Clamp applied to lead bonding
By designing a clamping structure with detachable beryllium bronze springs and stainless steel plates, the problems of easy deformation and difficult maintenance of carbon steel clamps were solved, enabling flexible adjustment of the springs and reducing costs, thereby improving the stability of substrate positioning and the service life of the clamps.
Patent Information
- Application Number
- CN202520268718.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-02-19
AI Technical Summary
Existing wire bonding clamps are made of carbon steel, which has good hardness and wear resistance but low hot hardness, is easy to deform, difficult to repair and costly, and difficult to maintain flexibly.
Design a clamp with a detachable spring and boss structure. The spring is detachably connected to the plate and is made of beryllium bronze. The plate is made of stainless steel and is connected by screws or buckles. This facilitates the adjustment and replacement of the spring, improving positioning stability and usage flexibility.
This enables flexible adjustment and maintenance of the spring clips, reduces maintenance costs, and improves the stability of substrate positioning and the service life of the fixture.
Smart Images

Figure CN223917710U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a clamp, and more particularly to a clamp used in wire bonding. Background Technology
[0002] With continuous innovation in mobile phone camera technology, cameras have evolved from single-lens to multi-lens, and from low-pixel to high-pixel and high-magnification optical zoom periscope lenses. In camera manufacturing, wire bonding is the mainstream process for packaging mobile phone camera modules. This involves connecting the gold fingers of a chip already attached to a substrate to the gold fingers of the substrate via wire bonding, enabling it to conduct electricity. During wire bonding, ceramic tips attach gold balls to both the chip and the substrate and pull the wires. This process requires the use of fixtures to fix the substrate in place. If the fixture design is flawed, problems such as insufficient or excessive clamping force on the substrate, or easy deformation, can easily occur.
[0003] Currently, the fixtures used in wire bonding stations primarily use internal springs to clamp and fix the substrate. The fixture and springs are integrally molded from carbon steel with a nickel plating finish. While carbon steel fixtures have high hardness and wear resistance after quenching and tempering, they suffer from low hot hardness, poor hardenability, easy deformation, and relatively low plasticity and strength. This type of fixture is also more difficult to manufacture and maintain. After prolonged use, the spring surface wears severely, necessitating complete replacement and resulting in high maintenance costs. Therefore, there is an urgent need for a fixture that is more convenient to use and maintain, and has a lower cost. Utility Model Content
[0004] The purpose of this invention is to provide a fixture for wire bonding to solve one or more technical problems existing in the prior art, and at least provide a beneficial option or create conditions.
[0005] The solution to the technical problem of this utility model is:
[0006] A fixture for wire bonding includes: a plate body; a positioning structure including bosses and spring contacts, wherein the plate body is provided with a through hole, and the bosses are respectively provided on the bottom side of the plate body at positions at least on both sides of the through hole, and a plurality of the bosses are detachably connected to the spring contacts, and the plurality of spring contacts protrude from the plurality of bosses in a direction close to the through hole, and the positioning structure is provided on the plate body in a plurality of ways.
[0007] This technical solution has at least the following beneficial effects: Multiple positioning structures for positioning substrates are provided on the board. During use, the entire board is pressed down onto a carrier plate containing multiple substrates, so that multiple through holes on the board are aligned with multiple substrates. As the board is gradually pressed down, the spring tabs protruding from the bosses press down and fix the substrates, causing the spring tabs to gradually deform elastically, thus pressing and positioning the substrates. At this time, wire bonding can be performed on the substrates and the chips attached to them. After completion, the board is lifted, and the entire carrier plate can be moved out from under the board for the next processing. If some spring tabs have insufficient downward pressure during use, they can be adjusted or replaced individually. If some spring tabs become deformed or damaged after long-term use, they can also be replaced or maintained individually. This detachable connection between the spring tabs and the bosses facilitates adjustment, replacement, and maintenance of the spring tabs at the required positions, improving flexibility and reducing production costs.
[0008] As a further improvement to the above technical solution, each positioning structure includes multiple bosses, each located on opposite sides of the through hole. Bosses are provided on the bottom side of the plate at positions opposite to the through holes. When positioning the substrate, spring tabs on either side of the through hole press against both sides of the substrate, securing it in place. This improves the stability of the force applied during substrate positioning, thereby enhancing the substrate positioning effect.
