Multi-backboard architecture server device for e-commerce transaction

Abstract

The utility model discloses a multi-backboard architecture server device for e-commerce transactions, and relates to the technical field of computer hardware infrastructures. The device comprises a complete machine plug-in frame, a server node capable of being plugged in the complete machine plug-in frame in a blind mode, a backboard management module comprising a low-speed backboard and a high-speed backboard, a power supply module and a fan module. The power supply backboard, the high-speed backboard, the low-speed backboard and the fan backboard are mutually independently constructed, so that the technical effects that signal interference coupling between data transmission is small, the backboards can be independently maintained and replaced, the density of server nodes is improved, and the use cost is reduced are achieved.

Description

Technical Field

[0001] This application relates to the field of computer hardware infrastructure technology, and in particular to a multi-backplane architecture server device for e-commerce transactions. Background Technology

[0002] With the rapid development of technologies such as the Internet, big data, cloud computing, and artificial intelligence, data is growing explosively. Industries such as e-commerce need to process massive amounts of data and complex computing tasks, placing extremely high demands on the computing power of servers. At the same time, data center construction costs are high, and server room space resources are limited, creating a strong demand for high-density servers. Traditional rack-mount servers with built-in central switching cannot increase server density because the central switching slots occupy part of the slots.

[0003] Meanwhile, as the communication bus speed between servers and switching networks increases, the design cost of traditional backplane solutions that integrate power supply, high-speed, and low-speed management networks into a single backplane increases dramatically, and the crosstalk between power supply and high-speed networks has a growing impact on signal quality.

[0004] Therefore, a new server module architecture is needed to address some of the problems existing in the aforementioned prior art, in response to user needs. Utility Model Content

[0005] This application provides a multi-backplane architecture server device for e-commerce transactions, which solves the technical problems of low density, low space utilization, and significant impact of power supply and high-speed network crosstalk on signal quality in existing rack servers. It achieves the technical effect of improving the space utilization of the server rack and reducing the impact of power supply and high-speed network crosstalk on signal quality during server rack operation.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A multi-backplane architecture server device for e-commerce transactions includes a chassis, multiple server nodes, a backplane management module, a fan module, and a power supply module. The chassis has multiple full-width slots, and the server nodes are fixed within these slots. The backplane management module, fan module, and power supply module are all located within the chassis, behind the full-width slots. Each server node includes a node motherboard area, a node switching area, a node I / O area, and a node power supply area. The node motherboard area is connected to the node switching area, node I / O area, and node power supply area. The system is electrically connected to the power supply module, with the node power supply area electrically connected to the power supply module. The backplane management module includes a high-speed backplane and a low-speed backplane, both of which are electrically connected to multiple server nodes. The fan module includes a fan backplane and multiple fans, arranged in an array at the rear of the entire machine frame and fixedly connected to the fan backplane. The fan backplane is electrically connected to both the low-speed backplane and the power supply module. The power supply module includes multiple power supply units and a power supply backplane, arranged in an array at the rear of the entire machine frame and electrically connected to the power supply backplane.

[0008] Furthermore, the height of the entire frame is 8U, which is suitable for computer racks with a depth of 800mm, and the frame has 8 full-width slots to accommodate up to 8 server nodes with a height of 1U.

[0009] Furthermore, all of the up to 8 server nodes include Ethernet ports, and each server node is interconnected with the other server nodes through the Ethernet ports, with each Ethernet port having 4 SerDes links.

[0010] Furthermore, the high-speed backplane is electrically connected to the node switching area; the low-speed backplane is electrically connected to the node motherboard area; and the power backplane is electrically connected to the node power supply area.

[0011] Furthermore, the node motherboard area includes a central processing unit and a network interface card (NIC), and the node switching area includes a switching chip; one end of the NIC is connected to the central processing unit, and the other end is electrically connected to the switching chip; the switching chip is electrically connected to the high-speed backplane.

