Laser processing machine

By introducing a water-cooling module into the laser processing machine, and utilizing a circulating flow channel and fan-cooled heat dissipation, the problems of working head weight and dust adhesion are solved, achieving lightweight design and efficient heat dissipation, and improving the reliability of the laser processing machine.

CN223916949UActive Publication Date: 2026-02-17SHENZHEN YICHENG ADVANTAGE TECH CO LTD
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Patent Information

Application Number
CN202423321006.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2026-02-17
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

Existing laser processing machines have fans and heat sinks at the working head, which makes the moving parts heavy and bulky. After long-term use, dust easily adheres and affects the heat dissipation effect, resulting in poor reliability.

Method used

The system employs a water-cooled module, which includes a water-cooled component, a water-cooled radiator, a water pump, and a fan. The water-cooled component is located on the working head, while the water-cooled radiator and water pump are fixed to the frame, forming a circulation channel. The coolant circulates to dissipate heat, and the fan provides air cooling to the water-cooled radiator, preventing the fan and heat sink from moving with the working head.

Benefits of technology

The lightweight working head moving part has been achieved, which has good heat dissipation, avoids dust adhesion problems, and improves reliability.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a laser processing machine. The working head can horizontally move in the plane relative to the rack, and the blue light laser module is arranged on the working head and can output blue light laser to achieve workpiece machining. In the water cooling module, the first flow channel of the water cooling piece communicates with the second flow channel of the water cooling radiator to form a circulating flow channel, and the water pump can drive cooling liquid to flow in the circulating flow channel. The heat of the blue laser module is conducted to the cooling liquid in the first flow channel through the water cooling piece. And when the cooling liquid flows to the second flow channel, the heat of the cooling liquid is conducted to the water-cooling radiator. And the fan performs air-cooling heat dissipation on the water-cooling radiator. The cooling liquid after heat dissipation returns to the first flow channel and absorbs heat from the water cooling piece. And the cooling liquid circularly flows, so that the heat dissipation effect on the blue light laser module is good. The water-cooling part is arranged on the working head, and the water-cooling radiator, the water pump and the fan are fixed to the rack and do not move along with the working head. The working head, the blue light laser module and the water cooling piece serve as moving parts, the weight is low, and the moving parts can be driven to move through small driving force.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and particularly relates to a laser processing machine. BACKGROUND

[0002] The laser processing machine of the related art moves a laser module by a work head, and the laser module generates laser irradiation on a workpiece. The laser processing machine realizes laser processing of the workpiece, such as laser engraving and laser cutting, by using heat effects generated by laser beam projection onto a material surface of the workpiece.

[0003] How to provide a laser processing machine capable of outputting blue laser light, having a good heat dissipation effect, and having a light weight of a moving part of a work head is a problem to be solved in the industry. CONTENT OF THE INVENTION

[0004] The application aims to provide a laser processing machine capable of outputting blue laser light, having a good heat dissipation effect, and having a light weight and a small volume of a moving part of a work head.

[0005] The application provides a laser processing machine, which comprises a rack, a work head, a blue laser module, and a water cooling module. The work head is capable of translating in a first plane relative to the rack. The blue laser module is installed on the work head. The water cooling module comprises a water cooling piece, a water cooling radiator, a water pump, and a fan. The water cooling piece is arranged on the work head and used for absorbing heat of the blue laser module. The water cooling radiator, the water pump, and the fan are all fixed on the rack. The water cooling piece is provided with a first flow channel, the water cooling radiator is provided with a second flow channel, the first flow channel and the second flow channel are communicated to form a circulating flow channel, and the circulating flow channel is filled with cooling liquid. The water pump is arranged in the circulating flow channel and used for driving the cooling liquid to flow in the circulating flow channel. The fan is used for air cooling and heat dissipation of the water cooling radiator.

[0006] In an optional implementation, the water cooling piece is in a plate shape, and the water cooling piece is arranged against a wall surface of the blue laser module.

[0007] In an optional implementation, a wall surface of the rack is provided with an air inlet, the fan is arranged at the air inlet, and the fan and the water cooling radiator are arranged to face each other.

[0008] In an optional implementation, the water pump and the water cooling radiator are arranged adjacently.

[0009] In an optional implementation, the water pump is arranged close to a rear side wall of the rack, and the fan and the water cooling radiator are located at the rear side wall of the rack.

[0010] In an optional implementation, the water cooling component and the water pump are connected through a first pipeline, the water pump and the water cooling radiator are connected through a second pipeline, and the water cooling radiator and the water cooling component are connected through a third pipeline; the laser processing machine further comprises a tow chain capable of moving along with the working head, and the first pipeline and the third pipeline are at least partially arranged in the tow chain.

