Information service heat dissipation case
By combining liquid cooling, air cooling, and conductive cooling with an aluminum alloy frame structure, the problem of poor heat dissipation in information service equipment chassis has been solved, achieving efficient heat dissipation and noise reduction.
Patent Information
- Application Number
- CN202520357455.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-04
AI Technical Summary
The poor heat dissipation capacity of existing information service equipment chassis leads to low equipment efficiency and unstable performance.
It adopts a combination of liquid cooling, air cooling and conductive cooling, and achieves efficient heat conduction and noise reduction through the design of liquid cooling flow channels and air ducts combined with aluminum alloy frame structure.
It improves the equipment's heat dissipation capacity, reduces noise, and ensures stable operation of the equipment in low-temperature environments.
Smart Images
Figure CN223926832U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of industrial equipment, and more particularly to an information service heat dissipation enclosure. Background Technology
[0002] The chassis is a crucial component of information service equipment, primarily used to house various functional boards, backplanes, filter components, fan assemblies, battery packs, etc., and must also possess excellent heat dissipation and dust protection capabilities. Poor heat dissipation in the chassis, leading to excessively high internal temperatures, will result in low equipment efficiency and unstable board performance. Therefore, the chassis's heat dissipation capacity directly affects the performance and operational stability of information service equipment. Summary of the Invention
[0003] This application provides an information service heat dissipation chassis that achieves good heat conduction and reduces noise through a combination of liquid cooling, air cooling and thermal conductivity.
[0004] This application provides an information service heat dissipation chassis, including:
[0005] The chassis body provides an installation space, in which multiple functional boards and related components are installed. Ventilation holes and fans are respectively provided on both sides of the chassis body. A fluid connector is installed at the rear of the chassis body for liquid inlet and outlet. The internal guide groove is provided with liquid cooling channels for heat conduction and heat dissipation of the internal functional boards.
[0006] The chassis body includes a front panel and a rear panel, wherein the rear panel is provided with a liquid cooling fluid interface, a grounding post, a fuse, an external integrated interface, and two battery packs.
[0007] The front panel is equipped with a display window, a switch, and an external connector. The display window is used to observe the status of each functional module.
[0008] Optionally, the front panel is a transparent shielded door structure.
[0009] Optionally, the functional boards include 3U functional boards and 6U functional boards, and the related components include backplanes, filter components, fan components, and battery packs.
[0010] Optionally, the installation space inside the chassis body is fixed together with a frame structure, and the frame structure and the chassis body are made of metal materials.
[0011] Optionally, the chassis body is made of aluminum alloy, and each functional board and related component is an independent heat dissipation module. The heat is conducted to the air cavity through the independent heat dissipation module, so as to dissipate heat through the air duct.
[0012] Optionally, the fluid connector is connected to the distributor to allow the fluid to flow in parallel through each functional board and then through the distributor to the liquid outlet of the chassis.
[0013] Optionally, the external integrated interfaces include a power input interface, a network interface, a VGA interface, and a USB signal interface.
[0014] The chassis in this embodiment achieves good heat conduction and reduces noise through a combination of liquid cooling, air cooling, and conductive cooling.
[0015] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0017] Figure 1 This is an exploded view of the information service cooling chassis according to an embodiment of this application.
[0018] Figure 2 This is a schematic diagram of the internal structure of the information service heat dissipation chassis according to an embodiment of this application;
[0019] Figure 3 This is a schematic diagram of the overall structure of the information service heat dissipation chassis according to an embodiment of this application;
[0020] Figure 4 This is a schematic diagram of the airflow of a heat dissipation chassis for information services, as shown in an embodiment of this application. Detailed Implementation
[0021] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0022] This application provides an information service heat dissipation chassis, such as... Figure 1 As shown, it includes:
[0023] The chassis body provides an installation space, in which multiple functional boards and related components are installed. Ventilation holes and fans are respectively provided on both sides of the chassis body. A fluid connector 11 is installed at the rear of the chassis body for liquid inlet and outlet. The internal guide groove is provided with liquid cooling channels for heat conduction and heat dissipation of the internal functional boards.
[0024] The chassis body includes a front panel and a rear panel, wherein the rear panel is provided with a liquid cooling fluid interface, a grounding post, a fuse, an external integrated interface, and two battery packs.
[0025] The front panel is equipped with a display window, a switch, and an external connector. The display window is used to observe the status of each functional module.
[0026] In specific examples, such as Figure 1 , Figure 2 As shown, the chassis body includes components such as a top cover 4, a rear shell 6, a left side panel 2, a right side panel 12, and a front shell assembly 17. The mounting space includes a function board 1, and the bottom surface has a liquid cooling plate 14 with a guide rail 5 installed inside. The battery assembly 8 and interface assembly 9 can be installed by inserting them into the guide rail 5. The front shell assembly 17 has a display screen and a connector 15; the display screen can be a touchscreen 16. A front back panel 13 and a rear back panel 3 are located behind the function board 1.
[0027] In some embodiments, the external integrated interface includes a power input interface, a network interface, a VGA interface, and a USB signal interface.
