Clamp for laser scribing machine

Abstract

The clamp for the laser scribing machine comprises a base and a limiting ring plate which are distributed in parallel, the base and the limiting ring plate are connected through a supporting piece, a plurality of vacuum adsorption pipes are arranged on the base, and the tops of the vacuum adsorption pipes are located in the limiting ring plate; a plurality of limiting grooves distributed in the circumferential direction are formed in the limiting ring plate, positioning plates capable of generating displacement in the radial direction of the limiting ring plate are arranged in the limiting grooves, and a limiting block used for positioning a silicon wafer is arranged at the inner end of at least one positioning plate; a plurality of first scale grooves distributed in the radial direction are formed in the two sides of the limiting groove, and second scale grooves corresponding to the first scale grooves are formed in the positioning plate. According to the utility model, silicon wafers can be positioned when being placed, the placement precision is improved, and rapid placement is facilitated; and meanwhile, the magnet sheet can move according to scales, so that silicon wafers with different ruler diameters can be conveniently placed, the silicon wafers can be clamped, the silicon wafers are prevented from deviating, the cutting precision of the silicon wafers is ensured, and the material loss is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of silicon wafer cutting, especially relates to a clamp for laser wafer dicing machine. BACKGROUND

[0002] The laser cutting technology is a new technology widely used in industrial manufacturing and production, and is a device for irradiating a workpiece surface with a high-energy laser beam to locally melt and vaporize the irradiated area, thereby achieving the purpose of wafer dicing. The laser wafer dicing machine is mainly used for wafer dicing and cutting metal materials, silicon, gallium arsenide and other semiconductor substrate materials. Since the machining is non-contact, there is no mechanical stamping force on the workpiece itself, and the workpiece is not easy to deform, the thermal influence is minimal, and the wafer dicing precision is high.

[0003] At present, a clamp needs to be used when cutting a silicon wafer with a laser wafer dicing machine to ensure the cutting precision of the silicon wafer. The utility model patent with the publication number CN203401254U proposes a laser silicon wafer cutting clamp, which includes a base, a support, a support surface, a silicon wafer suction rod and a suction pipe. The base and the support surface are parallel and connected through the support. The support surface is circular. A plurality of silicon wafer suction rods parallel to the support are arranged on the base. The top end surface of the silicon wafer suction rod is provided with a suction disc. The base surface is provided with a suction pipe. The side surface of the base is also provided with a suction port. The suction pipe and the suction port are connected through the inside of the base. Although the clamp can adsorb the silicon wafer on the support surface and blow air during the cutting process to ensure the integrity of the cutting edge through the suction pipe, it still has the following problems: no corresponding positioning component is arranged. Since the silicon wafer is placed manually, there is a problem of low placement precision. The silicon wafer is placed on the support surface as a whole, and there is no limiting position around it. When cutting a small size silicon wafer, the adsorption area is reduced, the suction force is reduced, and the silicon wafer may be affected by external force or manual operation, causing the position to deviate. These factors will affect the cutting precision, and even cause damage to the silicon wafer, resulting in loss. UTILITY MODEL CONTENT

[0004] To solve the problems in the prior art, the utility model provides a clamp for a laser wafer dicing machine, which solves the problem of low silicon wafer cutting precision. The purpose of the utility model and the solution to the technical problem are achieved by adopting the following technical scheme. According to the clamp for the laser wafer dicing machine, the base and the limiting ring plate are parallel. The base and the limiting ring plate are connected through the support. A plurality of vacuum suction pipes are arranged on the base, and the top of the vacuum suction pipe is located in the limiting ring plate. A plurality of limiting grooves are arranged on the limiting ring plate in the circumferential direction. A positioning plate capable of generating displacement in the radial direction of the limiting ring plate is arranged in the limiting groove. The inner end of at least one positioning plate is provided with a limiting block for positioning the silicon wafer. A plurality of first scale grooves are arranged on both sides of the limiting groove in the radial direction. A second scale groove corresponding to the first scale groove is arranged on the positioning plate.

[0005] Furthermore, the upper end face of the vacuum adsorption tube is provided with several adsorption holes, and its side wall is provided with air holes that are connected to the vacuum generator.

[0006] Furthermore, a silicone sleeve is fitted on the top of the vacuum adsorption tube, and the silicone sleeve has vent holes corresponding to the adsorption holes.

[0007] Furthermore, the top of the limiting groove is open, and the positioning plate is magnetically attached to the limiting groove.

