Device for realizing rapid multi-point voltage-withstanding grounding test

Abstract

The utility model discloses a rapid multi-point voltage-withstanding grounding test device, and relates to the field of voltage-withstanding grounding tests. The withstand voltage grounding test device comprises a main control module used for outputting pulse signals, a double-point drive test module used for respectively controlling a withstand voltage loop and a grounding loop, and a load module used for being tested. The sampling module is used for respectively collecting analog signals generated by the voltage withstanding loop and the grounding loop; and the analog-to-digital conversion chip is used for converting the analog signals into digital signals. According to the utility model, by adopting the voltage-withstanding grounding test parallel output technology, synchronous parallel operation of a voltage-withstanding test and a grounding test is realized, and the test process is greatly simplified, so that the voltage-withstanding test and the grounding test do not need to be carried out independently in sequence, but are carried out simultaneously under the condition of correct wiring, thereby not only reducing the test time, but also improving the test efficiency. And the production line efficiency is obviously improved.

Description

Technical Field

[0001] This utility model relates to the field of withstand voltage grounding testing, specifically to a device for realizing rapid multi-point withstand voltage grounding testing. Background Technology

[0002] Withstand voltage and grounding tests are typically performed during the design, manufacturing, installation, and maintenance phases of electrical equipment and electronic products, particularly during quality inspection, safety certification, and acceptance testing. Typical scenarios requiring withstand voltage and grounding tests include: the installation and acceptance phases of industrial equipment (such as transformers and motors) and building electrical systems (such as distribution cabinets and cables), to verify the integrity and reliability of their grounding systems and ensure the safe conduction of current to the ground in the event of a fault; and equipment in special environments (such as medical and chemical equipment) with even higher safety requirements, necessitating withstand voltage and grounding tests to prevent accidents.

[0003] However, existing technologies require individual testing for withstand voltage and grounding tests. The main drawbacks of individual withstand voltage and grounding tests are low testing efficiency, insufficient data correlation, and the possibility of overlooking potential problems. In practical applications, this testing mode cannot meet the needs of efficient and comprehensive testing, especially in industrial scenarios that require high-frequency or large-batch testing.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in the related technologies, this utility model proposes a device for rapid multi-point withstand voltage grounding testing to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows:

[0007] A device for rapid multi-point withstand voltage grounding testing, the device comprising:

[0008] The main control module for outputting pulse signals, the dual-point drive test module for controlling the withstand voltage circuit and the grounding circuit respectively, the load module for being tested, the sampling module for acquiring the analog signals generated by the withstand voltage circuit and the grounding circuit respectively, and the analog-to-digital converter chip for converting the analog signals into digital signals.

[0009] The main control module's output is connected to the dual-point drive test module, the dual-point drive test module's output is connected to the load module's input, the load module's output is connected to the sampling module's input, and the sampling module's output is connected to the analog-to-digital converter chip's input.

[0010] Preferably, the dual-point drive test module includes a withstand voltage loop control module for controlling the drive of the withstand voltage field-effect transistor and adjusting the output withstand voltage signal, and a grounding loop control module for controlling the drive of the grounding field-effect transistor and adjusting the output grounding signal; the withstand voltage loop control module and the grounding loop control module are connected in parallel.

[0011] Preferably, the withstand voltage circuit control module includes a withstand voltage MOSFET driver, a withstand voltage MOSFET switch, and a boost converter; the pulse signal is input to the withstand voltage MOSFET driver that controls the withstand voltage MOSFET switch, and the withstand voltage MOSFET driver controls the withstand voltage power board to output a withstand voltage signal to the boost converter.

[0012] Preferably, the grounding loop control module includes a grounding MOSFET driver, a grounding MOSFET switch, and a current booster; a pulse signal is input to the grounding MOSFET driver that controls the grounding MOSFET switch, and the grounding power board is controlled by the grounding MOSFET driver to output a grounding signal to the current booster.