[0011] In an optional implementation, the laser processing machine further comprises a first light guide structure and a galvanometer, both of which are arranged in the working head; the first light guide structure is configured to guide the output beam of the blue laser module to the galvanometer; and the galvanometer is configured to deflect the outgoing light of the first light guide structure.

[0012] In an optional implementation, the first light guide structure comprises a first reflecting element and a second reflecting element; the output end of the blue laser module and the first reflecting element are oppositely arranged along a first direction; the second reflecting element and the first reflecting element are oppositely arranged along a second direction; the second reflecting element and the light entrance side of the galvanometer are oppositely arranged along the first direction; and the first direction and the second direction are perpendicular to each other.

[0013] In an optional implementation, the laser processing machine further comprises a cross beam, a first guide mechanism and a second guide mechanism; the working head is mounted on the cross beam through the first guide mechanism, so as to be slidably mounted on the cross beam along a first direction; the cross beam is mounted on the machine frame through the second guide mechanism, so as to be slidably mounted on the machine frame along a second direction; the first direction and the second direction form a predetermined included angle; and the first direction and the second direction are parallel to the first plane.

[0014] In an optional implementation, the machine frame is provided with a first driving module, and the working head is connected to the first driving module; the first driving module is configured to drive the working head to translate in the first plane.

[0015] In an optional implementation, the machine frame is provided with a workbench, and the workbench is capable of moving up and down relative to the machine frame.

[0016] In an optional implementation, the machine frame is provided with a second driving module, and the workbench is connected to the second driving module; the second driving module is configured to drive the workbench to move up and down.

[0017] The laser processing machine provided by the embodiments of the present application has the beneficial effects that the work head can translate in the plane relative to the rack, the blue laser module is arranged on the work head to follow the movement of the work head, and the blue laser module can output blue laser to realize workpiece processing. In the water cooling module, the first flow channel of the water cooling piece and the second flow channel of the water cooling radiator are communicated to form a circulating flow channel, and the water pump can drive the cooling liquid to flow in the circulating flow channel. The working heat of the blue laser module is conducted to the cooling liquid in the first flow channel through the water cooling piece. When the cooling liquid flows to the second flow channel, the heat of the cooling liquid is conducted to the water cooling radiator. The water cooling radiator is air-cooled and heat-dissipated by the fan. After heat dissipation, the cooling liquid returns to the first flow channel and absorbs heat from the water cooling piece again. The cooling liquid circulates to have a good heat dissipation effect on the blue laser module. The dust adhesion problem caused by the fan and the heat sink arranged on the work head in the related art laser processing machine is avoided. The water cooling piece is arranged on the work head, and the water cooling radiator, the water pump and the fan are fixed to the rack and do not follow the movement of the work head. The work head, the blue laser module and the water cooling piece are the moving parts, which are light in weight and small in size, and can be driven to move by a small driving force. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The three-dimensional schematic view of the laser processing machine provided by the embodiments of the present application when the door is closed;

[0020] Figure 2 The three-dimensional schematic view of the laser processing machine provided by the embodiments of the present application when the door is closed; Figure 1

[0021] Figure 3 The three-dimensional exploded view of the laser processing machine provided by the embodiments of the present application; Figure 1

[0022] Figure 4 The three-dimensional exploded view of the work head related structure in the laser processing machine provided by the embodiments of the present application; Figure 3

[0023] Figure 5 The structural schematic view of the water cooling module in the laser processing machine provided by the embodiments of the present application; Figure 3

[0024] Figure 6 The structural schematic view of the laser processing machine provided by the embodiments of the present application after part of the rack structure is disassembled; Figure 3

[0025] Figure 7 The structural schematic view of the laser processing machine provided by the embodiments of the present application after part of the rack structure is disassembled;​​​​​Figure 4 A further exploded perspective view of the working head-related structure; the housing is not shown.

[0026] Figure 8 for Figure 7 A further exploded perspective view of the working head-related structure; the circuit board and shield are not shown.