[0008] Furthermore, the positioning plate is a metal plate, and a magnet is provided in the limiting groove to magnetically engage with the metal plate so that the metal plate can be displaced radially.

[0009] Furthermore, the base is provided with several fixing grooves distributed circumferentially.

[0010] Furthermore, the limiting ring plate is connected to the base by several support rods distributed circumferentially.

[0011] Furthermore, the limiting block is triangular in shape, and the inner end of the limiting block used for silicon wafer positioning is rounded.

[0012] Furthermore, the inner end of the positioning plate used for silicon wafer positioning is arc-shaped.

[0013] In summary, this utility model, by setting a limiting groove on the limiting ring plate, setting a limiting block on the magnet plate, and placing the silicon wafer inside the limiting ring plate, can position the silicon wafer during placement, improve placement accuracy, and facilitate rapid placement; at the same time, the magnet plate can move according to the scale, which is convenient for placing silicon wafers of different diameters, and can clamp the silicon wafer to prevent it from shifting, thus ensuring the cutting accuracy of the silicon wafer and reducing material waste.

[0014] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, preferred embodiments are given below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a fixture for a laser scribing machine according to the present invention. Detailed Implementation

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings and preferred embodiments.

[0017] Please see Figure 1A fixture for a laser scribing machine includes a base 1, a support member 2, a limiting ring plate 3, and a vacuum adsorption tube 7. The base 1 and the limiting ring plate 3 are arranged in parallel and connected by the support member 2. In this embodiment, the support member 2 is a support rod, which is set on the base 1 and distributed circumferentially. The limiting ring plate 3 and the support rod are connected by bolts 4. The base 1 is provided with a plurality of circumferentially distributed fixing grooves 13. The fixing grooves 13 are evenly spaced and can be fixed to the worktable by bolts or other fixing members passing through the fixing grooves 13, thereby fixing the base 1.

[0018] The vacuum adsorption tube 7 is located on the base 1, with its top inside the limiting ring plate 3, and is used to support the silicon wafer. When the silicon wafer is placed on the vacuum adsorption tube 7, the silicon wafer will also be located inside the limiting ring plate 3. In this embodiment, there are six vacuum adsorption tubes 7, and the diameter of three of them is different from that of the other three. They are used to adsorb different positions of the silicon wafer, so that multiple required silicon wafer parts can be cut out. The upper end face of the vacuum adsorption tube 7 is provided with several adsorption holes 6, and the side wall is provided with air holes 14 connected to the vacuum generator. The purpose of adsorbing the silicon wafer is achieved through the vacuum generator, air holes 14, and adsorption holes 6.

[0019] A silicone sleeve 5 is fitted on the top of the vacuum adsorption tube 7. The silicone sleeve 5 has several vent holes corresponding to the adsorption holes 6. The silicone sleeve 5 can reduce friction on the silicon wafer surface, thereby reducing scratches and improving the surface quality of the silicon wafer.

[0020] The limiting ring plate 3 is provided with several limiting grooves 15 along the circumferential direction. In this embodiment, there are three limiting grooves 15, and the top of the limiting grooves 15 is open. A positioning plate is provided in the limiting groove 15. The positioning plate used in this embodiment is a metal plate 8. A magnet 9 is provided in the limiting groove 15 to magnetically engage with the metal plate 8. The magnet 9 is fixed to the limiting ring plate 3. The metal plate 8 is attracted to the iron block 9. The metal plate 8 can be moved radially along the limiting ring plate 3 in the limiting groove 15. The end of the metal plate 8 that contacts the silicon wafer is arc-shaped, and the arc has the same curvature as the silicon wafer and the inner circle of the limiting ring plate 3. At least one metal plate 8 (the metal plate 8 in the middle) is provided with a limiting block 11. The limiting block 11 is triangular and is provided at the inner end of the metal plate 8. The inner end of the limiting block 11 used for positioning the silicon wafer is rounded. The silicon wafer is provided with a corner groove that matches the limiting block 11.

[0021] The limiting groove 15 has several first scale grooves 10 arranged radially on both sides. The first scale grooves 10 are located on the limiting ring plate 3. The metal plate 8 has a second scale groove 12 corresponding to the first scale grooves 10. The position of the metal plate 8 can be adjusted conveniently, quickly and accurately, which is convenient for clamping and positioning silicon wafers of different sizes. The width of the first scale groove 10 and the second scale groove 12 is the same. When a certain first scale groove 10 and the second scale groove 12 correspond, the two grooves are connected. A metal sheet or other sheet-like fixing parts that can be inserted into the groove can be placed into the groove to realize the detachable fixed connection between the metal plate 8 and the limiting ring plate 3. This can further fix the metal plate 8 and realize the positioning and clamping of the silicon wafer.

