Sheet coating clamp

Abstract

The utility model relates to the technical field of optical device film coating, in particular to a sheet film coating clamp, which comprises a film coating carrier and a bottom plate, the film coating carrier is provided with accommodating grooves arranged in an array, the accommodating grooves are used for placing film coating substrates, and the depth of the accommodating grooves is smaller than the thickness of the film coating substrates; the bottom of the containing groove is hollow, and a high-temperature adhesive tape is attached to the back face of the film coating carrier and is attached to the position, corresponding to the containing groove, of the film coating carrier. Protrusions arranged in an array mode are arranged on the bottom plate, and the positions of the protrusions correspond to the positions of the containing grooves, so that the high-temperature adhesive tape is bonded with the coating substrate. According to the coating carrier provided by the utility model, the depth of the accommodating groove is smaller than the thickness of the coating substrate, so that the surface, which needs to be coated with an optical film, of the coating substrate can be completely exposed, and the surface of the coating substrate can be completely covered with a film layer; the high-temperature adhesive tape is attached to the bottom of the containing groove, the high-temperature adhesive tape is slightly jacked up by the protrusions on the bottom plate, and the stability of the film coating substrate in the film coating process is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical device coating technology field especially relates to a sheet coating fixture. BACKGROUND

[0002] In the processing of optical parts, coating is a crucial process, aiming to improve the performance of optical parts, such as enhancing reflection, reducing transmission loss or achieving specific optical properties. However, the existing coating fixture has several shortcomings, especially when handling optical sheet parts.

[0003] Counterbore coating fixture is a commonly used coating auxiliary tool. The fixture structure with counterbores is designed to fix optical sheet parts to ensure the stability of the parts during the coating process. However, one major drawback of this fixture is that the optical sheet parts are blocked by the side walls of the counterbores, resulting in 100% film layer coverage on the surface of the optical parts.

[0004] In view of this, overcoming the shortcomings of the existing technology is an urgent problem in this technical field. SUMMARY

[0005] The technical problem to be solved by the utility model is that the existing counterbore coating fixture cannot guarantee 100% film layer coverage on the surface of optical parts.

[0006] The utility model adopts the following technical solutions:

[0007] On the one hand, the utility model provides a sheet coating fixture, which comprises a coating carrier 1 and a bottom plate 2. The coating carrier 1 is provided with an array of accommodating grooves 10. The accommodating grooves 10 are used to place coating substrates 3. The depth of the accommodating grooves 10 is less than the thickness of the coating substrates 3.

[0008] The bottom of the accommodating groove 10 is hollow. The back of the coating carrier 1 is provided with high-temperature adhesive tape. The high-temperature adhesive tape is placed corresponding to the position of the accommodating groove 10, which is used to bond the coating substrate 3 in the accommodating groove 10 to the high-temperature adhesive tape.

[0009] The bottom plate 2 is provided with an array of protrusions 20. The position of the protrusions 20 corresponds to the position of the accommodating grooves 10. The protrusions 20 are used to lift the high-temperature adhesive tape, so that the high-temperature adhesive tape is bonded to the coating substrate 3.

[0010] Preferably, the back of the coating carrier 1 is provided with a first groove 11 and a second groove 12 arranged longitudinally and transversely. The first groove 11 and the second groove 12 are used to place the high-temperature adhesive tape.

[0011] Preferably, the first groove 11 and the second groove 12 divide the back of the film-coating carrier 1 into a plurality of bosses 13, and the accommodating groove 10 is arranged from the upper surface of the film-coating carrier 1 to the bottom of the first groove 11 and the second groove 12.

[0012] The four corners of each accommodating groove 10 are provided with the boss 13, and the corner of the boss 13 is exposed from the bottom of the accommodating groove 10, and the corner of the boss 13 is used to support the film-coating substrate 3.

[0013] Preferably, the width of the high-temperature adhesive tape matches the width of the first groove 11 and the second groove 12.

[0014] Preferably, the thickness of the film-coating carrier 1 is 2-3 mm.