[0009] As a further improvement to the above technical solution, the spring sheet includes a positioning part and a connecting part that are connected to each other. The connecting part is detachably connected to the boss. A plurality of spaced-apart ribs are formed on the bottom side of the boss. The two sides of the connecting part abut against two adjacent ribs respectively. The positioning part protrudes from the boss. A limiting area is formed between the two spaced-apart ribs on the bottom side of the boss. The connecting part of the spring sheet can be quickly fitted into this limiting area to quickly align the connecting part of the spring sheet and connect it to the boss. The positioning part connected to the connecting part protrudes from the boss and is used to abut against and press down on the substrate for positioning, thereby firmly positioning the substrate.
[0010] As a further improvement to the above technical solution, positioning concave corners are respectively provided on both sides of the connecting part near the through hole, and two adjacent convex ribs are respectively located within the two positioning concave corners. When the connecting part is connected to the boss, the two convex ribs on the boss respectively engage with the two positioning concave corners. Through the concave-convex engagement, the connecting part can be more tightly connected to the boss, further improving the connection stability between the spring piece and the boss.
[0011] As a further improvement to the above technical solution, a screw is provided on the bottom side of the connecting part. The screw is connected to the boss and presses the connecting part tightly against the boss. By connecting the connecting part to the boss with a screw, the connecting part is pressed and fixed on the boss, so that the connecting part and the boss are firmly connected. When it is necessary to adjust the elastic downward pressure of the positioning part, the screw can be removed from the connecting part. In addition, when it is necessary to adjust the elastic downward pressure of the positioning part on the substrate, the tightness of the screw can be adjusted, making it more convenient to use.
[0012] As a further improvement to the above technical solution, the thickness of the spring sheet is between 0.25 cm and 0.35 cm. Within this thickness range, the spring sheet has sufficient thickness, resulting in stronger compressive stress and less deformation, thus achieving a stable structure even when the substrate is fixed for a long time.
[0013] As a further improvement to the above technical solution, the spring is made of beryllium bronze. Beryllium bronze springs have high hardness, elastic limit, fatigue limit, and wear resistance, as well as good corrosion resistance, thus maintaining good positioning of the substrate after prolonged use and extending the service life of the spring.
[0014] As a further improvement to the above technical solution, the plate is made of stainless steel. Stainless steel plates have strong corrosion resistance and toughness, long service life, good aging resistance, and high tensile strength, which can extend the service life of the plate.
[0015] As a further improvement to the above technical solution, at least one connecting wing is formed on each side of the plate, and at least one of the connecting wing is provided with a mounting hole. External devices are interconnected with the connecting wing on both sides of the plate, thus facilitating connection to both sides of the plate. The mounting holes on the two connecting wing also allow for the external devices to be connected and fixed to the plate, improving the convenience of connecting and installing the plate.
[0016] As a further improvement to the above technical solution, at least one of the connecting wings is provided with a positioning groove. When the peripheral device is connected to the connecting wing, the two can be quickly connected and aligned through the positioning groove on the top side of the connecting wing, thereby improving the tightness of the connection between the device and the connecting wing and making the connection structure between the connecting wing and the peripheral device more stable. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly explained below. Obviously, the described drawings are only a part of the embodiments of this utility model, and not all of them. Those skilled in the art can obtain other design schemes and drawings based on these drawings without creative effort.
[0018] Figure 1 This is a top view of the entire utility model.
[0019] Figure 2 This is a three-dimensional view of the entire utility model.
[0020] Figure 3 yes Figure 2 A magnified view of part A.
[0021] In the attached diagram: 100-plate, 110-through hole, 120-connecting wing, 121-mounting hole, 122-positioning groove, 200-positioning structure, 210-bore, 211-rib, 220-spring, 221-positioning part, 222-connecting part, 223-positioning concave angle, 230-screw. Detailed Implementation
[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0023] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0024] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0025] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0026] Reference Figures 1 to 3A fixture for wire bonding includes a plate 100 and a positioning structure 200. The positioning structure 200 includes bosses 210 and spring pieces 220. The plate 100 is provided with a through hole 110. The bosses 210 are respectively provided on the bottom side of the plate 100 at least on both sides of the through hole 110. The multiple bosses 210 are detachably connected to the spring pieces 220. The multiple spring pieces 220 protrude from the multiple bosses 210 in a direction close to the through hole 110. The positioning structure 200 is provided on the plate 100, and the through holes 110 on the plate 100 are also provided at positions corresponding to the positioning structure 200.
