the water inlet joint flows into the front and rear ends of the connecting pipe 11, and then supplies liquid to the upper and lower spray frames 9 to perform double-sided etching. When single-sided etching is required, the staff controls the extension and retraction of the electric push rod 12, the extension and retraction of the electric push rod 12 drives the connecting rod 13 to move forward or backward, the forward and backward movement of the connecting rod 13 drives the water block 14 to move forward or backward, and the forward and backward movement of the water block 14 can block a specified end of the connecting pipe 11, thereby making the upper or lower spray frame 9 to perform single-sided etching. When the connecting rod 13 moves forward and backward, the closing plate 15 also moves forward and backward, and the closing plate 15 closes the connection between the connecting rod 13 and the connecting pipe 11 to prevent liquid leakage of the connecting pipe 11.

[0028] As shown in Figure 1 , Figure 7 and Figure 8 , it further includes a swing assembly for controlling the left and right swinging of the spray frame 9, and the swing assembly includes a connecting frame 16 and a gas cylinder 17. The connecting frame 16 is fixedly connected between the right sides of the upper and lower spray frames 9, and the connecting frame 16 is slidingly connected with the mounting frame 3 and the cover box 7. The gas cylinder 17 is fixedly connected to the right lower part of the cover box 7, and the gas cylinder 17 is fixedly connected with the connecting frame 16.

[0029] In use, the gas cylinder 17 extends and retracts to drive the connecting frame 16 to move left and right, the connecting frame 16 moves left and right to drive the spray frame 9 to move left and right, and the spring extension rod 8 is elongated and shortened. The left and right movement of the spray frame 9 can ensure that the sprayed etching solution can uniformly cover the entire surface of the circuit board to be etched, reducing the phenomenon of local over-etching or incomplete etching.

[0030] As shown in Figure 1 , it further includes a suction assembly for sucking harmful gases generated during etching, and the suction assembly includes an air suction cover 18 and an air suction pipe 19. The air suction cover 18 is communicated with the upper side of the cover box 7, and the air suction cover 18 is communicated with two air suction pipes 19 which are symmetrically arranged left and right.

[0031] In use, the staff connects an air extractor to the air suction pipe 19, and the harmful gases generated during etching in the cover box 7 are sucked out through the air suction cover 18 and the air suction pipe 19, avoiding the diffusion of the gases to harm the health of the staff.

[0032] The above only describes the embodiments of the present application and is not intended to limit the present application. Any equivalent replacement made within the principles of the present application shall be included in the protection scope of the present application. The contents not described in detail in the present application belong to the existing technology known to the technical personnel in the field.

Claims

1. An etching apparatus for manufacturing a wiring board, characterized by comprising: The utility model provides a kind of etching liquid spraying device, including bottom box (1), and the drain pipe (2) is communicated on bottom box (1), and the mounting frame (3) is fixedly connected to the top end of bottom box (1), and the equidistantly distributed runner shaft (4) is rotatably connected in mounting frame (3), and the drive motor (5) is fixedly connected on mounting frame (3), and the output shaft of drive motor (5) is fixedly connected with adjacent runner shaft (4), and flat belt (6) is connected between runner shaft (4) by belt pulley, and the cover box (7) is fixedly connected to the top end of mounting frame (3), and two spring telescopic rods (8) of horizontal symmetry are fixedly connected in cover box (7) and bottom box (1), and two spray frames (9) are fixedly connected between horizontal corresponding two spring telescopic rods (8), and the liquid inlet pipe (10) is communicated on spray frame (9), and the connecting pipe (11) is communicated between the top end of two liquid inlet pipes (10), and water inlet joint is equipped in the middle part of connecting pipe (11), and the adjusting assembly for adjusting the flow direction of etching liquid in connecting pipe (11) is equipped on cover box (7).

2. The etching apparatus for manufacturing a circuit board according to claim 1, wherein The adjusting assembly includes electric push rod (12), and electric push rod (12) is fixedly connected on cover box (7), and the telescopic end of electric push rod (12) is fixedly connected with connecting rod (13), and water baffle (14) is fixedly connected on connecting rod (13), and water baffle (14) is located in connecting pipe (11) and is slidably connected with connecting pipe (11), and closing plate (15) is fixedly connected on connecting rod (13).

3. The etching apparatus for manufacturing a circuit board according to claim 2, wherein Water baffle (14) is rubber material.

4. The etching apparatus for manufacturing a circuit board according to claim 3, wherein Closing plate (15) is arc-shaped, for sticking to the surface of connecting pipe (11) to prevent liquid leakage.

5. The etching apparatus for manufacturing a circuit board according to claim 4, wherein It also includes swing assembly for controlling the left and right swing of spray frame (9), and the swing assembly includes connecting frame (16), and connecting frame (16) is fixedly connected between two spray frames (9), and connecting frame (16) is slidably connected with mounting frame (3) and cover box (7), and air cylinder (17) is fixedly connected on cover box (7), and air cylinder (17) is fixedly connected with connecting frame (16).

6. The etching apparatus for manufacturing a circuit board according to claim 5, wherein It also includes suction assembly for sucking harmful gas generated by etching, and the suction assembly includes air suction cover (18), and air suction cover (18) is communicated on the top end of cover box (7), and air suction pipe (19) is communicated on air suction cover (18).

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