[0015] Preferably, the top of the boss 20 is arc-shaped.

[0016] Preferably, the depth of the accommodating groove 10 is 0.1-1 mm.

[0017] Preferably, the accommodating groove 10 is arranged in a 7x7 array.

[0018] Preferably, the height of the boss 20 is 0.01-0.1 mm higher than the bottom of the accommodating groove 10.

[0019] Preferably, the edge of the upper surface of the accommodating groove 10 is provided with a chamfer, which facilitates the taking out of the film-coating substrate 3.

[0020] Compared with the prior art, the film-coating carrier 1 provided by the utility model has the following beneficial effects: the depth of the accommodating groove 10 of the film-coating carrier 1 is less than the thickness of the film-coating substrate 3, which can ensure that the side of the film-coating substrate 3 that needs to be coated with an optical film is fully exposed and not blocked, and ensure that the surface of the film-coating substrate 3 can be 100% covered with a film layer, and improve the convenience of taking out the film-coating substrate 3 after the film-coating is completed; the high-temperature adhesive tape is attached to the bottom of the accommodating groove 10, and the boss 20 on the bottom plate 2 slightly lifts the high-temperature adhesive tape, which can ensure that the film-coating substrate 3 placed in the accommodating groove 10 is bonded with the high-temperature adhesive tape, and improve the stability of the film-coating substrate 3 during the film-coating process, so that the accommodating groove 10 and the high-temperature adhesive tape cooperate to fix the film-coating substrate 3, and the stability of the film-coating substrate 3 during the film-coating process and the convenience of taking out the film-coating substrate 3 after the film-coating operation is completed are considered. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor.

[0022] Figure 1 is a schematic diagram of the overall structure of the wafer coating fixture provided by the embodiments of the present application;

[0023] Figure 2 is a schematic diagram of the protrusion of the wafer coating fixture provided by the embodiments of the present application;

[0024] Figure 3 is a schematic diagram of the first groove and the second groove of the wafer coating fixture provided by the embodiments of the present application;

[0025] Figure 4 is a schematic diagram of the boss and the accommodating groove of the wafer coating fixture provided by the embodiments of the present application.

[0026] Among them, the reference signs are:

[0027] 1-coating carrier, 10-accommodating groove, 11-first groove, 12-second groove, 13-boss, 2-bottom plate, 20-protrusion, 3-coating wafer. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0029] Unless otherwise required by the context, the term "comprising" is to be interpreted as open inclusion, that is, "including but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to mean that the specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner, that is, although they are carried in the embodiments or examples of the above terms due to the order of appearance and location, they are not limited to the combination of one embodiment or example.

[0030] In the description of the utility model, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relationship shown based on the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.

[0031] In the description of the utility model, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, in the description, the same type of nouns can also be described as two independent individuals by adding "A", "B" at the end, in which case the features limited by "A", "B" are only for the purpose of distinguishing the description of the same type of individuals, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.

[0032] In describing some embodiments, "coupled", "coupling" and "connected" and their derivatives can be used. For example, the term "connected" can be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. For another example, the term "coupling" can be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the term "connected" or "coupled" can also refer to two or more components that do not have direct contact with each other, but still cooperate or interact with each other, such as "optical coupling", "wireless connection" and the like. The embodiments disclosed herein are not necessarily limited to the content of the utility model.

[0033] In the description of the utility model, the expression "A and / or B" (wherein A and B are used to represent specific feature content in form) can be used, and the corresponding expression includes the following three combinations: only A, only B, and the combination of A and B.

[0034] In the utility model, "about", "approximately" or "approximately" includes the value described and the average value within the acceptable deviation range of the specific value, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system).