[0022] The working process of this utility model:

[0023] First, place the silicon wafer inside the limiting ring plate 3 and on the vacuum adsorption tube 7, aligning the corner groove of the silicon wafer with the limiting block 11. Then, move the position of the positioning plate to clamp and position the silicon wafer. Next, start the vacuum generator to adsorb the silicon wafer through the vacuum adsorption tube 7. Then, control the laser scribing machine to cut the wafer. After cutting, the cut silicon wafer workpiece is adsorbed by the vacuum adsorption tube 7, and the positioning plate is reset. Remove the cut silicon wafer waste. Finally, turn off the vacuum generator and remove the workpiece.

[0024] In other embodiments of this utility model, the limiting groove 15 can be a closed groove, and a clamping block that slides radially along the limiting ring plate 3 can be provided in the limiting groove 15. At the same time, a bolt is provided at the upper end of the limiting groove 15. The bolt passes through the upper end face of the limiting groove 15 and abuts against the top of the clamping block. By tightening and loosening the bolt, the extension distance of the clamping block can be adjusted, thereby realizing the clamping and positioning of the silicon wafer.

[0025] In other embodiments of this utility model, the positions of the magnet 9 and the metal plate 8 can be interchanged, that is, the metal plate 8 is fixed on the limiting ring plate 3, the magnet 9 is adsorbed on the metal plate 8, and can be radially displaced within the limiting groove 15 along the limiting ring plate 3.

[0026] In other embodiments of this utility model, the first scale groove 10 and the second scale groove 12 can also be replaced with scale lines. When the positioning plate is displaced, the displacement distance of the positioning plate can be accurately measured through the scale lines, thereby achieving the purpose of quickly adjusting the position of the positioning plate.

[0027] In other embodiments of this utility model, the support member 2 may be a fan-shaped support plate used to connect the base 1 and the limiting ring plate 3.

[0028] The above description is merely a preferred embodiment of this utility model. Any simple modifications, equivalent changes, and alterations made by those skilled in the art to the above embodiments without departing from the scope of the technical solution of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A fixture for a laser scribing machine, characterized in that: The device includes a base (1) and a limiting ring plate (3) arranged in parallel. The base (1) and the limiting ring plate (3) are connected by a support member (2). The base (1) is provided with a number of vacuum adsorption tubes (7), and the top of the vacuum adsorption tubes (7) is located inside the limiting ring plate (3). The limiting ring plate (3) is provided with a number of limiting grooves (15) arranged in a circumferential direction. The limiting grooves (15) are provided with positioning plates that can generate displacement along the radial direction of the limiting ring plate (3). At least one positioning plate is provided with a limiting block (11) for positioning silicon wafers at its inner end. The limiting grooves (15) are provided with a number of first scale grooves (10) arranged in a radial direction on both sides. The positioning plates are provided with second scale grooves corresponding to the first scale grooves (10).

2. The fixture for a laser scribing machine according to claim 1, characterized in that: The upper end face of the vacuum adsorption tube (7) is provided with several adsorption holes (6), and its side wall is provided with air holes connected to the vacuum generator.

3. The fixture for a laser scribing machine according to claim 2, characterized in that: The top of the vacuum adsorption tube (7) is fitted with a silicone sleeve (5), and the silicone sleeve (5) has a vent hole corresponding to the adsorption hole (6).

4. The fixture for a laser scribing machine according to claim 1, characterized in that: The top of the limiting groove (15) is open, and the positioning plate is magnetically attached to the limiting groove (15).

5. A fixture for a laser scribing machine according to claim 1, characterized in that: The positioning plate is a metal plate (8), and a magnet (9) is provided in the limiting groove (15) to magnetically engage with the metal plate (8) so that the metal plate (8) can be displaced radially.

6. A fixture for a laser scribing machine according to claim 1, characterized in that: The base (1) is provided with several fixing grooves (13) distributed along the circumference.

7. A fixture for a laser scribing machine according to claim 1, characterized in that: The limiting ring plate (3) and the base (1) are connected by several support rods distributed along the circumference.

8. A fixture for a laser scribing machine according to claim 1, characterized in that: The limiting block (11) is triangular, and the inner end of the limiting block (11) used to position the silicon wafer contact is rounded.

9. A fixture for a laser scribing machine according to claim 1, characterized in that: The positioning plate is used to position the inner end of the silicon wafer, which is arc-shaped.

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