[0027] Figure 9 for Figure 6 Schematic diagram of the optical path of a laser processing machine Figure 1 ;

[0028] Figure 10 for Figure 6 Schematic diagram of the optical path of a laser processing machine Figure 2 ;

[0029] Figure 11 for Figure 6 A schematic diagram of the working head and crossbeam in a laser processing machine;

[0030] Figure 12 for Figure 6 A schematic diagram of the structure of the first drive module and the second drive module in a laser processing machine. Detailed Implementation

[0031] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0032] In the description of the embodiments of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0034] In the embodiments of the present application, unless specifically defined and limited otherwise, the terms "mount", "connect", "connect", "fix", and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0035] A laser processing machine in the related art moves a laser module by a work head, and the laser generated by the laser module irradiates on a workpiece to realize workpiece processing. A fan and a heat sink are arranged on the work head to realize air cooling and heat dissipation of the laser module. The fan and the heat sink move with the work head, and the work head has a large weight and volume, so a large driving force is required. After long-term use, dust is easy to adhere to the fan and the heat sink, thereby affecting the air cooling and heat dissipation effect and the reliability is poor.

[0036] Please refer to Figures 1 to 4 , the embodiment of the present application provides a kind of laser processing machine 100, comprising: rack 10, work head 21, blue light laser module 30 and water cooling module 60.Work head 21 can be translated in first plane relative to rack 10.Blue light laser module 30 is installed in work head 21.Combined Figure 5 、 Figure 6 , water cooling module 60 includes water cooling piece 61, water cooling radiator 62, water pump 63 and fan 64.Water cooling piece 61 is arranged in work head 21, for blue light laser module 30 heat absorption.Water cooling radiator 62, water pump 63 and fan 64 are all fixed to rack 10.Water cooling piece 61 is provided with first flow channel 611, water cooling radiator 62 is provided with second flow channel 621, first flow channel 611 and second flow channel 621 are communicated to form circulation flow channel 60a, and circulation flow channel 60a is filled with cooling liquid.Water pump 63 is arranged in circulation flow channel 60a, for driving cooling liquid to flow in circulation flow channel 60a;Fan 64 is used for air cooling and heat dissipation of water cooling radiator 62.

[0037] Wherein, first direction X, second direction Y are all parallel to first plane.The up-down direction of rack 10 can be defined as third direction Z.The arrow on circulation flow channel 60a indicates the flow direction of cooling liquid.

[0038] The laser processing machine 100 provided by the embodiment of the present application, the work head 21 can translate in the plane relative to the frame 10, the blue laser module 30 is arranged on the work head 21 to follow the movement of the work head 21, the blue laser module 30 can output blue laser to realize workpiece processing.In the water cooling module 60, the first flow channel 611 of the water cooling piece 61 and the second flow channel 621 of the water cooling radiator 62 are communicated to form a circulating flow channel 60a, and the water pump 63 can drive the cooling liquid to flow in the circulating flow channel 60a.The working heat of the blue laser module 30 is conducted to the cooling liquid in the first flow channel 611 through the water cooling piece 61.When the cooling liquid flows to the second flow channel 621, the heat of the cooling liquid is conducted to the water cooling radiator 62.The fan 64 air-cools the water cooling radiator 62.After heat dissipation, the cooling liquid returns to the first flow channel 611 and absorbs heat from the water cooling piece 61 again.The cooling liquid circulates to have a good heat dissipation effect on the blue laser module 30.The related art laser processing machine avoids the problem of dust adhesion caused by the fan and the cooling fin arranged on the work head.The water cooling piece 61 is arranged on the work head 21, and the water cooling radiator 62, the water pump 63 and the fan 64 are fixed to the frame 10 and do not follow the movement of the work head 21.The work head 21, the blue laser module 30 and the water cooling piece 61 are the moving parts, which are light in weight and small in size, and can be driven to move by a small driving force.

[0039] In some embodiments, referring to Figures 1 to 3 , the frame 10 is box-shaped and can be assembled by a plurality of plate members 11.The frame 10 has a closed working space, and the work head 21 and other devices can be arranged in the frame 10.The frame 10 has an opening 10a, and a switch door 12 is arranged at the position of the opening 10a, such as a flip cover that can rotate relative to the frame 10 to switch the opening and closing of the opening 10a.The switch door 12 can be a transparent member, and the inside of the frame 10 can be seen from the outside when the switch door 12 is closed.The laser processing machine 100 can be a desktop laser processing machine.

[0040] In some embodiments, referring to Figure 2 , Figure 3 , the wall of the frame 10 has an air inlet (not shown) and an air outlet 10b.A fan (not shown) can be arranged at the air outlet 10b to generate an air flow from the air inlet to the air outlet 10b.The air outlet 10b can be connected to an exhaust duct (not shown) extending to the outside.The smoke generated by laser processing can follow the air flow through the air outlet 10b and the exhaust duct and be discharged to the outside of the frame 10 to improve the air environment in the frame 10.The air inlet can be arranged on the bottom side wall of the frame 10 or other positions.The air outlet 10b can be arranged on the rear side wall 13 of the frame 10 or other positions.

