Waterproof atmosphere lamp light-emitting module

Abstract

The utility model provides a waterproof atmosphere lamp light-emitting module which comprises a lamp holder shell cover, a PCBA board installed in the lamp holder shell cover and a lamp holder shell arranged on the lamp holder shell cover, a wrapping layer is arranged on the outer side of the PCBA board, and the wrapping layer is arranged between the lamp holder shell cover and the lamp holder shell. According to the utility model, efficient and stable protection and waterproof effects on the PCBA board can be realized through the wrapping layer arranged on the outer side of the PCBA board, and the problem that a traditional PCBA board is protected and waterproof by brushing three-proofing lacquer or UV glue is solved; the problems of short circuit or PCBA (Printed Circuit Board Assembly) damage caused by failure of waterproof performance of electronic components due to the influence of external factors (such as stress, humidity, temperature, dust, chemical solvent and the like) exist in the prior art.

Description

Technical Field

[0001] This utility model relates to the technical field of ambient light emission modules, specifically to a waterproof ambient light emission module. Background Technology

[0002] With the continuous development and upgrading of automotive technology, customers' visual and sensory needs are also constantly improving. As a primary lighting language for expressing the style of a car's interior, ambient lighting has become increasingly diverse in recent years, and its optical forms are constantly being updated to achieve different driving experience effects. Ambient lighting installed in different locations can present different lighting effects according to the driver's personalized needs, bringing a pleasant and relaxing feeling to the driving experience.

[0003] Meanwhile, for ease of use and to meet the needs of reading and office work, existing cars are also equipped with additional lighting or reading lights. Currently, most car models on the market have lighting and ambient lights installed on the roof. The waterproofing of traditional ambient light PCBA boards is achieved by applying conformal coating or UV adhesive to the PCBA board. However, especially for ambient lights in car windows, doors, or sunroofs, the electronic components are susceptible to short circuits or damage to the PCBA board due to external factors (such as stress, humidity, temperature, dust, chemical solvents, etc.), resulting in a short lifespan and frequent damage to the ambient lights. Utility Model Content

[0004] In view of this, the present invention provides a waterproof ambient light module, which can effectively protect and waterproof the PCBA board by designing a waterproof wrapping layer, avoiding damage or short circuit caused by external factors, and greatly improving the service life and working stability of the PCBA board.

[0005] To address the aforementioned technical problems, this utility model provides a waterproof ambient light module, comprising a lamp head cover, a PCBA board installed inside the lamp head cover, and a lamp head housing mounted on the lamp head cover. The lamp head housing and the lamp head cover are snapped together. A wrapping layer is provided on the outer side of the PCBA board, positioned between the lamp head cover and the lamp head housing. The wrapping layer encloses the PCBA board while exposing heat-generating components such as chips. These heat-generating components are inherently waterproof at the factory, for example, by being coated with conformal coating. This utility model achieves efficient and stable protection and waterproofing of the PCBA board through the wrapping layer on its outer side, solving the problem that traditional PCBA boards are protected and waterproofed by brushing on conformal coating or UV adhesive, which can lead to short circuits or damage to the PCBA board due to the susceptibility of electronic components to waterproofing failure caused by external factors (such as stress, humidity, temperature, dust, chemical solvents, etc.).

[0006] The coating layer is injection molded using a low-pressure injection molding machine. The coating layer is made of polyamide resin and is integrally molded with the PCBA board. Since polyamide resin is a condensation-type polymer compound with a CONH structure in its molecule, it is usually obtained by the condensation polymerization of diacids and diamines. Its softening point range is particularly narrow, unlike other thermoplastic resins which have a gradual curing or softening process. Polyamide resin materials undergo rapid curing when the temperature is slightly below the melting point, typically within 5-10 seconds. This significantly reduces the curing time of the coating layer, making it highly producible. This invention allows for pre-designing a mold based on the shape of the PCBA board, then placing the PCBA board in the mold and injection molding it using a low-pressure injection molding machine to achieve integral molding of the coating layer and the PCBA board. This greatly enhances the protective and waterproof performance of the PCBA board and significantly extends its service life.

[0007] The wrapping layer includes an upper waterproof plate adapted to the upper part of the PCBA board and a lower waterproof plate adapted to the lower part of the PCBA board. The upper and lower waterproof plates are detachably fastened together. This utility model facilitates convenient and efficient disassembly and repair when the PCBA board malfunctions, without damaging the upper or lower waterproof plates. It also allows for repeated use of the upper and lower waterproof plates, greatly improving the portability of maintenance operations.

[0008] A retaining strip is provided at the lower part of the upper waterproof plate or the upper part of the lower waterproof plate. Correspondingly, a retaining groove adapted to the retaining strip is provided at the upper part of the lower waterproof plate or the lower part of the upper waterproof plate. This utility model can achieve a firm fastening and fixing of the upper and lower waterproof plates and convenient and quick separation and disassembly for maintenance operations through the cooperation of the retaining strip and the retaining groove, which greatly improves the portability of PCBA board maintenance operations.