[0012] Furthermore, the node motherboard area also includes memory modules and out-of-band management modules; both memory modules and out-of-band management modules are electrically connected to the central processing unit.

[0013] Furthermore, the node switching area is fastened to the surface of the server node in the form of a snap-on plate.

[0014] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0015] 1. The interconnection backplanes for power supply, high-speed signals, and low-speed signals are independent of each other, with low signal interference coupling, ensuring signal quality during data transmission;

[0016] 2. The interconnect backplane is small in size, resulting in lower costs compared to traditional solutions;

[0017] 3. The interconnection backplanes for power supply, high-speed signals, and low-speed signals evolve, are maintained, and are replaced independently.

[0018] 4. Server nodes are connected through multiple network nodes on a high-speed backplane, replacing the central switching network, increasing the density of server nodes in the chassis, and increasing the signal transmission rate between server nodes. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the overall frame of the machine provided in the embodiments of this application (the left figure is the front view of the overall frame, and the right figure is the rear view of the overall frame);

[0021] Figure 2 A top view of the overall frame provided in the embodiments of this application;

[0022] Figure 3 This is a schematic diagram of the power supply path for the entire machine's insertion frame provided in an embodiment of this application;

[0023] Figure 4 The interconnection logical topology diagram of server nodes provided in the embodiments of this application;

[0024] Figure 5 An architecture diagram of a server node provided in an embodiment of this application;

[0025] Figure 6 This is a schematic diagram illustrating the interconnection between the node motherboard area and the node switching area provided in an embodiment of this application.

[0026] Attached label: 11-Node motherboard area, 12-Node switching area, 13-Node power supply area, 14-Node I / O area; 21-High-speed backplane, 22-Low-speed backplane; 31-Fan backplane; 32-Fan; 41-Power supply unit; 42-Power supply backplane; 5-Full-width slot. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0028] Figure 1 This is a schematic diagram of the overall frame of the machine provided in an embodiment of this application. Figure 1 As shown, the device includes a frame with multiple full-width slots 5 inside. Multiple server nodes can be fixedly installed in each full-width slot 5, and all server nodes are blindly inserted into the full-width slots. The frame also includes a backplane management module, a fan module, and a power supply module.

[0029] Figure 5 The server node architecture diagram provided in the embodiments of this application is as follows: Figure 5 As shown, the server node includes a node motherboard area 11, a node switching area 12, a node I / O area 14, and a node power supply area 13. The node motherboard area 11 is electrically connected to the node switching area 12, the node I / O area 14, and the node power supply area 13, respectively. The node power supply area 13 is electrically connected to the power supply module.

[0030] The backplane management module includes a low-speed backplane 22 and a high-speed backplane 21. The backplane management module is used to manage other modules in the chassis, including unified external management of server nodes, unified external management of the chassis, and management of the power supply module and fan module of the chassis.

[0031] The fan module includes a fan backplate 31 and multiple fans 32, such as Figure 1 As shown in the right figure, multiple fans 32 are arranged in an array at the rear of the unit frame, and each fan 32 is fixedly connected to a fan backplate 31. The fan backplate 31 is used to manage each fan 32. At the same time, the fan backplate 31 is electrically connected to the low-speed backplate 22 and the power supply module.

[0032] The power supply module includes multiple power supply units 41 (PSUs) and a power backplane 42, such as... Figure 1 As shown in the right figure, the power supply units 41 are arranged in the same way as the fans 32, and are stacked one after another and arranged in an array on the left side of the rear of the whole frame (i.e., arranged on one side of the fans 32). The power supply units 41 are electrically connected to the power backplate 42. The power supply units 41 are used to provide the power required for operation of other modules inside the whole frame.

[0033] This application provides a multi-backplane architecture server device and chassis for e-commerce transactions, which solves the technical problems of low density, low space utilization, and significant impact of power supply and high-speed network crosstalk on signal quality in existing rack servers. It achieves the technical effect of improving the space utilization of the server chassis and reducing the impact of power supply and high-speed network crosstalk on signal quality during server chassis operation.