[0035] In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0036] Embodiment 1:

[0037] The utility model discloses an embodiment 1 provides a kind of wafer coating fixture, as shown in Fig. Figure 1 It is provided with array arrangement containing groove 10 on the coating carrier 1, containing groove 10 is used to place coating substrate 3, the depth of containing groove 10 is less than the thickness of the coating substrate 3;The difference between the depth of containing groove 10 and the thickness of coating substrate 3 can be 0.05mm-0.1mm, for example, when the thickness of coating substrate 3 is 0.1mm, the difference between the depth of containing groove 10 and the thickness of coating substrate 3 can be 0.05mm, when the thickness of coating substrate 3 is 0.2mm, the difference between the depth of containing groove 10 and the thickness of coating substrate 3 can be 0.1mm, and the specific difference can be designed according to the thickness of coating substrate 3 itself, so that the surface of the coating substrate 3 can be completely exposed, and there is no shielding around. The bottom of containing groove 10 is hollow, and high-temperature adhesive tape is attached to the back of the coating carrier 1, corresponding to the position of containing groove 10, for bonding the coating substrate 3 in the containing groove 10 on the high-temperature adhesive tape. In the process of placing coating substrate 3, coating substrate 3 is gently placed in containing groove 10, and may be bonded to high-temperature adhesive tape. Therefore, the bottom plate 2 is provided with array arrangement protrusion 20, the position of protrusion 20 is arranged corresponding to the position of containing groove 10, and the protrusion 20 is used to lift the high-temperature adhesive tape, so that the high-temperature adhesive tape is bonded with the coating substrate 3. Specifically, as shown in Fig. Figure 2 The height of the protrusion 20 is higher than the bottom of the containing groove 10 by 0.01mm-0.1mm. When the thickness of coating substrate 3 is 0.1mm, the height of the protrusion 20 can be higher than the bottom of the containing groove 10 by 0.01mm, and when the thickness of coating substrate 3 is 1mm, the height of the protrusion 20 can be higher than the bottom of the containing groove 10 by 0.1mm. The specific corresponding value is accurate without affecting the coating operation of coating substrate 3, and can be set according to actual situation.

[0038] The depth of the accommodating groove 10 on the coating carrier 1 is less than the thickness of the coating substrate 3, which can ensure that one side of the coating substrate 3 which needs to be coated with an optical film is fully exposed and there is no shielding around, and ensure that the surface of the coating substrate 3 can be 100% covered with a film layer, and the convenience of taking out the coating substrate 3 after the coating is completed is improved; the high-temperature adhesive tape is attached to the bottom of the accommodating groove 10, and the protrusion 20 on the bottom plate 2 slightly lifts the high-temperature adhesive tape, which can ensure that the coating substrate 3 placed in the accommodating groove 10 is bonded with the high-temperature adhesive tape, and the stability of the coating substrate 3 in the coating process is improved, therefore, the accommodating groove 10 and the high-temperature adhesive tape cooperate to fix the coating substrate 3, and the stability of the coating substrate 3 in the coating process and the convenience of taking out the coating substrate 3 after the coating operation is completed are considered.

[0039] In order to facilitate the bonding and positioning of the high-temperature adhesive tape on the back of the coating carrier 1, as shown in Figure 3 The back of the coating carrier 1 is provided with longitudinally and transversely arranged first grooves 11 and second grooves 12, and the first grooves 11 and the second grooves 12 are used for attaching the high-temperature adhesive tape. Specifically, the width of the high-temperature adhesive tape matches the width of the first grooves 11 and the second grooves 12. In actual application scenarios, the width of the first grooves 11 and the second grooves 12 can be 3mm-5mm; the thickness of the coating carrier 1 is 2mm-3mm, the depth of the accommodating groove 10 is 0.1mm-1mm, and the specific depth of the first grooves 11 and the second grooves 12 is designed with reference to the depth of the accommodating groove 10, and it is necessary to ensure that the depth of the first grooves 11 and the second grooves 12 plus the depth of the accommodating groove 10 is equal to the thickness of the coating carrier 1. The first grooves 11 and the second grooves 12 divide the back of the coating carrier 1 into a plurality of bosses 13, and the accommodating groove 10 is arranged from the upper surface of the coating carrier 1 to the bottom of the first grooves 11 and the second grooves 12; as shown in Figure 4 Each of the accommodating grooves 10 is provided with the boss 13 at the four corners, the corner of the boss 13 is exposed from the bottom of the accommodating groove 10, and the corner of the boss 13 is used for supporting the coating substrate 3. Therefore, during the operation, first, the bottom plate 2 is placed on the operation platform, the back of the coating carrier 1 is upward, the high-temperature adhesive tape is bonded in the first grooves 11 or the second grooves 12, after the bonding is completed, the coating carrier 1 is turned over, the coating substrate 3 is placed in the accommodating groove 10, and the coating carrier 1 loaded with the coating substrate 3 is placed on the bottom plate 2, and then the coating operation can be started. After the coating operation is completed, in order to facilitate taking out the coating substrate 3, the edge of the upper surface of the accommodating groove 10 is provided with a chamfer, so that the accommodating groove 10 is in a horn opening shape, and the coating substrate 3 can be easily taken out.