[0009] A sealing strip is provided on the outer side of the card strip or the inner side of the card slot. The sealing strip should be a rubber strip from the prior art. This utility model can greatly improve the sealing performance of the card strip and the card slot due to the unstable connection through the sealing strip, further improve the waterproof capability of the PCBA board, and improve the service life of the PCBA board to a certain extent.

[0010] The coating layer is made of polyamide resin by low-pressure injection molding. Polyamide resin is a condensation-type polymer compound with a CONH structure in its molecule, typically obtained by the condensation polymerization of diacids and diamines. Its softening point range is particularly narrow, unlike other thermoplastic resins which undergo a gradual curing or softening process. Polyamide resin materials cure rapidly when the temperature is slightly below their melting point, typically within 5-10 seconds. This significantly reduces the molding and curing time of the coating layer, making it highly suitable for mass production.

[0011] In summary, compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0012] 1. Excellent waterproof and dustproof performance: The wrapping layer can be designed according to different PCBA boards. It can be quickly injection molded using a low-pressure injection molding machine, so that the wrapping layer and the PCBA board can be quickly integrated and formed into one piece, giving it good waterproof and dustproof performance. Its waterproof performance can even reach the IP67 level waterproof requirement.

[0013] 2. Shortened process cycle: Cold-press injection molding with a wrapping layer can reduce the time to a few seconds to tens of seconds, avoiding the curing waiting time after applying conformal coating or UV coating to the PCBA board in the traditional way.

[0014] 3. Reduced process flow: This utility model can design a mold that is compatible with the PCBA board, and then use a low-pressure injection molding machine to perform injection molding. The operation process is simple and has strong mass production capability.

[0015] 4. Strong encapsulation and improved shock resistance: This utility model can greatly improve the shock and impact resistance of the PCBA board by integrally molding the encapsulation layer with the PCBA board, thus greatly extending the service life of the PCBA board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the waterproof ambient light module of this utility model;

[0017] Figure 2 This is a top view of the waterproof ambient light module of this utility model;

[0018] Figure 3 This utility model Figure 2 Sectional view at point AA;

[0019] Figure 4 This is a schematic diagram of the PCBA board and the wrapping layer in the waterproof ambient light module of this utility model;

[0020] Figure 5 This utility model Figure 4 Sectional view at point BB.

[0021] Explanation of reference numerals in the attached drawings: 100, lamp holder cover; 200, PCBA board; 300, lamp holder housing; 400, wrapping layer; 410, upper waterproof plate; 420, lower waterproof plate; 500, retaining strip; 600, retaining groove; 700, sealing strip. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the following will be described in conjunction with the accompanying drawings of the embodiments of this utility model. Figure 1-5The technical solutions of the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model are within the protection scope of this utility model.

[0023] like Figure 1-5 As shown: This embodiment provides a waterproof ambient light module, including a lamp head cover 100, a PCBA board 200 installed inside the lamp head cover 100, and a lamp head housing 300 disposed on the lamp head cover 100. The lamp head housing 300 is snapped together with the lamp head cover 100. A wrapping layer 400 is provided on the outer side of the PCBA board 200, and the wrapping layer 400 is placed between the lamp head cover 100 and the lamp head housing 300. The wrapping layer 400 wraps the PCBA board 200 together and exposes heat-generating components such as chips. Heat-generating components such as heat sinks are inherently waterproof at the factory, for example, by being coated with conformal coating. This invention achieves efficient and stable protection and waterproofing of the PCBA board 200 by providing a wrapping layer 400 on the outside of the PCBA board 200. This solves the problem that traditional PCBA boards 200 are protected and waterproofed by brushing on conformal coating or UV glue, which can lead to short circuits or damage to the PCBA board 200 due to the failure of waterproofing performance caused by external factors (such as stress, humidity, temperature, dust, chemical solvents, etc.).

[0024] According to one embodiment of the present invention, such as Figure 1-3 As shown, the encapsulation layer 400 is injection molded using a low-pressure injection molding machine and is integrally formed with the PCBA board 200. The encapsulation layer 400 is made of polyamide resin by low-pressure injection molding and is integrally formed with the PCBA board 200. Since polyamide resin is a condensation-type polymer compound with a CONH structure in its molecule, it is usually obtained by condensation polymerization of diacids and diamines. Its softening point range is particularly narrow, unlike other thermoplastic resins, which have a gradual curing or softening process. Polyamide resin material undergoes rapid curing when the temperature is slightly below the melting point, usually within 5-10 seconds. This greatly reduces the molding and curing time of the encapsulation layer 400, making it highly mass-producible. This invention allows for the pre-design of a mold based on the shape of the PCBA board 200, followed by injection molding of the PCBA board 200 using a low-pressure injection molding machine, achieving integral molding of the encapsulation layer 400 and the PCBA board 200. This significantly enhances the protective and waterproof performance of the PCBA board 200 and greatly extends its service life.