[0041] In some embodiments, referring to Figure 2 , Figure 3The working head 21 can be provided with a cover 21a covering part of the devices on the working head 21, such as the blue laser module 30, the water cooling member 61, and the like, to protect the devices and improve reliability.

[0042] In some embodiments, referring to Figure 4 The blue laser module 30 can be a semiconductor laser module, which can output blue laser light and has a small structure size. The blue laser light output by the blue laser module 30 can have a wavelength of 400 nanometers (nm) to 500 nm, such as 450 nm. The processing material of the blue laser light can be paper, wood, leather, organic soft material, and the like.

[0043] In some embodiments, referring to Figure 7 、 Figure 8 The water cooling member 61 is in the form of a plate, and the water cooling member 61 abuts against the wall surface of the blue laser module 30. The plate-shaped water cooling member 61 abuts against the blue laser module 30, so that the working heat of the blue laser module 30 can be conducted to the water cooling member 61, and the cooling liquid in the water cooling member 61 absorbs the heat of the water cooling member 61. The blue laser module 30 can be in contact with the large surface of the water cooling member 61 to better absorb heat from the blue laser module 30.

[0044] The water cooling member 61 can be made of a material with good heat conduction, such as copper, aluminum, aluminum alloy, and the like. A heat-conducting adhesive can be arranged between the blue laser module 30 and the water cooling member 61 to reduce thermal resistance and improve heat transfer efficiency.

[0045] In some embodiments, referring to Figure 7 、 Figure 8 The water cooling member 61 includes a plate body 612 and a cover body 613. The plate body 612 has a flow channel groove, and the cover body 613 is fixed to one side of the plate body 612 having the flow channel groove. The plate body 612 and the cover body 613 enclose the first flow channel 611. The water cooling member 61 having the plate body 612 and the cover body 613 is easy to manufacture and assemble. The cover body 613 and the plate body 612 can be connected by welding or the like.

[0046] In some embodiments, referring to Figure 8 The first flow channel 611 of the water cooling member 61 is bent and extended, so as to increase the extension length of the first flow channel 611 in a limited area, to fill more cooling liquid in the water cooling member 61. The water cooling member 61 can efficiently absorb the working heat of the blue laser module 30.

[0047] In some embodiments, referring to Figure 2 、 Figure 3 The wall surface of the rack 10 has an air inlet 10c, and the fan 64 is arranged at the air inlet 10c. The fan 64 and the water cooling radiator 62 are arranged to face each other. In combination with Figure 5The cooling liquid with heat enters the second flow channel 621 of the water cooling radiator 62, and the heat of the cooling liquid is conducted to the outside through the wall of the second flow channel 621. The air flow generated by the fan 64 blows to the water cooling radiator 62, and the heat of the water cooling radiator 62 is taken away. The external clean air can enter the rack 10 through the air inlet 10c and the water cooling radiator 62, and the smoke dust generated by the laser processing is discharged out of the rack 10 through the air outlet 10b.

[0048] Exemplarily, the water cooling radiator 62 has the second flow channel 621 and the radiating fins 622 arranged on the outer wall of the second flow channel 621. The cooling liquid with heat enters the second flow channel 621, and the heat of the cooling liquid is conducted to the radiating fins 622 through the wall of the second flow channel 621. The air flow generated by the fan 64 blows to the radiating fins 622, and the heat of the radiating fins 622 is discharged out of the rack 10. The air inlet 10c can be arranged on the rear side wall 13 of the rack 10 or other positions.

[0049] In some embodiments, referring to Figure 6 , the water pump 63 and the water cooling radiator 62 are arranged adjacently. The distance between the two is shortened, the flow resistance of the cooling water in the circulating flow channel 60a is reduced, and the water pump 63 facilitates the flow of the cooling water.

[0050] Exemplarily, in combination with Figure 2 , Figure 6 , the water pump 63 is arranged below the water cooling radiator 62. The water cooling radiator 62 is located above the workbench 26, and the water pump 63 is located below the workbench 26.

[0051] In some embodiments, referring to Figure 6 , the water pump 63 is arranged close to the rear side wall 13 of the rack 10, and the fan 64 and the water cooling radiator 62 are located on the rear side wall 13 of the rack 10. The working noise of the water pump 63 and the fan 64 is small, and the user experience is good.