[0034] In this embodiment, the overall height of the server rack is 8U, making it suitable for computer racks with a depth of 800mm. The rack has eight full-width slots 5 for deploying server nodes, each slot 5 capable of accommodating one 1U high server node. The rack can accommodate a total of eight server nodes. The standard width of the rack is 19 inches, and its depth is 675mm.

[0035] The server nodes are 1U in height, and each server node can support a maximum of two CPUs (Central Processing Units). The front panel of the server node also has several I / O interfaces, which enable electrical connections with other servers.

[0036] In addition to server nodes, the entire chassis can also be equipped with a fixed service switch to enable external switching functions for multi-node servers.

[0037] Figure 3 This is a schematic diagram of the power supply path for the entire machine's mounting frame provided in an embodiment of this application. For example... Figure 3 As shown, multiple power supply units 41 in the power supply module are stacked in sequence, connected in series, and electrically connected to the power supply backplane 42.

[0038] For example, the power supply units 41 in the power supply module are all hot-swappable PSUs. Furthermore, after the power supply units 41 are stacked, one end is connected to the power supply backplane 42. The power supply units 41 support 220V AC power, and each power supply unit 41 supports a maximum input voltage of 3kW. The total power supply capacity of the entire module is up to 12kW. The power supply units 41 are uniformly managed by the power supply backplane 42, which enables monitoring and upgrade functions for the power supply units 41.

[0039] Figure 2 This is a top view of the overall frame provided in an embodiment of this application. Figure 2 and Figure 1 As shown in the right figure, the fan module includes a fan backplate 31 and 16 fans 32. The fan backplate 31 is fixedly connected to each fan 32 and electrically controls each fan backplate 32. The fan backplate 31 is electrically connected to the low-speed backplate 22 and the power supply backplate 42 respectively.

[0040] The fan module is used to provide heat dissipation for the server nodes. The fan module adopts an N+1 redundancy design, which can realize individual hot-swappable maintenance. The fan modules are managed by the backplane management module.

[0041] Figure 4 This is a logical topology diagram of the interconnection of server nodes provided in an embodiment of this application. For example... Figure 4 As shown, the entire frame contains up to 8 server nodes, each with an Ethernet port. The server nodes can interconnect with other server nodes via their respective Ethernet ports through MESH (Wireless Mesh Network).

[0042] Preferably, each Ethernet port supports bandwidth of 100G@25G / lane or 200G@56 / lane, and each Ethernet port is equipped with 4 SerDes links. The number of interconnect signals on the high-speed backplane of each server node is 56 SerDes links.

[0043] Therefore, the high-speed backplane 21 single line can support a maximum serial / deserialization rate of 56G, enabling full mesh interconnection of networks between 8 server nodes.

[0044] By interconnecting multiple nodes in a full mesh environment, the single boards in the switching slots of the central switching architecture can be eliminated, saving slots and increasing the number of server nodes in the overall machine's rack layout.

[0045] Figure 5 This is an architecture diagram of a server node provided in an embodiment of this application. Figure 5 As shown, in this application, the high-speed backplane 21 is electrically connected to the node switching area 12. The low-speed backplane 22 is electrically connected to the node motherboard area 11. The power backplane 42 is electrically connected to the node power supply area 13.

[0046] Figure 6 This is a schematic diagram illustrating the interconnection between the node motherboard area and the node switching area provided in an embodiment of this application. Figure 6 As shown in this embodiment, the node motherboard area 11 includes a central processing unit and a network card, and the node switching area 12 includes a switching chip.

[0047] One end of the network card is connected to the central processing unit, and the other end is electrically connected to the switching chip through an Ethernet port (ETH, Ethernet Interface), where ETH0 to ETH6 represent the Ethernet port numbers.