[0025] According to another embodiment of the present invention, such as Figure 1 , Figure 4 and Figure 5As shown, the wrapping layer 400 includes an upper waterproof plate 410 adapted to the upper part of the PCBA board 200 and a lower waterproof plate 420 adapted to the lower part of the PCBA board 200. Both the upper waterproof plate 410 and the lower waterproof plate 420 are injection molded by a low-pressure injection molding machine, and their material is polyamide resin. The upper waterproof plate 410 and the lower waterproof plate 420 can be detachably fastened together. This utility model, through the detachable setting of the upper waterproof plate 410 and the lower waterproof plate 420, facilitates convenient and efficient disassembly and repair when the PCBA board 200 malfunctions, without damaging the upper waterproof plate 410 or the lower waterproof plate 420. It also enables the upper waterproof plate 410 and the lower waterproof plate 420 to be reused multiple times, greatly improving the portability of maintenance operations.

[0026] According to another embodiment of the present invention, such as Figure 5 As shown, a retaining strip 500 is provided at the lower part of the upper waterproof plate 410 or the upper part of the lower waterproof plate 420. Correspondingly, a retaining groove 600 adapted to the retaining strip 500 is provided at the upper part of the lower waterproof plate 420 or the lower part of the upper waterproof plate 410. This utility model can achieve a firm fastening and fixing of the upper waterproof plate 410 and the lower waterproof plate 420 and convenient and quick separation, disassembly and maintenance operations through the cooperation of the retaining strip 500 and the retaining groove 600, which greatly improves the portability of PCBA board 200 maintenance operations.

[0027] A sealing strip 700 is provided on the outer side of the card strip 500 or the inner side of the card slot 600. The sealing strip 700 should be a non-slip, wear-resistant rubber strip with good sealing performance. This utility model can greatly improve the sealing performance of the card strip 500 and the card slot 600 due to the unstable connection through the sealing strip 700, further improve the waterproof capability of the PCBA board 200, and improve the service life of the PCBA board 200 to a certain extent.

[0028] How to use this utility model:

[0029] First, it needs to be clarified that this utility model mainly involves ambient light modules for automotive and outdoor ambient light installations. This utility model uses the manufacturing process of automotive ambient lights to illustrate how to achieve waterproof performance. During the manufacturing process of the ambient light module, the production of the wrapping layer 400 is carried out in two ways: one is to directly use a cold-press injection molding machine to integrally injection mold the PCBA board 200 and the wrapping layer 400. First, the operator makes a mold according to the shape of the PCBA board 200. Then, the operator places the PCBA board 200 in the mold, and then starts the cold-press injection molding machine to melt the polyamide resin and inject it into the mold. After standing for 5-10 seconds, the mold can be opened, and the formed PCBA board 200 and the wrapping layer 400 can be taken out together. Then, they are placed into the lamp head housing 100, and then the lamp head housing 300 is fastened into the lamp head housing 100 containing the PCBA board 200. First, the assembly of the ambient light module can be achieved. Second, according to the shape of the PCBA board 200, a mold is pre-designed to make an upper waterproof plate 410 or a lower waterproof plate 420. After the mold is made, the PCBA board 200 is placed on the lower waterproof plate 420, and then the upper waterproof plate 410 is fastened to the lower waterproof plate 420. This achieves the fastening of the PCBA board 200 with the upper waterproof plate 410 and the lower waterproof plate 420. Then, the PCBA board 200 with the upper waterproof plate 410 and the lower waterproof plate 420 is placed into the lamp head housing 100, and then the lamp head housing 300 is fastened into the lamp head housing 100 containing the PCBA board 200. This achieves the assembly of the ambient light module. This utility model can effectively protect and waterproof the PCBA board 200 by designing a waterproof wrapping layer 400, avoiding damage or short circuit caused by external factors, and greatly improving the service life and working stability of the PCBA board 200.

[0030] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A waterproof ambient light module, comprising a lamp head cover (100), a PCBA board (200) installed inside the lamp head cover (100), and a lamp head housing (300) disposed on the lamp head cover (100), characterized in that: The PCBA board (200) has a wrapping layer (400) on its outer side, which is placed between the lamp holder cover (100) and the lamp holder housing (300).

2. The waterproof ambient light module as described in claim 1, characterized in that: The wrapping layer (400) is injection molded by a low-pressure injection molding machine and is integrally formed with the PCBA board (200).

3. The waterproof ambient light module as described in claim 1, characterized in that: The wrapping layer (400) includes an upper waterproof plate (410) adapted to the upper part of the PCBA board (200) and a lower waterproof plate (420) adapted to the lower part of the PCBA board (200), and the upper waterproof plate (410) and the lower waterproof plate (420) are detachably fastened together.

4. The waterproof ambient light module as described in claim 3, characterized in that: A retaining strip (500) is provided on the lower part of the upper waterproof plate (410) or the upper part of the lower waterproof plate (420). Correspondingly, a retaining groove (600) adapted to the retaining strip (500) is provided on the upper part of the lower waterproof plate (420) or the lower part of the upper waterproof plate (410).

5. The waterproof ambient light module as described in claim 4, characterized in that: A sealing strip (700) is provided on the outer side of the card strip (500) or the inner side of the card slot (600).

6. The waterproof ambient light module as described in claim 1, characterized in that: The encapsulation layer (400) is made of polyamide resin by low-pressure injection molding.

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