[0027] As described above, the board 100 is provided with multiple positioning structures 200 for positioning the substrates. In use, the entire board is pressed down onto the carrier plate containing the multiple substrates, so that the multiple through holes 110 on the board 100 are respectively aligned with the multiple substrates. As the board 100 is gradually pressed down, the spring tabs 220 protruding from the bosses 210 press and fix the substrates, causing the spring tabs 220 to gradually deform elastically, pressing and positioning the substrates. At this time, wire bonding can be performed between the substrates and the chips attached to the substrates. After completion, the board 100 is lifted up. The entire carrier plate can be moved out from under the plate 100 to prepare for the next processing. If some springs 220 have insufficient downward pressure during use, they can be adjusted or replaced individually. If some springs 220 are deformed or damaged after long-term use, they can also be replaced or maintained individually. In this way, the springs 220 and the boss 210 are detachably connected, which makes it convenient to adjust, replace and maintain the springs 220 in the required positions, improves the flexibility of use and reduces production costs.
[0028] The protrusions 210 provided on the bottom side of the plate 100 at the side of the through hole 110 can be two, three, or four, etc. For example, when there are four protrusions 210, the four protrusions 210 are respectively located on the four sides of the through hole 110. At this time, the four protrusions 210 are respectively used for elastic pressing of the substrate. In order to ensure that there is sufficient downward pressure on the substrate while preventing damage to the substrate, in this embodiment, in each positioning structure 200, there are multiple protrusions 210, and the multiple protrusions 210 are respectively located on the two sides of the through hole 110 that are directly opposite each other. For example, two protrusions 210 are respectively located on the two sides of the through hole 110 that are directly opposite each other. On the bottom side of the plate 100, protrusions 210 are respectively provided on both sides of the through hole 110. When it is necessary to position the substrate, the spring pieces 220 on both sides of the through hole 110 press against the two sides of the substrate respectively, and press and position it from both sides of the substrate. This can improve the stability of the force applied to the substrate for positioning, thereby improving the positioning effect of the substrate.
[0029] The spring piece 220 may have two parts: one part is used for connection with the boss 210, and the other part is used for elastically pressing and positioning the substrate. Specifically, the spring piece 220 includes a positioning part 221 and a connecting part 222 connected to each other. The connecting part 222 is detachably connected to the boss 210. The bottom side of the boss 210 has a plurality of spaced-apart ribs 211. The two sides of the connecting part 222 abut against two adjacent ribs 211 respectively. The positioning part 221 protrudes from the boss 210. A limiting area is formed between the two spaced-apart ribs 211 on the bottom side of the boss 210. The connecting part 222 of the spring piece 220 can be quickly fitted into this limiting area to quickly align the connecting part 222 of the spring piece 220 and connect the connecting part 222 to the boss 210. The positioning part 221 connected to the connecting part 222 protrudes from the boss 210 and is used to abut against and press down on the substrate for positioning, thereby securing the substrate in place.
[0030] To ensure a tighter connection between the connecting part 222 and the boss 210, in this embodiment, positioning recesses 223 are provided on both sides of the connecting part 222 near the corners of the through hole 110, and two adjacent ribs 211 are located within the two positioning recesses 223. When the connecting part 222 is connected to the boss 210, the two ribs 211 on the boss 210 respectively engage with the two positioning recesses 223. Through this interlocking action, the connecting part 222 is more tightly connected to the boss 210, further improving the connection stability between the spring piece 220 and the boss 210.
[0031] There are several ways to detachably connect the connecting part 222 to the boss 210. For example, the connecting part 222 can be fixed to the boss 210 by means of a snap-fit. Specifically, a hook is formed on the connecting part 222, and a slot is provided on the boss 210. By the cooperation of the hook and the slot, the connecting part 222 and the boss 210 can be snapped and fixed together. Alternatively, the connecting part 222 can be fixed to the boss 210 by means of a screw 230. Specifically, a screw 230 is provided on the bottom side of the connecting part 222. The screw 230 is connected to the boss 210 and presses the connecting part 222 tightly onto the boss 210. By connecting the connecting part 222 to the boss 210 with screws 230, the connecting part 222 is pressed and fixed to the boss 210, so that the connecting part 222 and the boss 210 are firmly connected. When it is necessary to adjust the elastic downward pressure of the positioning part 221, the screws 230 can be removed from the connecting part 222. In addition, when it is necessary to adjust the elastic downward pressure of the positioning part 221 on the substrate, the tightness of the screws 230 can be adjusted, making it more convenient to use.
[0032] When the thickness of the spring piece 220 is relatively thin, if the spring piece 220 needs to provide sufficient elastic downward pressure to the substrate, it needs to be moved downward by a sufficient amount of displacement. In this case, the spring piece 220 will undergo significant elastic deformation and is prone to deformation. Therefore, in order to ensure the downward pressure that the spring piece 220 can provide and to extend its service life, in this embodiment, the thickness of the spring piece 220 is between 0.25 cm and 0.35 cm. Preferably, the thickness of the spring piece 220 can be 0.25 cm, 0.3 cm, or 0.35 cm, etc. Within this thickness range, the spring piece 220 has sufficient thickness, resulting in stronger downward compressive stress and less deformation, achieving the effect of maintaining structural stability even when the substrate is fixed for a long time.