[0013] Preferably, the sampling module includes a withstand voltage sampling module for acquiring the withstand voltage signal output by the boost converter and a grounding sampling module for acquiring the grounding signal output by the current boost converter; the withstand voltage sampling module and the grounding sampling module are connected in parallel.

[0014] Preferably, the withstand voltage signal includes a withstand voltage signal and a withstand voltage current signal; the sampling module sends the withstand voltage signal to the V1 pin of the analog-to-digital converter chip, and the sampling module sends the withstand voltage current signal to the V2 pin of the analog-to-digital converter chip.

[0015] Preferably, the grounding signal includes a grounding voltage signal and a grounding current signal; the sampling module sends the grounding voltage signal to the V5 pin of the analog-to-digital converter chip, and the sampling module sends the grounding current signal to the V6 pin of the analog-to-digital converter chip.

[0016] Preferably, the withstand voltage sampling module includes a buffer U2 and a resistor R3; wherein, the third pin of the buffer U2 is connected to one end of the resistor R3, the other end of the resistor R3 is connected to the grounded low-voltage sampling terminal in the loop, and the second pin of the buffer U2 is connected to the V2 pin of the analog-to-digital converter chip and the sixth pin of the buffer U2 respectively.

[0017] Preferably, the ground sampling module includes an operational amplifier U1, resistors R1, R2, R4, and R5; wherein, the second pin of the operational amplifier U1 is connected to one end of resistor R1 and one end of resistor R5, the other end of resistor R1 is connected to the high-voltage ground sampling terminal in the loop, and the other end of resistor R5 is connected to the V5 pin of the analog-to-digital converter chip; the third pin of the operational amplifier U1 is connected to one end of resistor R2 and resistor R4, the other end of resistor R2 is connected to the other end of resistor R3 and the low-voltage ground sampling terminal in the loop, and the other end of resistor R4 is grounded.

[0018] The beneficial effects of this utility model are as follows:

[0019] This invention utilizes a parallel output technology for withstand voltage and grounding tests, enabling simultaneous parallel operation of withstand voltage and grounding tests. This significantly simplifies the testing process, eliminating the need for separate withstand voltage and grounding tests. Instead, both tests are performed simultaneously with correct wiring, reducing testing time and significantly improving production line efficiency. This invention is suitable for high-frequency, high-volume production environments. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a device for rapid multi-point withstand voltage grounding testing according to an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of a device for rapid multi-point withstand voltage grounding testing according to an embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of the analog-to-digital converter chip in a device for rapid multi-point withstand voltage grounding testing according to an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the sampling module in a device for rapid multi-point withstand voltage grounding testing according to an embodiment of the present invention.

[0025] In the picture:

[0026] 1. Main control module; 2. Dual-point drive test module; 201. Withstand voltage circuit control module; 2011. Withstand voltage MOSFET driver; 2012. Withstand voltage MOSFET switch; 2013. Boost converter; 202. Grounding circuit control module; 2021. Grounding MOSFET driver; 2022. Grounding MOSFET switch; 2023. Boost converter; 3. Load module; 4. Sampling module; 401. Withstand voltage sampling module; 402. Grounding sampling module; 5. Analog-to-digital converter chip. Detailed Implementation

[0027] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0028] According to an embodiment of the present invention, a device for rapid multi-point withstand voltage grounding testing is provided.

[0029] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1 As shown, the device for realizing rapid multi-point withstand voltage grounding test according to the embodiment of the present utility model includes a main control module 1 for outputting pulse signals, a dual-point drive test module 2 for controlling the withstand voltage circuit and the grounding circuit respectively, a load module 3 for being tested, a sampling module 4 for acquiring the analog signals generated by the withstand voltage circuit and the grounding circuit respectively, and an analog-to-digital converter chip 5 for converting the analog signals into digital signals.

[0030] The output of the main control module 1 is connected to the dual-point drive test module 2, the output of the dual-point drive test module 2 is connected to the input of the load module 3, the output of the load module 3 is connected to the input of the sampling module 4, and the output of the sampling module 4 is connected to the input of the analog-to-digital converter chip 5.