[0040] In the above scheme, the protrusion 20 is used to lift the high temperature adhesive tape to bond with the coated substrate 3, and in the preferred scheme, the top of the protrusion 20 is arc-shaped.

[0041] In one embodiment, the accommodating grooves 10 are arranged in a 7x7 array. In actual design and processing, the number and array arrangement of the accommodating grooves 10 can be designed according to requirements.

[0042] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thin-film coating fixture, characterized in that, The application relates to a coating carrier (1) and a bottom plate (2), wherein the coating carrier (1) is provided with an array of accommodating grooves (10) for placing coating substrates (3), and the depth of the accommodating grooves (10) is less than the thickness of the coating substrates (3). The bottom of the accommodating grooves (10) is hollow, the back of the coating carrier (1) is provided with high-temperature adhesive tape, the high-temperature adhesive tape is arranged at positions corresponding to the accommodating grooves (10), and the high-temperature adhesive tape is used for bonding the coating substrates (3) in the accommodating grooves (10) to the high-temperature adhesive tape. The bottom plate (2) is provided with an array of protrusions (20), the positions of the protrusions (20) correspond to the positions of the accommodating grooves (10), and the protrusions (20) are used for lifting the high-temperature adhesive tape to bond the high-temperature adhesive tape to the coating substrates (3). The back of the coating carrier (1) is provided with longitudinally and transversely arranged first grooves (11) and second grooves (12), and the first grooves (11) and the second grooves (12) are used for arranging the high-temperature adhesive tape.

2. The wafer coating fixture of claim 1, wherein, The first grooves (11) and the second grooves (12) divide the back of the coating carrier (1) into a plurality of bosses (13), and the accommodating grooves (10) extend from the upper surface of the coating carrier (1) to the bottoms of the first grooves (11) and the second grooves (12).

3. The wafer coating fixture of claim 2, wherein, The four corners of each accommodating groove (10) are provided with the bosses (13), the corners of the bosses (13) are exposed from the bottoms of the accommodating grooves (10), and the corners of the bosses (13) are used for supporting the coating substrates (3). The width of the high-temperature adhesive tape matches the width of the first grooves (11) and the second grooves (12).

4. The wafer coating fixture of claim 2, wherein, The thickness of the coating carrier (1) is 2-3 mm.

5. The wafer coating fixture of any of claims 1-4, wherein, The top of the protrusions (20) is arc-shaped.

6. The wafer coating fixture of any of claims 1-4, wherein, The depth of the accommodating grooves (10) is 0.1-1 mm.

7. The wafer coating fixture of any of claims 1-4, wherein, The accommodating grooves (10) are arranged in a 7*7 array.

8. The wafer coating fixture of any of claims 1-4, wherein, The height of the protrusions (20) is 0.01-0.1 mm higher than the bottoms of the accommodating grooves (10).

9. The wafer coating fixture of any of claims 1-4, wherein, The edge of the upper surface of the accommodating grooves (10) is provided with a chamfer, and the coating substrates (3) are convenient to take out.

10. The wafer coating fixture of any of claims 1-4, wherein, ​

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