[0052] In some embodiments, referring to Figure 5 , Figure 6 , the water cooling member 61 and the water pump 63 are connected through the first pipeline 65, the water pump 63 and the water cooling radiator 62 are connected through the second pipeline 66, and the water cooling radiator 62 and the water cooling member 61 are connected through the third pipeline 67; the laser processing machine 100 further includes a drag chain 23 capable of moving with the work head 21, and the first pipeline 65 and the third pipeline 67 are at least partially arranged on the drag chain 23. The work head 21 can translate in the first plane relative to the rack 10. Arranging the first pipeline 65 and the third pipeline 67 on the drag chain 23 facilitates the assembly and protection of the pipelines.

[0053] In some embodiments, referring to Figures 7 to 9The first light guide structure 31 and the galvanometer 40 are arranged on the working head 21, the first light guide structure 31 is used to conduct the output light beam L1 of the blue laser module 30 to the galvanometer 40, and the galvanometer 40 is used to deflect the emergent light of the first light guide structure 31.

[0054] The first light guide structure 31 is used to adjust the propagation path of the blue laser module 30, so that the output light beam L1 of the blue laser module 30 is conducted to the galvanometer 40. The galvanometer 40 can deflect the laser in two directions to direct the laser to the workpiece for precise laser processing. The laser processing efficiency is high, the pattern is clear during laser engraving, and the effect is good. The working head 21 drives the galvanometer 40 to move for laser processing, so that the laser processing range is large.

[0055] In some embodiments, the first light guide structure 31 is a reflective light guide structure, that is, a light guide structure with a mirror. This way is simple in structure, easy to arrange, and occupies less space.

[0056] In some embodiments, please refer to Figure 4 、 Figure 7 、 Figure 8 , a shielding cover 32 can be arranged outside the first light guide structure 31 to reduce the entry of ambient light into the galvanometer 40. The shielding cover 32 has a light transmission area 321 for the output light beam of the infrared laser module 50 to enter the galvanometer 40.

[0057] In some embodiments, please refer to Figure 7 、 Figure 8 , the galvanometer 40 includes an X mirror piece, a Y mirror piece, a first control motor 41 and a second control motor 42. The first control motor 41 controls the X mirror piece to rotate around the first direction X, and the second control motor 42 controls the Y mirror piece to rotate around the second direction Y. The laser is incident on the light entrance side 40a of the galvanometer 40, and the X mirror piece and the Y mirror piece cooperate to make the laser reflect through the X mirror piece and the Y mirror piece in turn, change the direction of the laser beam to guide on the workpiece, and perform precise and efficient laser processing.

[0058] In some embodiments, please refer to Figures 7 to 10 , the first light guide structure 31 includes a first reflecting piece 311 and a second reflecting piece 312. The output end 30a of the blue laser module 30 and the first reflecting piece 311 are arranged opposite to each other along the first direction X, the second reflecting piece 312 and the first reflecting piece 311 are arranged opposite to each other along the second direction Y, the second reflecting piece 312 and the light entrance side 40a of the galvanometer 40 are arranged opposite to each other along the first direction X, and the first direction X and the second direction Y are perpendicular to each other.

[0059] The first light guide structure 31 has the first reflecting member 311 and the second reflecting member 312, and has a simple structure. The blue laser module 30 and the first light guide structure 31 are easy to arrange, and occupy a small space. The output light beam L1 of the blue laser module 30 is reflected by the first reflecting member 311 and the second reflecting member 312 in sequence, and then is incident to the light entrance side 40a of the galvanometer 40. After the laser is processed by the galvanometer 40, the laser is irradiated to the workpiece, and precise laser processing is realized. The first reflecting member 311 and the second reflecting member 312 can be a reflecting lens or a right-angle prism.

[0060] In other embodiments, the first light guide structure includes a second reflecting member, and no first reflecting member is arranged. The output end of the blue laser module and the second reflecting member are arranged opposite to each other along a second direction Y. The second reflecting member and the light entrance side of the galvanometer are arranged opposite to each other along a first direction X. The first direction X and the second direction Y are perpendicular to each other. The output light beam of the blue laser module is reflected by the second reflecting member, and then is incident to the light entrance side of the galvanometer. After the laser is processed by the galvanometer, the laser is irradiated to the workpiece, and precise laser processing is realized.

[0061] In some embodiments, referring to Figure 4 , Figure 7 , Figure 8 The work head 21 is provided with a circuit board 27. The circuit board 27 can be electrically connected with electrical devices (such as control motors of the galvanometer 40) on the work head 21. The circuit board 27 can be arranged in a spaced stacked manner, so that more electrical devices can be arranged on the circuit board 27. The circuit board 27 can be provided with an avoiding hole 271, so as to avoid related devices (such as control motors of the galvanometer 40), and the structure occupies a small space.