[0031] Specifically, the program simultaneously controls the output of grounding and withstand voltage tests, and calculates the sampled signals at the same time, enabling the withstand voltage test and grounding test to be performed in parallel.

[0032] Specifically, load module 3 refers to the device under test (DUT), and the acquired withstand voltage grounding signal is the voltage and current signal of the DUT acting on the load module.

[0033] In one embodiment, the dual-point drive test module 2 includes a withstand voltage loop control module 201 for controlling the drive of the withstand voltage field-effect transistor and adjusting the output withstand voltage signal, and a grounding loop control module 202 for controlling the drive of the grounding field-effect transistor and adjusting the output grounding signal; the withstand voltage loop control module 201 and the grounding loop control module 202 are connected in parallel.

[0034] In one embodiment, such as Figure 2 As shown, the withstand voltage circuit control module 201 includes a withstand voltage MOSFET driver 2011, a withstand voltage MOSFET switch 2012, and a booster 2013; a pulse signal is input to the withstand voltage MOSFET driver 2011 that controls the withstand voltage MOSFET switch 2012, and the withstand voltage MOSFET driver 2011 controls the withstand voltage power board to output a withstand voltage signal to the booster 2013; the grounding circuit control module 202 includes a grounding MOSFET driver 2021, a grounding MOSFET switch 2022, and a booster 2023; a pulse signal is input to the grounding MOSFET driver 2021 that controls the grounding MOSFET switch 2022, and the grounding MOSFET driver 2021 controls the grounding power board to output a grounding signal to the booster 2023.

[0035] Specifically, when parallel testing is selected, the main control module 1 can use an ARM (Advanced RISC Machine, i.e., an embedded processor or microcontroller based on the ARM architecture) to send PWM signals (Pulse Width Modulation, equivalent to a pulse signal) to the power board. The power board controls the MOSFET drivers of the withstand voltage circuit and the ground circuit respectively (the MOSFET drivers include withstand voltage MOSFET driver 2011 and ground MOSFET driver 2021). The ARM outputs two complementary pulse signals, one for withstand voltage and one for ground, to the MOSFET drivers of the upper and lower bridge arm MOSFET switches (within withstand voltage MOSFET switch 2012 and ground MOSFET switch 2022 respectively), so as to control the withstand voltage and ground power board to simultaneously output voltage to the boost converter 2013 required for withstand voltage and the boost converter 2023 required for ground, realizing the function of simultaneous output of two tests.

[0036] Specifically, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a voltage-controlled semiconductor device; a MOSFET driver is a dedicated circuit or chip used to drive a MOSFET (field-effect transistor). Its main function is to provide appropriate voltage and current to the gate of the MOSFET to ensure that the MOSFET can switch between on and off states efficiently and quickly.

[0037] In one embodiment, the sampling module 4 includes a withstand voltage sampling module 401 for acquiring the withstand voltage signal output by the booster 2013 and a grounding sampling module 402 for acquiring the grounding signal output by the current booster 2023; the withstand voltage sampling module 401 and the grounding sampling module 402 are connected in parallel.

[0038] In one embodiment, the withstand voltage sampling module 401 includes a buffer U2 and a resistor R3; wherein, the third pin of the buffer U2 is connected to one end of the resistor R3, the other end of the resistor R3 is connected to the grounded low-voltage sampling terminal in the loop, and the second pin of the buffer U2 is connected to the V2 pin of the analog-to-digital converter chip 5 and the sixth pin of the buffer U2 respectively.

[0039] In one embodiment, the ground sampling module 402 includes an operational amplifier U1, resistors R1, R2, R4, and R5; wherein, the second pin of the operational amplifier U1 is connected to one end of resistor R1 and one end of resistor R5, the other end of resistor R1 is connected to the high-voltage ground sampling terminal in the loop, and the other end of resistor R5 is connected to the V5 pin of the analog-to-digital converter chip 5; the third pin of the operational amplifier U1 is connected to one end of resistor R2 and resistor R4, the other end of resistor R2 is connected to the other end of resistor R3 and the low-voltage ground sampling terminal in the loop, and the other end of resistor R4 is grounded.