[0033] The spring 220 needs to have a certain elastic deformation capacity and sufficient hardness. In this embodiment, the spring 220 is made of beryllium bronze. The beryllium bronze spring 220 has high hardness, elastic limit, fatigue limit and wear resistance, as well as good corrosion resistance, thereby maintaining a good positioning effect on the substrate after long-term use and extending the service life of the spring 220.
[0034] In some embodiments, the plate 100 is made of stainless steel. Stainless steel plate 100 has strong corrosion resistance and toughness, long service life, good aging resistance, and high tensile strength, which can extend the service life of plate 100. In practical applications, plate 100 and boss 210 can be an integrally formed structure, that is, boss 210 can also be made of stainless steel, which facilitates overall production.
[0035] In use, the board 100 needs to be moved down close to the substrate. Therefore, in order to facilitate the automatic pressing of the board 100, the board 100 is usually connected to an external device to provide vertical movement drive. In this embodiment, at least one connecting wing 120 is formed on each side of the board 100. At least one connecting wing 120 is provided with a mounting hole 121. In practical applications, the number of connecting wings 120 on both sides of the board 100 can be one or more. For example, one connecting wing 120 is provided on each side of the board 100. In addition, the number of mounting holes 121 on each connecting wing 120 can be one or more, and the shape of the mounting hole 121 on each connecting wing 120 can also be circular or oblong, etc., and can be processed and shaped according to different installation needs. The peripheral device is connected to the connecting wings 120 on both sides of the board 100, which facilitates the connection to both sides of the board 100. The peripheral device can also be connected and fixed to the board 100 through the mounting holes 121 on the two connecting wings 120, which improves the convenience of connecting and installing the board 100.
[0036] Furthermore, at least one of the connecting wings 120 is provided with a positioning groove 122. The positioning groove 122 can have various shapes. For example, the positioning groove 122 extends along the length direction of the connecting wing 120, and one end of the positioning groove 122 extends to the end of the connecting wing 120. When the peripheral device is connected to the connecting wing 120, the two can be quickly connected and aligned through the positioning groove 122 on the top side of the connecting wing 120, thereby improving the tightness of the connection with the connecting wing 120 and making the device connection structure between the connecting wing 120 and the peripheral device more stable.
[0037] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A clamp for wire bonding, characterized in that: include: Plate(100); The positioning structure (200) includes a boss (210) and a spring (220). The plate (100) is provided with a through hole (110). The boss (210) is provided on the bottom side of the plate (100) at least on both sides of the through hole (110). The multiple bosses (210) are detachably connected to the springs (220). The multiple springs (220) protrude from the multiple bosses (210) in a direction close to the through hole (110). The positioning structure (200) is provided on the plate (100) in multiple ways.
2. The clamp for wire bonding according to claim 1, characterized in that: In each of the positioning structures (200), there are multiple bosses (210), and the multiple bosses (210) are located on opposite sides of the through hole (110).
3. A clamp for wire bonding according to claim 2, characterized in that: The spring piece (220) includes a positioning part (221) and a connecting part (222) connected to each other. The connecting part (222) is detachably connected to the boss (210). The bottom side of the boss (210) has a plurality of spaced ribs (211). The two sides of the connecting part (222) abut against two adjacent ribs (211). The positioning part (221) protrudes from the boss (210).
4. A clamp for wire bonding according to claim 3, characterized in that: The connecting part (222) has positioning concave corners (223) on both sides near the through hole (110), and the two adjacent convex ribs (211) are located in the two positioning concave corners (223).
5. A clamp for wire bonding according to claim 3, characterized in that: A screw (230) is provided on the bottom side of the connecting part (222), and the screw (230) is connected to the boss (210) and presses the connecting part (222) against the boss (210).
6. A clamp for wire bonding according to claim 1, characterized in that: The thickness of the spring clip (220) is between 0.25 cm and 0.35 cm.
7. A clamp for wire bonding according to claim 1, characterized in that: The shrapnel (220) is made of beryllium bronze.
8. A clamp for wire bonding according to claim 1, characterized in that: The plate (100) is made of stainless steel.
9. A clamp for wire bonding according to claim 1, characterized in that: At least one connecting wing (120) is formed on each side of the plate (100), and at least one of the connecting wing (120) is provided with a mounting hole (121).
10. A clamp for wire bonding according to claim 9, characterized in that: At least one of the connecting wings (120) is provided with a positioning groove (122).