[0062] In some embodiments, referring to Figure 6 , Figure 9 , Figure 10 The infrared laser module 50 is fixed to the rack 10. The second light guide structure 51 is used to conduct the output light beam L2 of the infrared laser module 50 to the galvanometer 40. The galvanometer 40 is also used to deflect the exit light of the second light guide structure 51. The output infrared laser of the infrared laser module 50 is conducted to the galvanometer 40 through the second light guide structure 51, and the laser is guided to the workpiece by the galvanometer 40 to realize infrared laser processing. The processing material of the infrared laser can be metal, plastic, etc.

[0063] In some embodiments, the infrared laser module 50 can be a fiber laser module or a carbon dioxide laser module, etc. The wavelength of the output infrared laser of the fiber laser module can be 1064 nanometers (nm). The wavelength of the output infrared laser of the carbon dioxide laser module can be 10600 nm. The radio frequency laser module also belongs to the carbon dioxide laser module.

[0064] The infrared laser module 50 is an optical fiber laser module. The optical fiber laser module includes an infrared fiber light source 501 and an infrared collimator 502. The infrared fiber light source 501 and the infrared collimator 502 are coupled by an optical fiber 503. The light output side of the infrared collimator 502 is the output end 30a of the infrared laser module 50. The optical fiber laser module is fixed on the rack 10, instead of being arranged on the work head 21.

[0065] In some embodiments, the second light guide structure 51 adjusts the propagation path of the infrared laser module 50, so that the output light beam L2 of the infrared laser module 50 is conducted to the galvanometer 40. The second light guide structure 51 is a reflective light guide structure, i.e., a light guide structure with a mirror. This way is simple in structure, easy to arrange, small in space occupation, and light in weight. It avoids the complex operation of the related art of using an optical fiber to conduct infrared laser into a galvanometer in a small space. It avoids the need for a large arrangement space for the related art of using an optical fiber to conduct infrared laser, to meet the minimum bending radius requirement of arranging the optical fiber.

[0066] In some embodiments, referring to Figure 6 , Figure 9 , Figure 10 The second light guide structure 51 includes a third reflecting element 511 and a fourth reflecting element 512. The third reflecting element 511 is fixed on the rack 10, and the fourth reflecting element 512 is fixed on the cross beam 22. The output end 50a of the infrared laser module 50 and the third reflecting element 511 are oppositely arranged along the first direction X. The fourth reflecting element 512 and the third reflecting element 511 are oppositely arranged along the second direction Y. The fourth reflecting element 512, the second reflecting element 312, and the light input side 40a of the galvanometer 40 are sequentially arranged along the first direction X. The second reflecting element 312 is a light combining mirror.

[0067] The second light guide structure 51 with the third reflecting element 511 and the fourth reflecting element 512 is simple in structure, and the infrared laser module 50 and the second light guide structure 51 are easy to arrange and small in space occupation. The output light beam L2 of the infrared laser module 50 is reflected by the third reflecting element 511 and the fourth reflecting element 512 in turn, and then passes through the second reflecting element 312 and is incident on the light input side 40a of the galvanometer 40. After the laser is processed by the galvanometer 40, the laser is irradiated on the workpiece, to realize accurate laser processing. The third reflecting element 511 and the fourth reflecting element 512 can be a mirror or a right-angle prism.

[0068] The second reflecting element 312 is a light combining mirror, which can reflect blue laser and transmit infrared light, so that the blue laser and the infrared laser are smoothly incident on the light input side 40a of the galvanometer 40.

[0069] In other embodiments, the second light guide structure includes a fourth reflector but omits a third reflector. The output end of the infrared laser module and the fourth reflector are positioned opposite each other along a second direction, while the fourth reflector and the incident side of the galvanometer are positioned opposite each other along a first direction, with the first and second directions perpendicular to each other. The output beam of the infrared laser module, after being reflected by the fourth reflector, can be incident on the incident side of the galvanometer. After being processed by the galvanometer, the laser beam irradiates the workpiece, achieving precise laser processing.