[0028] The chassis body has ventilation holes and fans 10 on the left and right sides. A fluid connector 11 is installed at the rear of the chassis for liquid inlet and outlet. Internal guide channels provide liquid cooling channels for heat conduction and dissipation of the internal functional boards 1. The sides of the rear panel contain the liquid cooling fluid interfaces (including inlet 19 and outlet 21), grounding posts, fuses, etc. The upper part of the rear panel contains two battery packs, and the lower part contains integrated external interfaces, including power input, one gigabit network port, one VGA port, and two USB ports. The overall external appearance is as follows: Figure 3 As shown.
[0029] In some embodiments, the front panel is a transparent shielded door structure. The front panel of the chassis body has a display window for observing each functional module and its operating status. In this specific example, the functional panel is designed as a transparent shielded door structure, satisfying both the observation requirements and the shielding requirements. The shielded door is a flip-down door, which can be easily opened and closed, facilitating observation of the equipment's status.
[0030] In some embodiments, the functional board includes a 3U functional board and a 6U functional board, and the related components include a backplane, a filter assembly, a fan assembly, and a battery pack. In some examples, the functional board includes two types: a 6U functional module board and a 3U functional module board.
[0031] In some embodiments, the mounting space within the chassis body is fixed together by a frame structure, and the frame structure and the chassis body are made of metal.
[0032] In some embodiments, the chassis body is made of aluminum alloy, and each functional board and related component is an independent heat dissipation module. The heat is conducted to the air cavity through the independent heat dissipation module so as to dissipate heat through the air duct.
[0033] In some embodiments, the fluid connector is connected to a distributor to allow parallel flow through each functional board and then through the distributor to the chassis outlet.
[0034] The casing is made of aluminum alloy, and the functional modules are independent heat dissipation modules. Each functional module conducts heat to the air cavity through the heat sink, and the whole machine uses a fan to dissipate the heat in the air cavity to the outside of the casing.
[0035] like Figure 4 As shown, the interior of the chassis forms a relatively sealed space. Heat transfer between the main heat-generating components and the chassis can be preliminarily verified based on the sealed unit configuration. The focus of the overall ventilation and cooling system design is on the rational control and distribution of airflow, ensuring it follows a predetermined path and is appropriately allocated to each component, allowing each electronic module to operate below its rated temperature. The cooling airflow primarily enters the chassis from the left panel and is expelled by a cooling fan mounted on the right panel.
[0036] In this specific example, the chassis is designed with three heat dissipation methods: liquid cooling, air cooling, and thermal conductivity. Various combinations of these methods can be provided depending on the application scenario. When the chassis is installed in a liquid-cooled rack, a combination of liquid cooling and thermal conductivity can be used to provide quiet and efficient heat dissipation. If the rack does not have liquid cooling capabilities, an air cooling and thermal conductivity combination can be used to meet the heat dissipation requirements of the device boards.
[0037] The internal modules are fixed together using a frame structure, and the frame and reinforced chassis are made of metal with good thermal conductivity. This reduces airflow resistance and increases the efficiency of heat dissipation.
[0038] This application utilizes a combination of liquid cooling, air cooling, and conductive cooling. When the equipment is installed in a liquid-cooled cabinet, it employs a liquid cooling + conductive cooling method to provide quiet and efficient heat dissipation. If the cabinet lacks liquid cooling capabilities, an air cooling + conductive cooling method can be used to meet the heat dissipation requirements of the equipment boards and ensure normal equipment operation. The fan module is the main heat-conducting component of the equipment, but it is also a major source of noise within the equipment. Intelligent fan control and reasonable airflow arrangement reduce airflow noise. Installing sound-absorbing dust filters at the air inlet achieves good heat conduction while reducing noise.
[0039] It should be noted that, in the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0040] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.
[0041] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application.
Claims
1. An information service heat dissipation chassis, characterized in that, include: The chassis body provides an installation space, in which multiple functional boards and related components are installed. Ventilation holes and fans are respectively provided on both sides of the chassis body. A fluid connector is installed at the rear of the chassis body for liquid inlet and outlet. The internal guide groove is provided with liquid cooling channels for heat conduction and heat dissipation of the internal functional boards. The chassis body includes a front panel and a rear panel, wherein the rear panel is provided with a liquid cooling fluid interface, a grounding post, a fuse, an external integrated interface, and two battery packs. The front panel is equipped with a display window, a switch, and an external connector. The display window is used to observe the status of each functional module.
2. The information service heat dissipation chassis as described in claim 1, characterized in that, The front panel is a transparent shielded door structure.
3. The information service heat dissipation chassis as described in claim 1, characterized in that, The functional boards include 3U functional boards and 6U functional boards, and the related components include backplanes, filter components, fan components, and battery packs.
4. The information service heat dissipation chassis as described in claim 3, characterized in that, The mounting space inside the chassis body is fixed together by a frame structure, and the frame structure and the chassis body are made of metal materials.
5. The information service heat dissipation chassis as described in claim 1, characterized in that, The chassis body is made of aluminum alloy. Each functional board and related component is an independent heat dissipation module. The heat is conducted to the air cavity through the independent heat dissipation module, and then dissipated through the air duct.
6. The information service heat dissipation chassis as described in claim 1, characterized in that, The fluid connector is connected to the distributor so that the fluid flows in parallel through each functional board and then through the distributor to the liquid outlet of the chassis.
7. The information service heat dissipation chassis as described in claim 1, characterized in that, The external integrated interfaces include a power input interface, a network interface, a VGA interface, and a USB signal interface.