[0040] In one embodiment, the withstand voltage signal includes a withstand voltage signal and a withstand current signal; the sampling module 4 sends the withstand voltage signal to the V1 pin of the analog-to-digital converter chip 5, and the sampling module 4 sends the withstand current signal to the V2 pin of the analog-to-digital converter chip 5; the ground signal includes a ground voltage signal and a ground current signal; the sampling module 4 sends the ground voltage signal to the V5 pin of the analog-to-digital converter chip 5, and the sampling module 4 sends the ground current signal to the V6 pin of the analog-to-digital converter chip 5.

[0041] Specifically, the sampling module 4 acquires the voltage values ​​of the withstand voltage test sampling current and ground voltage signals by acquiring the ground current output of the booster 2023 through the Hall sensor, the withstand voltage output of the booster 2013 through the high voltage board, and the sampling resistor used in the circuit terminal shared by the withstand voltage and ground. The signals are then processed by a buffer composed of operational amplifiers to distinguish and amplify the ground and withstand voltage samples, so that the sampling module 4 can simultaneously acquire the withstand voltage test sampling current and voltage and the ground test sampling current and voltage of the load. Finally, the signals reach the analog-to-digital converter chip 5 (the analog-to-digital converter chip 5 is an AD7606 chip).

[0042] Specifically, such as Figure 4As shown, the withstand voltage test adopts a two-wire test method, and the grounding test adopts a four-wire test method. The withstand voltage loop terminal and the low-voltage sampling terminal of the grounding voltage sampling are the same port. The withstand voltage sampling and the low-voltage sampling of the grounding terminal are separated into two paths. One path is the withstand voltage sampling, which is processed by the sampling resistor (i.e., resistor R3) and buffer U2 and then reaches the V2 pin of the AD chip. The other path signal and the grounding high voltage sampling loop signal are processed by the sampling resistor (i.e., resistors R1 and R2) and operational amplifier U1 to form a differential amplifier with an amplification factor of 1 and then reach the V5 pin of the AD chip.

[0043] The two-wire connection method for withstand voltage testing is as follows: the high-voltage end is connected to the positive terminal of the load under test, and the loop end is connected to the negative terminal of the load under test. The four-wire connection method for grounding testing is as follows: the grounding current output end and the grounding high voltage sampling end are connected to the casing of the load under test, and the grounding current loop end and the grounding low voltage sampling end are connected to the connection point between the load under test and the ground. The withstand voltage test loop end and the grounding low voltage sampling end share the same port.

[0044] Specifically, such as Figure 3 As shown, the withstand voltage signal reaches the V1 pin of the analog-to-digital converter chip 5, the withstand current signal reaches the V2 pin of the analog-to-digital converter chip 5, the ground voltage signal reaches the V5 pin of the analog-to-digital converter chip 5, and the ground current signal reaches the V6 pin of the analog-to-digital converter chip 5. The analog signals are converted into digital signals, and the test results of withstand voltage and grounding are obtained simultaneously through calculation.

[0045] In summary, by employing the above-mentioned technical solution of this utility model, the present utility model achieves the synchronous parallel execution of withstand voltage testing and grounding testing by adopting the parallel output technology of withstand voltage and grounding testing, which greatly simplifies the testing process. Therefore, it is not necessary to perform withstand voltage testing and grounding testing separately, but to perform the two tests simultaneously with correct wiring. This not only reduces testing time but also significantly improves production line efficiency, making it suitable for high-frequency, high-volume production environments.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for rapid multi-point withstand voltage grounding testing, characterized in that, The withstand voltage grounding test device includes: The main control module (1) is used to output pulse signals; (2) A dual-point drive test module for separately controlling the withstand voltage circuit and the grounding circuit; The load module (3) used for testing; A sampling module (4) for separately acquiring analog signals generated by the withstand voltage circuit and the grounding circuit; Analog-to-digital converter chip (5) used to convert analog signals into digital signals; The output of the main control module (1) is connected to the dual-point drive test module (2), the output of the dual-point drive test module (2) is connected to the input of the load module (3), the output of the load module (3) is connected to the input of the sampling module (4), and the output of the sampling module (4) is connected to the input of the analog-to-digital converter chip (5).