[0070] In some embodiments, please refer to Figure 2 , Figure 3 It also includes a crossbeam 22, a first guide mechanism 24, and a second guide mechanism 25. The working head 21 is mounted on the crossbeam 22 via the first guide mechanism 24, allowing the working head 21 to slide along the crossbeam 22 in a first direction X. The crossbeam 22 is mounted on the frame 10 via the second guide mechanism 25, allowing the crossbeam 22 to slide along the frame 10 in a second direction Y. A predetermined angle is formed between the first direction X and the second direction Y, and both the first direction X and the second direction Y are parallel to a first plane. The first guide mechanism 24 enables the working head 21 to slide smoothly relative to the crossbeam 22 in the first direction X. The second guide mechanism 25 enables the crossbeam 22 to slide smoothly in the second direction Y.

[0071] In some embodiments, please refer to Figure 11 The crossbeam 22 extends generally along the first direction X. The first guide mechanism 24 includes a first slide rail 241 and a first slider 242, with the first slider 242 slidably mounted on the first slide rail 241. The first slide rail 241 is fixed to the crossbeam 22, and the first slider 242 is fixed to the working head 21. This allows the working head 21 to be slidably mounted on the crossbeam 22 along the first direction X. Furthermore, the positions of the first slide rail 241 and the first slider 242 can be interchanged, also allowing the working head 21 to be slidably mounted on the crossbeam 22 along the first direction X.

[0072] In some embodiments, please refer to Figure 6 , Figure 12 The crossbeam 22 extends generally along the first direction X. The second guiding mechanism 25 includes a pair of guide rods 252 and a pair of guide seats 251. The two guide rods 252 extend along the second direction Y and are respectively fixed on opposite sides of the frame 10 along the first direction X. The two guide seats 251 are respectively installed at opposite ends of the crossbeam 22. The two guide rods 252 and the two guide seats 251 are matched one-to-one, so that the crossbeam 22 is slidably installed on the frame 10 along the second direction Y. A linear bearing may be provided between the guide seats 251 and the guide rods 252.

[0073] In some embodiments, please refer to Figure 6 , Figure 12The gantry 10 is provided with a first driving module 70, and the work head 21 is connected to the first driving module 70. The first driving module 70 is configured to drive the work head 21 to move in the first plane. The device (such as the blue laser module 30, the water cooling component 61, etc.) mounted on the work head 21 moves along with the work head 21.

[0074] In the first driving module 70 configured to output the movement in the first plane, there are various optional implementation manners.

[0075] For example, Figure 6 , Figure 12 The first driving module 70 can be a conventional core XY movement structure, which is a conventional driving scheme of the laser processing machine 100. The core XY movement structure adopts two control motors 71, two synchronous belts 72, and multiple synchronous pulleys 73, and can drive the work head 21 to move in the first plane (XY plane). When the two control motors 71 rotate in the same direction, the work head 21 can be driven to move in the first direction X. When the two control motors 71 rotate in opposite directions, the work head 21 can be driven to move in the second direction Y.

[0076] For example, the first driving module 70 can include an X-axis linear module (not shown in the figure) and a Y-axis linear module (not shown in the figure). The X-axis linear module can output displacement in the first direction X, and the Y-axis linear module can output displacement in the second direction Y. The X-axis linear module is mounted on the Y-axis linear module, and the workbench 26 is mounted on the X-axis linear module. The X-axis linear module and the Y-axis linear module are combined to realize the movement of the work head 21 in the first plane (XY plane). The X-axis linear module and the Y-axis linear module can be in the form of a lead screw transmission and a synchronous belt transmission.

[0077] In some embodiments, referring to Figure 2 , Figure 3 The gantry 10 is provided with a workbench 26 that can move up and down relative to the gantry 10. The workbench 26 is configured to place a workpiece. By adjusting the height position of the workbench 26, it is convenient to place workpieces of different height sizes in the gantry 10. It is also convenient to focus the optical system of the laser processing machine 100.

[0078] In combination Figure 4 The light exit side of the galvanometer 40 can be provided with a focusing mirror 90, which can be mounted on the work head 21. The focusing mirror 90 can include multiple lenses arranged along the optical axis. The focusing mirror 90 can focus the light emitted from the galvanometer 40 to concentrate the laser to the processing area, improve the energy density and processing efficiency, and realize high-quality laser processing.

[0079] In some embodiments, referring to Figure 12, the rack 10 is provided with a second driving module 80, and the workbench 26 is connected to the second driving module 80, and the second driving module 80 is used for driving the workbench 26 to move up and down. The workbench 26 moves up and down through the second driving module 80, so that the workpiece on the workbench 26 moves along.

[0080] When the second driving module 80 outputting the up-down movement is arranged, there are various optional implementation manners.