[0048] The switching chip is electrically connected to the high-speed backplane 21.

[0049] It should be noted that the node motherboard area 11 also includes a memory module and an out-of-band management module. The memory module is used to store all data involved in the data transmission process in this embodiment, and the out-of-band management module is used to realize the connection between the node motherboard area 11 and the external server. Both the memory module and the out-of-band management module are electrically connected to the central processing unit.

[0050] In this embodiment, the node I / O area 14 and the node motherboard area 11 are electrically connected via a high-speed connector. The node I / O area 14 is used to implement the external panel I / O interface function of the entire chassis, and the I / O interface includes service network cards, hard drives, debugging network ports, etc.

[0051] Meanwhile, in the server node, the node switching area 12 is fastened to the surface of the server node in the form of a snap-on plate, but it is still part of the server node, realizing the connection between the node motherboard area 11 and the high-speed backplane 21. At the same time, it facilitates the independent evolution and addition of the node switching area 12, and the node switching area 12 is independently decoupled from the node motherboard area 11.

[0052] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of this application.

Claims

1. A multi-backplane architecture server apparatus for e-commerce transactions, characterized by, The whole machine plug-in frame, a plurality of server nodes, a backboard management module, a fan module and a power supply module are included. A plurality of full-width slots (5) are arranged inside the whole machine plug-in frame, and the plurality of server nodes are fixed inside the plurality of full-width slots (5), and the backboard management module, the fan module and the power supply module are arranged inside the whole machine plug-in frame and behind the plurality of full-width slots (5). The server node includes a node mainboard area (11), a node exchange area (12), a node IO area (14) and a node power supply area (13), the node mainboard area (11) is electrically connected with the node exchange area (12), the node IO area (14) and the node power supply area (13) respectively, and the node power supply area (13) is electrically connected with the power supply module. The backboard management module includes a high-speed backboard (21) and a low-speed backboard (22), wherein the high-speed backboard (21) and the low-speed backboard (22) are electrically connected with the plurality of server nodes. The fan module includes a fan backboard (31) and a plurality of fans (32), the plurality of fans (32) are arranged in an array at the rear of the whole machine plug-in frame and are fixedly connected with the fan backboard (31), and the fan backboard (31) is electrically connected with the low-speed backboard (22) and the power supply module respectively. The power supply module includes a plurality of power supply units (41) and a power supply backboard (42), the plurality of power supply units (41) are arranged in an array at the rear of the whole machine plug-in frame and are electrically connected with the power supply backboard (42).

2. The apparatus of claim 1, wherein, The height of the whole machine plug-in frame is 8U, which is suitable for a computer cabinet with a depth of 800mm, and 8 full-width slots (5) are arranged inside the whole machine plug-in frame for accommodating at most 8 server nodes with a height of 1U.

3. The apparatus of claim 2, wherein, Each of the at most 8 server nodes includes an Ethernet port, each server node is connected with the other server nodes through the Ethernet port, and each Ethernet port is provided with 4 Serdes links.

4. The apparatus of claim 1, wherein, The high-speed backboard (21) is electrically connected with the node exchange area (12); The low-speed backboard (22) is electrically connected with the node mainboard area (11); The power supply backboard (42) is electrically connected with the node power supply area (13).

5. The apparatus of claim 1, wherein, The node mainboard area (11) includes a central processing unit and a network card, and the node exchange area (12) includes a switching chip. One end of the network card is connected with the central processing unit, and the other end is electrically connected with the switching chip. The switching chip is electrically connected with the high-speed backboard (21).

6. The apparatus of claim 5, wherein, The node mainboard area (11) further includes a memory bank and an out-of-band management module. The memory bank and the out-of-band management module are electrically connected with the central processing unit.

7. The apparatus of claim 1, wherein, The node exchange area (12) is in the form of a buckling plate and is buckled on the surface of the server node.

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