2. The device for rapid multi-point withstand voltage grounding testing according to claim 1, characterized in that, The dual-point drive test module (2) includes a withstand voltage loop control module (201) for controlling the withstand voltage MOSFET drive and adjusting the output withstand voltage signal, and a ground loop control module (202) for controlling the ground MOSFET drive and adjusting the output ground signal; the withstand voltage loop control module (201) and the ground loop control module (202) are connected in parallel.

3. The device for rapid multi-point withstand voltage grounding testing according to claim 2, characterized in that, The withstand voltage circuit control module (201) includes a withstand voltage MOSFET driver (2011), a withstand voltage MOSFET switch (2012), and a boost converter (2013); The pulse signal is input to the voltage-resistant MOSFET driver (2011) that controls the voltage-resistant MOSFET switch (2012), and the voltage-resistant MOSFET driver (2011) controls the voltage-resistant power board to output a voltage-resistant signal to the boost converter (2013).

4. The device for rapid multi-point withstand voltage grounding testing according to claim 3, characterized in that, The grounding loop control module (202) includes a grounding MOSFET driver (2021), a grounding MOSFET switch (2022), and a current booster (2023); A pulse signal is input to the ground field effect transistor driver (2021) that controls the ground field effect transistor switch (2022), and the ground field effect transistor driver (2021) controls the ground power board to output a ground signal to the current booster (2023).

5. The device for rapid multi-point withstand voltage grounding testing according to claim 4, characterized in that, The sampling module (4) includes a withstand voltage sampling module (401) for collecting the withstand voltage signal output by the booster (2013) and a grounding sampling module (402) for collecting the grounding signal output by the current booster (2023); the withstand voltage sampling module (401) and the grounding sampling module (402) are connected in parallel.

6. The device for rapid multi-point withstand voltage grounding testing according to claim 5, characterized in that, The withstand voltage signal includes a withstand voltage signal and a withstand current signal; The sampling module (4) transmits the withstand voltage signal to the V1 pin of the analog-to-digital converter chip (5), and the sampling module (4) transmits the withstand current signal to the V2 pin of the analog-to-digital converter chip (5).

7. The device for rapid multi-point withstand voltage grounding testing according to claim 6, characterized in that, The grounding signal includes a grounding voltage signal and a grounding current signal; The sampling module (4) transmits the ground voltage signal to the V5 pin of the analog-to-digital converter chip (5), and the sampling module (4) transmits the ground current signal to the V6 pin of the analog-to-digital converter chip (5).

8. The device for rapid multi-point withstand voltage grounding testing according to claim 6, characterized in that, The withstand voltage sampling module (401) includes a buffer U2 and a resistor R3; The third pin of the buffer U2 is connected to one end of the resistor R3, the other end of the resistor R3 is connected to the grounded low-voltage sampling terminal in the loop, and the second pin of the buffer U2 is connected to the V2 pin of the analog-to-digital converter chip (5) and the sixth pin of the buffer U2.

9. The device for rapid multi-point withstand voltage grounding testing according to claim 8, characterized in that, The ground sampling module (402) includes an operational amplifier U1, resistors R1, R2, R4 and R5; Wherein, the second pin of the operational amplifier U1 is connected to one end of the resistor R1 and one end of the resistor R5 respectively, the other end of the resistor R1 is connected to the ground high voltage sampling terminal in the loop terminal, and the other end of the resistor R5 is connected to the V5 pin of the analog-to-digital converter chip (5). The third pin of the operational amplifier U1 is connected to one end of the resistor R2 and the resistor R4 respectively. The other end of the resistor R2 is connected to the other end of the resistor R3 and the grounded low-voltage sampling terminal in the loop. The other end of the resistor R4 is grounded.

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