[0081] For example, please refer to Figure 12 The second driving module 80 includes a control motor 81, a synchronous belt mechanism 82 and a screw sliding block mechanism 83. The synchronous belt mechanism 82 includes a first pulley 821, a second pulley 822 and a synchronous belt 823, and the synchronous belt 823 is arranged around the first pulley 821 and the second pulley 822. The screw sliding block mechanism 83 includes a screw 831 and a nut 832, the screw 831 extends along the third direction Z, the screw 831 and the nut 832 are threadedly connected, the nut 832 is fixed to a sliding piece 833, the sliding piece 833 is slidingly installed on the rack 10 along the third direction Z, and the nut 832 and the workbench 26 are fixedly connected through a connecting frame 84. One end of the screw 831 is connected to the second pulley 822. The control motor 81 drives the first pulley 821 to rotate, drives the second pulley 822 and the screw 831 to rotate through the synchronous belt 823, and then drives the nut 832, the connecting frame 84 and the workbench 26 to move up and down synchronously.

[0082] For example, the second driving module 80 can include a Z-axis linear module (not shown in the figure). The Z-axis linear module can output the displacement of the third direction Z, and the workbench 26 is installed on the Z-axis linear module to realize the up-down movement of the workbench 26.

[0083] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser processing machine, characterized in that, include: Frame, working head, blue laser module and water cooling module; The working head can translate relative to the frame in a first plane; The blue laser module is mounted on the working head; The water-cooled module includes a water-cooling component, a water-cooling radiator, a water pump, and a fan; the water-cooling component is located on the working head and is used to absorb heat from the blue laser module; the water-cooling radiator, the water pump, and the fan are all fixed to the frame; The water-cooled component has a first flow channel, and the water-cooled radiator has a second flow channel. The first flow channel and the second flow channel are connected to form a circulating flow channel, which is filled with coolant. The water pump is located in the circulating flow channel and is used to drive the coolant to flow in the circulating flow channel. The fan is used to provide air cooling for the water-cooled radiator.

2. The laser processing machine as described in claim 1, characterized in that, The water-cooling component is plate-shaped and rests against the wall of the blue laser module.

3. The laser processing machine as described in claim 1, characterized in that, The frame wall has an air inlet, the fan is located at the air inlet, and the fan and the water-cooled radiator are arranged facing each other; And / or, the water pump and the water-cooled radiator are arranged adjacent to each other; And / or, the water pump is located near the rear side wall of the rack, and the fan and the water-cooled radiator are located on the rear side wall of the rack.

4. The laser processing machine as described in claim 1, characterized in that, The water-cooled component and the water pump are connected by a first pipeline, the water pump and the water-cooled radiator are connected by a second pipeline, and the water-cooled radiator and the water-cooled component are connected by a third pipeline. The laser processing machine also includes a cable chain that can follow the movement of the working head, with at least a portion of the first conduit and at least a portion of the third conduit located on the cable chain.

5. The laser processing machine as described in any one of claims 1 to 4, characterized in that, It also includes a first light guide structure and a galvanometer. Both the first light guide structure and the galvanometer are located on the working head. The first light guide structure is used to guide the output beam of the blue laser module to the galvanometer, and the galvanometer is used to deflect the outgoing light of the first light guide structure.

6. The laser processing machine as described in claim 5, characterized in that, The first light guide structure includes a first reflector and a second reflector. The output end of the blue laser module and the first reflector are arranged opposite each other along a first direction. The second reflector and the first reflector are arranged opposite each other along a second direction. The second reflector and the light incident side of the galvanometer are arranged opposite each other along the first direction. The first direction and the second direction are perpendicular to each other.

7. The laser processing machine as described in any one of claims 1 to 4, characterized in that, It also includes a crossbeam, a first guide mechanism, and a second guide mechanism; The working head is mounted on the crossbeam via the first guide mechanism, so that the working head is slidably mounted on the crossbeam along the first direction; The crossbeam is mounted on the frame via the second guide mechanism so that the crossbeam is slidably mounted on the frame along the second direction; the first direction and the second direction form a predetermined angle, and both the first direction and the second direction are parallel to the first plane.

8. The laser processing machine as described in any one of claims 1 to 4, characterized in that, The frame is provided with a first drive module, and the working head is connected to the first drive module. The first drive module is used to drive the working head to translate within the first plane.

9. The laser processing machine as described in any one of claims 1 to 4, characterized in that, The frame has a worktable that can move up and down relative to the frame.

10. The laser processing machine as described in claim 9, characterized in that, The frame is equipped with a second drive module, and the worktable is connected to the second drive module. The second drive module is used to drive the worktable to move up and down.